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L816-AM Hardware User Manual Page1of
L816-AM Hardware User Manual
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Applicability Table
L816-AM
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Copyright
Copyright © 2016 Fibocom Wireless Inc. All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to
excerpt, copy any part of or the entire document, or distribute the document in any form.
Notice
The document is subject to update from time to time owing to the product version upgrade or other
reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,
information and suggestions contained in the document do not constitute any explicit or implicit
Trademark
The trademark is registered and owned by Fibocom Wireless Inc.
Version Record
Sections describe modifications
Add product certification of warnings
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1 Foreword....................................................................................................................................... 6
1.1 Introduction........................................................................................................................................... 6
1.2 Reference Standard
............................................................................................................................
6
1.3 Related Documents.............................................................................................................................6
2 Overview........................................................................................................................................7
2.1 Introduction
...........................................................................................................................................
7
2.2 Specification..........................................................................................................................................7
2.3 Warnings............................................................................................................................................... 8
2.4 Application Framework
.....................................................................................................................
11
2.5 Hardware Framework........................................................................................................................12
3 Application Interface................................................................................................................13
3.1 LGA Interface
.....................................................................................................................................
13
3.1.1 Pin Distribution.............................................................................................................................. 13
3.1.2 Pin Definition.................................................................................................................................... 14
3.2 Power Supply
.....................................................................................................................................
19
3.2.1 Power Supply................................................................................................................................... 19
3.2.2 Power Consumption........................................................................................................................21
3.3 Control Signal
.....................................................................................................................................
22
3.3.1 Module Start-up............................................................................................................................... 22
3.3.1.1 Start-up Circuit
.............................................................................................................................
22
3.3.1.2 Start-up Timing............................................................................................................................ 23
3.3.2 Module Shutdown............................................................................................................................24
3.3.3 Module Reset................................................................................................................................... 25
3.4 USB Interface
.....................................................................................................................................
26
3.4.1 USB Interface Definition.................................................................................................................26
3.4.2 USB Interface Application.............................................................................................................. 26
3.5 USIM Interface
...................................................................................................................................
27
3.5.1 USIM Pins......................................................................................................................................... 27
3.5.2 USIM Interface Circuit.....................................................................................................................28
3.5.2.1 N.C. SIM Card Slot..................................................................................................................... 28
3.5.2.2 N.O. SIM Card Slot
.....................................................................................................................
28
3.5.3 USIM Hot-Plugging..........................................................................................................................29
3.5.4 USIM Design.................................................................................................................................... 30
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3.6 GPIO
....................................................................................................................................................
30
3.6.1 FW_Ready........................................................................................................................................31
3.6.2 SMS_Ready......................................................................................................................................31
3.6.3 Wakeup_Host...................................................................................................................................31
3.6.4 PA_Blanking..................................................................................................................................... 32
3.7 Interrupt Control.................................................................................................................................32
3.7.1 W_Disable#...................................................................................................................................... 32
3.7.2 BodySar.............................................................................................................................................33
3.8 Other Interfaces................................................................................................................................. 33
4 RF Interface
................................................................................................................................
34
4.1 Operating Band..................................................................................................................................34
4.2 Transmitting Power............................................................................................................................34
4.3 Receiver Sensitivity
...........................................................................................................................
35
4.4 RF PCB Design..................................................................................................................................36
4.4.1 Trace Routing Principle.................................................................................................................. 36
4.4.2 RF Impedance Design.................................................................................................................... 36
4.5 Antenna Design..................................................................................................................................37
4.5.1 Antenna Design Requirements..................................................................................................... 37
5 Structure Specification
............................................................................................................
38
5.1 Product Appearance..........................................................................................................................38
5.2 Dimension of Structure..................................................................................................................... 39
5.3 Recommended Design for PCB Bonding Pad
..............................................................................
40
5.4 SMT Paster.........................................................................................................................................41
5.5 Storage................................................................................................................................................42
5.5.1 Storage Life...................................................................................................................................... 42
5.5.2 Workshop Life.................................................................................................................................. 42
5.5.3 Recommended baking standards:................................................................................................42
5.6 Packing
................................................................................................................................................
42
5.6.1 Tray Package....................................................................................................................................42
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1 Foreword
1.1 Introduction
The document describes the electrical characteristics, RF performance, dimensions and application
environment, etc. of L816-AM-00 (hereinafter referred to as L816-AM). With the assistance of the
document and other instructions, the developers can quickly understand the hardware functions of
L816-AM modules and develop products.
1.2 Reference Standard
The design of the product complies with the following standards:
3GPP TS 51.010-1 V10.5.0: Mobile Station (MS) conformance specification; Part 1:
Conformance specification
3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification; Radio
transmission and reception (FDD);Part 1: Conformance specification
3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radio
transmission and reception; Part 1: Conformance testing
3GPP TS 21.111 V10.0.0: USIM and IC card requirements
3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment
3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)
3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application
3GPP TS 36.124V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile
terminals and ancillary equipment
3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)
3GPPTS27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment
(DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)
1.3 Related Documents
RF Antenna Application Design Specification
FIBOCOM_L8 Family System Driver Integration and Application Guidance
L816-AM AT Commands Manual
L816-AM SMT Application Design Specification
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2 Overview
2.1 Introduction
The L816-AM module are highly integrated 4G wireless communication LGA modules, which supports
LTE FDD/WCDMA/GSM systems (3 modes and 7 bands).
Specification
WCDMA/HSPA+: Band I,II,V(VI),VIII
GSM/GPRS/EDGE: 850/900/1800/1900MHz
Rel.9, 10Mbps DL/5Mbps UL (Cat 1)
UMTS:384 kbps DL/384 kbps UL
HSDPA CAT 7:7.2 Mbps Down;HSUPA CAT 6:5.76 Mbps Up
GPRS:MSC 10, CS-4 80 Kbps Down/20Kbps Up
Temperature
Operating: -10°C~+55°C
Physical
characteristics
Package: LGA 115 pins
Dimension:30.0 x 21.0 x 1.55mm
Antenna
WWAN Main Antenna x 1
WWAN Diversity Antenna x 1
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3GPP TS 27.007 and 27.005, and proprietary FIBOCOM AT commands
2.3 Warnings
EU Regulatory Conformance:
Hereby, We, FIBOCOM Wireless Inc. declares that this device L816-AM is in compliance with the
essential requirements and other relevant provisions of Directive 1999/5/EC.
In all cases assessment of the final product must be mass against the Essential requirements of the
R&TTE Directive Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.2
The maximum antenna gain for frequency 900 is 3dBi; for frequency 1800 is 5dBi and the antenna
separation distance is 20cm.
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
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L816-AM Hardware User Manual Page9of
installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that
to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the party responsible for compliance could
void the user's authority to operate this equipment.
This transmitter must not be co-located or operating in conjunction with any other antenna or
Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20cm between the radiator &
This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20 cm is maintained between the antenna and
users, and the maximum antenna gain allowed for use with this device is 5dBi.
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed
IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop
configurations or co-location with another transmitter), then the FCC authorization is no longer considered
valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will
be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC
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This transmitter module is authorized only for use in device where the antenna may be installed such that
20 cm may be maintained between the antenna and users. The final end product must be labeled in a
visible area with the following: “Contains FCC ID: ZMOL816AM and IC:21374-L816AM”. The grantee's
FCC ID & IC ID can be used only when all FCC&IC compliance requirements are met.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.
Industry Canada statement
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to
the following two conditions:
1) this device may not cause interference, and
2) this device must accept any interference, including interference that may cause undesired
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:
1) l'appareil ne doit pas produire de brouillage, et
2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d'en compromettre le fonctionnement.
This Class B digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.
This device complies with RSS-310 of Industry Canada. Operation is subject to the condition that this
device does not cause harmful interference.
Cet appareil est conforme à la norme RSS-310 d'Industrie Canada. L'opération est soumise à la
condition que cet appareil ne provoque aucune interférence nuisible.
This device and its antenna(s) must not be co-located or operating in conjunction with any other
antenna or transmitter, except tested built-in radios.
Cet appareil et son antenne ne doivent pas être situés ou fonctionner en conjonction avec une autre
antenne ou un autre émetteur, exception faites des radios intégrées qui ont été testées.
The County Code Selection feature is disabled for products marketed in the US/ Canada.
La fonction de sélection de l'indicatif du pays est désactivée pour les produits commercialisés aux
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Radiation Exposure Statement:
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20cm between the radiator & your
Déclaration d'exposition aux radiations:
Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un
environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de
distance entre la source de rayonnement et votre corps.
2.4 Application Framework
The peripheral applications for L816-AM module are shown in Figure 2-1:
Figure2-1 Application Framework
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2.5 Hardware Framework
The hardware framework in Figure 2-2 shows the main hardware functions of L816-AM module, including
base band and RF functions.
Baseband contains the followings:
GSM/UMTS/LTE FDD controller/Power supply
RF contains the followings:
Figure 2-2 Hardware Framework
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3 Application Interface
3.1 LGA Interface
The L816-AM module applies LGA packaging, with a total of 115 pins.
3.1.1 Pin Distribution
Figure 3-1 Pin Map (TOP Perspective View)