Fibocom Wireless L850GLL Users Manual

L850-GL Hardware User Manual

Version：V1.0.3 Update date：2/25/2017

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Applicability Table

No. Product model

1

L850-GL

Description

NA

L850-GL Hardware User Manual

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permission of the copyright holder, any company or individual is prohibited to

excerpt, copy any part of or the entire document, or distribute the document in any form.

The document is subject to update from time to time owing to the product vers

reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,

information and suggestions contained in the document do not constitute any explicit or implicit guarantee.

Remark

Modify the PCIe Interface Application;

Update the Pin Definition: change pin65 to NC

Modify the description

Update the content of PCIe

Add the power Consumption of 3CA

Add product certification of warnings

Copyright

Without the prior written

Notice

ion upgrade or other

Version Record

Version Update date

V1.0.0 2016-12-08 Draft

V1.0.1

2016-12-16

V1.0.2

V1.0.3 2017-02-25

2017-02-09

L850-GL Hardware User Manual

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................................

Power Consumption

................................

Sequence

................................

Definition

Application

................................

Definition

................................

Contents

1

Foreword

................................................................

.......... 7

1.1 Introduction

1.2 Reference Standard

1.3 Related Documents

2

Overview

2.1 Introduction

2.2 Specification

2.3 Warnings

2.3.1

2.3.2

2.3.3

2.4 CA combinations

FCC Statement

IC Statement

CE Statement

2.5 Application Framework

2.6 Hardware Framework

3

Application Interface

3.1 M.2Interface

................................................................

................................

.......... 7

........................... 7

............................ 7

.......... 8

........ 8

.............. 9

................................ 9

.................................. 11

................................ 12

............................... 13

.................... 14

...................... 15

................... 15

....... 15

3.1.1

Pin Distribution

3.1.2

Pin Definition

3.2 Power Supply

3.2.1

Power Supply

3.2.2

Logic level

3.2.3

3.3 Control Signal

3.3.1

Module Start-Up

3.3.1.1

3.3.1.2

3.3.2

Module Shutdown

3.3.3

Module Reset

Start-upCircuit

Start-upTiming

3.4 USB Interface

3.4.1

USB Interface

3.4.2

USB2.0 Interface

................................................................

................................

................................................................

................................

................................................................

................................

................................................................

................................

................................................................

.............................. 16

.................................. 17

.... 21

................................. 21

...... 22

..................... 23

.... 25

............................ 25

............... 25

........................... 25

......................... 26

................................. 27

.... 28

............... 28

...... 28

3.5 PCIe Interface

3.5.1

L850-GL Hardware User Manual

PCIe Interface

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................................................................

................................

................................... 29

.............. 29

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Application

................................

Circuit

Slot

................................

nctionality

RFConnector Characteristic

Dimension

................................

3.5.2

PCIe Interface

................................................................

........... 29

3.6 USIMInterface

3.6.1

3.6.2

3.6.3

3.6.4

3.7 Status Indicator

3.7.1

3.7.2

3.7.3

USIM Pins

USIM Interface

3.6.2.1

3.6.2.2

USIM Hot-Plugging

USIM Design

LED#1Signal

WOWWAN#

TX_BLANKING

3.8 Interrupt Control

3.8.1

W_DISABLE1#

3.8.2

BODYSAR

3.9 ClockInterface

N.C. SIMCard

N.O. SIM Card

................................................................

................................

................................................................

................................

................................................................

................................

................................... 31

...... 31

.................. 32

........................................ 32

...................................... 32

....................... 33

.................................. 34

................................. 34

.................................. 35

................................... 35

.............................. 36

................................ 36

.............................. 36

...... 37

................................... 37

3.10 ANT Tunable Interface

3.11 Config Interface

3.12 Other Interfaces

4

Radio Frequency

4.1 RF Interface

4.1.1

4.1.2

4.1.3

4.2 Operating Band

4.3 Transmitting Power

4.4 Receiver Sensitivity

4.5 GNSS

4.6 Antenna Design

5

Structure Specification

5.1 Product Appearance

RF Interface Fu

RF Connector

................................................................

................................

.................. 37

.............................. 38

.......................... 39

....... 39

............ 39

........ 39

............. 39

................................. 41

.......................... 42

.......................... 43

................. 44

................................ 45

.............. 47

........................ 47

5.2 Dimension of Structure

5.3 M.2 Interface Model

5.4 M.2 Connector

5.5 Storage

L850-GL Hardware User Manual

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................................

.................... 47

.......................... 48

................................... 48

............... 49

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................................

5.5.1

Storage Life

................................

.................................... 49

5.6 Packing

5.6.1

Tray Package

5.6.2

Tray size

................................................................

................................

................................................................

............... 49

................................. 50

......... 51

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The document describes the electrical characteristics, RF performance, dimensions and application

(hereinafter referred to as L850). With the assistance of the document and

other instructions, the developers can quickly understand the hardware functions of L850 modules and

Standard

The design of the product complies with

1 V10.8.0: User Equipment (UE) conformance specification;Radio transmission

and reception (FDD);Part 1: Conformance specification

3GPP TS 34.122 V10.1.0: Technical Specification Group Radio Access Network; Radio

ansmission and reception (TDD)

1 V10.6.0: User Equipment (UE) conformance specification; Radio transmission

and reception; Part 1: Conformance testing 3GPP TS 21.111 V10.0.0: USIM and IC card requirements 3GPP TS 51.011 V4.15.0: Specifica

3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)

3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Applic 3GPP TS 36.124 V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals

3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE) 3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipme

DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)

PCI Express M.2 Specification Rev1.0

Documents

L850 Module Performance Testing Report RF Antenna Application Design

Family System Driver Integration and Application Guidance Family AT CommandsManual

Mobile Equipment

Data Circuit terminating Equipment

1

Foreword

1.1

Introduction

environment, etc. of L850-GL

develop products.

1.2

Reference

3GPP TS 34.121-



tr

3GPP TS 36.521-



(SIM-ME) interface



the following standards:

tion of the Subscriber Identity Module -

application



and ancillary equipment



(DTE -



1.3

 L8- L8-

L850-GL Hardware User Manual

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Specification

ation Toolkit(USAT)

nt -

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L850 is a highly integrated 4G wireless communication module that adopts standard PCIe M.2 interface

supports LTE FDD/LTE TDD/WCDMA/ system. It is applicable to most broadband communication

networks of the mobile operator across the world.

LTE FDD: Band 1,2,3,4,5,7,8,11,12,13,17,18,19,20,21,26,28,29,30,66

LTE TDD: Band 38, 39, 40, 41

WCDMA/HSPA+: Band 1,2,4,5,8

GNSS/Beidou: support

UMTS/HSPA+

～

Normal operating temperature:

operating temperature:

Storage temperature:

Interface: M.2 Key

：

Weight: About5.8 g

WWAN Main Antenna x 1

WWAN Diversity Antenna x 1

When LTE TDD achieves maximum DL rate, its UL rate can

HSDPA+:42Mbps DL(Cat 24)/5.76Mbps UL(Cat6)

2

Overview

2.1

Introduction

and

2.2

Specification

Operating Band

Data Transmission

LTE FDD

LTE TDD

450Mbps DL/50Mbps UL(Cat 9)

260Mbps DL/30Mbps UL(Cat 9)

reach 10Mbps only

UMTS:384 kbps DL/384 kbps UL

DC-

Power Supply

Temperature

Physical

characteristics

Interface

Antenna

L850-GL Hardware User Manual

Reproduction

DC 3.135V

Expand

Dimension

4.4V,Typical 3.3V

-10°C ～+55°C

-20°C ～+70°C

-40°C ～+85°C

-B

30 x 42 x 2.3mm

-

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3V/1.8V

just for debugging

Tunable antenna

I2S(Reserved)

I2C(Reserved)

USB3.0(not supported yet)

3GPP TS 27.007 and 27.005

Multiple carrier

Windows MBIM support

Windows update

For normal operating temperature, LTE FDD Band 4 and 13 can support the temperature

to +60

Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two

(1) This device may not cause harmful interference, and (2) this device must accept any interferenc

received, including interference that may cause undesired operation.

Function Interface

Software

USIM

USB 2.0

PCIe 1.0 X1

W_Disable#

BodySar

LED

Clock

（

）

Protocol Stack

AT commands

Firmware update PCIe

IPV4/IPV6

Other feature

AGNSS

Note:

ranging from -20℃

2.3

Warnings

℃.

2.3.1

FCC Statement

L850-GL Hardware User Manual

Reproduction

Federal

-

conditions:

e

Page 9 of 51

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This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant

to Part 15 of the FCC Rules. These limits are designed to pr

interference in a residential installation. This equipment generates, uses and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause harmful interference

to radio communications. However, there is no guarantee that interference will not occur in a particular

installation. If this equipment does cause harmful interference to radio or television reception, which can

be determined by turning the equipment off

interference by one of the following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circu

to which the receiver is connected.

Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications not expressly approved by the party responsible for compliance could

authority to operate this

located or operating in conjunction with any other antenna or

This equipment complies with FCC radiation exposure limits set forth for an unc

This equipment should be installed and operated with

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20

users, and the maximum antenna gain allowed for use with this device is 5

The transmitter module may not be co

As long as 2 conditions above are met, further

integrator is still responsible for testing their end

and on, the user is encouraged to try to correct the

cm is maintained between the antenna and

dBi.

antenna.

test will not be required. However, the OEM

product for any additional compliance requirements



it different from that

FCC Caution:



void the user's

equipment.

This transmitter must not be co-

transmitter.

Radiation Exposure Statement:

your body.

1)

2)

-located with any other transmitter or

transmitter

-

ontrolled environment.

between the radiator &

required with this module installed

L850-GL Hardware User Manual

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In the event that these conditions

another

used

evaluating the end product (including the transmi

This transmitter module is authorized only for use in device where the antenna may be installed such that

20 cm may be maintained between the antenna and users. The final end product m

Contains FCC ID: ZMOL850GL

only when all FCC compliance requirements are met.

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or

remove this RF module in the user’s manual of the end product which integrates this module. The end

user manual shall include all required regulatory

This device complies with Industry Canada license

this device may not cause interference, this device must accept any interference, including interference that may cause undesired

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux

exempts de licence. L'exploitation

l'appareil ne doit pas produire de brouillage, l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage

est susceptible d'en compromettre le

This Class B digital apparatus complies with Canadian

Cet appareil numérique de la classe B est conforme à la norme NMB

This device complies with RSS

e does not cause harmful

la

condition que cet appareil ne provoque aucune interférence

(for example certain laptop

circumstances,

”. The grantee's FCC ID can be used

exempt RSS standard(s). Operation is

suivantes:

003 du

310 of Industry Canada. Operation is subject to the condition

la

L'opération

IMPORTANT NOTE:

can not be met

configurations or co-location with

valid and the FCC ID can not be

be responsible for re-

authorization.

transmitter), then the FCC authorization

on the final product. In these

is no longer considered

the OEM integrator will

End Product Labeling

visible area with the following: “

L

ust be labeled in a

2.3.2

IC Statement

Industry Canada statement



the following two conditions:

1)

2)

operation of the device.



1)

2)



est autorisée aux deux conditions

and

fonctionnement.

-

et

ICES-003.

-

Canada.

subject to

appareils radio



devic

 Cet appareil est conforme à

L850-GL Hardware User Manual

-

interference.

norme RSS-310 d'Industrie Canada.

nuisible.

ritten authorization -

that this

est soumise à la

Page 11 of 51

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antenna(s) antenna or transmitter, except tested built

Cet appareil et son antenne ne doivent pas être situés ou fonctionner en conjonction avec antenne ou un autre émetteur, ex

The County Code Selection feature is disabled for products marketed in the US/

l'indicatif

This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This

equipment should be installed and operated with minimum distance 20cm between the radiator &

Déclaration d'exposition aux radiations:

Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un

environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de

re la source de rayonnement et votre corps.

Hereby, We, Manufacturer name declares that the radio equipment type L850

of the final product must be mass against the Essential requirements of the

Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article

is 5 dBi

Declaration of Conformity(should include manufacturer contact info.)

Please added certification standard in your user manual which depended on the test standards your

If the DoC should be a simplified ve

full text of the EU declaration of conformity is available at the following internet address: http//

conjunction

produits

GL is in compliance with

separation distance is 20cm.

 This device and its

must not be co-located or operating in

with any other





 La fonction de sélection de

États-Unis et au Canada.

-in radios.

du pays est désactivée pour les

une autre

testées.

Canada.

commercialisés aux

Radiation Exposure Statement:

body.

your

distance ent

IC : 21374-L850GL

2.3.3

► EU Regulatory Conformance

the Directive 2014/53/EU.

CE Statement

-

In all cases assessment

Directive 2014/53/EU

3.2 requirements.

The maximum antenna gain for

►

and the antenna

device performed.,

fibocom.com

L850-GL Hardware User Manual

The

www.

