Fibocom Wireless M210AM User Manual

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M210-AM Datasheet

Version: 2.0.0

Update date: 05/17/2017

M210-AM Datasheet Page1of

Version

Update Date

Description

V1.0.0

01/12/2017

First edition.

V2.0.0

05/17/2017

Second edition of M210-AM datasheet

Copyright © 2017 Fibocom Wireless Inc. All rights reserved. Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt, copy any part of or the entire document, or distribute the document in any form.

Notice

The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless otherwise specified, the document only serves as the user guide. All the statements, information and suggestions contained in the document do not constitute any explicit or implicit guarantee.

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M210-AM Datasheet Page2of

About this Datasheet

This document is intended for engineers who are developing User Equipment

(UE) for LTE systems.

•

VerizonWireless Device Requirements LTE 3GPP Band 13 Network Access, Version 29.00; June

2016

•

VerizonWireless Device Requirements LTE 3GPP Multi-Band Network Access, Version 3.00; June

2016

Purpose and Scope

The M210-AM are complete Verizon Wireless certified LTE Category M1 modules including base-band, RF and memory, for the design of connected machine-to-machine devices, and other Internet-of-Things devices with embedded LTE connectivity. This document provides technical information about M210-AM LGA module. M210-AM are based on Sequans’ Monarch platform.

Who Should Read this Datasheet

References

[1]

• Verizon Wireless Unified Module Process for Compliance Testing and Approval, Version 12.0; Feb 2015

M210-AM Datasheet Page 3 of 38

[2]

•

3GPP E-UTRA 21 series Release 13 (EPS)

•

3GPP E-UTRA 22 series Release 13 (IMEI)

•

3GPP E-UTRA 23 series Release 13 (NAS, SMS)

•

3GPP E-UTRA 24 series Release 13 (NAS)

•

3GPP E-UTRA 31 series Release 13 (UICC)

•

3GPP E-UTRA 33 series Release 13 (security)

•

3GPP E-UTRA 36 series Release 13 (RAN)

•

ftp://ftp.3gpp.org/Specs/archive/

•

http://www.3gpp2.org/public_html/specs/CS0015-0.pdf

•

https://tools.ietf.org/html/

[3]

Testspecifications:

3GPP E-UTRA 36 series Release 13 (RAN)

ftp://ftp.3gpp.org/Specs/archive/

•

3GPP TR 21.905: "Vocabulary for 3GPP Specifications"

Core technology specifications:

• 3GPP2 C.S0015-A v1.0 (SMS)

• IETF, RFC 3261, 4861, 4862, 6434

For more information, see

[4]

Vocabularyreference:

For more information, see http://www.3gpp.org/ftp/specs/archive/21_series/21.905/

Changes in this Document

This is the first edition of the document.

M210-AM Datasheet Page 4 of 38

Documentation Conventions

General Conventions

Note

Important information requiring the user’s attention.

Caution

A condition or circumstance that may cause damage to the equipment or loss of data.

Warning

A condition or circumstance that may cause personal injury.

Italics

Italic font style denotes

•

emphasis of an important word;

•

first use of a new term;

•

title of a document.

Screen Name

Sans serif, bold font denotes

•

on-screen name of a window, dialog box or field;

•

keys on a keyboard;

•

labels printed on the equipment.

Software Conventions

Code

Regular Courier font denotes code or text displayed on-screen.

Code

Bold Courier font denotes commands and parameters that you enter exactly as shown. Multiple parameters are grouped in brackets [ ]. If you are to choose only one among grouped parameters, the choices are separated with a pipe: [parm1 | parm2 | parm3] If there is no pipe separator, you must enter each parameter: [parm1 parm2 parm3]

Code

Italic Courier font denotes parameters that require you to enter a value or variable. Multiple parameters are grouped in brackets [ ]. If you are to choose only one among grouped parameters, the choices are separated with a pipe: [parm1 | parm2 | parm3] If there is no pipe separator, you must enter a value for each parameter: [parm1 parm2 parm3]

This section illustrates the conventions that are used in this document.

