Fibocom Wireless L830EB User Manual

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L830-EB Hardware User Manual

Version: V1.0.0

Update date: 2017.07.04

Lenovo Customization Version

Applicability Table

No. Product model Description

1 L830-EB-02 NA

L830-EB Hardware User Manual Page 2 of 41

Without the prior written permission of the copyright holder, any company or individual is prohibited to

excerpt, copy any part of or the entire document, or distribute the document in any form.

Notice

The document is subject to update from time to time owing to the product version upgrade or other

reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,

information and suggestions contained in the document do not constitute any explicit or implicit

guarantee.

Version Record

Version Update Remark

V1.0.0 2017-07-04 Initial version

L830-EB Hardware User Manual Page 3 of 41

Contents

1 Preface........................................................................................................................................... 6

1.1 Introduction........................................................................................................................................... 6

1.2 Reference Standard

............................................................................................................................

1.3 Related Documents............................................................................................................................. 6

2 Overview

2.1 Introduction

........................................................................................................................................

...........................................................................................................................................

2.2 Specification..........................................................................................................................................7

2.3 Application Framework

........................................................................................................................

2.4 Hardware Framework..........................................................................................................................9

3 Application Interface.................................................................................................................. 9

3.1 M.2 Interface

3.1.1 Pin Map............................................................................................................................................. 10

3.1.2 Pin Definition.....................................................................................................................................11

3.2 Power Supply

3.2.1 Power Supply................................................................................................................................... 15

3.2.2 Logic level......................................................................................................................................... 16

3.2.3 Power Consumption........................................................................................................................16

.........................................................................................................................................

.....................................................................................................................................

3.3 Control Signal.....................................................................................................................................17

3.3.1 Module Start-Up...............................................................................................................................17

3.3.1.1 Start-up Circuit................................................................................................................................................17

3.3.1.2 Start-up Timing Sequence

3.3.2 Module Shutdown............................................................................................................................19

3.3.2.1 Software Shutdown

3.3.2.2 Hardware Shutdown

3.3.3 Module Reset................................................................................................................................... 21

............................................................................................................................

........................................................................................................................................

......................................................................................................................................

3.4 USB Interface..................................................................................................................................... 22

3.4.1 USB Interface Definition.................................................................................................................22

3.4.2 USB Interface Application.............................................................................................................. 22

3.5 USIM Interface................................................................................................................................... 23

3.5.1 USIM Pins......................................................................................................................................... 23

3.5.2 USIM Interface Circuit.....................................................................................................................23

3.5.2.1 N.C. SIM Card Slot........................................................................................................................................ 23

3.5.2.2 N.O. SIM Card Slot........................................................................................................................................ 24

3.5.3 USIM Hot-Plugging..........................................................................................................................25

3.5.4 USIM Design.................................................................................................................................... 25

L830-EB Hardware User Manual Page 4 of 41

3.6 Status Indicator.................................................................................................................................. 26

3.6.1 LED#1 Signal....................................................................................................................................26

3.6.2 WOWWAN#......................................................................................................................................27

3.7 Interrupt Control................................................................................................................................. 27

3.7.1 W_DISABLE1#.................................................................................................................................28

3.7.2 System Switch Control....................................................................................................................28

3.7.3 Body SAR..........................................................................................................................................28

3.8 Digital Audio

3.8.1 I2S Mode...........................................................................................................................................29

3.8.2 PCM Mode........................................................................................................................................30

........................................................................................................................................

3.9 I2C Interface Description..................................................................................................................30

3.10 Clock Interface................................................................................................................................. 31

3.11 Configuration Interface

....................................................................................................................

3.12 Other Interfaces............................................................................................................................... 32

4 Radio Frequency.......................................................................................................................32

4.1 RF Interface

4.1.1 RF Interface Functionality.............................................................................................................. 32

4.1.2 RF Connector Characteristic......................................................................................................... 32

4.1.3 RF Connector Dimension...............................................................................................................32

4.2 Operating Band

4.3 Transmitting Power............................................................................................................................34

4.4 Receiver Sensitivity

........................................................................................................................................

..................................................................................................................................

...........................................................................................................................

4.5 GNSS

4.6 Antenna Design

5 Structure Specification

5.1 Product Appearance

5.2 Dimension of Structure

...................................................................................................................................................

..................................................................................................................................

............................................................................................................

..........................................................................................................................

