Fibocom Wireless L850GL Users Manual

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L850-GL Hardware User Manual

Version：V1.0.3

Update date：2/25/2017

L850-GL Hardware User Manual Page2of

Applicability Table

No.

Product model

Description

L850-GL

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Without the prior written permission of the copyright holder, any company or individual is prohibited to

excerpt, copy any part of or the entire document, or distribute the document in any form.

Notice

The document is subject to update from time to time owing to the product version upgrade or other

reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,

information and suggestions contained in the document do not constitute any explicit or implicit

guarantee.

Version Record

Version

Update date

Remark

V1.0.0

2016-12-08

Draft

V1.0.1

2016-12-16

Modify the PCIe Interface Application;

Update the Pin Definition: change pin65 to NC

V1.0.2

2017-02-09

Modify the description

Update the content of PCIe

Add the power Consumption of 3CA

V1.0.3

2017-02-25

Add product certification of warnings

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Contents

1 Foreword

..........................................................................................................................................

1.1 Introduction........................................................................................................................................... 7

1.2 Reference Standard............................................................................................................................ 7

1.3 Related Documents

.............................................................................................................................

2 Overview...........................................................................................................................................8

2.1 Introduction........................................................................................................................................... 8

2.2 Specification

..........................................................................................................................................

2.3 Warnings............................................................................................................................................... 9

2.3.1 FCC Statement...................................................................................................................................9

2.3.2 IC Statement.....................................................................................................................................11

2.3.3 CE Statement................................................................................................................................... 12

2.4 CA combinations................................................................................................................................13

2.5 Application Framework

.....................................................................................................................

2.6 Hardware Framework........................................................................................................................15

3 Application Interface...................................................................................................................15

3.1 M.2Interface

........................................................................................................................................

3.1.1 Pin Distribution.................................................................................................................................16

3.1.2 Pin Definition.................................................................................................................................... 17

3.2 Power Supply

.....................................................................................................................................

3.2.1 Power Supply................................................................................................................................... 21

3.2.2 Logic level......................................................................................................................................... 22

3.2.3 Power Consumption........................................................................................................................23

3.3 Control Signal.....................................................................................................................................25

3.3.1 Module Start-Up...............................................................................................................................25

3.3.1.1 Start-upCircuit.................................................................................................................................................25

3.3.1.2 Start-upTiming Sequence

.............................................................................................................................

3.3.2 Module Shutdown............................................................................................................................26

3.3.3 Module Reset................................................................................................................................... 27

3.4 USB Interface..................................................................................................................................... 28

3.4.1 USB Interface Definition................................................................................................................. 28

3.4.2 USB2.0 Interface Application.........................................................................................................28

3.5 PCIe Interface.................................................................................................................................... 29

3.5.1 PCIe Interface Definition................................................................................................................ 29

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3.5.2 PCIe Interface Application..............................................................................................................29

3.6 USIMInterface

....................................................................................................................................

3.6.1 USIM Pins......................................................................................................................................... 31

3.6.2 USIM Interface Circuit.....................................................................................................................32

3.6.2.1 N.C. SIMCard Slot......................................................................................................................................... 32

3.6.2.2 N.O. SIM Card Slot

........................................................................................................................................

3.6.3 USIM Hot-Plugging..........................................................................................................................33

3.6.4 USIM Design.................................................................................................................................... 34

3.7 Status Indicator.................................................................................................................................. 34

3.7.1 LED#1Signal.....................................................................................................................................35

3.7.2 WOWWAN#......................................................................................................................................35

3.7.3 TX_BLANKING................................................................................................................................ 36

3.8 Interrupt Control

.................................................................................................................................

3.8.1 W_DISABLE1#.................................................................................................................................36

3.8.2 BODYSAR........................................................................................................................................ 37

3.9 ClockInterface

....................................................................................................................................

3.10 ANT Tunable Interface

....................................................................................................................

3.11 Config Interface................................................................................................................................38

3.12 Other Interfaces

...............................................................................................................................

4 Radio Frequency

..........................................................................................................................

4.1 RF Interface........................................................................................................................................39

4.1.1 RF Interface Functionality..............................................................................................................39

4.1.2 RFConnector Characteristic.......................................................................................................... 39

4.1.3 RF Connector Dimension...............................................................................................................39

4.2 Operating Band

..................................................................................................................................

4.3 Transmitting Power

............................................................................................................................

4.4 Receiver Sensitivity........................................................................................................................... 43

4.5 GNSS

...................................................................................................................................................

4.6 Antenna Design

..................................................................................................................................

5 Structure Specification.............................................................................................................. 47

5.1 Product Appearance

..........................................................................................................................

5.2 Dimension of Structure

.....................................................................................................................

5.3 M.2 Interface Model...........................................................................................................................48

5.4 M.2 Connector

....................................................................................................................................

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5.5 Storage

................................................................................................................................................

5.5.1 Storage Life...................................................................................................................................... 49

5.6 Packing................................................................................................................................................49

5.6.1 Tray Package................................................................................................................................... 50

5.6.2 Tray size............................................................................................................................................51

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1 Foreword

1.1 Introduction

The document describes the electrical characteristics, RF performance, dimensions and application

environment, etc. of L850-GL (hereinafter referred to as L850). With the assistance of the document and

other instructions, the developers can quickly understand the hardware functions of L850 modules and

develop products.

1.2 Reference Standard

The design of the product complies with the following standards:

3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification;Radio transmission

and reception (FDD);Part 1: Conformance specification

3GPP TS 34.122 V10.1.0: Technical Specification Group Radio Access Network; Radio

transmission and reception (TDD)

3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radio transmission

and reception; Part 1: Conformance testing

3GPP TS 21.111 V10.0.0: USIM and IC card requirements

3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment

(SIM-ME) interface

3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)

application

3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application Toolkit(USAT)

3GPP TS 36.124 V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals

and ancillary equipment

3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)

3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment

(DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)

PCI Express M.2 Specification Rev1.0

1.3 Related Documents

L850 Module Performance Testing Report

RF Antenna Application Design Specification

L8-Family System Driver Integration and Application Guidance

L8-Family AT CommandsManual

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2 Overview

2.1 Introduction

L850 is a highly integrated 4G wireless communication module that adopts standard PCIe M.2 interface

and supports LTE FDD/LTE TDD/WCDMA/ system. It is applicable to most broadband communication

networks of the mobile operator across the world.

2.2 Specification

Specification

Operating Band

LTE FDD: Band 1,2,3,4,5,7,8,11,12,13,17,18,19,20,21,26,28,29,30,66

LTE TDD: Band 38, 39, 40, 41

WCDMA/HSPA+: Band 1,2,4,5,8

GNSS/Beidou: support

Data Transmission

LTE FDD

450Mbps DL/50Mbps UL(Cat 9)

LTE TDD

260Mbps DL/30Mbps UL(Cat 9)

When LTE TDD achieves maximum DL rate, its UL rate can

reach 10Mbps only

UMTS/HSPA+ UMTS:384 kbps DL/384 kbps UL

DC-HSDPA+:42Mbps DL(Cat 24)/5.76Mbps UL(Cat6)

Power Supply

DC 3.135V～4.4V,Typical 3.3V

Temperature

Normal operating temperature:-10°C ～+55°C

Expandoperating temperature:-20°C ～+70°C

Storage temperature: -40°C～+85°C

Physical

characteristics Interface: M.2 Key-B

Dimension：30 x 42 x 2.3mm

Weight: About5.8 g

Interface

Antenna WWAN Main Antenna x 1

WWAN Diversity Antenna x 1

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Function Interface

USIM 3V/1.8V

USB 2.0（just for debugging

）

PCIe 1.0 X1

W_Disable#

BodySar

LED

Clock

Tunable antenna

I2S(Reserved)

I2C(Reserved)

USB3.0(not supported yet)

Software

Protocol Stack

IPV4/IPV6

AT commands

3GPP TS 27.007 and 27.005

Firmware update

PCIe

Other feature

Multiple carrier

Windows MBIM support

Windows update

AGNSS

Note:

For normal operating temperature, LTE FDD Band 4 and 13 can support the temperature

ranging from -20℃ to +60℃.

2.3 Warnings

2.3.1 FCC Statement

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference

received, including interference that may cause undesired operation.

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This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant

to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful

interference in a residential installation. This equipment generates, uses and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause harmful interference

to radio communications. However, there is no guarantee that interference will not occur in a particular

installation. If this equipment does cause harmful interference to radio or television reception, which can

be determined by turning the equipment off and on, the user is encouraged to try to correct the

interference by one of the following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.



Connect the equipment into an outlet on a circuit different from that

to which the receiver is connected.

Consult the dealer or an experienced radio/TV technician for help.

FCC Caution:

Any changes or modifications not expressly approved by the party responsible for compliance could

void the user's authority to operate this equipment.

This transmitter must not be co-located or operating in conjunction with any other antenna or

transmitter.

Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.

This equipment should be installed and operated with minimum distance 20cm between the radiator &

your body.

This device is intended only for OEM integrators under the following conditions:

1) The antenna must be installed such that 20 cm is maintained between the antenna and

users, and the maximum antenna gain allowed for use with this device is 5 dBi.

2) The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM

integrator is still responsible for testing their end-product for any additional compliance requirements

required with this module installed

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IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop

configurations or co-location with another transmitter), then the FCC authorization is no longer considered

valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will

be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC

authorization.

End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be installed such that

20 cm may be maintained between the antenna and users. The final end product must be labeled in a

visible area with the following: “Contains FCC ID: ZMOL850GL”. The grantee's FCC ID can be used only

when all FCC compliance requirements are met.

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or

remove this RF module in the user’s manual of the end product which integrates this module. The end

user manual shall include all required regulatory information/warning as show in this manual.

2.3.2 IC Statement

Industry Canada statement



This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to

the following two conditions:

1) this device may not cause interference, and

2) this device must accept any interference, including interference that may cause undesired

operation of the device.



Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio

exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:

1) l'appareil ne doit pas produire de brouillage, et

2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage

est susceptible d'en compromettre le fonctionnement.

 This Class B digital apparatus complies with Canadian ICES-003.



Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.



This device complies with RSS-310 of Industry Canada. Operation is subject to the condition that this

device does not cause harmful interference.



Cet appareil est conforme à la norme RSS-310 d'Industrie Canada. L'opération est soumise à la

condition que cet appareil ne provoque aucune interférence nuisible.

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

This device and its antenna(s) must not be co-located or operating in conjunction with any other

antenna or transmitter, except tested built-in radios.

 Cet appareil et son antenne ne doivent pas être situés ou fonctionner en conjonction avec une autre

antenne ou un autre émetteur, exception faites des radios intégrées qui ont été testées.

 The County Code Selection feature is disabled for products marketed in the US/ Canada.

 La fonction de sélection de l'indicatif du pays est désactivée pour les produits commercialisés aux

États-Unis et au Canada.

Radiation Exposure Statement:

This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This

equipment should be installed and operated with minimum distance 20cm between the radiator & your

body.

Déclaration d'exposition aux radiations:

Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un

environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de

distance entre la source de rayonnement et votre corps.

IC : 21374-L850GL

2.3.3 CE Statement

► EU Regulatory Conformance

Hereby, We, Manufacturer name declares that the radio equipment type L850-GL is in compliance with

the Directive 2014/53/EU.

In all cases assessment of the final product must be mass against the Essential requirements of the

Directive 2014/53/EU Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article

3.2 requirements.

The maximum antenna gain for is 5 dBi and the antenna separation distance is 20cm.

► Declaration of Conformity(should include manufacturer contact info.)

Please added certification standard in your user manual which depended on the test standards your

device performed., If the DoC should be a simplified version, please take below as reference, The

full text of the EU declaration of conformity is available at the following internet address: http//www.

fibocom.com

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L850-GL is in conformity with the relevant Union harmonization legislation: Radio Equipment directive:

2014 / 53 / EUwith reference to the following standards applied:

Health (Article 3.1(a) of Directive 2014/53/EU)

Applied Standard(s):

EN 62311 : 2008

Safety (Article 3.1(a) of Directive 2014/53/EU)

Applied Standard(s):

EN 60950-1: 2006 + A11: 2009 + A1: 2010 + A12: 2011 + A2: 2013

Electromagnetic compatibility (Article 3.1 (b) of Directive 2014/53/EU)

Applied Standard(s):

Draft EN 301 489-1 V2.1.1 / -3 V2.1.0 /-52 V1.1.0

Radio frequency spectrum usage (Article 3.2 of Directive 2014/53/EU)

Applied Standard(s):

Draft EN 301 511 V12.1.10

EN 301 908-1 V11.1.1 / -2 V11.1.1 /V11.1.1

2.4 CA combinations

CA Combinations

2CA

Inter-band

1+3,5,18,19,20,21,26

2+4,5,12,13,17,29,30,66

3+5,7,8,19,20,28

4+5,12,13,17,29,30

5+7,30,66

7+20,28

12+30

13+66

29+30

Intra-band

2,3,4,7,40,41

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CA Combinations

3CA

Inter-band

1+3+7, 1+3+19, 1+3+20, 1+19+21

2+4+5, 2+4+13, 2+5+30, 2+12+30, 2+29+30

3+7+20, 3+7+28

4+5+30, 4+12+30, 4+29+30

5+66+2, 13+66+2

2 contiguous plus inter-band

2+2+5, 2+2+13

3+3+7, 3+7+7, 3+3+20

4+4+5, 4+4+13

5+66+66, 13+66+66, 66+66+2, 66+66+66

2.5 Application Framework

The peripheralapplicationsfor L850 module are shown in Figure 2-1:

Figure2-1 Application Framework

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2.6 Hardware Framework

The hardware framework in Figure 2-2 shows the main hardware functions of L850 module, including

base band and RF functions.

Baseband contains the followings:

GSM/UMTS/LTE FDD controller/Power supply



NAND/internal LPDDR2 RAM

Application interface

RF contains the followings:



RF Transceiver

RF Power/PA

RF Front end



RF Filter

Antenna

Figure 2-2 Hardware Framework

3 Application Interface

3.1 M.2Interface

The L850 module applies standard M.2 Key-B interface, with a total of 75 pins.

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3.1.1 Pin Distribution

Figure 3-1 Pin Distribution

Note:

Pin “Notch” represents the gap of the gold fingers.

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3.1.2 Pin Definition

The pin definition is as follows:

Pin Name

I/O

Reset Value

Pin Description

Type

CONFIG_3

NC,L850 M.2 module is configured as the WWAN – PCIe,USB3.0 interface type

+3.3V

Power input

Power Supply

GND

Power Supply

+3.3V

Power input

Power Supply

GND

Power Supply

FUL_CARD_ POWER_OFF#

Power enable,Module power on input,internal pull up

CMOS

3.3/1.8V

USB D+

I/O

USB Data Plus

0.3---3V

W_DISABLE1#

IPDWWAN Disable,active low

CMOS

3.3/1.8V

USB D-

I/O

USB Data Minus

0.3---3V

LED1#

System status LED,Output open drain,CMOS 3.3V

CMOS 3.3V 11

GND

Power Supply

Notch

I2S_CLK

I2S Serial clock, Reserved

CMOS 1.8V

CONFIG_0

GND

GND,L850 M.2 module is configured as the WWAN – PCIe,USB3.0 interface type

I2S_RX

IPDI2S Serial receive data,

CMOS 1.8V

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Pin Name

I/O

Reset Value

Pin Description

Type

Reserved

WOWWAN#

OPDWake up host

CMOS 1.8V

I2S_TX

I2S Serial transmit data, Reserved

CMOS 1.8V

DPR

IPUBody SAR Detect,active low

CMOS

3.3/1.8V

W_DISABLE2#

GNSS disable,active low, Reserved

CMOS

3.3/1.8V

GND

Power Supply

I2S_WA

I2S Word alignment/select, Reserved

CMOS 1.8V

USB3.0‐Tx

‐

USB3.0 Transmit data minus, Not support now

UIM_RESET

OLSIM reset signal

1.8V/3V

USB3.0‐Tx+

USB3.0 Transmit data plus, Not support now

UIM_CLK

OLSIM clock Signal

1.8V/3V

GND

Power Supply

UIM_DATA

I/OLSIM data input/output

1.8V/3V

USB3.0‐Rx‐

USB3.0 receive data minus, Not support now

UIM_PWR

SIM power supply,3V/1.8V

1.8V/3V

USB3.0‐Rx+

USB3.0 receive data plus, Not support now

38NCNC

GND

Power Supply

GNSS_SCL

I2C Serial clock, Reserved

CMOS 1.8V

PETn0

PCIe TX Differential signals Negative

GNSS_SDA

I/O

I2C Serial data input/output, Reserved

CMOS 1.8V 43

PETp0

PCIe TX Differential signals Positive

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Pin Name

I/O

Reset Value

Pin Description

Type

GNSS_IRQ

GNSS Interrupt Request, Reserved

CMOS 1.8V 45

GND

Power Supply

SYSCLK

OPD26M clock output

1.8V

PERn0

PCIe RX Differential signals Negative

TX_BLANKING

OPDPA Blanking Timer

CMOS 1.8V

PERp0

PCIe RX Differential signals Positive

PERST#

PE-Reset is a functional reset to the Add-In card as defined by the PCIe Mini Card CEM specification

CMOS 3.3V 51

GND

Power Supply

CLKREQ#

Clock Request is a reference clock request signal as defined by the PCIe Mini Card CEM specification; Also used by L1 PM Substates

CMOS 3.3V 53

REFCLKN

PCIe Reference Clock signal Negative

PEWAKE#

PCIe PME Wake. Open Drain with pull up on platform,active low

CMOS 3.3V

REFCLKP

PCIe Reference Clock signal Positive

RFE_RFFE2_ SCLK

MIPI Interface Tunable ANT, RFFE2 clock,Open Drain output

CMOS

3.3/1.8V

GND

Power Supply

RFE_RFFE2_ SDATA

MIPI Interface Tunable ANT, RFFE2 data,Open Drain output

CMOS

3.3/1.8V

ANTCTL0

Tunable ANT CTRL0

CMOS 1.8V

COEX3

Wireless Coexistence between WWAN and WiFi/BT modules. IDC_UART_TXD, Reserved

CMOS

3.3/1.8V 61

ANTCTL1

Tunable ANT CTRL1

CMOS 1.8V

COEX2

Wireless Coexistence between WWAN and WiFi/BT modules, IDC_UART_RXD

CMOS 1.8V

L850-GL Hardware User Manual Page20of

Pin Name

I/O

Reset Value

Pin Description

Type

,Reserved

ANTCTL2

Tunable ANT CTRL2

CMOS 1.8V

COEX1

Wireless Coexistence between WWAN and WiFi/BT modules, GNSS_EXT_FTA ,Reserved

CMOS 1.8V 65NCNC

SIM_DETECT

SIM Detect,internal pull up(330KΩ), active high

CMOS 1.8V

RESET#

WWAN reset input,internal pull up(10KΩ),active low

CMOS 1.8V 68NCNC

CONFIG_1

GND

GND,L850 M.2 module is configured as the WWAN – PCIe,USB3.0 interface type

+3.3V

Power input

Power Supply

GND

Power Supply

+3.3V

Power input

Power Supply

GND

Power Supply

+3.3V

Power input

Power Supply

CONFIG_2

GND

GND,L850 M.2 module is configured as the WWAN – PCIe,USB3.0 interface type

Reset Value: The initial status after modulereset, not the status when working.

H:High Voltage Level

L: Low Voltage Level

PD:Pull-Down

PU:Pull-Up

T:Tristate

OD:Open Drain

PP:Push-Pull

PI: Power Input

PO: Power Output

Note:

The unused pins can be left floating.

L850-GL Hardware User Manual Page21of

3.2 Power Supply

The power interface of L850 module as shown in the following table:

Pin Name

I/O

Pin Description

DC Parameter（V）

Minimum

Value

Typical

Value

Maximum

Value

2,4,70,72,74

+3.3V

Power supply input

3.135

3.3

4.4

UIM_PWR

USIM power supply

1.8V/3V

L850 module uses PCIe interface, according to the PCIe specification, the PCIe Vmain should be used as

the +3.3V power source, not the Vaux. The Vaux is the PCIe backup power source and it is not sufficient

as the power supply. In addition, the DC/DC power supply other than PCIe ports should not be used as

the external power cannot control the module status through the PCIe protocol.

3.2.1 Power Supply

The L850 module should be powered through the +3.3V pins, and the power supply design is shown in

Figure 3-2:

Figure 3-2 Power Supply Design

The filter capacitor design for power supply as shown in the following table:

Recommended

capacitance

Application

Description

220uF x 2

Voltage-stabilizing capacitors

Reduce power fluctuations of the module in operation, requiring capacitors with low ESR.