M210-AM Datasheet Page 5 of 38

Table of Contents

About this Datasheet............................................................................................................. 3

Purpose and Scope................................................................................................................................... 3

Who Should Read this Datasheet...........................................................................................................3

References.................................................................................................................................................. 3

Changes in this Document........................................................................................................................4

Documentation Conventions....................................................................................................................5

Table of Contents....................................................................................................................6

1 Product Features

................................................................................................................

1.1 Features Description................................................................................................................ 8

2 FCC Regulation Warning...............................................................................................13

• Manual Information To the End User....................................................................................13

• Federal Communication Commission Interference Statement.........................................13

• Radiation Exposure Statement..............................................................................................13

• End Product Labeling..............................................................................................................14

This device is intended only for OEM integrators under the following conditions:...........14

3 Physical Characteristics............................................................................................... 15

3.1 ECCN and Part Number

..........................................................................................................

3.2 Electrical Operating Conditions.............................................................................................. 16

3.2.1 Detailed Information.................................................................................................................... 16

3.2.2 M210-AM Power Tree.................................................................................................................16

3.2.3 Power Supplies Environment.................................................................................................... 18

3.3 Environmental Operating Conditions..................................................................................... 19

3.3.1 Temperature..................................................................................................................................19

3.3.2 Humidity......................................................................................................................................... 19

3.4 Power Supply Dimensioning................................................................................................... 20

3.5 I/O Characteristics

....................................................................................................................

3.6 Performance.............................................................................................................................. 25

M210-AM Datasheet Page 6 of 38

3.7 Component Reliability.............................................................................................................. 26

3.8 Package Description.................................................................................................................26

3.8.1 Module Footprint.......................................................................................................................... 26

3.8.2 Marking Information.....................................................................................................................30

3.9 Packing Information..................................................................................................................30

3.10 Storage Conditions

.................................................................................................................

3.11 Mounting Considerations.......................................................................................................31

4 Signal and Pins................................................................................................................. 32

4.1 M210-AM Pinout

.......................................................................................................................

4.2 UART Interfaces........................................................................................................................33

4.2.1

High-Speed UARTs................................................................................................................ 33

4.3 Power-up Sequence

.................................................................................................................

4.4 LTE Low Power Mode..............................................................................................................35

A Acronyms......................................................................................................................... 36

M210-AM Datasheet Page 7 of 38

1 Product Features

1.1

M210-AM-00

Features Description

M210-AM modules include Monarch SQN3330 Cat-M1 baseband, a complete dual band RF front end, memory and required circuitry to meet 3GPP EUTRA (Long Term Evolution - LTE, Release 13 set of specifications) and Verizon Wireless LTE Cat-M1 UE specifications.

For more information on the core technology specifications see the section

References on page 3. The terms M210-AM module refer to the hardware

and the associated embedded software.

The architecture block diagram of the M210-AM is presented on Figure 1-1.

M210-AM Datasheet Page 8 of 38

Figure 1-1: M210-AM-00 Block Diagram

Table 1-1 on page 10 provides detail on general features of the M210-

AM.

Table 1-2 on page 11 provides detail for the LTE-related

features of the M210-AM.

M210-AM’s ECCN and part number are detailed in the Section 3.1 ECCN and

Part Number on page 15.

Table 1-1: General Features

General interfaces

•

JTAG

•

I2C (reserved)

•

USIM

•

SPI (reserved)

•

GPIO

•

UART (x3, including one reserved)

Supported Frequency Bands

•

LTE Band 4

•

LTE Band 13

Operation voltages

•

bat1

(range from 3.1 V to 4.5 V)

Packaging

•

LGA module

• 108 pads (21.35 x 20.25 x 1.79 mm)

•

RoHS compliant, halogen-free

M210-AM Datasheet Page 9 of 38

Operating temperature

•

RF compliant -30°C to +60°C (ambient)

•

Operational: -40°C to +85°C (board)

See also Section 3.3 Environmental Operating Conditions on page 19.