.....................................................................................................................

5.3 M.2 Interface Model...........................................................................................................................38

5.4 M.2 Connector....................................................................................................................................38

5.5 Storage

5.5.1 Storage Life...................................................................................................................................... 39

5.6 Packing

5.6.1 Tray Package....................................................................................................................................40

5.6.2 Tray size............................................................................................................................................41

L830-EB Hardware User Manual Page 5 of 41

................................................................................................................................................

1 Preface

1.1 Introduction

The document describes the electrical characteristics, RF performance, dimensions and application

environment, etc. of L830-EB (hereinafter referred to as L830). With the assistance of the document and

other instructions, the developers can quickly understand the hardware functions of L830 modules and

develop products.

1.2 Reference Standard

The design of the product complies with the following standards:



3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification;Radio

transmission and reception (FDD);Part 1: Conformance specification

 3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radio

transmission and reception; Part 1: Conformance testing



3GPP TS 21.111 V10.0.0: USIM and IC card requirements

 3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment

(SIM-ME) interface



3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)

application



3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application

Toolkit(USAT)

 3GPP TS 36.124 V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile

terminals and ancillary equipment



3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)

 PCI_Express_M.2_Specification_Rev1.1

1.3 Related Documents

 RF Antenna Application Design Specification

 L8-Family System Driver Integration and Application Guidance



L8-Family AT Commands Manual

L830-EB Hardware User Manual Page 6 of 41

RF_067, Issue 01

EU Regulator Conformance

Hereby, We, Fibocom Wireless Inc. declares that the radio equipment type L830-EB is in compliance with the Directive 2014/53/EU. In all cases assessment of the final product must be mass against the Essential requirements of the Directive 2014/53/EU Article 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article

3.2 requirements. External antenna is used with the module during the testing process, the maximum antenna gain for frequency < 1G is 3dBi, for frequency > 1G is 5dBi and the antenna separation distance is 20cm.

EU Declaration of Conformity (DoC) Hereby,

Name of manufacturer: Fibocom Wireless Inc.

5/F, Tower A, Technology Building II, 1057 Nanhai Blvd,

Address:

Nanshan, City: Shenzhen, Country: China

declares that the DoC is issued under its sole responsibility and that this product:

Product description: LTE module Type designation(s): L830-EB Trademark: Fibocom

Product Identification Element L830-EB

is in conformity with the relevant Union harmonization legislation: Radio Equipment directive: 2014 / 53 / EU.

with reference to the following standards applied:

1. Health (Article 3.1(a) of Directive 2014/53/EU)

Applied Standard(s):

 EN 62311 : 2008

2. Safety (Article 3.1(a) of Directive 2014/53/EU)

Applied Standard(s):

 EN 60950-1: 2006 + A11: 2009 + A1: 2010 + A12: 2011 + A2: 2013

3. Electromagnetic compatibility (Article 3.1 (b) of Directive 2014/53/EU)

Applied Standard(s):

 Draft EN 301 489-1 V2.2.0 / -52 V1.1.0 / Final Draft EN301489-3 V2.1.1

4. Radio frequency spectrum usage (Article 3.2 of Directive 2014/53/EU)

Applied Standard(s):

 EN 301 908-1 V11.1.1 / -2 V11.1.1 / -13 V11.1.1  EN 303 413 V1.1.1

The Notified Body SIEMIC INC. with Notified Body number 2200 performed:

Modules: B+C and issued the EU-type examination certificate.

Signed for and on behalf of:

Date: August 21, 2017 City: Shenzhen, Name: Bond Yuan Title: Certification Engineer

Signature:

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

 Reorient or relocate the receiving antenna.  Increase the separation between the equipment and receiver.  Connect the equipment into an outlet on a circuit different from that

to which the receiver is connected.

 Consult the dealer or an experienced radio/TV technician for help.

FCC Caution:

 Any changes or modifications not expressly approved by the party responsible for

compliance could void the user's authority to operate this equipment.

 This transmitter must not be co-located or operating in conjunction with any other

antenna or transmitter.

Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.

This device is intended only for OEM integrators under the following conditions:

External antenna is used with the module during the testing process, the maximum antenna gain for

frequency<1G is 3dBi, for frequency>1G is 5 dBi and the antenna separation distance is 20cm.

2) The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed

IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains FCC ID:

ZMOL830EB

The grantee's FCC ID can be used only when all FCC compliance requirements are met.

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

2 Overview

2.1 Introduction

The L830 is a highly integrated 4G cellular module which uses the standard PCIe M.2 interface.It supports

LTE FDD/WCDMA mode cellular communication.

2.2 Specification

Specification

LTE FDD: Band 1,3,5,7,8,20,28

Operating Band

Data

Transmission

Power Supply DC 3.135V～4.4V, Typical 3.3V

Temperature

WCDMA/HSPA+: Band I, V, VIII

GPS/GLONASS: L1

1 +3,5,7,20

LTE inter-band CA

LTE intra-band CA 3,7

LTE FDD

UMTS/HSPA+

Normal Operating temperature：-10°C～+55°C

Extended Operating temperature：-30°C ～+65°C

3 +5,7,8,20,28

5 +7

7 +20,28

300Mbps DL/50Mbps UL(Cat 6)

UMTS:384 kbps DL/384 kbps UL

DC-HSDPA+:42Mbps DL(Cat 24)/5.76Mbps UL(Cat6)

Storage temperature：-40°C～+85°C

Interface: M.2 Key-B

Physical

characteristics

WCDMA Band 1/8 24dBm

LTE Band 1/3/7/8/20 23dBm

Interface

Antenna Connector

L830-EB Hardware User Manual Page 7 of 41

Dimension：30 x 42 x 2.3mm

Weight: About 5.8 g

WWAN Main Antenna x 1

WWAN Diversity(GNSS AUX) Antenna x 1

Function Interface

When the temperature goes beyond the normal operating temperature range of -10°C~+55°C, the

RF performance of the module may be slightly off 3GPP specifications.

2.3 Application Framework

The peripheral applications for L830 module are shown in Figure 2-1:

Figure2-1 Application Framework

Software

USIM 3V/1.8V

USB 2.0 x 1

I2S

I2C

EINT、System Indicator

Clock

Protocol Stack

AT commands 3GPP TS 27.007 and 27.005, and proprietary FIBOCOM AT commands

Firmware update USB

Note：

IPV4/IPV6

L830-EB Hardware User Manual Page 8 of 41

2.4 Hardware Framework

The hardware framework in Figure 2-2 shows the main hardware functions of L830 module, including

baseband and RF functions.

Baseband contains the followings:



UMTS/LTE FDD controller/Power supply



NAND/internal LPDDR2 RAM

 Application interface

RF contains the followings:

 RF Transceiver



RF Power/PA



RF Front end

 RF Filter



Antenna Connector

Figure 2-2 Hardware Framework

3 Application Interface

3.1 M.2 Interface

The L830 module uses standard M.2 Key-B interface, with a total of 75 pins.

L830-EB Hardware User Manual Page 9 of 41

3.1.1 Pin Map

Figure 3-1 Pin Map

Note:

Pin “Notch” represents the gap of the gold fingers.

L830-EB Hardware User Manual Page 10 of 41

3.1.2 Pin Definition

The pin definition is as follows:

Pin Pin Name I/O

Reset

Pin Description Type

Value

Connected to internal GND, L830

1 CONFIG_3 O L

2 +3.3V PI Module main power input. Power Supply

3 GND GND Power Supply

4 +3.3V PI Module main power input. Power Supply

5 GND GND Power Supply

6 FULL_CARD_POWER_OFF# I

7 USB D+ I/O USB 2.0 D+ signal 0.3---3V

8 W_DISABLE1# I PU WWAN Disable, active low. CMOS 3.3V

9 USB D- I/O USB 2.0 D- signal 0.3---3V

10 LED1# O OD System status LED, drain output. CMOS 3.3V

11 GND GND Power Supply

12 Notch Notch

M.2 module is configured as the

WWAN-SSIC 0 interface type.

Power on/off control signal,active

High.

CMOS

3.3/1.8V

13 Notch Notch

14 Notch Notch

15 Notch Notch

16 Notch Notch

17 Notch Notch

18 Notch Notch

19 Notch Notch

20 I2S_CLK O PD I2S serial clock CMOS 1.8V

Not connected, L830 M.2 module is

21 CONFIG_0 O

22 I2S_RX I PD I2S serial data input CMOS 1.8V

L830-EB Hardware User Manual Page 11 of 41

configured as the WWAN-SSIC 0

interface type.

+ 30 hidden pages

Fibocom Wireless L830EB User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual