L830-EA M.2 Module
Hardware User Manual
Version：V1.0.3
Date：2015.09.19
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Copyright
Copyright ©2015 Fibocom Wireless Inc . All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to
excerpt, copy any part of or the entire document, or transmit the document in any form.
Attention
The document is subject to update from time to time owing to the product version upgrade or other
reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,
information and suggestions contained in the document do not constitute any explicit or implicit
guarantee.
Trademark
The trademark is registered and owned by Fibocom Wireless Inc.
Versions
Version
Date
Remarks
V1.0.0
2015-06-05
Initial Version
V1.0.1
2015-06-16
Update the supported Cat of HSPA ;
Update the description of digital voice ;
Update the description of USB and Win8/Android switch ;
Update the consumption
V1.0.2
2015-07-07
Update part of error description
V1.0.3
2015-09-19
Delete the Band25, Update the parameters of GPS, and update the
logo
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Applicability Table
No.
Type
Note
1
L830-EA
NA
The difference of L830-EA M.2 wireless module as listed below:
Model No.
LTE FDD
WCDMA
GSM/GPRS/EDGE
L830-EA
Band
1,2,3,4,5,7,8,9,13,17,18,19,20,26,29
Band
1,2,4,5,6,8
850/900/1800/1900MHz
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Content
1 Foreword.................................................................................................................................................................... 7
1.1 Introduction.....................................................................................................................................................7
1.2 Reference Standard......................................................................................................................................7
2 Product Overview..................................................................................................................................................... 9
2.1 Description......................................................................................................................................................9
2.2 Specifications................................................................................................................................................. 9
2.3 Appearance..................................................................................................................................................14
3 Structure...................................................................................................................................................................15
3.1 Dimension Diagram of Structure.............................................................................................................. 15
3.2 Application Interface Description..............................................................................................................16
3.3 M.2 Connector............................................................................................................................................. 17
4 Hardware Introduction........................................................................................................................................... 18
4.1 Pin Definitions..............................................................................................................................................18
4.1.1 Pin Map............................................................................................................................................. 18
4.1.2 Description of Pins...........................................................................................................................19
5 Hardware Interface.................................................................................................................................................23
5.1 Power Interface........................................................................................................................................... 23
5.1.1 Power Supply................................................................................................................................... 23
5.1.2 VIO_1V8............................................................................................................................................23
5.2 Power on/off and Reset Signal................................................................................................................. 24
5.2.1 Power on /off Signal........................................................................................................................24
5.2.1.1 Power on Signal................................................................................................................... 24
5.2.1.2 Power off signal....................................................................................................................25
5.2.1.3 The Recommended Design of Power on/off................................................................... 26
5.2.2 RESET Signal.................................................................................................................................. 26
5.3 Status Indicating Signal............................................................................................................................. 27
5.3.1 Status Indicating Pin....................................................................................................................... 27
5.4 USB /SSIC Interface................................................................................................................................... 28
5.4.1 USB Interface................................................................................................................................... 28
5.4.2 USB SSIC Interface.........................................................................................................................29
5.5 USIM Interface.............................................................................................................................................29
5.5.1 USIM Pins......................................................................................................................................... 29
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5.5.2 USIM Interface Design....................................................................................................................30
5.5.2.1 “Normal Closed” SIM Card Circuit Design.......................................................................30
5.5.2.2 “Normally Open” SIM Circuit Design.................................................................................30
5.5.3 Points for Attention in USIM Design.............................................................................................31
5.5.4 USIM Hot-Plugging..........................................................................................................................32
5.5.4.1 Hardware Connection..........................................................................................................32
5.5.4.2 Software Settings................................................................................................................. 32
5.6 Digital Audio................................................................................................................................................. 33
5.6.1 I2S Interface..................................................................................................................................... 33
5.6.2 PCM Port Description..................................................................................................................... 33
5.7 Win8/Android Switch Control Interface................................................................................................... 34
5.8 W_DISABLE# Interface............................................................................................................................. 35
5.8.1 Description of WWAN_DISABLE# Interface...............................................................................35
5.8.2 GPS_DISABLE# Interface............................................................................................................. 35
5.9 TX_BLANKING Interface...........................................................................................................................35
5.10 WAKEUP_Host Interface.........................................................................................................................36
5.11 BODY_SAR Interface...............................................................................................................................36
5.12 I2C Interface.............................................................................................................................................. 36
5.13 Clock Interface.......................................................................................................................................... 37
5.14 Config Interface......................................................................................................................................... 37
5.15 RF Interface............................................................................................................................................... 37
5.15.1 RF Connector Interface................................................................................................................ 37
5.15.2 RF Connecting Seat......................................................................................................................38
5.15.3 Main Performance of RF Connector.......................................................................................... 39
5.16 Other Interfaces........................................................................................................................................ 39
6 Electrical and Environmental Features...............................................................................................................39
6.1 Electrical Features...................................................................................................................................... 39
6.2 Environmental Features.............................................................................................................................40
7 RF Interface.............................................................................................................................................................41
7.1 Operating Frequency Band....................................................................................................................... 41
7.2 Receiving Sensitivity...................................................................................................................................42
7.3 GNSS............................................................................................................................................................ 43
7.4 RF PCB Design........................................................................................................................................... 43
7.4.1 Wiring Principle................................................................................................................................ 43
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7.4.2 Impedance Design...........................................................................................................................43
7.5 Antenna Design........................................................................................................................................... 44
7.5.1 Main Antenna Design Requirements........................................................................................... 44
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1 Foreword
1.1 Introduction
The document describes the electrical characteristics, RF performance, dimensions and application
1.2 Reference Standard
3GPP TS 27.007 -v6.9.0: AT command set for User Equipment (UE)
3GPP TS 27.005 -v6.0.1: Use of Data Terminal Equipment -Data Circuit terminating Equipment
(DTE-DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)
3GPP TS 23.040 -v6.9.0: Technical realization of Short Message Service (SMS)
3GPP TS 24.011 -v6.1.0: Point- to - Point (PP) Short Message Service (SMS) support on mobile
radio interface
3GPP TS 27.010 -v6.0.0: Terminal Equipment to User Equipment (TE-UE) multiplexer protocol
3GPP TS 27.060 -v6.0.0: Packet domain; Mobile Station (MS) supporting Packet Switched services
3GPP TS 25.304-v6.10.0: User Equipment (UE) procedures in idle mode and procedures for cell
reselection in connected mode
3GPP TS 25.308 -v6.4.0: High Speed Downlink Packet Access (HSDPA); Overall description;
Stage 2
3GPP TS 25.309 -v6.6.0: FDD enhanced uplink; Overall description; Stage 2
3GPP TS 23.038 -v6.1.0: Alphabets and language - specific information
3GPP TS 21.111 -v6.3.0: USIM and IC card requirements
3GPP TS 31.111 -v6.11.0 "USIM Application Toolkit (USAT)"
3GPP TS 45.002 -v6.12.0: Multiplexing and multiple access on the radio path
3GPP TS 51.014 -v4.5.0: Specification of the SIM Application Toolkit for the Subscriber Identity
Module - Mobile Equipment (SIM-ME) interface
3GPP TS 51.010 -1 -v6.7.0: Mobile Station (MS) conformance specification; Part 1: Conformance
specification
3GPP TS 22.004 -v6.0.0: General on supplementary services
3GPP TS 23.090 -v6.1.0: Unstructured Supplementary Service Data (USSD); Stage 2
environment, etc. of L830-EA M.2 wireless modules. With the assistance of the document and other
instructions, developers can quickly understand the performance of L830-EA M.2 wireless modules and
develop products.
The design of the product compiles with the following standards ：
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3GPP TS 24.008 v6.19, Mobile radio interface Layer 3 specification;
3GPP TS 25.101 V7.18.0: User Equipment (UE) radio transmission and reception (FDD)
3GPP TS 36.101 V9.18.0: User Equipment (UE) radio transmission and reception
3GPP TS 36.104 V9.13.0: Base Station (BS) radio transmission and reception
3GPP TS 36.106 V9.4.0: FDD Repeater radio transmission and reception
3GPP TS 36.113 V9.5.0: Base Station (BS) and repeater ElectroMagnetic Compatibility (EMC)
3GPP TS 36.124 V9.2.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals
and ancillary equipment
3GPP TS 36.133 V9.18.0: Requirements for support of radio resource management
3GPP TS 34.121-1 version 7.2.0: The requirements and this test apply to all types of UTRA for the
FDD UE
3GPP TS 36.521-1 User Equipment (UE) conformance specification; Radio transmission and
reception; Part 1: Conformance testing
3GPP TS 34.122 V5.7.0: Technical Specification Group Radio Access Network; Radio transmission
and reception (TDD)
3GPP TS 45.005 9.4.0: Digital cellular telecommunications system (Phase 2+); Radio transmission
and reception
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2 Product Overview
2.1 Description
L830-EA M.2 modules are highly integrated 4G wireless modules, supports 3 modes 16 bands that
including the main 4G/3G/2G modes (LTE FDD/ WCDMA/ /GSM) and with wide bands, but not TDD
mode in China. These bands support the main operators of Europe and North America and the cellular
network of parts of the Asia .
2.2 Specifications
Specification
Operating Frequency
Range
L830-EA
LTE FDD: Band 1,2,3,4,5,7,8,9,13,17,18,19,20,26,29
WCDMA HSPA+: Band 1,2,4,5,6,8
GSM/GPRS/EDGE: 850/900/1800/1900MHz
LTE inter-band CA
1 +5,8,18,19,26
2 +4,5,13,17,29
3 +5,8,19,20,26
4 +5,13,17,29
7 +3,20
LTE intra-band CA
4
GNSS
Supported
Weight
5.7 grams
Data Rate
LTE FDD
Cat6 (300Mbps DL,50Mbps UL)
UMTS/HSDPA/HSUPA
3GPP Rel.10
DC-HSDPA 42Mbps(Cat 24)
HSUPA 5.76Mbps(Cat6)
GSM 3GPP release 7
EDGE (E-GPRS) multi-slot class 33(296kbps DL,
236.8kbps UL)
GPRS multi-slot class 33 (107kbps DL,85.6kbps
UL)
Physical
Dimension ：42x 30 x 2.3 mm
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Characteristics
Interface ：M.2
Environment
Operating Temperature：-30℃ ~ +65℃
Storage Temperature：-40℃ ~ +85℃
Performance
Operating Voltage
Voltage：3.135V ~ 4.4V Normal：3.3V
Current
Consumption
(Typical Value)
5mA (Sleep Mode)
LTE FDD DATA：750mA
WCDMA：580mA
2G Talk：300mA (GSM PCL5)
Interface
RF Interface
Antenna ：Mainx1，Diversityx1
Function Interface
1 x USB 2.0，Multiple Profiles over USB，USB SSIC
SIM Support ，I2C Support，I2S/PCM Support
GPIO，Clock
Data Features
Protocol Stack
External TCP/IP and UDP/IP protocol stack
EDGE
Multi-slot class 33 (5 Down; 4 Up; 6 Total)
Coding Scheme MCS1~9
GPRS
Multi-slot class 33 (5 Down; 4 Up; 6 Total)
Coding Scheme MCS1~4
CSD
UMTS(14.4kbps)，GSM(9.6kbps)
USSD
Support
SMS
MO / MT Text and PDU modes
Cell broadcast
Audio
not supported yet
Character Set
IRA，GSM，UCS2，HEX
AT Commands
FIBOCOM proprietary AT commands
GSM 07.05
GSM 07.07
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Accessories
Firmware Loader Tool over USB
User Manual
Developer Kit
Note:
1. Please make sure the temperature for device will not be higher than 65˚C.
2. The minimum distance between the user and/or any bystander and the radiating structure of the
transmitter is 20cm.
3. Assessment of compliance of the product with the requirements relating to the Radio and
Telecommunication Terminal Equipment Directive (EC Directive 1999/5/EC) was performed by
PHOENIX TESTLAB (Notified Body No.0700),
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Note:
Federal Communications Commission (FCC) Declaration of Conformity
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
This device has been tested and found to comply with the limits for a Class B digital , pursuant to Part 15
of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiated radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help.
FCC Caution:
Changes or modifications not expressly approved by the party responsible for compliance could void the
user‘s authority to operate the equipment.
RF Exposure Information
This device meets the government’s requirements for exposure to radio waves.
This device is designed and manufactured not to exceed the emission limits for exposure to radio
frequency (RF) energy set by the Federal Communications Commission of the U.S. Government.
This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In
order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to
the antenna shall not be less than 20cm (8 inches) during normal operation.
IMPORTANT NOTE:
This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC
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compliance requirement of the end product, which integrates this module. 20cm minimum distance has to
be able to be maintained between the antenna and the users for the host this module is integrated into.
Under such configuration, the FCC radiation exposure limits set forth for an population/uncontrolled
environment can be satisfied.
Any changes or modifications not expressly approved by the manufacturer could void the user's authority
to operate this equipment.
USERS MANUAL OF THE END PRODUCT:
In the users manual of the end product, the end user has to be informed to keep at least 20cm separation
with the antenna while this end product is installed and operated. The end user has to be informed that
the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end
user has to also be informed that any changes or modifications not expressly approved by the
manufacturer could void the user's authority to operate this equipment. If the size of the end product is
smaller than 8x10cm, then additional FCC part 15.19 statement is required to be available in the users
manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference and (2) this device must accept any
interference received, including interference that may cause undesired operation.
LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area with the following " Contains TX FCC ID:
ZMOL830". If the size of the end product is larger than 8x10cm, then the following FCC part 15.19
statement has to also be available on the label: This device complies with Part 15 of FCC rules.
Operation is subject to the following two conditions: (1) this device may not cause harmful interference
and (2) this device must accept any interference received, including interference that may cause
undesired operation.
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2.3 Appearance
The product appearance of L830-EA M.2 wireless module is shown as below:
Top View：
Figure 2- 1 Top View
Bottom view:
Figure 2- 2 Bottom View
L830-EA
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3 Structure
3.1 Dimension Diagram of Structure
Figure 3- 1 Dimension Diagram of Structure
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3.2 Application Interface Description
L830-EA M.2 module uses 75-pin gold fingers as the external interface, the size of the module please
refer to the section 3.1.As shown in Figure 4-2, L830-EA M.2 module uses the 75-pin fingers interface
( 67 pins are the signal interface and 8 pins are notch) .About the naming rules of M.2, L830-EA adopts
the Type 3042-S3-B (30mmx42mm,the maximum thickness of element layer of Top surface is 1.5mm , the
thickness of PCB is 0.8mm , Key ID is B ) .
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3.3 M.2 Connector
Recommend to use the M.2 connector from LOTES, the type is APCI0026-P001A, the package of
connector design please refer to the relevant specifications.
As shown in Figure 3-2:
Figure 3- 2 APCI0026-P001A M.2 connector dimension
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4 Hardware Introduction
4.1 Pin Definitions
4.1.1 Pin Map
CONFIG_2
75
74
+3.3V
GND
73
72
+3.3V
GND
71
70
+3.3V
CONFIG_1
69
68
CLK32K
RESET#
67
66
SIM_DETECT
ANTCTL3
65
64
NC
ANTCTL2
63
62
NC
ANTCTL1
61
60
NC
ANTCTL0
59
58
NC
GND
57
56
NC
NC
55
54
NC
NC
53
52
NC
GND
51
50
NC
NC
49
48
TX_BLANKING
NC
47
46
SYSCLK
GND
45
44
GNSS_IRQ
NC
43
42
GNSS_SDA
NC
41
40
GNSS_SCL
GND
39
38
NC
SSIC-RXP
37
36
UIM_PWR
SSIC-RXN
35
34
UIM_DATA
GND
33
32
UIM_CLK
SSIC-TXP
31
30
UIM_RESET
SSIC-TXN
29
28
I2S_WA
GND
27
26
W_DISABLE2#
DPR
25
24
I2S_TX
WOWWAN#
23
22
I2S_RX
CONFIG_0
21
20
I2S_CLK
Notch
Notch
Notch
Notch
Notch
Notch
Notch
Notch
GND
11
10
LED1#(3.3V)
USB D-
9
8
W_DISABLE1#(3.3V)
USB D+
7
6
FUL_CARD_POWER_OFF#(1.8V)
GND
5
4
+3.3V
GND
3
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CONFIG_3
1
Figure 4-2 Pin Diagram (TOP View)
4.1.2 Description of Pins
Pins of L830-EA M.2 modules are described in the table below:
Pin#
PIN Name
I/O
Reset
Value
Idle
Value
Description
1
CONFIG_3
OLL
The internal connected with GND,
L830-EA M.2 module shall configure
as the WWAN-SSIC0 interface type.
2
+3.3V
PI
Main power supply, voltage range:
3.135V ~ 4.4V
3
GND
GND
4
+3.3V
PI
Main power supply, voltage range:
3.135V ~ 4.4V
5
GND
GND
6
FUL_CARD_POWER_OFF#
IPUPU
Power off control signal, internal
200K pull-down resistor, CMOS 1.8V
7
USB D+
I/O
USB2.0 signal +
8
W_DISABLE1#
IPDPU
WWAN Disable, Low active,
CMOS 3.3V
9
USB D-
I/O
USB2.0 signal -
10
LED1#
OODOD
System status LED, drain output ,
active low , CMOS 3.3V
11
GND
GND
12
Notch
Notch
13
Notch
Notch
14
Notch
Notch
15
Notch
Notch
16
Notch
Notch
17
Notch
Notch
18
Notch
Notch
19
Notch
Notch
20
I2S_CLK
OPDT
I2S serial clock，CMOS 1.8V ,
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(Not supported yet )
21
CONFIG_0
ONCNC
Not connected.
L830-EA M.2 module shall configure
as the WWAN-SSIC0 interface type.
22
I2S_RX
IPDT
I2S serial data input, CMOS 1.8V ,
(Not supported yet )
23
WOWWAN#
OPDPU
The module wake-up Host device
signal, active low, CMOS 1.8V
24
I2S_TX
OPDT
I2S serial data output，CMOS 1.8V ,
(Not supported yet )
25
DPR
IPDPU
Body SAR Detect，CMOS 1.8V
26
W_DISABLE2#
IPDPU
GPS Disable signal, active low,
CMOS 1.8V（not supported yet）
27
GND
GND
28
I2S_WA
OPDT
I2S left and right channel clock
(LRCK) , CMOS 1.8V ,
(Not supported yet )
29
SSIC-TXN
O
USB SSIC Transmit data minus
30
UIM_RESET
OPPPP
USIM card reset signal
31
SSIC-TXP
O
USB SSIC Transmit data plus
32
UIM_CLK
OPPPP
USIM card clock signal
33
GND
GND
34
UIM_DATA
I/OPUPU
USIM card data signal，
internal 4.7K pull-up resistor
35
SSIC-RXN
I
USB SSIC Receive data minus
36
UIM_PWR
O
SIM card power supply output，
1.8V/3.0V
37
SSIC-RXP
I
USB SSIC Receive data plus
38NCNC
39
GND
GND
40
GNSS_SCL
OPUPU
I2C serial data clock signal，
internal 4.7K pull-up resistor，
CMOS 1.8V
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41NCNC
42
GNSS_SDA
I/OPUPU
I2C serial data clock signal，
internal 4.7K pull-up resistor，
CMOS 1.8V
43NCNC
44
GNSS_IRQ
IPUPU
Win8/Android dual system switch
interrupt input signal, CMOS 1.8V
45
GND
GND
46
SYSCLK
OPDL
26MHz clock signal output
47NCNC
48
TX_BLANKING
OLL
GSM TDMA Timer output signal，
External GPS control signal ,
CMOS 1.8V
49NCNC
50NCNC
51
GND
GND
52NCNC
53NCNC
54NCNC
55NCNC
56NCNC
57
GND
GND
58NCNC
59
ANTCTL0
OLL
Tunable antenna control signal,bit0,
CMOS 1.8V. (Not supported yet)
60NCNC
61
ANTCTL1
OLL
Tunable antenna control signal, MIPI
RFFE SDATA, CMOS 1.8V .
(Not supported yet)
62NCNC
63
ANTCTL2
OLL
Tunable antenna control signal, MIPI
RFFE SCLK, CMOS 1.8V.
(Not supported yet)
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64NCNC
65
ANTCTL3
O
Tunable antenna control signal, MIPI
RFFE VIO, CMOS 1.8V .
(Not supported yet)
66
SIM_DETECT
IPUPU
SIM Detect，CMOS 1.8V,390K ohm
pull-up resistor
67
RESET#
IPUPU
External reset signal input, pull
up(100K ohms),CMOS 1.8V
68
CLK32K
OPD32KHz clock output
69
CONFIG_1
OLL
The inside connect with GND，
L830-EA M.2 module configure as
the WWAN-SSIC0 interface type.
70
+3.3V
PI
Main power supply input,
voltage range: 3.135V ~ 4.4V
71
GND
GND
72
+3.3V
PI
Main power supply input,
voltage range: 3.135V ~ 4.4V
73
GND
GND
74
+3.3V
PI
Main power supply input ,
voltage range: 3.135V ~ 4.4V
75
CONFIG_2
OLL
The inside connect with GND，
L830-EA M.2 module configure as
the WWAN-SSIC0 interface type.
PI：Power Input
H：High Voltage Level
L：Low Voltage Level
PD：Pull-Down
PU：Pull-Up
T：Tristate
OD：Open Drain
PP：Push-Pull
Note : the unused pins can NC directly while designing.
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5 Hardware Interface
5.1 Power Interface
5.1.1 Power Supply
L830-EA M.2 modules require 3.135V ~ 4.4V direct current power supply, which can provide the
maximum GSM emission current of 2A.
Input power supply requirements:
Parameter
Minimum Value
Recommended Value
Maximum Value
Unit
+3.3V
3.135
3.3
4.4
V
Points for attention in design:
1. Supply voltage fluctuation shall be lower than 200mV.
2. Minimum supply voltage drop shall be higher than 3.135V.
The filter capacitor design of power supply circuit as follows:
Recommended
capacitor
Application
Description
330uF
Supply capacitance
Reduce power-supply fluctuation during phone call.
The capacitance value bigger is better
1uF,100nF
Digital signal noise
Filter the interference caused by clock and digital
signals
39pF,33pF
700 /850 /900 MHz
Filter RF interference
18pF,8.2pF,6.8pF
800/1700/1800/1900,
2100/2600MHz
Filter RF interference
5.1.2 VIO_1V8
As the power supply for the digital circuit inside the module, VIO_1V8 can be used as the module`s
reference level of the status index signal and digital signal. Only used for internal circuit.
Parameter
Minimum Value
Recommended Value
Maximum Value
Unit
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VIO_1V8
1.7135
1.8
1.8865
V
VIH0.7* VSD2_1V8
1.8
1.8865
V
VIL-0.300.3* VSD2_1V8
V
5.2 Power on/off and Reset Signal
L830-EA M.2 wireless modules provide two control signals to power on /power off and reset the modules.
Pins definition as listed below :
Pin#
Pin Name
Electrical Level
Description
6
FUL_CARD_POWER_OFF#
CMOS 1.8V
Power on/off signal
67
RESET#
CMOS 1.8V
External reset signal input
5.2.1 Power on /off Signal
5.2.1.1 Power on Signal
After the M.2 module is connected to the power supply, the user can through pull up the signal of
“ FUL_CARD_POWER_OFF# ” to make the module power on.
Timing sequence requirement of the startup pulse:
Parameter
Condition
Minimum Value
Typical Value
Maximum Value
Unit
Pulse Width
Power on
20
100
ms
The timing sequence control is shown in the diagram below:
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Figure 5- 1 Power on Timing Control Diagram
Note : the“>1s”of VBAT is the time aim at the module power supply(that is the capacitance charging). If
the VBAT is already set up or supplied in the long term, then the control time that aimed at VBAT can
ignore and only control the“ RESET_N”and “POWER_ON/OFF# ” .
5.2.1.2 Power off signal
L830-EA M.2 module supports two power_off modes. Through the software modes to turn off the module
in general condition. Only the system halted or happened exceptions, use the following hardware modes
to turn off it, pull down the FUL_CARD_POWER_OFF# signal or floating①. For details as listed below:
Off modes
Methods
Condition
Software off
Send AT+CPWROFF commands.
Normal power_off
Hardware off
Pull down the
FUL_CARD_POWER_OFF# signal
or floating
①
Only used for system halted or happens
exceptions and the software modes cannot be
used.
The description of hardware power_off as follows (Pull down the FUL_CARD_POWER_OFF signal or
floating) :
While pulling down the FUL_CARD_POWER_OFF signal or floating, the modules` PMU (Power
Management Unit) will be reset, then the module will get into off modes from working modes.
Note ①: the RESET_N must be pulled down before pulling down the FUL_CARD_POWER_OFF signal,
and then the module will be turned off safely.
The timing sequence requirements of the pulse are as follows:
Parameter
Condition
Minimum Value
Typical Value
Maximum Value
Unit
Pulse Width
Power off
5
100
ms
The timing sequence control is shown in the diagram below:
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Figure 5- 2 Power off Timing Control Diagram
5.2.1.3 The Recommended Design of Power on/off
The recommended design of FUL_CARD_POWER_OFF# signal is as follows:
Figure 5- 3 Recommended Design of FUL_CARD_POWER_OFF# Signal
5.2.2 RESET Signal
L830-EA M.2 wireless modules support external reset function. It is feasible to reset the module back to
the original state by the Reset Signal.
When setting the Reset Signal low for 100ms, the module will be reset and restarted. When the user uses
the Reset function, the PMU inside the module will not lose power.
Note: Reset signal is a sensitive signal line. In designing PCB layout, please keep the line away from RF
interference, and make it well wrapped with ground wire. And it is advised to add an anti-shaking
capacitor at the place close to the module end. At the same time; Reset_N signal line shall avoid the PCB
edge and the surface, then reset the ESD can be avoided.
The timing sequence requirements of its pulse are as follows:
Parameters
Condition
Minimum Value
Typical Value
Maximum Value
Unit
Pulse Width
Reset
7
100
1000
ms
Recommended design:
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Figure 5- 4 Reset# Circuit Recommended Design
5.3 Status Indicating Signal
5.3.1 Status Indicating Pin
L830-EA M.2 modules provide drain output signal for indexing RF status.
Pin#
Pin Name
Description
10
LED1#
Close or open RF network status index, ,CMOS 3.3V
LED# signal description as listed below :
No
Status
LED1#
1
RF function opened
Low level
2
RF function closed
High level
Recommended design:
Figure 5- 5 Recommended design of LED Status Index
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5.4 USB /SSIC Interface
L830-EA M.2 wireless modules support USB 2.0 and USB SSIC. While the L830-EA M.2 module insert
into the PC, the USB/SSIC interface will map one MBIM interface and one ACM interface in the PC side
on Win8/8.1/10 system. (it will display GNSS Sensor while the ACM port is installed driver ). Through the
Win8/Android switch pin can switch to three ACM ports and three NCM ports②. For details as follows:
Win8/8.1/10 system supports MBIM interface without extra drive. If you need to support GNSS you
should install the corresponding ACM port drive.
Three AOM ports③will use for sending AT command(2 of the AOM ports) and grab software LOG
information (one of the AOM port).
Three NCM ports are virtual network ports, mainly for initiating data traffic.
Note②:About the Win8/Android system switch refer to the section 5.7, Android system requires the
corresponded drive is installed on PC.
Note③: One of the AOM port can use for Modem COM port and initiate data services. Due to the speed of
Modem COM port is too slow to up to DL 300Mbpss, so it is not suggested. The Modem COM can be
used to initiate data services temporarily only while the client`s NCM port is useless.
5.4.1 USB Interface
Pin#
Pin Name
I/O
Description
7
USB_DP
I/O
USB signal+
9
USB_DM
I/O
USB signal-
Reference Circuit Design:
Figure 5- 6 USB Interface Reference Circuit Design
T101 and T102 shall be TVS with capacitance lower than 1pF .
VUSB power supply has built connected within the module, so the VBUS PIN of Host side can be floating.
USB_D+ and USB_D- are the high-speed differential signal line, and their highest transmission rate is
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480Mbps. The following requirements should be followed in designing PCB layout.
USB_D+ and USB_D- signal lines should have the same length, and should be parallel; avoid right
USB_D+ and USB_D- signal lines should be wrapped with GND at the ends.
USB2.0 differential signal line should be laid at the signal layer closest to the ground layer.
USB signal line shall be far away from stronger interference signal, such as power supply.
Ensure impedance matching; impedance is required to be 90ohm.
5.4.2 USB SSIC Interface
L830-EA M.2 wireless modules support USB Super Speed Inter-Chip（USB SSIC, achieve the high speed
transmission with low consumption between the chips, meet the high bandwidth transmission requires of
the 4G LTE and mobile network.
The definition of USB SSIC interface as listed below:
Pin#
Pin Name
I/O
Function Description
29
SSIC_TXN
O
USB SSIC Transmitter Signal N，connect SSIC_RXN in AP
side
31
SSIC_TXP
O
USB SSIC Transmitter Signal P，connect SSIC_RXP in AP
side
35
SSIC_RXN
I
USB SSIC Receiver Signal N，connect SSIC_TXN in AP side
37
SSIC_RXP
I
USB SSIC Receiver Signal P，connect SSIC_TXP in AP side
USB SSIC is the high-speed differential signal line, and their highest transmission rate is up to 5Gbps.
The following requirements should be followed in designing PCB layout.
SSIC_TXN/ SSIC_TXP and SSIC_RXN/ SSIC_RXP are two differential signal lines, the routing
requires parallel and equal length, meanwhile, it requires to avoid right angle routing;
TX and RX signal lines should be wrapped with GND at the ends.
TX and RX signal lines require isolate.
The differential signal line should be laid at the signal layer closest to the ground layer.
Ensure impedance matching; impedance is required to be 100ohm.
5.5 USIM Interface
L830 M.2 series wireless modules support USIM and high speed SIM cards. But 8-line intelligent USIM is
not supported yet.
5.5.1 USIM Pins
Pin#
Pin Name
I/O
Function Description
angle wiring.
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36
UIM_PWR
O
USIM power supply signal
30
UIM_RESET
O
USIM Reset Signal
32
UIM_CLK
O
USIM clock signal
34
UIM_DATA
I/O
USIM data signal
66
SIM_DETECT
I
USIM Plug-in detection signal , 390K resistor will be pulled up
by default.
High level indicates that SIM card is inserted.
Low level indicates that card is not inserted.
5.5.2 USIM Interface Design
5.5.2.1 “Normal Closed” SIM Card Circuit Design
Reference Circuit Design:
Figure 5- 7 Reference Design of “Normally Closed” SIM Card Interface
Normally closed SIM Connector:
1）Pull out SIM card, pin 7 and pin 8 will short-circuit .
2）Insert SIM card, pin 7 and pin 8 will disconnect.
5.5.2.2 “Normally Open” SIM Circuit Design
Referenced Circuit Design:
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Figure 5- 8 Reference Design of “Normally Open” SIM Card Interface
Normally Open SIM Connector:
1）Pull out SIM card, pin 7 and pin 8 will disconnect.
2）Insert SIM card, pin 7 and pin 8 will short-circuit
Note:
In order to improve EMC performance, the SIM card slot should be close to the module to the largest
extent.
The filter capacitor on the SIM-card signal circuit should be placed close to SIM card pin to the largest
extent.
ESD device (like TVS) shall be added to the SIM-card signal circuit protection. ESD device should be
placed close to SIM card pin.
SIM card connector shall be with shielding function, to improve the anti-jamming capability of SIM
card
SIM1_CD signal connection supports hot-plugging; active high level by default(change to active low
through AT commands ). If the module detects the signal at high level, it means there is a card in the
module.
5.5.3 Points for Attention in USIM Design
SIM card interface design is very important for the normal operation of the module and SIM card.
The following points need to be complied with during the design:
SIM card layout and wiring must keep away from EMI interference source, like RF antenna and digital
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switch signal.
In order to ensure signal completeness, the wire distance between the module and SIM card should
not exceed 100mm.
In order to avoid mutual interference, USIM_CLK and USIM_IO signals should be separated in wiring.
It would be best to wrap them with ground wire respectively.
SIM card signal line should be protected with ESD. These protective devices should have small
capacitance (like Zener diode, etc.). Users are recommended to select ESD devices with equivalent
capacitance lower than 33pF. During layout, ESD device should be close to the SIM card interface.
5.5.4 USIM Hot-Plugging
L830-EA M.2 module supports SIM card status-detection function. This function allows the hot-plugging of
SIM card.
5.5.4.1 Hardware Connection
SIM card hot-plugging function needs to work with SIM_DETECT signal.
SIM_DETECT will be at low level without SIM card; after inserting SIM card, SIM_DETECT will be at high
level.
Note :
For “Normal closed” SIM card, as shown in the figure 5-7, SIM_DETECT signal line is connected to
U2’s Pin8 (SW2), and Pin7 (SW1) is connected to the ground. When the SIM card is not inserted,
SW2 and SW1 short circuit, SW2 will be at low level. When the SIM card is inserted, SW2 and SW1
will be disconnected, SIM_DETECT level will be pulled up.
For “Normal opened” SIM card, as shown in the figure 5-8, SIM_DETECT signal line is connected to
U2’s Pin8 (SW2), and Pin7 (SW1) will be pulled up 4.7K resistor . When the SIM card is not inserted,
SW2 and SW1 will be disconnected, then SW2 will be at low level. When the SIM card is inserted,
SW2 and SW1 will short circuit, SIM_DETECT level will be pulled up.
5.5.4.2 Software Settings
“+MSMPD” configures AT command for the SIM card status-detection function.
If set AT+MSMPD=0, SIM card status-detection function will be closed, and the module will not detect
SIM_DETECT signal.
If set AT+MSMPD=1, SIM card status-detection function will be in operation, and the module will
detect if the SIM card is inserted by SIM_DETECT Pin.
If SIM_DETECT is at high level, which indicates SIM card is inserted, the module will automatically
register it to the network.
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If SIM_DETECT is at low level, which indicates SIM card is not inserted, the module will not register it
to the network.
Note: the default of +MSMPD parameter is “1”.SIM_DETECT is the detection signal. While the module
first power on or plug after that, SIM_DETECT will detect if the SIM card is existing or not. Just only if the
SIM_DETECT is low level, the module will cannot read SIM card.
5.6 Digital Audio
L830-EA M.2 module supports digital audio I2S interface④that supports normal I2S mode and PCM
mode. I2S interface level is 1.8V on average.
I2S signal description:
Pin#
Pin Name
I/O
Description
20
I2S_CLK
O
Bit Clock
28
I2S_WA
O
Left and right channel clock (LRCK)
22
I2S_RX
I
Serial data input
24
I2S_TX
O
Serial data output
Note④: The digital audio interface is not supported yet.
5.6.1 I2S Interface
L830-EA M.2
Signal Direction
Audio CODEC I2S Port
I2S_CLK
I2S_CLK
I2S_WA
I2S_LRCK
I2S_RX
I2S_SDOUT
I2S_TX
I2S_SDIN
Description:
I2S interface can be configured as client-server work mode.
Suitable for various audio sampling frequencies(48KHz, 44.1KHz, 32KHz, 24KHz, 22.5KHz, 16KHz,
5.6.2 PCM Port Description
L830-EA M.2
Signal Direction
Audio CODEC PCM Port
I2S_CLK0(PCM_CLK ,PCM clock signal)
PCM_CLK（PCM clock signal）
12KHz, 11.025KHz and 8KHz).
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I2S_WA0(PCM_SYNC , PCM frame
synchronization signal)
PCM_SYNC（PCM frame
synchronization signal）
I2S_RX(PCM_DIN , PCM data input)
PCM_DOUT（PCM data output）
I2S_TX(PCM_DOUT , PCM data output)
PCM_DIN（PCM data input）
Note:
PCM interface can be configured as client-server work mode.
Support short frame synchronization at 16, 32, 48, and 64 bit mode
Support burst and continuous mode transmission
Supports clock length of frame synchronization signal and rising edge/ falling edge trigger
configuration of data transmission.
Suitable for various audio sampling frequencies(48KHz, 44.1KHz, 32KHz, 24KHz, 22.5KHz, 16KHz,
12KHz, 11.025KHz and 8KHz).
Note: Cause the timing of I2S modes is easier than PCM modes and easier to fit, recommend clients to
use transmission audio of I2S mode. While transmission with PCM modes, the PCM timing sequence is
difficult to fit to make the tone quality become bad.
5.7 Win8/Android Switch Control Interface
L830-EA M.2 module supports the Win8/Android dual system switch. Check and achieve the switch
function
through interrupt signal ”GNSS_IRQ”.
Pin#
Name
I/O
Description
44
GNSS_IRQ
I
The detection signal of Win8/Android dual system switch,
CMOS 1.8V
The definition of GNSS_IRQ signal function as listed below :
No.
GNSS_IRQ
Function
1
High/Floating
Win8 system supports, , the module`s USB ports shall set as MBIM mode.
2
Low
Android system supports, the module`s `USB ports shall set as 3ACM+3NCM
modes.
Note：
1. Check and achieve the Win8/Android system switch through GNSS_IRQ level while module starting .
Keep the GNSS_IRQ level stability during starting.
2. Check and achieve the Win8/Android system switch through GNSS_IRQ rising edge/ falling edge
while the module starting. The de-bouncing time sets as 100ms. The module will reboot once meeting
all the requirements and switch different system supports.
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3. ”Win8” refers to Windows version above the Win8, including Win8 / 8.1/10 systems that support MBIM
port. For the low version of Windows 7 system, still use the Android system of ACM.
5.8 W_DISABLE# Interface
5.8.1 Description of WWAN_DISABLE# Interface
L830-EA M.2 module supports open/close the WWAN RF functional signal through hardware, and this
function can also be controlled by AT commands.
Pin#
Name
I/O
Description
8
W_DISABLE1#
I
WWAN on/off signal, CMOS 3.3V
The definition of W_DISABLE# signal as listed below:
No.
W_DISABLE#
Function
1
Low
WWAN off
2
High
WWAN on
3
Floating
WWAN function is controlled by AT commands, it is on by default.
5.8.2 GPS_DISABLE# Interface
L830-EA M.2 module supports open/close GPS functional signal, and this function is also controlled by AT
commands.
Pin#
Name
I/O
Description
26
W_DISABLE2#
I
GPS on/off signal , 1.8V
The definition of GPS_DISABLE# signal as listed below:
No.
GPS_DISABLE#
Function
1
Low
GPS off
2
High
GPS on
3
Floating
GPS function is controlled by AT commands, it is on by default.
Note: This function is not supported yet.
5.9 TX_BLANKING Interface
Output the low level by default. While the module works in GSM bands, TX_BLANKING will output the
pulse signal that synchronized with GSM burst timing sequence. Because of the GSM TX will interface
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GPS signal receiving, suggest to close GPS or stop GPS data receiving while AP has detected the
TX_BLANKING pulse signal.
Pin#
Name
I/O
Description
48
TX_BLANKING
O
External GPS control signal
5.10 WAKEUP_Host Interface
L830-EA M.2 module supports WAKEUP_Host; the pin is high level by default. Output low level while
awaking host.
Pin#
Name
I/O
Description
23
WOWWAN#
O
L830-EA M.2 module wakes up the Host signal, 1.8V
signal，
low level is available
5.11 BODY_SAR Interface
L830-EA M.2 module supports BODY_SAR（DPR pin）.
BODY_SAR is input signal(this signal is output by AP-side) and with high level by default. Low level is
available. AP can detect the human body`s nearing through distance sensor, then output the BODY_SAR
signal with low level. Once the module detect the signal through interrupt detection, it will reduce the TX
power. The reduced threshold value can be set by AT commands.
Pin#
Name
I/O
Description
25
DPR
I
BODY_SAR detection
5.12 I2C Interface
L830-EA M.2 module supports a 12C interface and with I2C master by default. This I2C used for drive
external I2C slave device, such as Audio codec and so on.
Pin#
Name
I/O
Description
42
GNSS_SDA
I/O
I2C control signal input/output ,1.8V signal
40
GNSS_SCL
O
I2C control clock signal, 1.8V signal
The signal connection of L830-EA I2C and external 12C slave device ( such as Audio Codec）as listed
below:
L830-EA M.2
Direction
Audio Codec I2C Port
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GNSS_SDA
I2C_SDA
GNSS_SCL
I2C_SCL
5.13 Clock Interface
L830-EA M.2 module supports a 26MHz clock output and a 32KHz clock output.
Pin#
Name
I/O
Description
46
SYSCLK
O
26MHz clock output (recommend the external GPS to
use it, and can also use as MCLK of audio codec)
68
CLK32K
O
32KHz clock output
5.14 Config Interface
L830-EA M.2 module supports 4 config pins and the module is configured to WWAN-SSIC-0:
Pin#
Pin Name
I/O
Description
Value
1
CONFIG_3
O
The internal connect to GND
0
21
CONFIG_0
ONC-
69
CONFIG_1
O
The internal connect to GND
0
75
CONFIG_2
O
The internal connect to GND
0
The configuration of L830-EA M.2 Socket 2 Module type as listed below :
Config_0
(pin21)
Config_1
(pin69)
Config_2
(pin75)
Config_3
(pin1)
Module Type and Main
Host Interface
Port
Configuration
GND
GND
GND
GND
SSD-SATA
N/A
GND
GND
N/C
GND
WWAN-PCIe
N/A
N/C
GND
GND
GND
WWAN-SSIC
0
5.15 RF Interface
5.15.1 RF Connector Interface
L830-EA M.2 module provide 2 RF connected interface, used for the connection of external antenna. M is
the RF main antenna, D/G is the Diversity/GNSS antenna.
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Figure 5- 9 RF connector diagram
5.15.2 RF Connecting Seat
L830-EA M.2 module adopts the Murata MM4829-2702 RF connecting seat.
The dimension is 2.0*2.0*0.6mm. The structure diagram as follows :
Figure 5- 10 Structure diagram of RF connecting seat
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Figure 5-11 0.81mm coaxial cable matching RF connector
Figure 5-12 the RF connector insert into RF connecting seat
5.15.3 Main Performance of RF Connector
Rated condition
Environmental condition
Frequency range
DC to 6GHz
Temperature range:
Characteristic
impedance
50Ω
–40°C to +85°C
5.16 Other Interfaces
L830-EA M.2 module does not support the GPIO and Tunable ANT interface yet.
6 Electrical and Environmental Features
6.1 Electrical Features
The table below lists the range of L830-EA module ’s electrical characteristics:
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Parameters
Minimum Value
Maximum Value
Unit
Power supply signal
0
4.4
V
Digital signal
0
1.9
V
6.2 Environmental Features
This table below shows the environmental features of L830-EA.
Parameters
Minimum Value
Maximum Value
Unit
Operational Temperature
-30
+65
°C
Storage Temperature
-40
+85
°C
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7 RF Interface
7.1 Operating Frequency Band
The RF operating frequency band as listed below:
Operating Band
Description
Mode
Tx (MHz)
Rx (MHz)
Band 1
IMT 2100MHz
LTE FDD/WCDMA
1920 - 1980
2110 - 2170
Band 2
PCS 1900MHz
LTE FDD/WCDMA/GSM
1850 - 1910
1930 - 1990
Band 3
DCS 1800MHz
LTE FDD/GSM
1710 - 1785
1805 - 1880
Band 4
AWS 1700MHz
LTE FDD/WCDMA
1710 - 1755
2110 - 2155
Band 5
CLR 850MHz
LTE FDD/WCDMA/GSM
824 - 849
869 - 894
Band 6
UMTS 800MHz
WCDMA
830 - 840
875 - 885
Band 7
IMT-E 2600Mhz
LTE FDD
2500 - 2570
2620 - 2690
Band 8
E-GSM 900MHz
LTE FDD/WCDMA/GSM
880 - 915
925 - 960
Band 9
UMTS 1700MHz
LTE FDD
1749.9 -1784.9
1844.9 -1879.9
Band 13
USMH Block C
LTE FDD
777 - 787
746 - 756
Band 17
LSMH Blocks B/C
LTE FDD
704 - 716
734 - 746
Band 18
Japan Lower
800Mhz
LTE FDD
815 - 830
860 - 875
Band 19
Japan Upper
800Mhz
LTE FDD
830 - 845
875 - 890
Band 20
EUDD 800MHz
LTE FDD
832 - 862
791 - 821
Band 26
ECLR 850MHz
LTE FDD
814 - 849
859 - 894
Band 29
LSMH blocks D/E
LTE FDD
N/A
716 - 728
GPS L1
1574.42
-1576.42
GLONASS L1
1597.55
-1605.89
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7.2 Receiving Sensitivity
For different modes , the receiving sensitivity of L830-EA bands as listed below :
Mode
Band
Rx Sensitivity(dbm)
Note
GSM
GSM850
-109
BER<2.43%
GSM900
-109
BER<2.43%
DCS1800
-109
BER<2.43%
PCS1900
-109
BER<2.43%
WCDMA
Band 1
-110
BER<0.1%
Band 2
-110
BER<0.1%
Band 4
-110
BER<0.1%
Band 5
-110
BER<0.1%
Band 6
-110
BER<0.1%
Band 8
-110
BER<0.1%
LTE FDD
Band 1
-101
10MHz Band width
Band 2
-99
10MHz Band width
Band 3
-101
10MHz Band width
Band 4
-100
10MHz Band width
Band 5
-101
10MHz Band width
Band 7
-98
10MHz Band width
Band 8
-100
10MHz Band width
Band 9
-100
10MHz Band width
Band 13
-100
10MHz Band width
Band 17
-100
10MHz Band width
Band 18
-100
10MHz Band width
Band 19
-100
10MHz Band width
Band 20
-101
10MHz Band width
Band 26
-100
10MHz Band width
Band 29
-100
10MHz Band width
Note : The above values are tested in the double antenna situation (Main+Diversity). If used the single
antenna (without Diversity), the value of sensitivity will accordingly drop by some 3dbm.
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7.3 GNSS
L830-EA M.2 module supports GPS , GLONASS and aGPS. The antenna with RF Diversity and
GNSS.Through the AT order can open or close the GNSS functions, please reference the AT order
manual.
For Android system, GNSS output by ACM according to the data format of NEMA0183 , and the baud
rate is 115200;
For Win8/8.1/10 system, GNSS output by GNSS Sendor.
Description
Condition
Test Result
Power
GPS fixing
70mA
GPS tracking
70mA
GLONASS fixing
65mA
GLONASS tracking
65mA
Sleep
3.5mA
TTFF
GPS/
GLONASS
Cold start
38s/–130dBm
Warm start
35s/–130dBm
Hot Start
1s/–130dBm (GPS signal powers off 1s)
aGPS
Cold start
1s/–130dBm
Sensitivity
GPS
–158dBm
–160dBm
GLONASS
–157dBm
–158dBm
Note：The current of GNSS is testing under the situation of RF disable.
7.4 RF PCB Design
7.4.1 Wiring Principle
L830-EA adopts double RF antennas, the MAIN_ANT used for transmitting and receiving, the DIV_ANT
used for receiving. On the one hand, diversity antenna can improve the receiving sensitivity, on the other
hand, it can also improve the download speed. Because the L830-EA project is for LTE module, the
Antenna need double antennas can meet the performance requirements.
7.4.2 Impedance Design
The impedance of RF signal line of antenna interface needs to be controlled at 50 ohm.
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7.5 Antenna Design
7.5.1 Main Antenna Design Requirements
(1) Antenna efficiency
Antenna efficiency is the ratio of the input power and radiant power. Because of the antenna’s return loss,
material loss and coupling loss, the radiant power is always lower than the input power. The ratio is
recommended to be > 40% (–4dB).
(2) S11 or VSWR
S11 shows the matching degree of the antenna’s 50 ohm impedance, which affects antenna efficiency to
a certain extent. It is feasible to use VSWR testing method to measure the index. It is recommended that
S11 < –10dB.
(3) Polarization
Polarization is the rotation direction of the electric field of the antenna at the direction of the largest
radiation.
It is recommended to use linear polarization; for diversity antenna, it is recommended to use different
polarization directions from that of the main antenna.
(4) Radiation pattern
Radiation pattern refers to the electromagnetic field intensity at various directions in the far field of the
antenna. Half-wave doublet antenna is the perfect terminal antenna. In the case of built-in antenna, it is
recommended to use PIFA.
Antenna area: H 6mm * W 10mm * L 100mm. It is recommended to use PIFA or IFA.
Antenna radiation direction: Omni-directional.
(5) Gain and directivity
Antenna directivity refers to the electromagnetic field intensity at various directions of the electromagnetic
wave. Gain is the combination of the antenna efficiency and antenna directivity. It is recommended that
antenna gain ≤ 3dBi.
(6) Interference
In addition to antenna performance, other interference from the PCB will also affect the module
performance. In order to ensure the high performance of the module, the interference must be under
control. Suggestions: keep speaker, LCD, CPU, FPC wiring, audio circuit, and power supply away from
the antenna; add appropriate separation and shielding devices, or conduct filtering on the path.
(7) TRP/TIS
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TRP (Total Radiated Power)：
GSM850/900>28dBm
DCS1800/PCS1900 >25dBm
WCDMA Band 1, 2, 4, 5, 6, 8>19dBm
LTE FDD Band 1, 2, 3, 4, 5, 7, 8, 9, 13, 17, 18, 19, 20, 26 >19dBm
TIS (Total Isotropic Sensitivity)：
GSM850/900/DCS1800/PCS1900 <-102dBm
WCDMA Band 1, 2, 4, 5, 6, 8<-102dBm
LTE FDD Band 1, 2, 3, 4, 5, 7, 8, 9, 13, 17, 18, 19, 20, 26 <-95dBm (10MHz Band width)
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