Humidity

• 10% to 85% See also Section 3.3 Environmental Operating Conditions on page 19.

M210-AM Datasheet Page 10 of 38

Table 1-2: LTE Features

Standard compliance

•

3GPP E-UTRA Release 13 compliant

PHY

•

One UL and one DL transceiver

•

Support of HD-FDD Duplexing

•

Category M1 UE

•

Channel 1.4 MHz bandwidth

•

Normal and extended cyclic prefix

•

Support of MPDCCH

•

Modulation

DL: QPSK, 16QAM

UL: QPSK, 16QAM

•

All coding schemes corresponding to modulations

•

All channel coding (turbo-coding with interleaver, tail biting convolutional coding,

block and repetition coding) and CRC lengths

•

Sounding (including in special subframes)

•

Control and data in special subframes

•

All power control schemes and DL power allocation schemes

•

HARQ Incremental Redundancy and Chase Combining, with bundling or multi-

plexing

•

Measurements and computations related to CQI (Channel Quality Indicator), PMI

(Pre-coding Matrix Indicator) and RI (Rank Indicator), RSRP, and RSRQ

•

UEPCOP (from 3GPP Release 12) Power Saving Mode

MAC

•

Random Access procedure in normal and special subframes

•

Scheduling Request, Buffer Status Reporting, and Power Headroom Reporting

•

Discontinuous reception (DRX, eDRX) with long and short cycles

•

Fast scanning

•

Hosted configuration

•

IPv4, IPv6

•

RoHC

•

Location based services

•

Advanced QoS features

RLC

•

ARQ modes: UM, AM, and TM

PDCP

•

Ciphering and deciphering: NULL, AES, SNOW 3G

•

Integrity and protection: AES, SNOW 3G

RRC

•

MIB and new SIB1bis

•

Intra and inter-frequency measurements and handover

•

Up to 8 Data Radio Bearers supported

•

Support of CE (Coverage Extension) Mode

M210-AM Datasheet Page 11 of 38

Table 1-2: LTE Features (Continued)

NAS and above

•

NAS

•

SMS over SG

•

LWM2M Client

M210-AM Datasheet Page 12 of 38

2 FCC Regulation Warning

•

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end

user regarding how to install or remove this RF module in the user's

manual of the end product which integrates this module.

The end user manual shall include all required regulatory informa-

tion/warning as show in this manual.

•

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to

the following two conditions: (1) This device may not cause harmful inter-

ference, and (2) this device must accept any interference received,

including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a

Class B digital device, pursuant to Part 15 of the FCC Rules. These limits

aredesigned toprovide reasonableprotectionagainst harmfulinterference

in aresidential installation.This equipment generates,uses and can radiate

radio frequency energy and, if not installed and used in accordance with

theinstructions,may causeharmful interferenceto radiocommunications.

However, there is no guarantee that interference will not occur in a partic-

ularinstallation. Ifthis equipmentdoes causeharmful interferencetoradio

or televisionreception, whichcan be determined byturning theequipment

off and on, the user is encouraged to try to correct the interference by one

of the following measures:

–

Reorient or relocate the receiving antenna.

–

Increase the separation between the equipment and receiver.

–

Connect the equipment into an outlet on a circuit differentfrom that to

which the receiver is connected.

–

Consult the dealer or an experienced radio/TV technician for help.

Any changes or modificationsnot expressly approved by theparty respon-

sible for compliance could void the user's authority to operate this equip-

ment. This transmitter must not be co-located or operating in conjunction

with any other antenna or transmitter.

•

RadiationExposure Statement

This equipment complies with FCC radiation exposure limits set forth for

an uncontrolled environment. This equipment should be installed and

operatedwith minimum distance 20 cm between the radiator & your body.