 LDO or DC/DC power supply requires the

capacitor of no less than 440uF

 The capacitor for battery power supply can be

reduced to 100~200uF

1uF,100nF

Digital signal noise

Filter out the interference generated from the clock and digital signals

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Recommended

capacitance

Application

Description

39pF,33pF

700/800, 850/900 MHzfrequency band

Filter out low frequency band RF interference

18pF,8.2pF,6.8pF

1500/1700/1800/1900,2100/ 2300,2500/2600MHzfrequen cy band

Filter out medium/high frequency band RF interference

The stable power supply can ensure the normal operation of L850 module;and the ripple of the power

supply should be less than 300mV in design. When the module operates with themaximum emission

power, the maximum operating current can reach 1000mA, so the power source should be not lower than

3.135V, or the module may shut down or reboot. The power supply limits are shown in Figure 3-3:

Figure 3-3 Power Supply Limit

3.2.2 Logic level

The L850module 1.8V logic level definitionas shown in the following table:

Parameters

Minimum

Typical

Maximum

Unit

1.8V logic level

1.71

1.8

1.89

VIH1.3

1.8

1.89

VIL-0.300.5

The L850module 3.3V logic level definition as shown in the following table:

Parameters

Minimum

Typical

Maximum

Unit

3.3V logic level

3.135

3.3

3.465

VIH2.3

3.3

3.465

VIL-0.300.9

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3.2.3 Power Consumption

In the condition of 3.3V power supply, the L850 power consumption as shown in the following table:

Parameter

Mode

Condition

Average

Current(mA)

off

Power off

Power supply,module power off

0.08

Sleep

WCDMA

DRX=6

2.5

DRX=8

1.8

DRX=9

1.6

LTE FDD

Paging cycle #64 frames (0.64 sec DRx cycle)

2.6

LTE TDD

Paging cycle #64 frames (0.64 sec DRx cycle)

2.8

Radio Off

AT+CFUN=4,Flight mode

1.2

WCDMA-RMS

WCDMA

WCDMA Data transfer Band 1 @+23.5dBm

680

WCDMA Data transfer Band 2 @+23.5dBm

710

WCDMA Data transfer Band 4 @+23.5dBm

500

WCDMA Data transfer Band 5 @+23.5dBm

530

WCDMA Data transfer Band 8 @+23.5dBm

580

LTE-RMS

LTE FDD

LTE FDD Data transfer Band 1 @+23dBm

760

LTE FDD Data transfer Band 2 @+23dBm

760

LTE FDD Data transfer Band 3 @+23dBm

770

LTE FDD Data transfer Band 4 @+23dBm

710

LTE FDD Data transfer Band 5 @+23dBm

550

LTE FDD Data transfer Band 7 @+23dBm

TBD

LTE FDD Data transfer Band 8 @+23dBm

540

LTE FDD Data transfer Band 11 @+23dBm

TBD

LTE FDD Data transfer Band 12 @+23dBm

600

LTE FDD Data transfer Band 13 @+23dBm

560

LTE FDD Data transfer Band 17 @+23dBm

580

LTE FDD Data transfer Band 18 @+23dBm

560

LTE FDD Data transfer Band 19 @+23dBm

520

LTE FDD Data transfer Band 20 @+23dBm

630

L850-GL Hardware User Manual Page24of

Parameter

Mode

Condition

Average

Current(mA)

LTE FDD Data transfer Band 21 @+23dBm

TBD

LTE FDD Data transfer Band 26 @+23dBm

540

LTE FDD Data transfer Band 28 @+23dBm

530

LTE FDD Data transfer Band 30 @+23dBm

TBD

LTE FDD Data transfer Band 66 @+23dBm

700

LTE TDD

LTE TDD Data transfer Band 38 @+23dBm

450

LTE TDD Data transfer Band 39 @+23dBm

320

LTE TDD Data transfer Band 40 @+23dBm

420

LTE TDD Data transfer Band 41 @+23dBm

440

The power consumption of L850 in 3CA mode as shown in the following tables:

3CA Combination

Condition

(LTE FDD 3CA, Full RB)

Average

Current(mA)

1+3+7, 1+3+19, 1+3+20, 1+19+21

2+4+5, 2+4+13, 2+5+30, 2+12+30, 2+29+30

3+7+20, 3+7+28

4+5+30, 4+12+30, 4+29+30

5+66+2, 13+66+2

2+2+5, 2+2+13

3+3+7, 3+7+7, 3+3+20

4+4+5, 4+4+13

5+66+66, 13+66+66, 66+66+2, 66+66+66

Band 1 @+22dBm

720

Band 2 @+22dBm

880

Band 3 @+22dBm

860

Band 4 @+22dBm

760

Band 5 @+22dBm

800

Band 7 @+22dBm

1110

Band 12 @+22dBm

790

Band 13 @+22dBm

630

Band 19 @+22dBm

760

Band 20 @+22dBm

750

Band 21 @+22dBm

950

Band 28 @+22dBm

720

Band 30 @+22dBm

1330

Band 66 @+22dBm

710

Note：

The data above is an average value obtained by testing some samples.

L850-GL Hardware User Manual Page25of

3.3 Control Signal

The L850 module provides two control signals for power on/off and reset operations, the pin defined as

shown in the following table:

Pin Name

I/O

Reset Value

Functions

Type

FUL_CARD_POWER_ OFF#

Power on/off signal,internalpull-up

High or floating: Power on Low : Power off

3.3/1.8V

RESET#

Reset signal, internal 10KΩ pull-up,active low

1.8V

3.3.1 Module Start-Up

3.3.1.1 Start-upCircuit

The FUL_CARD_POWER_OFF# pin needs an external 3.3V or 1.8V pull up for booting up. The

VDD_1V8 should be provided from the external circuit. AP (Application Processor) controls the module

start-up，and the circuit design is shown in Figure3-4:

Figure 3-4 Circuit for Module Start-up Controlled by AP

3.3.1.2 Start-upTiming Sequence

After powering on, the module will start-up by pulling upthe FUL_CARD_POWER_OFF# signal for

more than 20ms (100msis recommended). Meanwhile, the module will output 1.8V voltage through

VSD2_1V8 pin and start the initialization process. The start-up timing is shown in Figure 3-5:

L850-GL Hardware User Manual Page26of

Figure 3-5 Timing Control for Start-up

Note:

The VSD2_1V8 signal is the internal PMU 1.8V output voltage which is not connected to the M.2

interface. The above timing of VSD2_1V8 is only for reference.

The RESET# is required to pull high with a t

on1

delay after the +3.3V, because it takes some time

tocharge thecapacitors for +3.3V power supply. If the +3.3V power supply is already stable

before starting upthe module, the delay time can be ignored.

3.3.2 Module Shutdown

The module can be shut down by the following controls:

Shutdown Control

Action

Condition

Software

Sending AT+CPWROFF command

Normal shutdown(recommend)

Hardware

Pull down

FUL_CARD_POWER_OFF# pin

Only used whena hardware exception occurs

and the software control cannot be used.

The module can be shut downby sending AT+CPWROFF command. When the module receives the

software shutdown command, the module will start the finalization process (the reverse process of

initialization), andit will be completed after 3s. In the finalization process, the module will save the network,

SIM card and some other parameters from memory, then clear the memory and PMU will be powered off.

After shutdown, the VSD2_1V8 voltage is also shut down. The software control timing isshown in Figure

3-6:

L850-GL Hardware User Manual Page27of

Figure 3-6 Software Shutdown Timing Control

After the software shutdown, the FUL_CARD_POWER_OFF # pin will remain high which prevents the

module from restarting again. Toenable the next restart, the FUL_CARD_POWER_OFF#pin should be

pulled low after shutting down.

Note:

The VSD2_1V8 signal is the internal PMU 1.8V output voltage which is not connected to the M.2

interface. The above timing of VSD2_1V8 is only for reference.

3.3.3 Module Reset

The L850 module can reset to its initial status by pulling down the RESET# signal for more than 10ms

(100msis recommended), and the module will restart after the RESET# signal is released. When the

customer executes RESET# function, the PMU remains its power inside the module. The recommended

circuit design is shown in the Figure 3-7:

Figure 3-7 Recommended Design for Reset Circuit

The reset control timing is shown in Figure 3-8:

L850-GL Hardware User Manual Page28of

Figure 3-10 Reset Timing Control

Note:

RESET# is a sensitive signal, it’s recommended to add a filter capacitor close to the module. In

case of PCB layout, the RESET# signal lines should keep away from the RF interference and

protected by GND. Also, the RESET# signal lines shall neither near the PCB edge nor route on

the surface planes to avoid module from reset caused by ESD problems.

3.4 USB Interface

The L850 module supports USB2.0 which is compatible with USB High-Speed (480 Mbit/s) and USB

Full-Speed (12 Mbit/s). For the USB timing and electrical specification of L850 module, please refer

to“Universal Serial Bus Specification 2.0”.

USB interface just for debugging.

3.4.1 USB Interface Definition

Pin#

Pin Name

I/O

Reset Value

Description

Type

USB_D+

I/O

USB Data Plus

0.3---3V,

USB2.0

USB_D-

I/O

USB Data Minus

0.3---3V,

USB2.0

3.4.2 USB2.0 Interface Application

USB interface is used for debugging only, so it only needs to introduce the USB interface test in hardware

design.

L850-GL Hardware User Manual Page29of

3.5 PCIe Interface

L850 module supports PCIe 1.0 interface and one data transmission channel.

After L850 module is inserted into PC, PCIe interface can, work with the drive program, map an MBIM

port and a GNSS port in Win10 system. While MBIM interface is used for initiating data service in Win10

system and GNSS interface for receiving GNSS data.

3.5.1 PCIe Interface Definition

Pin#

Pin Name

I/O

Reset Value

Description

Type

PETn0

PCIe TX Differential signals

Negative

PETP0

PCIe TX Differential signals Positive

PERn0

PCIe RX Differential signals

NegativeBit0

PERP0

PCIe RX Differential signals Positive

REFCLKN

PCIe Reference Clock signal

Negative

REFCLKP

PCIe Reference Clock signal

Positive

PERST#

PE-Reset is a functional reset to the Add-In

card as defined by the PCIe Mini Card CEM

specification

CMOS 3.3V

CLKREQ#

Clock Request is a reference clock request

signal as defined by the PCIe Mini Card CEM

specification; Also used by L1 PM Substates

CMOS 3.3V 54

PEWAKE#

PCIe PME Wake. Open Drain with pull up on

platform,active low

CMOS 3.3V

3.5.2 PCIe Interface Application

The reference circuit is shown in Figure 3-9:

L850-GL Hardware User Manual Page30of

Figure 3-9 Reference Circuit for PCIe Interface

L850 module supports one PCIe 1.0 interface, including three difference pairs: transmit pair TXP/N,

receiving pair RXP/N and clock pair CLKP/N.

PCIe can achieve the maximum transmission rate of 2.5 GT/s, and must strictly follow the rules below in

PCB Layout:



The differential signal pair lines shall be parallel and equal in length;



The differential signal pair lines shall be short if possible and be controlled within 500mm for AP end;

The impedance of differential signal pair lines is recommended to be 100 ohm, and can be

controlled to 80～120 ohm in accordance with PCIe protocol;



It shall avoid the discontinuous reference ground, such as segment and space;

When the differential signal lines go through different layers, the via hole of grounding signal should

be in close to that of signal, and generally, each pair of signals require 1-3 grounding signal via

holes and the lines shall never cross the segment of plane;

Try to avoid bended lines and avoid introducing common-mode noise in the system, which will

influence the signal integrity and EMI of difference pair. As shown in Figure 3-10, the bending

angle of all lines should be equal or greater than 135° , the spacing between difference pair

lines should be larger than 20mil, and the line caused by bending should be greater than 1.5

times line width at least. When a serpentine line is used for length match with another line, the

bended length of each segment shall be at least 3 times the line width ( ≥ 3W). The largest

spacing between the bended part of the serpentine line and another one of the differential lines

must be less than 2 times the spacing of normal differential lines (S1<2S);

L850-GL Hardware User Manual Page31of

Figure 3-10 Requirement of PCIe Line



The difference in length of two data lines in difference pair should be within 5mil, and the length

match is required for all parts. When the length match is conducted for the differential lines, the

designed position of correct match should be close to that of incorrect match, as shown in Figure

3-11. However, there is no specific requirements for the length match of transmit pair and receiving

pair, that is, the length match is only required in the internal differential lines rather than between

different difference pairs. The length match should be close to the signal pin and pass the

small-angle bending design.

Figure 3-11 Length Match Design of PCIe Difference Pair

3.6 USIMInterface

The L850 module has a built-in USIM card interface, which supports 1.8V and 3V SIM cards.

3.6.1 USIM Pins

The USIM pins descriptionas shown in the following table:

Pin Name

I/O

Reset Value

Description

Type

UIM_PWR

USIM power supply

1.8V/3V

L850-GL Hardware User Manual Page32of

Pin Name

I/O

Reset Value

Description

Type

UIM_RESET

OLUSIM reset

1.8V/3V

UIM_CLKOL

USIM clock

1.8V/3V

UIM_DATA

I/OLUSIM data,internal pull up(4.7KΩ)

1.8V/3V

SIM_DETECT

USIM card detect, internal 390K

pull-up.

Active high, and high level indicates

SIM card is inserted; and low level

indicates SIM card is detached.

1.8V

3.6.2 USIM Interface Circuit

3.6.2.1 N.C. SIMCard Slot

The reference circuit design for N.C. (Normally Closed)SIM card slot is shown in Figure 3-12:

Figure 3-12Reference Circuit for N.C. SIM Card Slot

The principlesof theN.C.SIM card slot are described as follows:



When the SIM card is detached, it connects the short circuit between CD and SW pins, and drives the

SIM_DETECT pin low.

When the SIM card is inserted, it connects an open circuit between CD and SW pins, and drives the

SIM_DETECT pin high.