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GL is in conformity with the relevant Union

2014 / 53 / EUwith reference to the following standards applied:

Health (Article 3.1(a) of Directive 2014/53/EU)

Safety (Article 3.1(a) of Directive 2014/53/EU)

1: 2006 + A11: 2009 + A1: 2010 + A12: 2011 + A2: 2013

Electromagnetic compatibility (Article 3.1 (b) of Directive 2014/53/EU)

3 V2.1.0 /

usage (Article 3.2 of Directive 2014/53/EU)

2 V11.1.1 /V11.1.1

combination

harmonization legislation: Radio Equipment directive:

L850-

Applied Standard(s):

EN 62311 : 2008

Applied Standard(s):

EN 60950-

Applied Standard(s):

Draft EN 301 489-1 V2.1.1 / -

-52 V1.1.0

Radio frequency spectrum

Applied Standard(s):

Draft EN 301 511 V12.1.10

EN 301 908-1 V11.1.1 / -

2.4

CA

s

CA Combinations

2CA

Inter-band

1+3,5,18,19,20,21,26

2+4,5,12,13,17,29,30,66

3+5,7,8,19,20,28

4+5,12,13,17,29,30

5+7,30,66

7+20,28

12+30

13+66

Intra-band

L850-GL Hardware User Manual

29+30

2,3,4,7,40,41

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2 contiguous plus inter

Framework

The peripheralapplicationsfor L850 module are shown in Figure 2

1+19+21

2+4+5, 2+4+13, 2+5+30, 2+12+30, 2+29+30

5+66+66, 13+66+66, 66+66+2, 66+66+66

CA Combinations

Inter-band

1+3+7, 1+3+19, 1+3+20,

3+7+20, 3+7+28

4+5+30, 4+12+30, 4+29+30

5+66+2, 13+66+2

2+2+5, 2+2+13

3+3+7, 3+7+7, 3+3+20

4+4+5, 4+4+13

3CA

2.5

Application

-band

-1:

L850-GL Hardware User Manual

Figure2-1 Application Framework

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Framework

The hardware framework in Figure 2

GSM/UMTS/LTE FDD controller/Power supply

NAND/internal LPDDR2 RAM

Interface

The L850 module applies standard M.2 Key

2 shows the main hardware functions of L850 module,

2.6

Hardware

base band and RF functions.

-

including

Baseband contains the followings:



Application interface

RF contains the followings:

RF Transceiver

RF Power/PA

RF Front end

RF Filter

Antenna

3 Application

3.1

M.2Interface

L850-GL Hardware User Manual

Figure 2-2 Hardware Framework

-B interface, with a total of 75 pins.

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Pin “Notch” represents the gap of t

3.1.1

Pin Distribution

Note:

L850-GL Hardware User Manual

Figure 3-1 Pin Distribution

he gold fingers.

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Reset Value

NC PU

PD

GND PD

NC,L850 M.2 module is configured as

PCIe,USB3.0 interface

power

GND,L850 M.2 module is configured as

PCIe,USB3.0 interface

on

open

3.1.2

The pin definition is as follows:

Pin Pin Name I/O

1

2

3

4

5

6

7

Pin Definition

CONFIG_3

+3.3V PI

GND

+3.3V PI

GND

FUL_CARD_ POWER_OFF#

USB D+ I/O

O

I

8

W_DISABLE1# I

Pin Description

the WWAN – type

Power input

GND

Power input

GND

Power enable,Module input,internal pull up

USB Data Plus

WWAN Disable,active low

Type

Power Supply

CMOS

3.3/1.8V

0.3---3V

CMOS

3.3/1.8V

9

USB D- I/O

10 LED1#

11 GND

12 Notch

13 Notch

14 Notch

15 Notch

16 Notch

17 Notch

18 Notch

19 Notch

20 I2S_CLK

O

T

O

USB Data Minus

System status LED,Output drain,CMOS 3.3V

GND

Notch

I2S Serial clock, Reserved

0.3---3V

CMOS 3.3V

Power Supply

CMOS 1.8V

21 CONFIG_0

22 I2S_RX

L850-GL Hardware User Manual

I

I2S Serial receive data,

the WWAN – type

CMOS 1.8V

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Reset Value

PD

PU

PD

PU

PCIe TX Differential signals Positive

Pin Pin Name I/O

23 WOWWAN#

24 I2S_TX

25 DPR

O

I

26 W_DISABLE2# I

27 GND

28 I2S_WA

USB3.0‐Tx‐

29

30 UIM_RESET

USB3.0‐Tx+

31

O

Pin Description

Reserved

Wake up host

L

I2S Serial transmit data, Reserved

Body SAR Detect,active low

GNSS disable,active low, Reserved

GND

I2S Word alignment/select, Reserved

USB3.0 Transmit data minus, Not support now

SIM reset signal

USB3.0 Transmit data plus, Not support now

Type

CMOS 1.8V

CMOS

3.3/1.8V

CMOS

3.3/1.8V

Power Supply

CMOS 1.8V

1.8V/3V

32 UIM_CLK

33 GND

34 UIM_DATA I/O

USB3.0‐Rx‐

35

36 UIM_PWR

USB3.0‐Rx+

37

38 NC

39 GND

40 GNSS_SCL

41 PETn0

42 GNSS_SDA

O

I

O

I

O

I/O

L

SIM clock Signal

GND

SIM data input/output

USB3.0 receive data minus, Not support now

SIM power supply,3V/1.8V

USB3.0 receive data plus, Not support now

NC

GND

I2C Serial clock, Reserved

PCIe TX Differential signals Negative

I2C Serial data input/output, Reserved

1.8V/3V

Power Supply

1.8V/3V

Power Supply

CMOS 1.8V

43 PETp0

L850-GL Hardware User Manual

O

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Reset Value

PD PD

PD

Differential signals Positive

Reset is a functional reset to the

In card as defined by the PCIe Mini

Clock Request is a reference clock

signal as defined by the PCIe

Mini Card CEM specification; Also used

PCIe PME Wake. Open Drain with pull

Wireless Coexistence between WWAN and WiFi/BT modules. IDC_UART_TXD,

between WWAN

IDC_UART_RXD

Pin Pin Name I/O

44 GNSS_IRQ

45 GND

46 SYSCLK

47 PERn0

48 TX_BLANKING

49 PERp0

50 PERST#

51 GND

52

CLKREQ#

I

O

I

O

I

O

Pin Description

26M clock output

PA Blanking Timer

T

GNSS Interrupt Request, Reserved

GND

PCIe RX Differential signals Negative

PCIe RX

PEAddCard CEM specification

GND

T

request

Type

CMOS 1.8V

Power Supply

1.8V

CMOS 1.8V

CMOS 3.3V

Power Supply

CMOS 3.3V

53 REFCLKN

54 PEWAKE#

55 REFCLKP

RFE_RFFE2_

56

SCLK

57 GND

RFE_RFFE2_

58

SDATA

59 ANTCTL0

60 COEX3

I

O

L

I

O

by L1 PM Substates

PCIe Reference Clock signal Negative

up on platform,active low

PCIe Reference Clock signal Positive

MIPI Interface Tunable ANT, RFFE2 clock,Open Drain output

GND

MIPI Interface Tunable ANT, RFFE2 data,Open Drain output

Tunable ANT CTRL0

Reserved

CMOS 3.3V

CMOS

3.3/1.8V

Power Supply

CMOS

3.3/1.8V

CMOS 1.8V

CMOS

3.3/1.8V

61 ANTCTL1

62 COEX2

L850-GL Hardware User Manual

O

I

T

Tunable ANT CTRL1

Wireless Coexistence and WiFi/BT modules,

ritten authorization -

CMOS 1.8V

Page 19 of 51

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Reset Value

PD

GND

Reset Value: The initial status after modulereset, not the status when working.

The unused pins can be left floating.