M210-AM Datasheet Page 13 of 38

•

This device is intended only for OEM integrators under the following

conditions:

The antenna must be installed such that 20 cm is maintained between the

antenna and users,

The transmitter module may not be co-located with any other transmitter

or antenna.

To complywith FCCregulationslimiting bothmaximum RFoutput power

•

10 dBi in 700 MHz Band

•

6 dBi in 1700 MHz Band

Assuming collocated with an ordinaryWLAN/WiMaxtransmitter with 34

dBm average EIRP power

•

6.5 dBi in Cellular band

•

6 dBi in PCS band

Remark: This assumption is not valid if the output power of the collocated

WLAN/ WiMax transmitter is higher than 34 dBm.

The product using this module must also comply with the maximum

antenna gain to meet FCC EMC and RF exposure related limits. The

modular grant lists those maximum gain values.

The OEM integrator needs show that the product hosting this module

15.107 and 15.109, respectively).

End Product Labeling

When the module is installed in the host device, the FCC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: "Contains FCC ID: ZMOM210AM". The grantee's FCC ID can be used only when all FCC compliance requirements are met.

and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile exposure condition must not exceed:

StandaloneCondition:

In theevent thatthese conditionscannot be met(for examplecertainlaptop configurations or co-location with another transmitter), then the FCC authorization is no longerconsidered valid and the FCCID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

needs to be compliant with radiated and conducted emissions limits for unintentional radiators (digital devices) per 15B testing (limits in part

M210-AM Datasheet Page 14 of 38

3 Physical Characteristics

3.1

ECCN and Part Number

The ECCN and orderable partnumberof the M210-AM modules will be

provided in a future revision of the document.

M210-AM Datasheet Page 15 of 38

3.2

Electrical Operating Conditions

3.2.1

Detailed Information

Table 3-1: Electrical Operating Conditions for M210-AM

Direction

Minimum

Typical

Maximum

VBAT1

3.1 V

4.5 V

SIM_VCC (1.8 V or 3.0 V)

Out

1.62 V

1.8 V

1.98 V

2.7 V

3.0 V

3.3 V

1V8 See note below.

Out

1.71 V

1.8 V

1.89 V 3V0

Out

2.85 V

3.0 V

3.15 V

VCC1_PA

2.85 V

3.0 V

3.3 V

VCC2_PA

2.85 V

3.0 V

3.3 V

3.2.2

M210-AM Power Tree

Figure 3-1 provides a representation of the power tree of the M210-AM.

Note: 1.

The maximum current consumption allowed from the 1V8 refer-

ence pin is 100 mA.

2.Each output reference voltage (1V8, 3V0) can be either running or powered off depending on the internal software configuration. They should not be used to power external IC or parts that require permanent supply.

M210-AM Datasheet Page 16 of 38

Figure 3-1: M210-AM Power Tree

M210-AM Datasheet Page 17 of 38

3.2.3

Power Supplies Environment

Figure 3-2 illustrates the connections between the RF front-end power

supplies of the M210-AM.

Figure 3-2: M210-AM LTE RF Front-End Power Supplies Diagram

M210-AM

M210-AM Datasheet Page 18 of 38

3.3

Environmental Operating Conditions

3.3.1

Temperature

•

RF compliant: -30°C to +60°C (ambient)

•

Operational, with additional software to limit TxPower: -40°C to +85°C

(measured on board)

•

Storage: -40°C to +85°C

3.3.2

Humidity

•

Operating: 10% to 85% (non condensing)

•

Storage: 5% to 85% (non condensing)

M210-AM Datasheet Page 19 of 38

3.4

Power Supply Dimensioning

Important: - Information provided here is estimated peak current consump-

Average and detailed power consumption figures are provided

Estimated Peak Power Consumption

Estimated Battery Peak

Current (for V

BAT1

=4.2 V)

TX Power = 23 dBm

1.8 W

430 mA

TX Power = 20 dBm

1.6 W

380 mA

TX Power = 18 dBm

1.5 W

360 mA

TX Power = 13 dBm

1.3 W

310 mA

1.1 W

260 mA

tion for the M210-AM Module in various LTE Tx/Rx configurations, with and without DC/DC losses.

in Sequans’ Software Release Notes.

Table 3-2: Estimated Peak Current and Peak Power Consumption (LTE Band 13)

M210-AM Datasheet Page 20 of 38

3.5

I/O Characteristics

The voltage and current characteristics of the various IO pads of the M210-

AM versus IO bank supply voltage are illustrated in the tables below.

Caution:

Refer to M210-AM Pin List to know the type of IO pad used on every

termination.

•

The Minimum values for Ioland Iohshould not be exceeded to guarantee

•

The Nominal valuesfor Ioland Iohrepresentthe nominal values for thepad

•

The Maximum values for Ioland Iohrepresent the maximal values for the

that the logical level are not spoiled for each pad type.

type. They are provided for information only.

pad type. They are provided for information only.

Note that the Vohvalues in the tables below do not apply to GPIOsconfiguredin open drainmode.GPIOscan beindividually

configured in open drain mode. When in open drain mode they either drive the line to Vol, or leave it floating, to be pulled up by

an externalpullup resistance. ThePCB designer must ensure that the voltage on these pads never exceeds Vihof the IO group to

which they belong.

M210-AM Datasheet Page 21 of 38

Table 3-3: DC Characteristics for Digital IOs, Voltage 1.8 V

Parameter

Drive

Strength

Min.

Nom.

Max.

Unit

Input Low Voltage

-0.3

0.63

Input High Voltage

1.17

3.6

Threshold Point

0.79

0.87

0.94

T+

Schmitt Trigger Low to High Threshold Point

1.12

1.22

T-

Schmitt Trigger High to Low Threshold Point

0.61

0.71

0.8

T PU

Threshold Point with Pull-up Resistor Enabled

0.79

0.86

0.93

T PD

Threshold Point with Pull-down Resistor Enabled

0.8

0.87

0.95

T+ PU

Schmitt Trigger Low to High Threshold Point with Pull-up Resistor Enabled

1.12

1.21

T- PU

Schmitt Trigger High to Low Threshold Point with Pull-up Resistor Enabled

0.61

0.7

0.8

T+ PD

Schmitt Trigger Low to High Threshold Point with Pull-down Resistor Enabled

1.01

1.13

1.23

T- PD

Schmitt Trigger High to Low Threshold Point with Pull-down Resistor Enabled

0.62

0.72

0.81

V I

Input Leakage Current @ VI=1.8V or 0V

±10

µA

Tri-state Output Leakage Current @ VO=1.8V or 0V

±10

µA Input Capacitance

M210-AM Datasheet Page 22 of 38

Table 3-3: DC Characteristics for Digital IOs, Voltage 1.8 V - BIDIR and IN Types

Parameter

Drive

Strength

Min.

Nom.

Max.

Unit

Pull-up Resistor

5689148

kOhm

Pull-down Resistor

5290167

kOhm

Output Low Voltage

0.45

Output High Voltage

1.35

Low Level Output Current at VOL(max)

2 mA

1.2

2.2

3.6mA4 mA

2.3

4.3

7.1mA8 mA

4.6

8.6

14.3

High Level Output Current at VOH(max)

2 mA

1.0

2.4

4.6mA4 mA

2.0

4.7

9.2

8 mA

4.0

9.4

18.4

Parameter

Drive

Strength

Min.

Nom.

Max.

Unit

Input Low Voltage

-0.3

0.4

Input High Voltage

1.1

VBAT1 +

0.3

Parameter

Min.

Nom.

Max.