3.6.2.2 N.O. SIM Card Slot

The reference circuit design for N.O. (Normally Open) SIM card slot is shown in Figure 3-13:

L850-GL Hardware User Manual Page33of

Figure 3-13 Reference Circuit for N.O. SIM Card Slot

The principlesof theN.O.SIM card slot are described as follows:



When the SIM card is detached, it connects an open circuit between CD and SW pins, and drives

the SIM_DETECT pin low.

When the SIM card is inserted, it connects the short circuit between CD and SW pins, and drives the

SIM_DETECT pin high.

3.6.3 USIM Hot-Plugging

The L850 module supports the SIM card hot-plugging function, which determines whether the SIM card is

inserted or detached by detecting the SIM_DETECT pin state of the SIM card slot.

The SIM card hot-plugging function can be configuredby “AT+MSMPD” command, and the description for

AT command as shown in the following table:

AT Command

Hot-plugging

Detection

Function Description

AT+MSMPD=1

Enable

Default value, the SIM card hot-plugging detection function is

enabled.

The module can detect whether the SIM card is inserted or not

through the SIM_DETECT pin state.

AT+MSMPD=0

Disable

The SIM card hot-plugging detect function is disabled.

The module readsthe SIM card when starting up, and the

SIM_DETECT status will not be detected.

After the SIM card hot-plugging detection functionis enabled, the module detects that the SIM card is

insertedwhen the SIM_DETECT pin is high, then executes the initialization program and finish the

L850-GL Hardware User Manual Page34of

network registration after reading the SIM card information. When the SIM_DETECT pin is low, the

module determines that the SIM card is detachedand does not read the SIM card.

Note:

By default, SIM_DETECT is active-high, which can be switched to active-low by the AT

command. Please refer to the AT CommandsManual for the AT command.

3.6.4 USIM Design

The SIM card circuit design shall meet the EMC standards and ESD requirements with the

improvedcapability to resist interference, to ensure that the SIM card can work stably. Thefollowing

guidelines should be noted in case of design:

The SIM card slotplacement should near the module as close as possible, and away from the RF

antenna, DC/DC power supply, clock signal lines, and other strong interference sources.

The SIM card slot with a metal shielding housing can improve the anti-interference ability.

The trace length between the SIM card slotand the module should not exceed 100mm, or it could

reduce the signal quality.

The UIM_CLK and UIM_DATA signal lines should be isolated by GND to avoid crosstalk

interference. If it is difficult for the layout, the whole SIM signal lines should be wrapped with

GND as a group at least.

The filter capacitors and ESDdevices for SIM card signals should be placed near to the SIM card

slot, and the ESD devices with 22~33pF capacitance should be used.

3.7 Status Indicator

The L850 module providesthree signals to indicate the operating status of the module, and the status

indicator pinsas shown in the following table:

Pin Name

I/O

Reset Value

Pin Description

Type

LED1#OPD

System status LED, drain output.

CMOS 3.3V

WOWWAN#

Module wakes upHost (AP).

CMOS 1.8V

TX_BLANKING

PA Blanking output, externalGPS control

signal.

CMOS 1.8V

L850-GL Hardware User Manual Page35of

3.7.1 LED#1Signal

The LED#1 signal is used to indicate the operating status of the module, and the detailed description as

shown in the following table:

Module Status

LED1# Signal

RF function ON

Low level (LED On)

RF function OFF

High level (LED Off)

The LED driving circuit is as follows:

Figure 3-14 LEDDriving Circuit

Note:

The resistance of LED current-limiting resistor is selected according to the driving voltage and

the driving current.

3.7.2 WOWWAN#

The WOWWAN# signal is used to wake the Host (AP) when there comes the data request.The definition

of WOWWAN# signal is as follows:

Operating Mode

WOWWAN# Signal

data requests

Pull low 1s then pull high (pulse signal).

Idle/Sleep

High level

The WOWWAN# timing is shown in Figure 3-15:

Figure 3-15 WOWWAN#Timing

L850-GL Hardware User Manual Page36of

3.7.3 TX_BLANKING

When the module operates in LTE TDD Band 39, TX_BLANKING outputs the pulse signal synchronous

with TDD burst TX timing.

As TDD TX may interfere the receiving of GPS signal, AP will disable GPS or stop GPS data receiving

when detecting TX_BLANKING pulse signal, so as to avoid abnormal operation of GPS.

Operating Mode of Module

TX_BLANKING Signal

Default state

Low level

TDD burst TX(Band38)

Output the pulse signal synchronous with TDD burst TX

TX_BLANKING timing is shown in Figure 3-16:

Figure 3-16 TX_BLANKING Timing

3.8 Interrupt Control

The L850 module provides four interrupt signals, and the pin definition is as follows:

Pin Name

I/O

Reset Value

Pin Description

Type

W_DISABLE1#

Enable/Disable RF network

CMOS 3.3V

DPR

Body SAR detection

CMOS 1.8V

W_DISABLE2#

GNSS Disablesignal, Reserved

CMOS 1.8V

GNSS_IRQ

GNSS Interrupt Request, Reserved

CMOS 1.8V

3.8.1 W_DISABLE1#

The module provides a hardware pin to enable/disable WWAN RF function, and the function can also be

controlled by the AT command. The module enters the Flight mode afterthe RF function is disabled. The

definition of W_DISABLE1# signal is as follows:

W_DISABLE1# signal

Function

High/Floating

WWAN function is enabled, the module exits the Flight mode.

Low

WWAN function is disabled, the module entersFlight mode.

L850-GL Hardware User Manual Page37of

Note：

The function of W_DISABLE1# can be customized, please refer to the software porting guide.

3.8.2 BODYSAR

The L850 module supportsBody SARfunction by detecting the DPR pin. The voltage level of DPR is high

by default, and when the SAR sensor detects the closing human body, the DPR signal will be pulled down.

As the result, the module then lowers down its emission power to its default threshold value, thus

reducing theRF radiation onthe human body. The threshold of emission power can be set by the AT

Commands. The definition ofDPR signalas shown in the following table:

DPR signal

Function

High/Floating

The module keeps the default emission power

Low

Lower the maximum emission power to the threshold value of the module.

3.9 ClockInterface

The L850 module supports a clock interface, itcan output 26MHz clock.

Pin Name

I/O

Reset Value

Pin Description

Type

SYSCLK

26M clock output, default disabled

can be used for externalGPS, etc

1.8V

3.10ANT Tunable Interface

The module supports ANT Tunable interfaces with two different control modes, i.e. MIPI interface and 3bit

GPO interface. Through cooperating with external antenna adapter switch via ANT Tunable, it can flexibly

configure the bands of LTE antenna to improve the antenna’s working efficiency and save space for the

antenna.

Pin Name

I/O

Reset Value

Pin Description

Type

RFE_RFFE2_

SCLK

Tunable ANT control,MIPI Interface,

RFFE2 clock,Open Drain output

CMOS

3.3/1.8V

RFE_RFFE2_

SDATA

Tunable ANT control,MIPI Interface,

RFFE2 data,Open Drain output

CMOS

3.3/1.8V

ANTCTL0

Tunable ANT control,GPO interface,

CMOS 1.8V

L850-GL Hardware User Manual Page38of

Pin Name

I/O

Reset Value

Pin Description

Type

Bit0

ANTCTL1

Tunable ANT control,GPO interface,

bit1

CMOS 1.8V

ANTCTL2

Tunable ANT control,GPO interface,

Bit2

CMOS 1.8V

3.11Config Interface

The L850 module provides four config pins for the configuration as the WWAN-PCIe, USB3.0 type M.2

module:

Pin Name

I/O

Reset Value

Pin Description

Type

CONFIG_3

CONFIG_0

OLInternally connected to GND

CONFIG_1

OLInternally connected to GND

CONFIG_2

OLInternally connected to GND

The M.2 module configuration as the following table:

Config_0

(pin21)

Config_1

(pin69)

Config_2

(pin75)

Config_3

(pin1)

Module Type and Main

Host Interface

Port

Configuration

GND

WWAN – PCIe,USB3.0

Please refer to ”PCI Express M.2 Specification Rev1.0” for more details.

3.12Other Interfaces

The module does not support other interfaces yet.

L850-GL Hardware User Manual Page39of

4 Radio Frequency

4.1 RF Interface

4.1.1 RF Interface Functionality

The L850 module supports two RF connectors used for external antenna connection. As the Figure 4-1

shows, “M” is for Main antenna, used to receive and transmit RF signals; “D/G” is for Diversity antenna,

used to receive the diversity RF signals.

Figure 4-1 RF connectors

4.1.2 RFConnector Characteristic

Rated Condition

Environment Condition

Frequency Range

DC to 6GHz

Temperature Range

Characteristic Impedance

50Ω

–40°C to +85°C

4.1.3 RF Connector Dimension

The L850 module adopts standard M.2 module RF connectors, the model name is 818004607 from ECT

company, and the connector size is 2*2*0.6m. The connector dimension is shown as following picture:

L850-GL Hardware User Manual Page40of

Figure 4-2 RF connector dimensions

Figure 4-3 0.81mm coaxial antenna dimensions

Figure 4-4 Schematic diagram of 0.81mm coaxial antenna connected to the RF connector

L850-GL Hardware User Manual Page41of

4.2 Operating Band

The L850 module operating bands of the antennas are as follows:

Operating

Band

Description

Mode

Tx (MHz)

Rx (MHz)

Band 1

IMT 2100MHz

LTE FDD/WCDMA

1920 - 1980

2110 - 2170

Band 2

PCS 1900MHz

LTE FDD/WCDMA

1850 - 1910

1930 - 1990

Band 3

DCS 1800MHz

LTE FDD

1710 - 1785

1805 - 1880

Band 4

AWS 1700MHz

LTE FDD/WCDMA

1710 - 1755

2110 - 2155

Band 5

CLR 850MHz

LTE FDD/WCDMA

824 - 849

869 - 894

Band 7

IMT-E 2600Mhz

LTE FDD

2500 - 2570

2620 - 2690

Band 8

E-GSM 900MHz

LTE FDD/WCDMA

880 - 915

925 - 960

Band 11

LPDC 1500MHz

LTE FDD

1427.9 - 1447.9

1475.9 - 1495.9

Band 12

LSMH Blocks A/B/C

700MHz

LTE FDD

699 - 716

729 - 746

Band 13

USMH Block C

700MHz

LTE FDD

777 - 787

746 - 756

Band 17

LSMH Blocks B/C

700MHz

LTE FDD

704 - 716

734 - 746 Band 18

Japan Lower 800MHz

LTE FDD

815 - 830

860 - 875

Band 19

Japan Upper 800MHz

LTE FDD

830 - 845

875 - 890

Band 20

EUDD 800MHz

LTE FDD

832 - 862

791 - 821

Band 21

UPDC 1500MHz

LTE FDD

1447.9 - 1462.9

1495.9 - 1510.9

Band 26

ECLR 850MHz

LTE FDD

814 - 849

859 - 894

Band 28

APAC 700MHz

LTE FDD

703 - 748

758 - 803

Band 29

LSMH blocks D/E

700MHz

LTE FDD

N/A

716 - 728

Band 30

WCS blocks A

2300MHz

LTE FDD

2305 - 2315

2350 - 2360 Band 66

1700MHz

LTE FDD

1710 - 1780

2110 - 2200

Band 38

IMT-E 2600MHz

LTE TDD

2570 - 2620

Band 39

TDD 1900MHZ

LTE TDD

1880 - 1920

L850-GL Hardware User Manual Page42of

Operating

Band

Description

Mode

Tx (MHz)

Rx (MHz)

Band 40

IMT 2300MHz

LTE TDD

2300 - 2400

Band 41

BRS/EBS 2500MHZ

LTE TDD

2496 - 2690

GPS L1

N/A

1575.42±1.023

GLONASS

N/A

1602.5625±4 BeiDou

N/A

1561.098±2.046

4.3 Transmitting Power

The transmitting power foreach band of the L850 moduleas shown in the following table:

Mode

Band

Tx Power(dBm)

Note

WCDMA

Band 1

23.5±1

Band 2

23.5±1

Band 4

23.5±1

Band 5

23.5±1

Band 8

23.5±1

LTE FDD

Band 1

23±1

10MHz Bandwidth, 1 RB

Band 2

23±1

10MHz Bandwidth, 1 RB

Band 3

23±1

10MHz Bandwidth, 1 RB

Band 4

23±1

10MHz Bandwidth, 1 RB

Band 5

23±1

10MHz Bandwidth, 1 RB

Band 7

23±1

10MHz Bandwidth, 1 RB

Band 8

23±1

10MHz Bandwidth, 1 RB

Band 11

23±1

10MHz Bandwidth, 1 RB

Band 12

23±1

10MHz Bandwidth, 1 RB

Band 13

23±1

10MHz Bandwidth, 1 RB

Band 17

23±1

10MHz Bandwidth, 1 RB

Band 18

23±1

10MHz Bandwidth, 1 RB

Band 19

23±1

10MHz Bandwidth, 1 RB

Band 20

23±1

10MHz Bandwidth, 1 RB

L850-GL Hardware User Manual Page43of

Mode

Band

Tx Power(dBm)

Note

Band 21

23±1

10MHz Bandwidth, 1 RB

Band 26

23±1

10MHz Bandwidth, 1 RB

Band 28

23±1

10MHz Bandwidth, 1 RB

Band 30

23±1

10MHz Bandwidth, 1 RB

Band 66

23±1

10MHz Bandwidth, 1 RB

LTE TDD

Band 38

23±1

10MHz Bandwidth, 1 RB

Band 39

23±1

10MHz Bandwidth, 1 RB

Band 40

23±1

10MHz Bandwidth, 1 RB

Band 41

23±1

10MHz Bandwidth, 1 RB

4.4 Receiver Sensitivity

The receiver sensitivity foreach band of the L850 module as shown in the following table:

Mode

Band

Rx Sensitivity(dBm)

Typical

Note

WCDMA

Band 1

TBD

BER<0.1%

Band 2

TBD

BER<0.1%

Band 4

TBD

BER<0.1%

Band 5

TBD

BER<0.1%

Band 8

TBD

BER<0.1%

LTE FDD

Band 1

TBD

10MHz Bandwidth

Band 2

TBD

10MHz Bandwidth

Band 3

TBD

10MHz Bandwidth

Band 4

TBD

10MHz Bandwidth

Band 5

TBD

10MHz Bandwidth

Band 7

TBD

10MHz Bandwidth

Band 8

TBD

10MHz Bandwidth

Band 11

TBD

10MHz Bandwidth

Band 12

TBD

10MHz Bandwidth

Band 13

TBD

10MHz Bandwidth

Band 17

TBD

10MHz Bandwidth

L850-GL Hardware User Manual Page44of

Mode

Band

Rx Sensitivity(dBm)

Typical

Note

Band 18

TBD

10MHz Bandwidth

Band 19

TBD

10MHz Bandwidth

Band 20

TBD

10MHz Bandwidth

Band 21

TBD

10MHz Bandwidth

Band 26

TBD

10MHz Bandwidth

Band 28

TBD

10MHz Bandwidth

Band 29

TBD

10MHz Bandwidth

Band 30

TBD

10MHz Bandwidth

Band 66

TBD

10MHz Bandwidth

LTE TDD

Band 38

TBD

10MHz Bandwidth

Band 39

TBD

10MHz Bandwidth

Band 40

TBD

10MHz Bandwidth

Band 41

TBD

10MHz Bandwidth

Note:

The above values are measuredfor the dual antennas situation(Main+Diversity). For single main

antenna (without Diversity), the sensitivity will drop around 3dBm for each band of LTE.

4.5 GNSS

L850 module supports GNSS/BeiDou and AGNSS functions, and adopts RF Diversity and GNSS/Beidou

integrated antenna.

Description

Condition

Test Result

Power

GPS fixing

TBD

GPS tracking

TBD

GLONASS fixing

TBD

GLONASS tracking

TBD

BeiDou fixing

TBD

BeiDou tracking

TBD

Sleep

TBD

L850-GL Hardware User Manual Page45of

Description

Condition

Test Result

TTFF GPS/GLONASS/BeiDou

Cold start

TBD

Warm start

TBD

Hot Start

TBD

AGNSS

Cold start

TBD

Sensitivity

GPS

Open Sky

TBD

GLONASS

Open Sky

TBD

BeiDou

Open Sky

TBD

Note:

Please note that GPS current is tested with RF disabled.

4.6 Antenna Design

The L850module provides main and diversity antenna interfaces, and the antenna design requirements

as shown in the following table:

L850 module Main antenna requirements

Frequency range

The most proper antenna to adapt the frequencies should be used.

Bandwidth(WCDMA)

WCDMA band 1(2100) : 250 MHz

WCDMA band 2(1900) : 140 MHz

WCDMA band 4(1700) : 445 MHz

WCDMA band 5(850) : 70 MHz

WCDMA band 8(900) : 80 MHz

Bandwidth(LTE)

LTE band 1(2100): 250 MHz

LTE band 2(1900): 140MHz

LTE Band 3(1800): 170 MHz

LTE band 4(1700): 445MHz

LTE band 5(850): 70 MHz

LTE band 7(2600): 190 MHz

LTE Band 8(900): 80 MHz

LTE Band 11(1500): 68 MHz

LTE Band 12(700): 47 MHz

LTE Band 13(700): 41 MHz

L850-GL Hardware User Manual Page46of

L850 module Main antenna requirements

LTE Band 17(700): 42 MHz

LTE Band 18(800): 80 MHz

LTE Band 19(800): 80 MHz

LTE band 20(800): 71 MHz

LTE band 21(1500): 63 MHz

LTE band 26(850): 80 MHz

LTE band 28(700): 100 MHz

LTE band 29(700): 12 MHz

LTE band 30(2300): 55 MHz

LTE band 66(1700): 490MHz

LTE band 38(2600): 50 MHz

LTE Band 39(1900): 40 MHz

LTE band 40(2300): 100 MHz

LTE band 41(2500): 194 MHz

Bandwidth(GNSS/BeiDou)

GPS: 2MHz

GLONASS: 8MHz

BeiDou: 4MHz

Impedance

50Ohm

Input power

> 26dBmaverage power WCDMA & LTE

Recommended standing-wave ratio (SWR)

≤ 2:1

L850-GL Hardware User Manual Page47of

5 Structure Specification

5.1 Product Appearance

The product appearance for L850 module is shown in Figure5-1:

Figure 5-1 Module Appearance

5.2 Dimension of Structure

The structuraldimensionof the L850 module is shown in Figure 5-2:

Figure 5-2 Dimension of Structure

L850-GL Hardware User Manual Page48of

5.3 M.2 Interface Model

The L850 M.2 module adopts 75-pin gold finger as external interface, where 67 pins are signal pins and 8

pins are notch pins as shown in Figure 3-1. For module dimension, please refer to chapter 5.2. Based on

the M.2 interface definition, L850 module adopts Type 3042-S3-B interface (30x42mm, the component

maximum height on t top layer is 1.5mm, PCB thickness is 0.8mm, and KEY ID is B).

5.4 M.2 Connector

The L850 module connects to AP via M.2 connector, it is recommended to use M.2 connector from

LOTES company with the model APCI0026-P001A as shown in Figure 5-3. The package of connector,

please refer to the specification.

L850-GL Hardware User Manual Page49of

Figure 5-3 M.2 Dimension of Structure

5.5 Storage

5.5.1 Storage Life

Storage Conditions (recommended): Temperature is 23 ± 5 ℃, relative humidity is RH 35-70%.

Storage period (sealed vacuum packing): Under the recommended storage conditions, the storage life is

12 months.

5.6 Packing

The L850 module uses the tray sealed vacuum packing, combined with the outer packing method using

the hard cartoon box, so that the storage, transportation and the usage of modules can be protected to

the greatest extent.

Note：

The module is a precision electronic product, and may suffer permanent damage if no correct

electrostatic protection measures are taken.

L850-GL Hardware User Manual Page50of

5.6.1 Tray Package

The L850 module uses tray package,20 pcs are packed in each tray, with 5 trays in each box and 6 boxes

in each case. Tray packaging process is shown in Figure 5-4:

Figure 5-4 Tray Packaging Process

L850-GL Hardware User Manual Page51of

5.6.2 Tray size

The pallet size is 330*175*6.0mm, as shown in Figure 5-5:

ITEMLWHTA0B0

DIM

330.0±0.5

175.0±0.5

6.0±0.3

0.5±0.1

43±0.3

33.0±0.3

ITEMA1B1CDEF

DIM

294.0±0.3

159.0±0.3

20.0±0.5

9.0±0.5

24.5±0.5

187.5±0.2

ITEMGJ

DIM

105.0±0.2

9.0±0.2

Figure 5-5Tray Size (Unit: mm)

Fibocom Wireless L850GL Users Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Specification

2.3.1 FCC Statement

2.3.2 IC Statement

2.3.3 CE Statement

Application interface

W_DISABLE1#

Operating

Band