Wireless Coexistence between WWAN

GNSS_EXT_FTA

SIM Detect,internal pull up(330KΩ),

input,internal

GND,L850 M.2 module is configured as

PCIe,USB3.0 interface

GND,L850 M.2 module is configured as

PCIe,USB3.0 interface

pull

Pin Pin Name I/O

63 ANTCTL2

64 COEX1

65 NC

66 SIM_DETECT

67 RESET#

68 NC

69 CONFIG_1

O

T

I

O

Pin Description

,Reserved

Tunable ANT CTRL2

Type

CMOS 1.8V

and WiFi/BT modules, ,Reserved

NC

active high

WWAN reset up(10KΩ),active low

NC

the WWAN – type

CMOS 1.8V

O

Power input

GND

Power input

GND

Power input

the WWAN – type

70 +3.3V PI

71 GND

72 +3.3V PI

73 GND

74 +3.3V PI

75 CONFIG_2

H:High Voltage Level

L: Low Voltage Level PD:Pull-Down

PU:Pull-Up

T:Tristate

OD:Open Drain

Power Supply

PP:Push-Pull

PI: Power Input

PO: Power Output

Note:

L850-GL Hardware User Manual

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Page 20 of 51

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The power interface of L850 module as shown in the following table:

I/O

PI

PO

L850 module uses PCIe interface, according to the PCIe specification, the PCIe Vmain should be used as

the +3.3V power source, not the Vaux. The Vaux is the PCIe backup power source and

as the power supply. In addition, the DC/DC power supply other than PCIe ports should not be used as

the external power cannot control the module status through the PCIe protocol.

The L850 module should be powered through

The filter capacitor design for power supply as shown in the following

stabilizing

Digital signal noise

DC Parameter

Typical

Value

3.3

1.8V/3V

the +3.3V pins, and the power supply design is shown in

Reduce power fluctuations of the module in operation, requiring capacitors with

LDO or DC/DC power supply requires the capacitor of no less than The capacitor for battery power supply can

Filter out the interference generated from the clock

3.2

Power Supply

（V）

2,4,70,72,74 +3.3V

36 UIM_PWR

3.2.1

Figure 3-2:

Power Supply

Pin Name

Pin Description

Power supply input 3.135

USIM power supply

Minimum

Value

4.4

Maximum

Value

it is not sufficient

Figure 3-2 Power Supply Design

Recommended

capacitance

220uF x 2

1uF,100nF

L850-GL Hardware User Manual

Application

Voltagecapacitors

table:

Description



reduced to 100~200uF

and digital signals

low ESR.

440uF

be

-

Page 21 of 51

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MHzfrequency band

1500/1700/1800/1900,2100/ 2300,2500/2600MHzfrequen

The stable power supply can ensure the normal operation of L850 module;and the ripple of the

supply should be less than 300mV in design. When the module operates with themaximum emission

power, the maximum operating current can reach 1000mA, so the power source should be not lower than

3.135V, or the module may shut down or reboot. The power

The L850module 1.8V logic level definitionas shown in the following table:

Minimum

1.71

1.3

-

The L850module 3.3V logic level definition as shown in the following table:

Minimum

3.135

2.3

-

band RF interference

frequency

supply limits are shown in Figure 3

Maximum

Recommended

capacitance

39pF,33pF

18pF,8.2pF,6.8pF

Application

700/800,

cy band

850/900

Description

Filter out low frequency

Filter out interference

medium/high

frequency

band

RF

Figure 3-3 Power Supply Limit

-3:

3.2.2

Logic level

power

Parameters

1.8V logic level

V

IH

V

IL

1.8 1.89

0.3

Typical

1.8 1.89

Parameters

3.3V logic level

V

IH

V

IL

L850-GL Hardware User Manual

3.3 3.465

0.3

Typical

3.3 3.465

0

0.5

0

0.9

Unit

V

Unit

V

-

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Consumption

In the condition of 3.3V power supply, the L850 power consumption as shown in the following table:

Paging cycle #64 frames (0.64 sec DRx cycle)

3.2.3

Power

Parameter

Mode

Condition

Average

Current(mA)

I

off

Power off

WCDMA

Power supply,module power off

DRX=6

DRX=8

0.08

2.5

1.8

I

Sleep

I

WCDMA-RMS

DRX=9

LTE FDD

LTE TDD

Radio Off

AT+CFUN=4,Flight mode

WCDMA Data transfer Band 1 @+23.5dBm

WCDMA Data transfer Band 2 @+23.5dBm

WCDMA

WCDMA Data transfer Band 4 @+23.5dBm

1.6

2.6

2.8

1.2

680

710

500

I

LTE-RMS

WCDMA Data transfer Band 5 @+23.5dBm

WCDMA Data transfer Band 8 @+23.5dBm

LTE FDD Data transfer Band 1 @+23dBm

530

580

760

LTE FDD Data transfer Band 2 @+23dBm

760

LTE FDD Data transfer Band 3 @+23dBm

770

LTE FDD Data transfer Band 4 @+23dBm

LTE FDD Data transfer Band 5 @+23dBm

LTE FDD Data transfer Band 7 @+23dBm

710

550

TBD

LTE FDD

LTE FDD Data transfer Band 8 @+23dBm

LTE FDD Data transfer Band 11 @+23dBm

LTE FDD Data transfer Band 12 @+23dBm

LTE FDD Data transfer Band 13 @+23dBm

LTE FDD Data transfer Band 17 @+23dBm

540

TBD

600

560

580

LTE FDD Data transfer Band 18 @+23dBm

LTE FDD Data transfer Band 19 @+23dBm

LTE FDD Data transfer Band 20 @+23dBm

L850-GL Hardware User Manual

560

520

630

-

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The power consumption of L850 in 3CA mode as shown in the following tables:

1+3+7, 1+3+19, 1+3+20, 1+19+21

2+4+13, 2+5+30, 2+12+30, 2+29+30

5+66+66, 13+66+66, 66+66+2, 66+66+66

average value obtained by testing some samples.

Parameter

Mode

Condition

Average

Current(mA)

LTE FDD Data transfer Band 21 @+23dBm

LTE FDD Data transfer Band 26 @+23dBm

LTE FDD Data transfer Band 28 @+23dBm

LTE FDD Data transfer Band 30 @+23dBm

LTE FDD Data transfer Band 66 @+23dBm

LTE TDD Data transfer Band 38 @+23dBm

LTE TDD Data transfer Band 39 @+23dBm

LTE TDD

LTE TDD Data transfer Band 40 @+23dBm

LTE TDD Data transfer Band 41 @+23dBm

Condition

3CA Combination

(LTE FDD 3CA, Full RB)

Band 1 @+22dBm

Band 2 @+22dBm

Band 3 @+22dBm

Band 4 @+22dBm

TBD

540

530

TBD

700

450

320

420

440

Average

Current(mA)

720

880

860

760

2+4+5,

3+7+20, 3+7+28

4+5+30, 4+12+30, 4+29+30

5+66+2, 13+66+2

2+2+5, 2+2+13

3+3+7, 3+7+7, 3+3+20

4+4+5, 4+4+13

Note：

The data above is an

L850-GL Hardware User Manual

Band 5 @+22dBm

Band 7 @+22dBm

Band 12 @+22dBm

Band 13 @+22dBm

Band 19 @+22dBm

Band 20 @+22dBm

Band 21 @+22dBm

Band 28 @+22dBm

Band 30 @+22dBm

Band 66 @+22dBm

-

800

1110

790

630

760

750

950

720

1330

710

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The L850 module provides two control signals for power on/off and reset operations, the pin defined as

FUL_CARD_POWER_OFF# pin needs an external 3.3V or 1.8V pull up for booting up. The

VDD_1V8 should be provided from the external circuit. AP (Application Processor) controls the module

and the circuit design is shown in Figure3

igure 3

Sequence

After powering on, the module will start

more than 20ms (100msis recommended). Meanwhile, the module will output 1.8V voltag

VSD2_1V8 pin and start the initialization process. The start

I/O

up Controlled by AP

up by pulling upthe FUL_CARD_POWER_OFF# signal for

up timing is shown in Figure 3

Power on/off signal,internalpull

High or floating: Power on

Reset signal, internal 10KΩ

3.3

Control Signal

shown in the following table:

Pin Pin Name

6

67 RESET#

FUL_CARD_POWER_ OFF#

Reset Value Functions

I

PU

I

-up

Low : Power off

pull-up,active low

Type

3.3/1.8V

1.8V

3.3.1

3.3.1.1

Module Start-Up

Start-upCircuit

The

start-up，

3.3.1.2

Start-upTiming

F

-4 Circuit for Module Start-

-4:

-

L850-GL Hardware User Manual

e through

-

-5:

Page 25 of 51

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The VSD2_1V8 signal is the internal PMU 1.8V output voltage which is not connected

interface. The above timing of VSD2_1V8 is only for reference.

The RESET# is required to pull high with a t

tocharge thecapacitors for +3.3V power supply. If the +3.3V power supply is already

before starting upthe module, the delay time can be ignored.

Shutdown

The module can be shut down by the following controls:

Sending AT+CPWROFF command

FUL_CARD_POWER_OFF# pin

The module can be shut downby sending AT+CPWROFF command. When the module receives the

software shutdown command, the module will start the finalization process (the reverse process of

initialization), andit will be completed after 3s. In the finalization

SIM card and some other parameters from memory, then clear the memory and PMU will be powered off.

After shutdown, the VSD2_1V8 voltage is also shut down. The software control timing isshown in Figure

delay after the +3.3V, because it takes some time

recommend

Only used whena hardware exception occurs

and the software control cannot be used.

Figure 3-5 Timing Control for Start-up

Note:

3.3.2

Module

Shutdown Control Action

Software

Pull down

Hardware

on1

Condition

Normal shutdown(

to the M.2

stable

)

3-6:

L850-GL Hardware User Manual

-

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Figure 3

After the software shutdown, the FUL_CARD_POWER_OFF # pin will remain high which prevents the

module from restarting again. Toenable the next restart, the FUL_CARD_POWER_OFF#pin should be

The VSD2_1V8 signal is the internal PMU 1.8V output voltage which is not connected to the M.2

interface. The above timing of VSD2_1V8 is only for reference.

The L850 module can reset to its initial

(100msis recommended), and the module will restart after the RESET# signal is released. When the

customer executes RESET# function, the PMU remains its power inside the module. The recommended

cuit design is shown in the Figure 3

Figure 3

The reset control timing is shown in Figure 3

pulled low after shutting down.

Note:

-6 Software Shutdown Timing Control

3.3.3

cir

Module Reset

-7:

-7 Recommended Design for Reset Circuit

L850-GL Hardware User Manual

-8:

-

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RESET# is a sensitive signal, it’s

case of PCB layout, the RESET# signal lines should keep away from the RF interference and

protected by GND. Also, the RESET# signal lines shall neither near the PCB edge nor route on

planes to avoid module from reset caused by ESD problems.

The L850 module supports USB2.0 which is compatible with USB High

Speed (12 Mbit/s). For the USB timing and electrical specification of L850 module,

to“Universal Serial Bus Specification 2.0”.

Definition

Reset Value

Application

USB interface is used for debugging only, so it only needs to introduce the USB interface test in hardware

Speed (480 Mbit/s) and USB Full

Figure 3-10 Reset Timing Control

Note:

the surface

3.4 USB Interface

USB interface just for debugging.

-

please refer

3.4.1

Pin# Pin Name I/O

7

9

3.4.2

design.

L850-GL Hardware User Manual

USB Interface

USB_D+

USB_D-

I/O

USB2.0 Interface

Description

USB Data Plus

USB Data Minus

Type

0.3---3V,

USB2.0

0.3---3V,

USB2.0

-

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L850 module supports PCIe 1.0 interface and one data

After L850 module is inserted into PC, PCIe interface can, work with the drive program, map an MBIM

port and a GNSS port in Win10 system. While MBIM interface is used for initiating data service in Win10

receiving GNSS

Definition

Reset Value

Application

The reference circuit is shown in Figure 3

Reset is a functional reset to the Add

defined by the PCIe Mini Card CEM

Clock Request is a reference clock request

signal as defined by the PCIe Mini Card CEM

specification; Also used by L1 PM Substates

Wake. Open Drain with pull up on

In

3.5

PCIe Interface

transmission channel.

system and GNSS interface for

3.5.1

Pin# Pin Name I/O

41

43 PETP0

47

49 PERP0

53

55

PCIe Interface

PETn0

PERn0

REFCLKN I

REFCLKP I

O

I

data.

Description

PCIe TX Differential signals

Negative

PCIe TX Differential signals Positive

PCIe RX Differential signals

NegativeBit0

PCIe RX Differential signals Positive

PCIe Reference Clock signal

Negative

PCIe Reference Clock signal

Positive

Type

50

52

54

PERST#

CLKREQ#

PEWAKE# O

I

O

L

T

3.5.2

PCIe Interface

PE-

card as

specification

PCIe PME

platform,active low

-9:

CMOS 3.3V

L850-GL Hardware User Manual

-

Page 29 of 51

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Figure 3

L850 module supports one PCIe 1.0 interface,

receiving pair RXP/N and clock pair CLKP/N.