Unit

Input Low Voltage

0.2

Table 3-4: DC Characteristics for IN_PMU Type

Table 3-5: DC Characteristics - BIDIR_WAKE Type

M210-AM Datasheet Page23of

ERFORMANCE

Table 3-5: DC Characteristics - BIDIR_WAKE Type (Continued)

Parameter

Min.

Nom.

Max.

Unit

Input High Voltage. See note below related to maximum value.

0.8

3.6

V V

Output Low Voltage

Output High Voltage

1.6

1.8

HYSICALCHARACTERISTICS

M210-AM Datasheet Page 24 of 38

3.6

Performance

Table 3-5 and Table 3-6 present the M210-AM module’s performance in LTE

Band 4 and Band 13.

Table 3-5: Output Power

LTE Band

Frequency (kHz)

TCH

Conducted Power (dBm) Bandwidth 1.4 MHz, Full

Band 13

779500

23205

23 +2/-2.7

782000

23230

23 +2/-2.7

784500

23255

23 +2/-2.7

Band 4

1712500

19975

23 +2/-2.7

1732500

20175

23 +2/-2.7

1752500

20375

23 +2/-2.7

LTE Band

Frequency (kHz)

TCH

Typ. Sensitivity level

(dBm)

Bandwidth 1.4 MHz

Band 13

748500

5205

-103

751000

5230

-103

753500

5255

-103

Band 4

2112500

1975

-103

2132500

2175

-103

2152500

2375

-103

Table 3-6: RF Sensitivity

M210-AM Datasheet Page 25 of 38

3.7

Component Reliability

Note:

3.8

Package Description

3.8.1

Module Footprint

The dimensions marked in Figure 3-4 are listed in Table 3-7.

Information relatedto component reliability will beprovided in a future edition of this document.

Figure 3-4: Top and Side View of the M210-AM

M210-AM Datasheet Page 26 of 38

Table 3-7: M210-AM Outline Dimensions

Mark

Minimum (mm)

Nominal (mm)

Maximum (mm)

21.25

21.35

21.45

20.15

20.25

20.35

1.71

1.79

1.94

Not Available

0.08

M210-AM Datasheet Page 27 of 38

The dimensions marked in Figure 3-5 are listed in Table 3-8.

Mark

Dimension and tolerance (mm)

21.35 ± 0.1

20.25 ± 0.1

12 ± 1.0

4.125 ± 0.5

10.8 ± 1.0

4.725 ± 0.5

M210-AM Datasheet Page 28 of 38

Figure 3-5: M210-AM Bottom Side View of Pads

Table 3-8: M210-AM Dimensions and Tolerances

Table 3-8: M210-AM Dimensions and Tolerances (Continued)

Mark

Dimension and tolerance (mm)

0.6 ± 0.05

1.2 ± 0.1

0.6 ± 0.05

0.9 ± 0.1

0.325 ± 0.05

0.6 ± 0.05

19.2 ± 0.2

18 ± 0.2

1.075 ± 0.1

1.675 ± 0.15

6.125 ± 0.5

6.8 ± 0.5

1.2 ± 0.01

0.5 ± 0.05

0.9 ± 0.1

7 ± 0.5

6.725 ± 0.5

18.9 ± 0.2

15.9 ± 0.2

M210-AM Datasheet Page 29 of 38

3.8.2

Marking Information

Figure 3-6: M210-AM-00 Marking Description

3.9

Packing Information

3.10

Storage Conditions

Calculated shelf life in sealed bag : 12 months at < 40°C and < 90% RH

Peak package body temperature: 250°C

After bag is opened, devices thatwill be subjected to reflow solder or other

high temperature process must be:

The module is delivered in Tape-and-Reel.

Note:

M210-AM Datasheet Page 30 of 38

Details about packingofthe moduleswill be provided in a future revision of this document.

