Fibocom Wireless L850GL Users Manual

L850-GL Hardware User Manual

Version：V1.0.3

Update date：2/25/2017

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Applicability Table

No.

Product model

Description

L850-GL

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Without the prior written permission of the copyright holder, any company or individual is prohibited to

excerpt, copy any part of or the entire document, or distribute the document in any form.

Notice

The document is subject to update from time to time owing to the product version upgrade or other

reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,

information and suggestions contained in the document do not constitute any explicit or implicit

guarantee.

Version Record

Version

Update date

Remark

V1.0.0

2016-12-08

Draft

V1.0.1

2016-12-16

Modify the PCIe Interface Application;

Update the Pin Definition: change pin65 to NC

V1.0.2

2017-02-09

Modify the description

Update the content of PCIe

Add the power Consumption of 3CA

V1.0.3

2017-02-25

Add product certification of warnings

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Contents

1 Foreword

..........................................................................................................................................

1.1 Introduction........................................................................................................................................... 7

1.2 Reference Standard............................................................................................................................ 7

1.3 Related Documents

.............................................................................................................................

2 Overview...........................................................................................................................................8

2.1 Introduction........................................................................................................................................... 8

2.2 Specification

..........................................................................................................................................

2.3 Warnings............................................................................................................................................... 9

2.3.1 FCC Statement...................................................................................................................................9

2.3.2 IC Statement.....................................................................................................................................11

2.3.3 CE Statement................................................................................................................................... 12

2.4 CA combinations................................................................................................................................13

2.5 Application Framework

.....................................................................................................................

2.6 Hardware Framework........................................................................................................................15

3 Application Interface...................................................................................................................15

3.1 M.2Interface

........................................................................................................................................

3.1.1 Pin Distribution.................................................................................................................................16

3.1.2 Pin Definition.................................................................................................................................... 17

3.2 Power Supply

.....................................................................................................................................

3.2.1 Power Supply................................................................................................................................... 21

3.2.2 Logic level......................................................................................................................................... 22

3.2.3 Power Consumption........................................................................................................................23

3.3 Control Signal.....................................................................................................................................25

3.3.1 Module Start-Up...............................................................................................................................25

3.3.1.1 Start-upCircuit.................................................................................................................................................25

3.3.1.2 Start-upTiming Sequence

.............................................................................................................................

3.3.2 Module Shutdown............................................................................................................................26

3.3.3 Module Reset................................................................................................................................... 27

3.4 USB Interface..................................................................................................................................... 28

3.4.1 USB Interface Definition................................................................................................................. 28

3.4.2 USB2.0 Interface Application.........................................................................................................28

3.5 PCIe Interface.................................................................................................................................... 29

3.5.1 PCIe Interface Definition................................................................................................................ 29

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3.5.2 PCIe Interface Application..............................................................................................................29

3.6 USIMInterface

....................................................................................................................................

3.6.1 USIM Pins......................................................................................................................................... 31

3.6.2 USIM Interface Circuit.....................................................................................................................32

3.6.2.1 N.C. SIMCard Slot......................................................................................................................................... 32

3.6.2.2 N.O. SIM Card Slot

........................................................................................................................................

3.6.3 USIM Hot-Plugging..........................................................................................................................33

3.6.4 USIM Design.................................................................................................................................... 34

3.7 Status Indicator.................................................................................................................................. 34

3.7.1 LED#1Signal.....................................................................................................................................35

3.7.2 WOWWAN#......................................................................................................................................35

3.7.3 TX_BLANKING................................................................................................................................ 36

3.8 Interrupt Control

.................................................................................................................................

3.8.1 W_DISABLE1#.................................................................................................................................36

3.8.2 BODYSAR........................................................................................................................................ 37

3.9 ClockInterface

....................................................................................................................................

3.10 ANT Tunable Interface

....................................................................................................................

3.11 Config Interface................................................................................................................................38

3.12 Other Interfaces

...............................................................................................................................

4 Radio Frequency

..........................................................................................................................

4.1 RF Interface........................................................................................................................................39

4.1.1 RF Interface Functionality..............................................................................................................39

4.1.2 RFConnector Characteristic.......................................................................................................... 39

4.1.3 RF Connector Dimension...............................................................................................................39

4.2 Operating Band

..................................................................................................................................

4.3 Transmitting Power

............................................................................................................................

4.4 Receiver Sensitivity........................................................................................................................... 43

4.5 GNSS

...................................................................................................................................................

4.6 Antenna Design

..................................................................................................................................

5 Structure Specification.............................................................................................................. 47

5.1 Product Appearance

..........................................................................................................................

5.2 Dimension of Structure

.....................................................................................................................

5.3 M.2 Interface Model...........................................................................................................................48

5.4 M.2 Connector

....................................................................................................................................

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5.5 Storage

................................................................................................................................................

5.5.1 Storage Life...................................................................................................................................... 49

5.6 Packing................................................................................................................................................49

5.6.1 Tray Package................................................................................................................................... 50

5.6.2 Tray size............................................................................................................................................51

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1 Foreword

1.1 Introduction

The document describes the electrical characteristics, RF performance, dimensions and application

environment, etc. of L850-GL (hereinafter referred to as L850). With the assistance of the document and

other instructions, the developers can quickly understand the hardware functions of L850 modules and

develop products.

1.2 Reference Standard

The design of the product complies with the following standards:

3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification;Radio transmission

and reception (FDD);Part 1: Conformance specification

3GPP TS 34.122 V10.1.0: Technical Specification Group Radio Access Network; Radio

transmission and reception (TDD)

3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radio transmission

and reception; Part 1: Conformance testing

3GPP TS 21.111 V10.0.0: USIM and IC card requirements

3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment

(SIM-ME) interface

3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)

application

3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application Toolkit(USAT)

3GPP TS 36.124 V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals

and ancillary equipment

3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)

3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment

(DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)

PCI Express M.2 Specification Rev1.0

1.3 Related Documents

L850 Module Performance Testing Report

RF Antenna Application Design Specification

L8-Family System Driver Integration and Application Guidance

L8-Family AT CommandsManual

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2 Overview

2.1 Introduction

L850 is a highly integrated 4G wireless communication module that adopts standard PCIe M.2 interface

and supports LTE FDD/LTE TDD/WCDMA/ system. It is applicable to most broadband communication

networks of the mobile operator across the world.

2.2 Specification

Specification

Operating Band

LTE FDD: Band 1,2,3,4,5,7,8,11,12,13,17,18,19,20,21,26,28,29,30,66

LTE TDD: Band 38, 39, 40, 41

WCDMA/HSPA+: Band 1,2,4,5,8

GNSS/Beidou: support

Data Transmission

LTE FDD

450Mbps DL/50Mbps UL(Cat 9)

LTE TDD

260Mbps DL/30Mbps UL(Cat 9)

When LTE TDD achieves maximum DL rate, its UL rate can

reach 10Mbps only

UMTS/HSPA+ UMTS:384 kbps DL/384 kbps UL

DC-HSDPA+:42Mbps DL(Cat 24)/5.76Mbps UL(Cat6)

Power Supply

DC 3.135V～4.4V,Typical 3.3V

Temperature

Normal operating temperature:-10°C ～+55°C

Expandoperating temperature:-20°C ～+70°C

Storage temperature: -40°C～+85°C

Physical

characteristics Interface: M.2 Key-B

Dimension：30 x 42 x 2.3mm

Weight: About5.8 g

Interface

Antenna WWAN Main Antenna x 1

WWAN Diversity Antenna x 1

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Function Interface

USIM 3V/1.8V

USB 2.0（just for debugging

）

PCIe 1.0 X1

W_Disable#

BodySar

LED

Clock

Tunable antenna

I2S(Reserved)

I2C(Reserved)

USB3.0(not supported yet)

Software

Protocol Stack

IPV4/IPV6

AT commands

3GPP TS 27.007 and 27.005

Firmware update

PCIe

Other feature

Multiple carrier

Windows MBIM support

Windows update

AGNSS

Note:

For normal operating temperature, LTE FDD Band 4 and 13 can support the temperature

ranging from -20℃ to +60℃.

2.3 Warnings

2.3.1 FCC Statement

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference

received, including interference that may cause undesired operation.

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This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant

to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful

interference in a residential installation. This equipment generates, uses and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause harmful interference

to radio communications. However, there is no guarantee that interference will not occur in a particular

installation. If this equipment does cause harmful interference to radio or television reception, which can

be determined by turning the equipment off and on, the user is encouraged to try to correct the

interference by one of the following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.



Connect the equipment into an outlet on a circuit different from that

to which the receiver is connected.

Consult the dealer or an experienced radio/TV technician for help.

FCC Caution:

Any changes or modifications not expressly approved by the party responsible for compliance could

void the user's authority to operate this equipment.

This transmitter must not be co-located or operating in conjunction with any other antenna or

transmitter.

Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.

This equipment should be installed and operated with minimum distance 20cm between the radiator &

your body.

This device is intended only for OEM integrators under the following conditions:

1) The antenna must be installed such that 20 cm is maintained between the antenna and

users, and the maximum antenna gain allowed for use with this device is 5 dBi.

2) The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM

integrator is still responsible for testing their end-product for any additional compliance requirements

required with this module installed

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IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop

configurations or co-location with another transmitter), then the FCC authorization is no longer considered

valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will

be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC

authorization.

End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be installed such that

20 cm may be maintained between the antenna and users. The final end product must be labeled in a

visible area with the following: “Contains FCC ID: ZMOL850GL”. The grantee's FCC ID can be used only

when all FCC compliance requirements are met.

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or

remove this RF module in the user’s manual of the end product which integrates this module. The end

user manual shall include all required regulatory information/warning as show in this manual.

2.3.2 IC Statement

Industry Canada statement



This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to

the following two conditions:

1) this device may not cause interference, and

2) this device must accept any interference, including interference that may cause undesired

operation of the device.



Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio

exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:

1) l'appareil ne doit pas produire de brouillage, et

2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage

est susceptible d'en compromettre le fonctionnement.

 This Class B digital apparatus complies with Canadian ICES-003.



Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.



This device complies with RSS-310 of Industry Canada. Operation is subject to the condition that this

device does not cause harmful interference.



Cet appareil est conforme à la norme RSS-310 d'Industrie Canada. L'opération est soumise à la

condition que cet appareil ne provoque aucune interférence nuisible.

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

This device and its antenna(s) must not be co-located or operating in conjunction with any other

antenna or transmitter, except tested built-in radios.

 Cet appareil et son antenne ne doivent pas être situés ou fonctionner en conjonction avec une autre

antenne ou un autre émetteur, exception faites des radios intégrées qui ont été testées.

 The County Code Selection feature is disabled for products marketed in the US/ Canada.

 La fonction de sélection de l'indicatif du pays est désactivée pour les produits commercialisés aux

États-Unis et au Canada.

Radiation Exposure Statement:

This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This

equipment should be installed and operated with minimum distance 20cm between the radiator & your

body.

Déclaration d'exposition aux radiations:

Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un

environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de

distance entre la source de rayonnement et votre corps.

IC : 21374-L850GL

2.3.3 CE Statement

► EU Regulatory Conformance

Hereby, We, Manufacturer name declares that the radio equipment type L850-GL is in compliance with

the Directive 2014/53/EU.

In all cases assessment of the final product must be mass against the Essential requirements of the

Directive 2014/53/EU Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article

3.2 requirements.

The maximum antenna gain for is 5 dBi and the antenna separation distance is 20cm.

► Declaration of Conformity(should include manufacturer contact info.)

Please added certification standard in your user manual which depended on the test standards your

device performed., If the DoC should be a simplified version, please take below as reference, The

full text of the EU declaration of conformity is available at the following internet address: http//www.

fibocom.com

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L850-GL is in conformity with the relevant Union harmonization legislation: Radio Equipment directive:

2014 / 53 / EUwith reference to the following standards applied:

Health (Article 3.1(a) of Directive 2014/53/EU)

Applied Standard(s):

EN 62311 : 2008

Safety (Article 3.1(a) of Directive 2014/53/EU)

Applied Standard(s):

EN 60950-1: 2006 + A11: 2009 + A1: 2010 + A12: 2011 + A2: 2013

Electromagnetic compatibility (Article 3.1 (b) of Directive 2014/53/EU)

Applied Standard(s):

Draft EN 301 489-1 V2.1.1 / -3 V2.1.0 /-52 V1.1.0

Radio frequency spectrum usage (Article 3.2 of Directive 2014/53/EU)

Applied Standard(s):

Draft EN 301 511 V12.1.10

EN 301 908-1 V11.1.1 / -2 V11.1.1 /V11.1.1

2.4 CA combinations

CA Combinations

2CA

Inter-band

1+3,5,18,19,20,21,26

2+4,5,12,13,17,29,30,66

3+5,7,8,19,20,28

4+5,12,13,17,29,30

5+7,30,66

7+20,28

12+30

13+66

29+30

Intra-band

2,3,4,7,40,41

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CA Combinations

3CA

Inter-band

1+3+7, 1+3+19, 1+3+20, 1+19+21

2+4+5, 2+4+13, 2+5+30, 2+12+30, 2+29+30

3+7+20, 3+7+28

4+5+30, 4+12+30, 4+29+30

5+66+2, 13+66+2

2 contiguous plus inter-band

2+2+5, 2+2+13

3+3+7, 3+7+7, 3+3+20

4+4+5, 4+4+13

5+66+66, 13+66+66, 66+66+2, 66+66+66

2.5 Application Framework

The peripheralapplicationsfor L850 module are shown in Figure 2-1:

Figure2-1 Application Framework

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2.6 Hardware Framework

The hardware framework in Figure 2-2 shows the main hardware functions of L850 module, including

base band and RF functions.

Baseband contains the followings:

GSM/UMTS/LTE FDD controller/Power supply



NAND/internal LPDDR2 RAM

Application interface

RF contains the followings:



RF Transceiver

RF Power/PA

RF Front end



RF Filter

Antenna

Figure 2-2 Hardware Framework

3 Application Interface

3.1 M.2Interface

The L850 module applies standard M.2 Key-B interface, with a total of 75 pins.

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3.1.1 Pin Distribution

Figure 3-1 Pin Distribution

Note:

Pin “Notch” represents the gap of the gold fingers.

+ 35 hidden pages

Fibocom Wireless L850GL Users Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Specification

2.3.1 FCC Statement

2.3.2 IC Statement

2.3.3 CE Statement

Application interface