PCIe can achieve the maximum transmission rate of 2.5 GT/s, and must strictly follow the rules below in

The differential signal pair lines shall

The differential signal pair lines shall be short if possible and be controlled within 500mm for AP end;

The impedance of differential signal pair lines is recommended to be 100 ohm, and can be

120 ohm i

It shall avoid the discontinuous reference ground, such as segment and space;

When the differential signal lines go through different layers, the via hole of grounding signal should

be in close to that of signal, and gene

holes and the lines shall never cross the segment of plane;

Try to avoid bended lines and avoid introducing common

influence the signal integrity and EMI of

angle of all lines should be equal or greater than 135

lines should be larger than 20mil, and the line caused by bending should be greater than 1.5 times line width at least. When a serpentine line is used for length match with another line, the

bended length of each segment shall be at least 3 times the line

spacing between the bended part of the serpentine line and another one of the differential lines

must be less than 2 times the spacing of normal differential lines (S1<2S);

mode noise in the system, which will

, the spacing between difference pair

-9 Reference Circuit for PCIe Interface

PCB Layout:



controlled to 80～



be parallel and equal in length;

n accordance with PCIe protocol;

-3 grounding signal via

-

-10, the bending

L850-GL Hardware User Manual

°

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≥ 3W). The largest

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The difference in length of two data lines in difference pair should be within

match is required for all parts. When the length match is conducted for the differential lines, the

designed position of correct match should be close to that of incorrect match, as shown in Figure

11. However, there is no specific r

pair, that is, the length match is only required in the internal differential lines rather than between

different difference pairs. The length match should be close to the signal pin and pass

-

in USIM card interface, which supports 1.8V and 3V SIM cards.

The USIM pins descriptionas shown in the

I/O

PO

5mil, and the length



Figure 3-10 Requirement of PCIe Line

3-

small-angle bending design.

3.6

USIMInterface

Figure 3

the

The L850 module has a built-

3.6.1

Pin Pin Name

36 UIM_PWR

L850-GL Hardware User Manual

USIM Pins

following table:

Reset Value Description

USIM power supply

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Type

1.8V/3V

Page 31 of 51

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I/O

Circuit

The reference circuit design for N.C. (Normally Closed)SIM card slot is shown in Figure 3

Figure 3

The principlesof theN.C.SIM card slot are described as follows:

is detached, it connects the short circuit between CD and SW pins, and drives the

When the SIM card is inserted, it connects an open circuit between CD and SW pins, and drives the

circuit design for N.O. (Normally Open) SIM card slot is shown in Figure 3

USIM data,internal pull up(4.7KΩ)

USIM card detect, internal 390K

Active high, and high level indicates

SIM card is inserted; and low level

indicates SIM card is detached.

Pin Pin Name

Reset Value Description

Type

30 UIM_RESET

32 UIM_CLK

34 UIM_DATA

66

SIM_DETECT

3.6.2

3.6.2.1

USIM Interface

N.C. SIMCard Slot

O

I

L

USIM reset

L

USIM clock

L

pull-up.

PD

1.8V/3V

1.8V

-12:

When the SIM card

SIM_DETECT pin low.



SIM_DETECT pin high.

3.6.2.2

N.O. SIM Card Slot

The reference

L850-GL Hardware User Manual

-12Reference Circuit for N.C. SIM Card Slot

-13:

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13

The principlesof theN.O.SIM card slot are described as

When the SIM card is detached, it con

the SIM_DETECT pin low.

inserted,

Plugging

The L850 module supports the SIM

inserted or detached by detecting the SIM_DETECT pin state of the SIM card slot.

plugging function can be configuredby “AT+MSMPD” command, and the description for

AT command as shown in the following table:

plugging detection functionis enabled, the module detects that the SIM card is

insertedwhen the SIM_DETECT pin is high, then executes the initialization program and finish the

plugging function, which determines whether the SIM card is

plugging detection function is

The module can detect whether the SIM card is inserted or not

plugging detect function is disabled.

when starting up, and the

SIM_DETECT status will not be detected.

Figure 3-



When the SIM card is

SIM_DETECT pin high.

Reference Circuit for N.O. SIM Card Slot

follows:

it connects the short circuit between CD and

3.6.3

The SIM card hot-

AT Command

AT+MSMPD=1

AT+MSMPD=0

USIM Hot-

Hot-plugging

Detection

Enable

Disable

card hot-

Function Description

Default value, the SIM card hot-

enabled.

through the SIM_DETECT pin state.

The SIM card hot-

The module readsthe SIM card

SW pins, and drives the

After the SIM card hot-

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network registration after reading the SIM ca

module determines that the SIM card is detachedand does not read the SIM card.

By default, SIM_DETECT is active

command. Please refer to the

The SIM card circuit design shall meet the EMC standards and ESD requirements with the

improvedcapability to resist interference, to ensure that the SIM card can work stably. Thefollowing

be noted in case of design:

The SIM card slotplacement should near the module as close as possible, and away from the RF

antenna, DC/DC power supply, clock signal lines, and other strong interference sources.

The SIM card slot with a metal shielding

The trace length between the SIM card slotand the module should not exceed 100mm, or it could

The UIM_CLK and UIM_DATA signal lines should be isolated by GND to avoid crosstalk

interference. If it is difficult for the layout, the whole SIM signal lines should be wrapped with

The filter capacitors and ESDdevices for SIM card signals should be placed near to the SIM card

slot, and the ESD devices with 22~

Indicator

The L850 module providesthree signals to indicate the operating status of the module, and the status

indicator pinsas shown in the following table:

Reset Value

high, which can be switched to active

interference ability.

output, externalGPS control

Note:

-

-low by the AT

3.6.4

guidelines should

USIM Design



reduce the signal quality.

housing can improve the anti-



GND as a group at least.



33pF capacitance should be used.

3.7

Status

Pin Pin Name

10 LED1#

23 WOWWAN#

48 TX_BLANKING

I/O

O

PD

PU

PD

Pin Description

System status LED, drain output.

Module wakes upHost (AP).

PA Blanking

signal.

Type

CMOS 3.3V

CMOS 1.8V

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The LED#1 signal is used to indicate the operating status of the module, and the detailed description as

follows:

The resistance of LED current

The WOWWAN# signal is used to wake the Host (AP) when there comes the data request.The definition

of WOWWAN# signal is as follows:

The WOWWAN# timing is shown in Figure 3

LED1#

Low level (LED On)

High level (LED Off)

WOWWAN# Signal

Pull low 1s then pull high (pulse

High level

limiting resistor is selected according to the driving voltage and

3.7.1

LED#1Signal

shown in the following table:

Module Status

RF function ON

RF function OFF

The LED driving circuit is as

Signal

Figure 3-14 LEDDriving Circuit

Note:

-

the driving current.

3.7.2

Operating Mode

data requests

Idle/Sleep

WOWWAN#

-15:

signal).

L850-GL Hardware User Manual

Figure 3-15 WOWWAN#Timing

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When the module operates in LTE TDD Band 39, TX_BLANKING outputs the pulse signal synchronous

As TDD TX may interfere the receiving of GPS signal, AP will disable GPS or stop GPS data receiving

when detecting TX_BLANKING pulse signal, so as to avoid abnormal operation of GPS.

s shown in Figure 3

Control

The L850 module provides four interrupt signals, and the pin definition is as follows:

The module provides a hardware pin to enable/disable WWAN RF function, and the function can also be

controlled by the AT command. The

definition of W_DISABLE1# signal is as follows:

Function

WWAN

WWAN function is disabled, the module entersFlight mode.

pulse signal synchronous with TDD burst TX

3.7.3

with TDD burst TX timing.

Operating Mode of Module

Default state

TDD burst TX(Band38)

TX_BLANKING

TX_BLANKING Signal

Low level

Output the

TX_BLANKING timing i

-16:

Figure 3-16 TX_BLANKING Timing

3.8

Interrupt

Pin Pin Name I/O

8

W_DISABLE1#

25 DPR

26 W_DISABLE2#

44 GNSS_IRQ

I

Reset Value Pin Description

PD

PU

PD

Enable/Disable RF network

Body SAR detection

GNSS Disablesignal, Reserved

GNSS Interrupt Request, Reserved

3.8.1

W_DISABLE1#

Type

CMOS 3.3V

CMOS 1.8V

W_DISABLE1# signal

High/Floating

Low

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The function of W_DISABLE1# can be customized, please refer to the software porting guide.

The L850 module supportsBody SARfunction by detecting the DPR pin. The voltage level of DPR is high

sensor

As the result, the module then lowers down its emission power to its default threshold value, thus

reducing theRF radiation onthe human body. The threshol

Commands. The definition ofDPR signalas shown in the following

The L850 module supports a clock interface, itcan output 26MHz clock.

Reset Value

Interface

The module supports ANT Tunable interfaces with two different

GPO interface. Through cooperating with external antenna adapter switch via ANT Tunable, it can flexibly

configure the bands of LTE antenna to improve the antenna’s working efficiency and save space for the

Function

The module keeps the default emission power

Lower the maximum emission power to the threshold value of the module.

Reset Value

signal

26M clock output, default disabled

can be used for externalGPS, etc

Tunable ANT control,MIPI Interface,

Tunable ANT control,MIPI Interface, Tunable ANT control,GPO interface,

Note：

3.8.2

by default, and when the SAR

DPR signal

High/Floating

Low

3.9

BODYSAR

ClockInterface

detects the closing human body, the DPR

table:

will be pulled down.

AT

Pin Pin Name I/O

46

SYSCLK

O

Pin Description

Type

1.8V

3.10

ANT Tunable

antenna.

Pin Pin Name I/O

RFE_RFFE2_

56

SCLK

RFE_RFFE2_

58

SDATA

59 ANTCTL0

O

Pin Description

RFFE2 clock,Open Drain output

RFFE2 data,Open Drain output

Type

CMOS

3.3/1.8V

CMOS

3.3/1.8V

CMOS 1.8V

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Reset Value

Interface

The L850 module provides four config pins for the

The M.2 module configuration as the following table:

Config_2

(pin75)

GND

Please refer to ”PCI Express M.2 Specification Rev1.0” for more details.

Interfaces

The module does not support other interfaces yet.

Reset Value

Tunable ANT control,GPO interface,

PCIe, USB3.0 type M.2

Module Type and Main

Pin Pin Name I/O

61 ANTCTL1

63 ANTCTL2

O

3.11

Config

module:

Pin Pin Name

1

CONFIG_3

21

CONFIG_0

69

CONFIG_1

75

CONFIG_2

I/O

O

L

O

L

O

L

O

Pin Description

Bit0

bit1

Bit2

configuration as the WWAN-

Pin Description

NC

Internally connected to GND

Type

CMOS 1.8V

Type

Config_0

(pin21)

GND GND

Config_1

(pin69)

Config_3

NC WWAN – PCIe,USB3.0

(pin1)

3.12

Other

Host Interface

Port

Configuration

0

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Frequency

Functionality

module supports two RF connectors used for external antenna connection. As the Figure 4

shows, “M” is for Main antenna, used to receive and transmit RF signals; “D/G” is for Diversity antenna,

used to receive the diversity RF signals.

Characteristic

DC to 6GHz

50Ω

Dimension

The L850 module adopts standard M.2 module RF connectors, the model name is

company, and the connector size is 2*2*0.6m. The connector dimension is shown as following picture:

Environment Condition

4 Radio

4.1

RF Interface

4.1.1

The L850

RF Interface

-1

Figure 4-1 RF connectors

4.1.2

Rated Condition

Frequency Range

Characteristic Impedance

4.1.3

RFConnector

RF Connector

Temperature Range

–40°C to +85°C

818004607

from ECT

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Figure 4

4 Schematic diagram of 0.81mm coaxial antenna connected to the RF connector

-2 RF connector dimensions

-3 0.81mm coaxial antenna dimensions

Figure 4-

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Band

The L850 module operating bands of the antennas are as follows:

LSMH Blocks A/B/C Japan Lower 800MHz

Japan Upper 800MHz

2570

1880

4.2

Operating

Band

Band 1 IMT 2100MHz

Band 2 PCS 1900MHz

Band 3 DCS 1800MHz

Band 4 AWS 1700MHz

Band 5 CLR 850MHz

Band 7 IMT-E 2600Mhz

Band 8 E-GSM 900MHz

Band 11 LPDC 1500MHz

Description

Band 12

700MHz

Band 13

USMH Block C

700MHz

Mode

LTE FDD/WCDMA 1920 - 1980

LTE FDD/WCDMA 1850 - 1910

LTE FDD 1710 - 1785

LTE FDD/WCDMA 1710 - 1755

LTE FDD/WCDMA 824 - 849

LTE FDD 2500 - 2570

LTE FDD/WCDMA 880 - 915

LTE FDD 1427.9 - 1447.9

LTE FDD

Tx (MHz)

699 - 716

777 - 787

Rx (MHz)

2110 - 2170

1930 - 1990

1805 - 1880

2110 - 2155

869 - 894

2620 - 2690

925 - 960

1475.9 - 1495.9

729 - 746

746 - 756

Band 17

Band 18

Band 19

Band 20 EUDD 800MHz

Band 21 UPDC 1500MHz

Band 26 ECLR 850MHz

Band 28 APAC 700MHz

Band 29

Band 30

Band 66 1700MHz

Band 38 IMT-E 2600MHz

LSMH Blocks B/C

700MHz

LSMH blocks D/E

700MHz

WCS blocks A

2300MHz

LTE FDD

LTE FDD 815 - 830

LTE FDD 830 - 845

LTE FDD 832 - 862

LTE FDD 1447.9 - 1462.9

LTE FDD 814 - 849

LTE FDD 703 - 748

LTE FDD

LTE FDD 1710 - 1780

LTE TDD

704 - 716

N/A

2305 - 2315

734 - 746

860 - 875

875 - 890

791 - 821

1495.9 - 1510.9

859 - 894

758 - 803

716 - 728

2350 - 2360

2110 - 2200

- 2620

Band 39 TDD 1900MHZ

L850-GL Hardware User Manual

LTE TDD

- 1920

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BRS/EBS 2500MHZ

Power

The transmitting power foreach band of the L850 moduleas shown in the following table:

2300

2496

10MHz Bandwidth, 1 RB

10MHz

10MHz Bandwidth, 1 RB

10MHz

10MHz Bandwidth, 1 RB

Operating

Band

Description

Mode

Tx (MHz)

Rx (MHz)

Band 40 IMT 2300MHz

Band 41

GPS L1

GLONASS

L1

BeiDou

4.3

Transmitting

LTE TDD

N/A

Mode Band

Band 1

WCDMA

Band 2

Band 4

Band 5

Tx Power(dBm) Note

23.5±1

- 2400

- 2690

1575.42±1.023

1602.5625±4

1561.098±2.046

LTE FDD

Band 8

Band 1

Band 2

Band 3

Band 4

Band 5

Band 7

Band 8

Band 11

Band 12

Band 13

Band 17

Band 18

23.5±1

23±1

Bandwidth, 1 RB

Band 19

Band 20

L850-GL Hardware User Manual

23±1

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Sensitivity

The receiver sensitivity foreach band of the L850 module as shown in the following table:

10MHz Bandwidth, 1 RB

10MHz

BER<0.1%

10MHz Bandwidth

10MHz

10MHz Bandwidth

Mode Band

Tx Power(dBm) Note

Band 21

Band 26

Band 28

Band 30

Band 66

Band 38

23±1

LTE TDD

Band 39

Band 40

Band 41

23±1

4.4

Receiver

Bandwidth, 1 RB

Mode

WCDMA

LTE FDD

Band

Band 1

Band 2

Band 4

Band 5

Band 8

Band 1

Band 2

Band 3

Band 4

Band 5

Band 7

Band 8

Rx Sensitivity(dBm)

Typical

TBD

Note

Bandwidth

Band 11

Band 12

Band 13

Band 17

L850-GL Hardware User Manual

TBD

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The above values are measuredfor the dual antennas situation(Main+Diversity). For single main

antenna (without Diversity), the sensitivity will drop around

L850 module supports GNSS/BeiDou and

10MHz Bandwidth

Test Result

Mode

Band

Band 18

Rx Sensitivity(dBm)

Typical

TBD

Note

LTE TDD

Band 19

Band 20

Band 21

Band 26

Band 28

Band 29

Band 30

Band 66

Band 38

Band 39

Band 40

Band 41

Note:

TBD

4.5

GNSS

integrated antenna.

Description

Power

Condition

GPS fixing TBD

GPS tracking TBD

GLONASS fixing TBD

GLONASS tracking TBD

BeiDou fixing TBD

BeiDou tracking TBD

Sleep TBD

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GPS/GLONASS/BeiDou

Please note that GPS current is tested with RF disabled.

Design

The L850module provides main and diversity antenna

L850 module Main antenna requirements

Test Result

The most proper antenna to adapt the frequencies should

Description

TTFF

AGNSS

GPS

Condition

Cold start TBD

Warm start TBD

Hot Start TBD

Cold start TBD

Open Sky TBD

Sensitivity

4.6

Antenna

GLONASS

BeiDou

Note:

Open Sky TBD

as shown in the following table:

Frequency range

Bandwidth(WCDMA)

Bandwidth(LTE)

WCDMA band 1(2100) : 250 MHz

WCDMA band 2(1900) : 140 MHz

WCDMA band 4(1700) : 445 MHz

WCDMA band 5(850) : 70 MHz

WCDMA band 8(900) : 80 MHz

LTE band 1(2100): 250 MHz

LTE band 2(1900): 140MHz

LTE Band 3(1800): 170 MHz

LTE band 4(1700): 445MHz

LTE band 5(850): 70 MHz

LTE band 7(2600): 190 MHz

be used.

LTE Band 8(900): 80 MHz

LTE Band 11(1500): 68 MHz

LTE Band 12(700): 47 MHz

LTE Band 13(700): 41 MHz

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L850 module Main antenna requirements

Bandwidth(GNSS/BeiDou)

LTE Band 17(700): 42 MHz

LTE Band 18(800): 80 MHz

LTE Band 19(800): 80 MHz

LTE band 20(800): 71 MHz

LTE band 21(1500): 63 MHz

LTE band 26(850): 80 MHz

LTE band 28(700): 100 MHz

LTE band 29(700): 12 MHz

LTE band 30(2300): 55 MHz

LTE band 66(1700): 490MHz

LTE band 38(2600): 50 MHz

LTE Band 39(1900): 40 MHz

LTE band 40(2300): 100 MHz

LTE band 41(2500): 194 MHz

GPS: 2MHz

GLONASS: 8MHz

Impedance

Input power

Recommended standing-wave ratio (SWR)

BeiDou: 4MHz

50Ohm

> 26dBmaverage power WCDMA & LTE

≤ 2:1

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Specification

Appearance

The product appearance for L850 module is shown in Figure5

Structure

The structuraldimensionof the L850 module is shown in Figure 5

5 Structure

5.1

Product

Figure 5-1 Module Appearance

-1:

5.2

Dimension of

-2:

Figure 5-2 Dimension of Structure

L850-GL Hardware User Manual

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Model

pin gold finger as external interface, where 67 pins are signal pins and 8

pins are notch pins as shown in Figure 3

on, L850 module adopts Type 3042

maximum height on t top layer is 1.5mm, PCB thickness is 0.8mm, and KEY ID is B).

The L850 module connects to AP via M.2 connector, it is recommended to use M.2 conn

LOTES company with the model APCI0026

1. For module dimension, please refer to chapter

B interface (30x42mm, the component

3. The package of connector,

5.3

M.2 Interface

The L850 M.2 module adopts 75-

the M.2 interface definiti

-

-S3-

5.2. Based on

5.4

M.2 Connector

please refer to the specification.

-P001A as shown in Figure 5-

ector from

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Page 48 of 51

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Figure 5

Storage Conditions (recommended): Temperature is 23 ± 5

Storage period (sealed vacuum packing): Under the recommended storage conditions, the storage life is

The L850 module uses the tray sealed vacu

the hard cartoon box, so that the storage, transportation and the usage of modules can be protected to

The module is a precision electronic product, and may suffer

electrostatic protection measures are taken.

, relative humidity is RH 35

-3 M.2 Dimension of Structure

5.5

Storage

5.5.1 Storage Life

12 months.

℃

-70%.

5.6

Packing

the greatest extent.

Note：

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The L850 module uses tray package,20 pcs are packed in each tray, with 5 trays in each box and 6 boxes

in each case. Tray packaging process is shown

5.6.1

Tray Package

in Figure 5-4:

Figure 5-4 Tray Packaging Process

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pallet size is 330*175*6.0mm, as shown in Figure 5

175.0±0.5

B1

159.0±0.3

9.0±0.2

43±0.3

24.5±0.5

5.6.2

The

Tray size

-5:

ITEM

DIM 330.0±0.5

ITEM A1

DIM 294.0±0.3

ITEM

DIM 105.0±0.2

G

L

W

H

6.0±0.3 0.5±0.1

C

20.0±0.5 9.0±0.5

J

T

A0

D

33.0±0.3

E

187.5±0.2

B0

F

Figure 5-5Tray Size (Unit: mm)

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