Additional storage conditions impacting the mounting process are providedinSection 3.11Mounting Considerations on page31.

mounted within 168 hours of factory conditions ≤ 30°C/60%RH, or

Stored as per J-STD-033

Devices require bake, before mounting, if

HumidityIndicator Card reads >10%for level2a-5a devicesor >60%for

level 2 devices when read at 23±5°C

3a or 3b above are not met

If baking is required, refer to IPC/FEDEC J-STD-033 for bake procedure.

Note:

3.11

Mounting Considerations

Note:

Details will be provided in a future revision of this document.

The M210-AM can support up to 3 reflows with 250°C maximum.

Parameter

Setting

Peak package body temperature

To be defined

Liquidous Time

To be defined

Preheat/Soak

To be defined

Ramp-up rate

To be defined

Ramp-down rate

To be defined

This section provides reflow information.

Table 3-10: Reflow Parameters

Level and body temperature are defined by IPC/JEDEC J-STD-020.

M210-AM Datasheet Page 31 of 38

4 Signal and Pins

4.1

M210-AM Pinout

The signals and all the related details are listed in the MS-Excel companion

file delivered together with the present document in a PDF portfolio.

The pads listed in Table 4-1 are connected to ground.

Pad #

Pad Name

Comment

1 20 22 24 26 28 30 31 32 33 34 42 43 45 46 53 55 62 63 64 65 66 68 69 70 71 72 73 74 86 87

GND

All GND pads shall be connected to the same copper.

T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 T23 T24 T25 T26 T27 T28 T29 T30

GND

T1 to T30 pads are used as both GND and thermal drops.

Table 4-1: Ground and Thermal Pads

M210-AM Datasheet Page 32 of 38

4.2

UART Interfaces

4.2.1

High-Speed UARTs

Figure 4-1 representsthe typical implementation for thehardware flowcontrol

M210-AM are designed for use as DCE (Data Communication Equipment).

•

Port TXD on Application sends data to the module’s TXD signal line.

•

Port RXD on Application receives data from the module’s RXD signal line.

Note:

CLK signals can be input or output.

4.3

Power-up Sequence

M210-AM

for UART0, UART1 and UART2. TDX and RDX signals are mandatory. RTS and CTS are strongly recommended.The other signals are optional.

Based on the conventions for DCE-DTE connections, the DCE device will communicate with the customer application (DTE) using the following signals:

M210-AM Datasheet Page 33 of 38

Figure 4-1: UART0, UART1 and UART2 Signals Convention and Flow

Control

The following timing requirement applies to the signals VBAT1,

MODULE_PWR_EN and RESET_N. It must be respected for proper M210-

AM’sbehavior.

Figure 4-3: VBAT1, MODULE_PWR_EN and RESET_N Signals Timing

Symbol

Description

Minimum Duration

Maximum Duration

VBAT1 setup time

1 ms

ts1

RESET_N setup time

1 ms

th1

RESET_N hold time

1 µs

Requirement for Cold Start

Figure 4-4: VBAT1, MODULE_PWR_EN and RESET_N Signals Timing

Requirement for Warm Start

Figure 4-5: VBAT1, MODULE_PWR_EN and RESET_N Signals Timing

Requirement for Reset Cycle

The timing minimum values are listed in Table 4-3.

Table 4-3: VBAT1, MODULE_PWR_EN and RESET_N Signal Timing Values

M210-AM Datasheet Page 34 of 38

4.4

LTE Low Power Mode

Important: The M210-AM module is provided with an internal RTC whose

The M210-AM will automatically enter in low-power mode. M210-AM can be

woken from low power mode by external sources through:

•

SIM_DETECTinput signal to cope with SIM card insertion into a SIM card

connector with built-in hardware detection. The default configuration to

wake-up the module is a low-to-high transition.

•

The RTS0 input signal whenever data traffic is initiated by the host

connected to the module UART0 with hardware flow control; The default

configuration to wake-up the module is a high-to-low transition.

•

Two dedicated input signal WAKE0 and WAKE1; The default configura-

tion to wake-up the module is on a high-to-low transition. This can be

modified by software. As example, these signals can be used to detect an

alarm from an external IC such as a sensor. Software can disable the

wake-up functionality on these signals.

•

A subset of GPIO input signals:GPIO2, GPIO3, GPIO25,GPIO27, GPIO42;

they are not configured by default as wake-up source but software can

configure them for future use.

•

Pads that are not driven by an external device shall be driven low by soft-

ware if they have a GPIO or RFDATA mode that allows it.

•

For pads that are known to be driven by an external device:

Configure that external device to hold the signal stable during low-power

mode, and configure M210-AM to treat that pin as an input, without

internal pull-up or pull-down.

•

For pads where,at the time of low-power mode, the signal may or may not

be driven by an external device:

ConfigureM210-AM to enable theinternal pull-up/pull-down on thepad to

guarantee that it will not be floating during low-power mode.

supply is VBAT1. As a consequence, VBAT1 should not be removed, in order to keep RTC active.

Important: WAKE inputs are detected on level (configurable by software

to 0 or 1) that must last at least 5 periods of the 32 kHz clock, that is 156.25 ìs.

Toget the lowest possible power consumption during low-power mode, all IOs must be stable. At software configuration time, take care of the following, to prevent them from being in conflict or floating:

Note:

M210-AM Datasheet Page 35 of 38

Each signal’s pull (up or down) is determined by register. It can be modified by software. Please see the default configuration in the signal’s list.

A Acronyms

Acronym

Definition

AFE

Analog Front-End

APC

Automatic Control Power

APT

AveragePower Tracking

Coverage Extension

COO

Country of origin

CPU

Central Processing Unit

DC/DC

Direct current converter

Downlink

DPLL

Digital Phase-Locked Loop

ECCN

Export Control Classification Number

EPS

Evolved Packet System

ESD

Electro-static discharge

ETSI

European Telecommunications Standard Institute

GND

Ground

GNSS

Global Navigation Satellite System. Superset for systems such as GPS, Galileo, Glonass, BeiDou or QZSS among others.

GPIO

General Purpose Input Output

HBM

Human Body Model (ESD)

I/O

Input/Output

I2C

Inter-integrated circuit (bus)

M210-AM Datasheet Page 36 of 38

Acronym

Definition

IMEI

International Mobile Equipment Identity

IMS

Instant Messaging Service

Internet Protocol

JTAG

Joint Test Action Group. See IEEE 1149.7 specification

LDO

Low Drop-Out regulator

LGA

Large Grid Array

LNA

Low-Noise Amplifier

LTE

Long Term Evolution, or 4G. Standard is developed by the 3GPP

www.3gpp.org

Machine Model (ESD)

NAS

Network Access Server

NVM

Non Volatile Memory

OMADM

Open Mobile Alliance Device Management

PCB

Printed Circuit Board

PHY

Physical Layer

PLL

Phase-Locked Loop

PMIC

Power Management Integrated Circuit

pSRAM

Pseudo-Static Random Access Memory

QTY

Quantity

RAM

Random Access Memory

Resource Block

Radio Frequency

RFIC

RF Integrated Circuit

RoHS

Restriction of Hazardous Substances

RTC

Real-Time Clock

Reception

M210-AM Datasheet Page 37 of 38

Acronym

Definition

S/N

or SN: Serial Number

SAW

Surface Acoustic Wave(filters)

SDM

Socketed Device Model (ESD)

SIM

Subscriber Identification Module

SMS

Short Message Service

SPI

Serial Peripheral Interface

TCXO

Temperature-controlledcrystal oscillator

Transmission

UART

Universal asynchronous receiver transmitter.

User Equipment

UICC

Universal integrated circuit card (SIM)

Uplink

XTAL

Crystal

M210-AM Datasheet Page 38 of 38

Fibocom Wireless M210AM User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual