Fibocom Wireless L816AM Users Manual

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L816-AM Hardware User Manual Page1of

L816-AM Hardware User Manual

Version: 2.0.4

Update date: 2016.09.18

L816-AM Hardware User Manual Page2of

Applicability Table

No.

Product model

Description

L816-AM

N/A

L816-AM Hardware User Manual Page3of

Copyright

Without the prior written permission of the copyright holder, any company or individual is prohibited to

excerpt, copy any part of or the entire document, or distribute the document in any form.

Notice

The document is subject to update from time to time owing to the product version upgrade or other

reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,

information and suggestions contained in the document do not constitute any explicit or implicit

guarantee.

Trademark

The trademark is registered and owned by Fibocom Wireless Inc.

Version Record

Version

Update Date

Description

V2.0.0

2016-04-28

Initial version

V2.0.1

2016-07-19

Sections describe modifications

V2.0.2

2016-07-26

Modified description

V2.0.3

2016-07-28

Update part chart

V2.0.4

2016-09-18

Add product certification of warnings

L816-AM Hardware User Manual Page4of

Contents

1 Foreword....................................................................................................................................... 6

1.1 Introduction........................................................................................................................................... 6

1.2 Reference Standard

............................................................................................................................

1.3 Related Documents.............................................................................................................................6

2 Overview........................................................................................................................................7

2.1 Introduction

...........................................................................................................................................

2.2 Specification..........................................................................................................................................7

2.3 Warnings............................................................................................................................................... 8

2.4 Application Framework

.....................................................................................................................

2.5 Hardware Framework........................................................................................................................12

3 Application Interface................................................................................................................13

3.1 LGA Interface

.....................................................................................................................................

3.1.1 Pin Distribution.............................................................................................................................. 13

3.1.2 Pin Definition.................................................................................................................................... 14

3.2 Power Supply

.....................................................................................................................................

3.2.1 Power Supply................................................................................................................................... 19

3.2.2 Power Consumption........................................................................................................................21

3.3 Control Signal

.....................................................................................................................................

3.3.1 Module Start-up............................................................................................................................... 22

3.3.1.1 Start-up Circuit

.............................................................................................................................

3.3.1.2 Start-up Timing............................................................................................................................ 23

3.3.2 Module Shutdown............................................................................................................................24

3.3.3 Module Reset................................................................................................................................... 25

3.4 USB Interface

.....................................................................................................................................

3.4.1 USB Interface Definition.................................................................................................................26

3.4.2 USB Interface Application.............................................................................................................. 26

3.5 USIM Interface

...................................................................................................................................

3.5.1 USIM Pins......................................................................................................................................... 27

3.5.2 USIM Interface Circuit.....................................................................................................................28

3.5.2.1 N.C. SIM Card Slot..................................................................................................................... 28

3.5.2.2 N.O. SIM Card Slot

.....................................................................................................................

3.5.3 USIM Hot-Plugging..........................................................................................................................29

3.5.4 USIM Design.................................................................................................................................... 30

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3.6 GPIO

....................................................................................................................................................

3.6.1 FW_Ready........................................................................................................................................31

3.6.2 SMS_Ready......................................................................................................................................31

3.6.3 Wakeup_Host...................................................................................................................................31

3.6.4 PA_Blanking..................................................................................................................................... 32

3.7 Interrupt Control.................................................................................................................................32

3.7.1 W_Disable#...................................................................................................................................... 32

3.7.2 BodySar.............................................................................................................................................33

3.8 Other Interfaces................................................................................................................................. 33

4 RF Interface

................................................................................................................................

4.1 Operating Band..................................................................................................................................34

4.2 Transmitting Power............................................................................................................................34

4.3 Receiver Sensitivity

...........................................................................................................................

4.4 RF PCB Design..................................................................................................................................36

4.4.1 Trace Routing Principle.................................................................................................................. 36

4.4.2 RF Impedance Design.................................................................................................................... 36

4.5 Antenna Design..................................................................................................................................37

4.5.1 Antenna Design Requirements..................................................................................................... 37

5 Structure Specification

............................................................................................................

5.1 Product Appearance..........................................................................................................................38

5.2 Dimension of Structure..................................................................................................................... 39

5.3 Recommended Design for PCB Bonding Pad

..............................................................................

5.4 SMT Paster.........................................................................................................................................41

5.5 Storage................................................................................................................................................42

5.5.1 Storage Life...................................................................................................................................... 42

5.5.2 Workshop Life.................................................................................................................................. 42

5.5.3 Recommended baking standards:................................................................................................42

5.6 Packing

................................................................................................................................................

5.6.1 Tray Package....................................................................................................................................42

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1 Foreword

1.1 Introduction

The document describes the electrical characteristics, RF performance, dimensions and application

environment, etc. of L816-AM-00 (hereinafter referred to as L816-AM). With the assistance of the

document and other instructions, the developers can quickly understand the hardware functions of

L816-AM modules and develop products.

1.2 Reference Standard

The design of the product complies with the following standards:



3GPP TS 51.010-1 V10.5.0: Mobile Station (MS) conformance specification; Part 1:

Conformance specification



3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification; Radio

transmission and reception (FDD);Part 1: Conformance specification



3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radio

transmission and reception; Part 1: Conformance testing



3GPP TS 21.111 V10.0.0: USIM and IC card requirements



3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment

(SIM-ME) interface



3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)

application



3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application

Toolkit(USAT)



3GPP TS 36.124V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile

terminals and ancillary equipment



3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)



3GPPTS27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment

(DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)

1.3 Related Documents



RF Antenna Application Design Specification



FIBOCOM_L8 Family System Driver Integration and Application Guidance



L816-AM AT Commands Manual



L816-AM SMT Application Design Specification

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2 Overview

2.1 Introduction

The L816-AM module are highly integrated 4G wireless communication LGA modules, which supports

LTE FDD/WCDMA/GSM systems (3 modes and 7 bands).

2.2 Specification

Specification

Operating Band

LTE FDD: Band II,IV, XII

WCDMA/HSPA+: Band I,II,V(VI),VIII

GSM/GPRS/EDGE: 850/900/1800/1900MHz

Data

Transmission

LTE FDD

Rel.9, 10Mbps DL/5Mbps UL (Cat 1)

WCDMA / HSDPA /

HSUPA:

UMTS:384 kbps DL/384 kbps UL

HSDPA CAT 7:7.2 Mbps Down;HSUPA CAT 6:5.76 Mbps Up

GPRS/EDGE

GPRS:MSC 10, CS-4 80 Kbps Down/20Kbps Up

Power Supply

DC 3.3V～4.5V

Temperature Operating: -10°C～+55°C

Storage: -40°C ～+85°C

Physical

characteristics Package: LGA 115 pins

Dimension:30.0 x 21.0 x 1.55mm

Weight:~2.4g

Interfaces

Antenna WWAN Main Antenna x 1

WWAN Diversity Antenna x 1

Function

Interface

USIM 3V/1.8V

USB 2.0 x 1

EINT, GPIO

USIM x 1

RF MIPI,RF GPO

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Software

AT commands

3GPP TS 27.007 and 27.005, and proprietary FIBOCOM AT commands

Firmware update

USB

2.3 Warnings

2.3.1 CE Statement

EU Regulatory Conformance:

Hereby, We, FIBOCOM Wireless Inc. declares that this device L816-AM is in compliance with the

essential requirements and other relevant provisions of Directive 1999/5/EC.

CE 0560

R&TTE Regulation:

In all cases assessment of the final product must be mass against the Essential requirements of the

R&TTE Directive Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.2

requirements.

The maximum antenna gain for frequency 900 is 3dBi; for frequency 1800 is 5dBi and the antenna

separation distance is 20cm.

2.3.2 FCC Statement

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference

received, including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant

to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful

interference in a residential installation. This equipment generates, uses and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause harmful interference

to radio communications. However, there is no guarantee that interference will not occur in a particular

L816-AM Hardware User Manual Page9of

installation. If this equipment does cause harmful interference to radio or television reception, which can

be determined by turning the equipment off and on, the user is encouraged to try to correct the

interference by one of the following measures:



Reorient or relocate the receiving antenna.

 Increase the separation between the equipment and receiver.

 Connect the equipment into an outlet on a circuit different from that

to which the receiver is connected.

 Consult the dealer or an experienced radio/TV technician for help.

FCC Caution:

 Any changes or modifications not expressly approved by the party responsible for compliance could

void the user's authority to operate this equipment.

 This transmitter must not be co-located or operating in conjunction with any other antenna or

transmitter.

Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.

This equipment should be installed and operated with minimum distance 20cm between the radiator &

your body.

This device is intended only for OEM integrators under the following conditions:

1) The antenna must be installed such that 20 cm is maintained between the antenna and

users, and the maximum antenna gain allowed for use with this device is 5dBi.

2) The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM

integrator is still responsible for testing their end-product for any additional compliance requirements

required with this module installed

IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop

configurations or co-location with another transmitter), then the FCC authorization is no longer considered

valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will

be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC

authorization.

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End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be installed such that

20 cm may be maintained between the antenna and users. The final end product must be labeled in a

visible area with the following: “Contains FCC ID: ZMOL816AM and IC:21374-L816AM”. The grantee's

FCC ID & IC ID can be used only when all FCC&IC compliance requirements are met.

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or

remove this RF module in the user’s manual of the end product which integrates this module. The end

user manual shall include all required regulatory information/warning as show in this manual.

2.3.3 IC Statement

Industry Canada statement



This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to

the following two conditions:

1) this device may not cause interference, and

2) this device must accept any interference, including interference that may cause undesired

operation of the device.



Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio

exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:

1) l'appareil ne doit pas produire de brouillage, et

2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage

est susceptible d'en compromettre le fonctionnement.



This Class B digital apparatus complies with Canadian ICES-003.



Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.



This device complies with RSS-310 of Industry Canada. Operation is subject to the condition that this

device does not cause harmful interference.



Cet appareil est conforme à la norme RSS-310 d'Industrie Canada. L'opération est soumise à la

condition que cet appareil ne provoque aucune interférence nuisible.



This device and its antenna(s) must not be co-located or operating in conjunction with any other

antenna or transmitter, except tested built-in radios.



Cet appareil et son antenne ne doivent pas être situés ou fonctionner en conjonction avec une autre

antenne ou un autre émetteur, exception faites des radios intégrées qui ont été testées.



The County Code Selection feature is disabled for products marketed in the US/ Canada.



La fonction de sélection de l'indicatif du pays est désactivée pour les produits commercialisés aux

États-Unis et au Canada.

L816-AM Hardware User Manual Page11of

Radiation Exposure Statement:

This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This

equipment should be installed and operated with minimum distance 20cm between the radiator & your

body.

Déclaration d'exposition aux radiations:

Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un

environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de

distance entre la source de rayonnement et votre corps.

2.4 Application Framework

The peripheral applications for L816-AM module are shown in Figure 2-1:

Figure2-1 Application Framework

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2.5 Hardware Framework

The hardware framework in Figure 2-2 shows the main hardware functions of L816-AM module, including

base band and RF functions.

Baseband contains the followings:



GSM/UMTS/LTE FDD controller/Power supply



NAND+LPDDR2 RAM

 Application interface

RF contains the followings:

 RF Transceiver

 RF Power/PA



RF Front End

 RF Filter

Figure 2-2 Hardware Framework

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3 Application Interface

3.1 LGA Interface

The L816-AM module applies LGA packaging, with a total of 115 pins.

3.1.1 Pin Distribution

Figure 3-1 Pin Map (TOP Perspective View)

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3.1.2 Pin Definition

The L816-AM pin definition is as follows:

Pin Name

I/O

Reset

Value

Pin Description

Type USB2.0

USB_DP

I/OTUSB Data Positive

0.3---3V

USB_DN

I/OTUSB Data Negative

0.3---3V

VBUS

USB VBUS Supply

2.0---5.25V

SIM

SIM1_DATA

I/OLUSIM data, internal 4.7KΩ pull-up

1.8V/3V

SIM1_RST

OLUSIM reset

1.8V/3V

SIM1_CLK

OLUSIM clock

1.8V/3V

VSIM1

USIM power supply

1.8V/3V

SIM1_CD

USIM card detection with 390KΩ pull-

up, active high

1.8V

EINT

Wakeup_Modem

IPDReserved

CMOS 1.8V

W_Disable#

IPDDisable WWAN

CMOS 1.8V

BodySar

IPDBody SAR detection

CMOS 1.8V

GPIO

FW_Ready

OPDFW_Ready output

CMOS 1.8V

SMS_Ready

OPDSMS_Ready output

CMOS 1.8V

USB_En/Disable

OPDEnable_Disable-USB Signal Output

CMOS 1.8V

PA_Blanking

OPDPA_Blanking output

CMOS 1.8V

GPIO_Modem

I/OPDReserved

CMOS 1.8V

Wakeup_Host

OPDWakeup_Host output

ANT

Main_ANT

I/O

Main antenna

DIV_ANT

Diversity antenna

ANT Tunable

L816-AM Hardware User Manual Page15of

Pin Name

I/O

Reset

Value

Pin Description

Type

RFE_RFFE2_VIO

RFFE2 VIO for tunable ANT

1.8V

RFE_RFFE2_SCLK

Reserved

1.8V

RFE_RFFE2_SDATA

I/O

Reserved

1.8V

RF GPO

GPIO_RF1

RF_GPIO_1

2.3V

GPIO_RF2

RF_GPIO_2

2.3V

ASM_2V5

2.5V

Module Control

Reset_N

Module reset input with 100KΩ pull-up

1.8V

Power_On/Off

Module power on/off signal.

Advise the customer to increase the 200KΩ pull-down

1.8V

Power

VBAT_BB

PI-Power input

Power supply

VBAT_PA

PI-Power input

Power supply

VBAT_PA

PI-Power input

Power supply

VBAT_TR

PI-Power input

Power supply

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

L816-AM Hardware User Manual Page16of

Pin Name

I/O

Reset

Value

Pin Description

Type

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

GND

--GND

Ground

L816-AM Hardware User Manual Page17of

Pin Name

I/O

Reset

Value

Pin Description

Type

TG1

GND

--Thermal Ground

Ground

TG2

GND

--Thermal Ground

Ground

TG3

GND

--Thermal Ground

Ground

TG4

GND

--Thermal Ground

Ground

TG5

GND

--Thermal Ground

Ground

TG6

GND

--Thermal Ground

Ground

TG7

GND

--Thermal Ground

Ground

TG8

GND

--Thermal Ground

Ground

TG9

GND

--Thermal Ground

Ground

TG10

GND

--Thermal Ground

Ground

TG11

GND

--Thermal Ground

Ground

TG12

GND

--Thermal Ground

Ground

TG13

GND

--Thermal Ground

Ground

TG14

GND

--Thermal Ground

Ground

TG15

GND

--Thermal Ground

Ground

TG16

GND

--Thermal Ground

Ground

TG17

GND

--Thermal Ground

Ground

TG18

GND

--Thermal Ground

Ground

TG19

GND

--Thermal Ground

Ground

TG20

GND

--Thermal Ground

Ground

TG21

GND

--Thermal Ground

Ground

TG22

GND

--Thermal Ground

Ground

TG23

GND

--Thermal Ground

Ground

TG24

GND

--Thermal Ground

Ground

TG25

GND

--Thermal Ground

Ground

TG26

GND

--Thermal Ground

Ground

TG27

GND

--Thermal Ground

Ground

TG28

GND

--Thermal Ground

Ground

L816-AM Hardware User Manual Page18of

Pin Name

I/O

Reset

Value

Pin Description

Type

TG29

GND

--Thermal Ground

Ground

TG30

GND

--Thermal Ground

Ground

TG31

GND

--Thermal Ground

Ground

TG32

GND

--Thermal Ground

Ground

TG33

GND

--Thermal Ground

Ground

TG34

GND

--Thermal Ground

Ground

TG35

GND

--Thermal Ground

Ground

TG36

GND

--Thermal Ground

Ground

TG37

GND

--Thermal Ground

Ground

TG38

GND

--Thermal Ground

Ground

TG39

GND

--Thermal Ground

Ground

TG40

GND

--Thermal Ground

Ground

TG41

GND

--Thermal Ground

Ground

TG42

GND

--Thermal Ground

Ground

TG43

GND

--Thermal Ground

Ground

TG44

GND

--Thermal Ground

Ground

TG45

GND

--Thermal Ground

Ground

H: High Voltage Level

L: Low Voltage Level

PD: Pull-Down

PU: Pull-Up

T: Tri-State

OD: Open Drain

PP: Push-Pull

PI: Power Input

PO: Power Output

Note:

The unused pins can be left floating.

L816-AM Hardware User Manual Page19of

3.2 Power Supply

The power interface for L816-AM module is as follows:

Pin Name

I/O

Pin Description

DC Parameters （V）

Minimum

Value

Typical

Value

Maximum

Value

VBAT_BB

Power input to BB

3.3

3.8

4.5

VBAT_PA

Power input to RF PA

DC-DC

3.3

3.8

4.547VBAT_PA

Power input to RF PA

DC-DC

3.3

3.8

4.548VBAT_TR

Power input to

transceiver

3.3

3.8

4.5 15

VBUS

USB power supply

2.0

3.8

5.25

VSIM1

SIM1 power supply

1.8V/3V

3.2.1 Power Supply

The L816-AM module should be powered through the VBAT pins, and the power supply design is shown

in Figure 3-2:

Figure 3-2 Power Supply Design

L816-AM Hardware User Manual Page20of

The filter capacitor design for power supply is shown in the following table:

Recommended

capacitance

Application

Description

220uF x 2

Voltage-stabilizing capacitors

Reduce power fluctuations of the module in

operation, requiring capacitors with low ESR



LDO or DC/DC power supply requires the

capacitor of no less than 440uF

 The capacitor for battery power supply

can be reduced to 100～220uF

1uF,100nF

Digital signal noise

Filter out the interference generated from the

clock and digital signals

39pF,33pF

850/900 MHz frequency band

Filter out low frequency band RF interference

18pF,8.2pF,6.8pF

1800/1900,2100MHz frequency

band

Filter out medium/high frequency band RF

interference

The stable power supply can ensure the normal operation of L816-AM module; and the ripple of the

power supply should be less than 165mV in design. When the module operates under GSM mode (Burst

transmit), the maximum operating current can reach 2A, so the power source should be not lower than

3.135V, or the module may shut down or reboot. The power supply limits are shown in Figure 3-3: Figure 3-3 Power Supply Limit

L816-AM Hardware User Manual Page21of

3.2.2 Power Consumption

In the case of 3.8V power supply, the power consumption for L816-AM module is shown in the following

table:

Parameter

Mode

Condition

Average

Current(mA)

off

Power off

Power supply, module power off

TBD

Idle

GPRS

MFRMS=5

TBD

WCDMA

DRX=8

TBD

LTE FDD

DRX=8

TBD

Radio Off

AT+CFUN=4, Flight mode

TBD

Sleep

GPRS

MFRMS=2

TBD

MFRMS=5

TBD

MFRMS=9

TBD

WCDMA

DRX=6

TBD

DRX=8

TBD

DRX=9

TBD

LTE FDD

Paging cycle #64 frames (0.64 sec DRx cycle)

TBD

Radio Off

AT+CFUN=4,Flight mode

TBD

IGPRS-RMS

CS4

GPRS

1Rx slot

nTX slot GPRS Data transfer GSM850; PCL=5; 1Rx/2Tx

TBD

GPRS Data transfer GSM900; PCL=5; 1Rx/2Tx

TBD

GPRS Data transfer DCS1800; PCL=0; 1Rx/2Tx

TBD

GPRS Data transfer PCS1900; PCL=0; 1Rx/2Tx

TBD

EGPRS-RMS

MCS9

EDGE

EDGE Data transfer GSM850; PCL=8; 1Rx/2Tx

TBD

EDGE Data transfer GSM900; PCL=8; 1Rx/2Tx

TBD

EDGE Data transfer DCS1800; PCL=2; 1Rx/2Tx

TBD

EDGE Data transfer PCS1900; PCL=2; 1Rx/2Tx

TBD

WCDMA-RMS

WCDMA WCDMA Data transfer Band I @+23dBm

TBD

WCDMA Data transfer Band II @+23dBm

TBD

L816-AM Hardware User Manual Page22of

Parameter

Mode

Condition

Average

Current(mA)

WCDMA Data transfer Band V(VI) @+23dBm

TBD

WCDMA Data transfer Band VIII @+23dBm

TBD

LTE-RMS

LTE FDD

LTE FDD Data transfer Band 2 @+23dBm

TBD

LTE FDD Data transfer Band 4 @+23dBm

TBD

LTE FDD Data transfer Band 12 @+23dBm

TBD

3.3 Control Signal

The L816-AM module provides two control signals to execute the power on/off and reset operations, the

pin definition is as follows:

Pin Name

I/O

Reset Value

Functions

Type

Power_On/Off

Power on/off signal with internal 200KΩ

pull-down.

High: Power on

Low or floating: Power off

1.8V

Reset_N

Reset signal with 100KΩ internal

pull-up, active low.

1.8V

3.3.1 Module Start-up

3.3.1.1 Start-up Circuit

The VRTC output from the module can be used as the pull up voltage and the module has two start-up

modes:



AP (Application Processor) controls the module start-up, and the circuit design is shown in Figure

3-4:

 Automatically start-up when powered on, and the circuit design is shown in Figure 3-5:

L816-AM Hardware User Manual Page23of

Figure 3-4 Circuit for Module Start-up Controlled by AP

Figure 3-5 Circuit for Automatic Start-up

3.3.1.2 Start-up Timing

After powering on, the module will start-up by pulling up the Power_On/Off signal for more than 20ms

(100ms is recommended).The start-up timing is shown in Figure 3-6:

Figure 3-6 Timing Control for Start-up

L816-AM Hardware User Manual Page24of

Note:

The Reset_N is required to pull high with a 1s delay after the VBAT, because it takes some time

to charge the capacitors for +3.3V power supply. If the VBAT power supply is already stable

before starting up the module, the delay time can be ignored.

3.3.2 Module Shutdown

The L816-AM module can be shut down by software or hardware control.

Control mode

Action

Condition

Software

Sending AT+CPWROFF

command

Normal shutdown.

Hardware

Pull down Power_On/Off pin

Only used when a hardware exception occurs

and the software control cannot be used.

The module can be shut down by sending AT+CPWROFF command. When the module receives the

shutdown command, the module will plug Low the FW_Ready and start the finalization process (the

reverse process of initialization), and it will be completed after 3s. In the finalization process, the module

will save the network, SIM card and some other parameters from memory, then clear the memory and

PMU will be powered off. The control timing is shown in Figure 3-7:

Figure 3-7 Software Shutdown Timing Control

After the software shutdown, the Power_On/Off pin will remain high which prevents the module from

restarting again. To enable the next restart, the Power_On/Off pin should be pulled low after shutting

down.

L816-AM Hardware User Manual Page25of

3.3.3 Module Reset

The L816-AM module can reset to its initial status by pulling down the Reset_N signal for more than 10ms

(100ms is recommended), and the module will restart after the Reset_N signal is released. When the

customer executes Reset_N function, the PMU remains its power inside the module. The recommended

circuit design is shown in the Figure 3-8:

Figure 3-8 Recommended Design for Reset Circuit

The reset control timing is shown in Figure 3-9:

Figure 3-9 Reset Timing Control

Note:

Reset_N is a sensitive signal, it’s recommended to add a filter capacitor close to the module. In

case of PCB layout, the Reset_N signal lines should keep away from the RF interference and

protected by GND. Also, the Reset_N signal lines shall neither near the PCB edge nor route on

the surface planes to avoid module from reset caused by ESD problems.

L816-AM Hardware User Manual Page26of

3.4 USB Interface

The L816-AM module supports USB 2.0 which is compatible with USB High-Speed (480 Mbit/s) and USB

Full-Speed (12 Mbit/s). For the USB timing and electrical specification of L816-AM module, please refer to

“Universal Serial Bus Specification 2.0”.

3.4.1 USB Interface Definition

Pin Name

I/O

Reset Value

Pin Description

Type

VBUS

USB power supply

2.0---5.25V

USB_DNIOT

USB Data Negative

0.3---3V

USB_DPIOT

USB Data Positive

0.3---3V The VBUS power supply is used as the detection of the USB port; after VBUS is powered on, the USB

function of the module will be enabled and the enumeration will begin. The VBUS pin is only used for the

detection of USB port, and the supply current is about 1mA. When USB_DN & USB_DP are disconnected,

the module will not enter sleep mode for the case if VBUS power is supplied.

The USB driver will map 3 COM ports and 4 NCM ports, which are described as follows:



2 COM ports are used to send AT Commands.



1 COM port is used to capture LOG information with debugging softwares.



4 NCM ports are virtual network ports, which are used to initiate the data service.

Note:

One COM port can be used as the Modem COM port to initiate the data service. Since the speed

of the Modem COM port is not sufficient for the 150 Mbps peak downlink speed requirement for

LTE, so it is not recommended to be used.

3.4.2 USB Interface Application

The reference circuit is shown in Figure 3-10:

Figure 3-10 Reference Circuit for USB Interface

L816-AM Hardware User Manual Page27of

Since the module supports USB 2.0 High-Speed, it is required to use TVS diodes with equivalent

capacitance of 1pF or smaller ones on the USB_DN/DP differential signal lines, it is recommended to use

0.5pF TVS diodes. There is no special requirement for TVS diodes on VBUS pin, normally the 8 ~ 10pF

TVS diodes can be used.

USB_DN and USB_DP are high speed differential signal lines with the maximum transfer rate of 480

Mbit/s, so the following rules shall be followed carefully in the case of PCB layout:

 USB_DN and USB_DP signal lines should have the differential impedance of 90 ohms.



USB_DN and USB_DP signal lines should be parallel and have the equal length, the right angle

routing should be avoided.

 USB_DN and USB_DP signal lines should be routed on the layer that is next to the ground layer,

and be wrapped with GND on both sides and layers.

3.5 USIM Interface

The L816-AM module has a built-in USIM card interface, which supports 1.8V and 3V SIM cards.

3.5.1 USIM Pins

The USIM pins are described as follows:

Pin Name

I/O

Reset Value

Pin Description

Type

VSIM1

USIM power supply

1.8V/3V

SIM1_RST

USIM reset

1.8V/3V

SIM1_CLK

USIM clock

1.8V/3V

SIM1_DATA

I/O

USIM data with internal 4.7KΩ pull-up

1.8V/3V

SIM1_CD

USIM card detection with 390KΩ pull up.

Active-high, and high level means SIM

card is inserted; and low level means SIM

card is detached.

1.8V

L816-AM Hardware User Manual Page28of

3.5.2 USIM Interface Circuit

3.5.2.1 N.C. SIM Card Slot

The reference circuit design for N.C. (Normally Closed) SIM card slot is shown in Figure 3-11:

Figure 3-11 Reference Circuit for N.C. SIM Card Slot

The principles for N.C. SIM card slot design are described as follows:

 When the SIM card is detached, it connects the short circuit between CD and SW pins, and drives the

SIM1_CD pin low.

 When the SIM card is inserted, it connects an open circuit between CD and SW pins, and drives the

SIM1_CD pin high.

Suggested SIM1_CD pin increase TVS to protect the pin.

3.5.2.2 N.O. SIM Card Slot

The reference circuit design for N.O. (Normally Open) SIM card slot is shown in Figure 3-12:

Figure 3-12 Reference Circuit for N.O. SIM Card Slot

L816-AM Hardware User Manual Page29of

The principles for N.O. SIM card slot design are described as follows:



When the SIM card is detached, it connects an open circuit between CD and SW pins, and drives the

SIM1_CD pin low.

 When the SIM card is inserted, it connects the short circuit between CD and SW pins, and drives the

SIM1_CD pin high.



Suggested SIM1_CD pin increase TVS to protect the pin.

3.5.3 USIM Hot-Plugging

The L816-AM module supports the SIM card hot-plugging detection function, which determines whether

the SIM card is inserted or detached by detecting the SIM1_CD pin state of the SIM card slot.

The SIM card hot-plugging detection function can be configured by “AT+MSMPD” command, and the

description for AT command is as follows:

AT Command

Hot-plugging Detection

Function Description

AT+MSMPD=1

Enable

Default value, the SIM card hot-plugging detection

function is enabled.

The module can detect whether the SIM card is inserted

or not through the SIM1_CD pin state.

AT+MSMPD=0

Disable

The SIM card hot-plugging detection function is disabled.

The module reads the SIM card when starting up, and the

SIM1_CD status will not be detected.

After the SIM card hot-plugging detection function is enabled, the module detects that the SIM card is

inserted when the SIM1_CD pin is high, then executes the initialization program and finish the network

registration after reading the SIM card information. When the SIM1_CD pin is low, the module determines

that the SIM card is detached and does not read the SIM card.

Note:

By default, SIM1_CD is active-high, which can be switched to active-low by the AT command.

Please refer to the AT Commands Manual for the AT command.

L816-AM Hardware User Manual Page30of

3.5.4 USIM Design

The SIM card circuit design shall meet the EMC standards and ESD requirements with the improved

capability to resist interference, to ensure that the SIM card can work stably. The following guidelines

should be noted in case of design:



The SIM card slot placement should near the module as close as possible, and away from the

RF antenna, DC/DC power supply, clock signal lines, and other strong interference sources.

 The SIM card slot with a metal shielding housing can improve the anti-interference ability.



The trace length between the SIM card slot and the module should not exceed 100mm, or it

could reduce the signal quality.

 The SIM1_CLK and SIM1_DATA signal lines should be isolated by GND to avoid crosstalk

interference. If it is difficult for the layout, the whole SIM signal lines should be wrapped with

GND as a group at least.

 The filter capacitors and ESD devices for SIM card signals should be placed near to the SIM

card slot, and the ESD devices with 22~33pF capacitance should be used.

3.6 GPIO

The L816-AM module provides four signals to indicate the operating status of the module, the status

indicator pins are as follows:

Pin Name

I/O

Reset Value

Pin Description

Type

FW_Ready

Modem SMS Ready Inform

HOST 1.8V

CMOS 1.8V

SMS_Ready

Modem FW Ready Inform

HOST 1.8V

CMOS 1.8V

USB_En/Disable

Reserved

CMOS 1.8V

Wakeup_Host

Module wakes up Host (AP).

CMOS 1.8V

PA_Blanking

PA Blanking output, external

GPS control signal.

CMOS 1.8V

GPIO_Modem

Reserved

CMOS 1.8V

L816-AM Hardware User Manual Page31of

3.6.1 FW_Ready

Firmware ready is a modem driven GPIO, which on power on reset, it should be low. Once the firmware in

the modem is ready after boot, it should assert (high) GPIO. In an unlikely event of a firmware/modem

crash, if a crash/exception handler is to be run, FW ready GPIO should be de-asserted.

FW_Ready timing is shown in Figure 3-6，3-7，3-9。

3.6.2 SMS_Ready

SMS ready is a modem driven GPIO, which should be low while power up/off and reset sequences.

Whenever modem receives an SMS from the network, it should assert (high) GPIO during 100msec, then

de-assert (low).

SMS ready GPIO should be triggered by non-class 2 “SIM card data” messages regardless message

storage status (even the storage is full and not be able to store new received message).

SMS_Ready timing is shown in Figure 3-13:

Figure 3-13 SMS_Ready Timing

3.6.3 Wakeup_Host

The Wakeup_Host signal is used to wake the Host (AP) when there is an incoming call, SMS or other data

requests. The definition of Wakeup_Host signal is as follows:

Operating Mode

Wakeup_Host Signal

Ringing /SMS or data requests

Pull high 100ms then pull low (pulse signal).

Idle/Sleep

low level

Wakeup_Host timing is shown in Figure 3-14:

Figure 3-14 Wakeup_Host Timing

L816-AM Hardware User Manual Page32of

3.6.4 PA_Blanking

While the module works in GSM frequency band, the PA_Blanking pin will output the pulse signals that

synchronize with the GSM burst TX timing. As the GSM TX may interfere the receiving of the GPS signal,

AP can disable GPS or stop receiving GPS data when it detects the PA_Blanking pulse signals, to avoid

GPS working abnormally.

Operating modes

PA_BLANKING signal

Default

Low level

GSM burst TX

Output the pulse signals that synchronize with the GSM burst TX.

PA_BLANKING timing is shown in Figure 3-15:

Figure 3-15 PA_Blanking Timing

3.7 Interrupt Control

The L816-AM module provides four interrupt signals, and the pin definition is as follows:

Pin Name

I/O

Reset Value

Pin Description

Type

Wakeup_Modem

Reserved

CMOS 1.8V

W_Disable#

Enable/Disable RF network

CMOS 1.8V

BodySar

Body SAR detection

CMOS 1.8V

3.7.1 W_Disable#

The module provides a hardware pin to enable/disable WWAN RF function, and the function can also be

controlled by the AT command. The module enters the Flight mode after the RF function is disabled. The

definition of W_Disable# signal is as follows:

W_Disable# signal

Function

High/Floating

WWAN enable, the module exits the Flight mode.

Low

WWAN disable, the module enters Flight mode.

L816-AM Hardware User Manual Page33of

3.7.2 BodySar

The L816-AM module supports the BodySar detection function. The voltage level is high by default for

BodySar, and when the SAR sensor detects the closing human body, the BodySar signal will be pulled

down. As the result, the module then lowers down its emission power to its default threshold value, thus

reducing the RF radiation on the human body. The threshold of emission power can be set by the AT

Commands. The definition for BodySar function is as follows:

BodySar signal

Function

High/Floating

The module keeps the default emission power.

Low

Lower the maximum emission power to the threshold value of the module.

3.8 Other Interfaces

ANT Tunable, and RF_GPO.

Pin Name

I/O

Reset Value

Pin Description

Type

RFE_RFFE2_VIO

POPDRF LOGIC SWITCH

1.8V

RFE_RFFE2_SCLK

OPDReserved

1.8V

RFE_RFFE2_SDATA

I/OPDReserved

1.8V

Pin Name

I/O

Reset Value

Pin Description

Type

GPIO_RF1

OPDRF LOGIC SWITCH

2.3V

GPIO_RF2

OPDRF LOGIC SWITCH

2.3V

The RFFE port will be re-purposed to be GPO, with GPO1/GPO2, they can be used control external

DPDT, SPxT.

L816-AM Hardware User Manual Page34of

4 RF Interface

4.1 Operating Band

The L816-AM module provides main and diversity antenna interfaces; main antenna is used to transmit

and receive RF signals, and the diversity antenna is only used to receive RF signals. The operating bands

of the antennas are as follows:

Operating

Band

Description

Mode

Tx (MHz)

Rx (MHz)

Band 1

IMT 2100MHz

WCDMA

1920 - 1980

2110 - 2170

Band 2

PCS 1900MHz

LTE FDD/WCDMA/GSM

1850 - 1910

1930 - 1990

Band 3

DCS 1800MHz

GSM

1710 - 1785

1805 - 1880

Band 4

AWS 1700MHz

LTE FDD

1710 - 1755

2110 - 2155

Band 5

CLR 850MHz

WCDMA/GSM

824 - 849

869 - 894

Band 6

850MHz

WCDMA

830 - 840

875 -885

Band 8

E-GSM 900MHz

WCDMA/GSM

880 - 915

925 - 960

Band 12

Lower SMH/LSMH

blocks A/B/C

LTE FDD

699 - 716

729 - 746

4.2 Transmitting Power

The transmitting power for each band of the L816-AM module is as follows:

Mode

Band

Tx Power(dBm)

Note

GPRS

(1 slot Tx)

GSM850

32.5±1dBm

GSM900

32.5±1dBm

DCS1800

29.5±1dBm

PCS1900

29.5±1dBm

WCDMA

Band I

23±1dBm

Band II

23±1dBm

Band V

23±1dBm

Band VI

23±1dBm

L816-AM Hardware User Manual Page35of

Mode

Band

Tx Power(dBm)

Note

Band VIII

23±1dBm

LTE FDD

Band 2

23±1dBm

10MHz Bandwidth, 1 RB

Band 4

23±1dBm

10MHz Bandwidth, 1 RB

Band 12

23±1dBm

10MHz Bandwidth, 1 RB

4.3 Receiver Sensitivity

The receiver sensitivity for each band of the L816-AM module is as follows:

Mode

Band

Rx Sensitivity(dbm)-typical

Note

GPRS

GSM850

TBD

BLER<10%

GSM900

TBD

BLER<10%

DCS1800

TBD

BLER<10%

PCS1900

TBD

BLER<10%

WCDMA

Band I

TBD

BER<0.1%

Band II

TBD

BER<0.1%

Band V

TBD

BER<0.1%

Band VI

TBD

BER<0.1%

Band VIII

TBD

BER<0.1%

LTE FDD

Band 2

TBD

10MHz Bandwidth

Band 4

TBD

10MHz Bandwidth

Band 12

TBD

10MHz Bandwidth

Note:

The above LTE values are measured for the Dual-Antenna situation (Main + Diversity). For

single main antenna (without Diversity), the sensitivity will drop around 3dBm for each band of

LTE. The WCDMA and GSM have not diversity function.

L816-AM Hardware User Manual Page36of

4.4 RF PCB Design

4.4.1 Trace Routing Principle

The L816-AM module supports dual antennas, which meets the requirements for LTE of 3GPP. The

MAIN_ANT is used to transmit and receive RF signals, while the DIV_ANT is used to receive RF signals.

Using diversity antenna to improve the receiving sensitivity of RF antenna and double the download rate.

Since L816-AM is an LTE module, dual antennas should be applied to meet the performance

requirements.

The L816-AM module does not provide RF connector itself, so routing RF traces are required for the

connection with RF connectors or antenna feed points on the application mainboard. It is recommended

to use the microstrip line for RF trace, with the insertion loss controlled within 0.2dB and impedance

controlled at 50Ω.

It is recommended to reserve a π circuit (the parallel inductors should connect to the RF trace) between

the L816-AM module and the antenna connectors (or the feed points). The parallel devices are directly

across the RF lines and no branch is allowed.

Figure 4-1 L816-AM Antenna π Circuit

4.4.2 RF Impedance Design

The RF traces impedance of the antenna interface shall be controlled at 50Ω.

L816-AM Hardware User Manual Page37of

4.5 Antenna Design

4.5.1 Antenna Design Requirements

The L816-AM module provides Main and Diversity antenna interfaces, and the antenna design

requirements are as follows：

Main antenna requirements for L816-AM module

Frequency range

The most proper antenna to adapt the frequencies should be used.

Bandwidth

(GPRS/EDGE

）

GSM850 : 70 MHz

GSM900 : 80 MHz

GSM1800(DCS) : 170 MHz

GSM1900(PCS) : 140 MHz

Bandwidth (WCDMA)

WCDMA band I(2100) : 250 MHz

WCDMA band II(1900) : 140 MHz

WCDMA band V(850) : 70 MHz

WCDMA band VI(850): 55MHz

WCDMA band VIII(900) : 80 MHz

Bandwidth (LTE)

LTE band 2(1900): 140 MHz

LTE Band 4(1700): 445 MHz

LTE band 12(700): 50 MHz

Impedance

50 Ohm

Input power

> 35dBm(2W) peak power GSM

> 25dBm average power WCDMA & LTE

Recommended

standing-wave ratio

(SWR)

≤ 2:1

L816-AM Hardware User Manual Page38of

5 Structure Specification

5.1 Product Appearance

The product appearance for L816-AM module is shown in Figure 5-1:

Figure 5-1 Module Appearance

L816-AM Hardware User Manual Page39of

5.2 Dimension of Structure

The structural dimension of the L816-AM module is shown in Figure 5-2:

Figure 5-2 Dimension of Structure

L816-AM Hardware User Manual Page40of

5.3 Recommended Design for PCB Bonding Pad

Recommended Design for PCB Bonding Pad of the L816-AM module is shown in Figure 5-3

Figure5-3 Recommended Design for PCB Bonding Pad (Unit: mm)

L816-AM Hardware User Manual Page41of

5.4 SMT Paster

SMT Paster of the L816-AM module is shown in Figure Figure5-4

Please refer to L816-AM SMT Application Design Specification

Stencil thickness≥0.12mm

Figure5-4 Recommended Design for stencil (Unit: mm)

L816-AM Hardware User Manual Page42of

5.5 Storage

5.5.1 Storage Life

Storage Conditions (recommended): Temperature is 23 ± 5 ℃, relative humidity is RH 35-70%.

Storage period (sealed vacuum packing): Under the recommended storage conditions, the storage life is

12 months.

5.5.2 Workshop Life

For the module integrated some components for “Class 3” humidity-sensitive ,the workshop life need

24hours. After unpacking and under the environment with the room temperature of 23±5

℃

and the

relative humidity of less than 60%, the reflow production or other high-temperature operations shall be

conducted within 24 hours for products, or products shall be stored in the environment with the relative

humidity of less than 10%, in order to keep products dry.

5.5.3 Recommended baking standards:

 Continuous baking time: 24 hours.



Temperature: 125±5℃.



Oven: Heat convection oven.

 Component tray can NOT be baked on high temperature, Need use high temperature tray baking

5.6 Packing

The L816-AM module uses the tray sealed vacuum packing, combined with the outer packing method

using the hard cartoon box, so that the storage, transportation and the usage of modules can be protected

to the greatest extent.

Note:

The vacuum package bag includes the humidity card and a desiccant. The module is the

humidity sensitive device, and the humidity sensitivity level is Class 3, which meets the

requirements of the American Electronic Component Industry Association (JEDEC). Please read

the relevant application guidance and precautions referred to herein, to avoid the permanent

damage to the product caused by humidity.

5.6.1 Tray Package

Please read the L816-AM packing instructions of Fibocom company 《FIBOCOM-SAL-WI-63 L816-AM Packing

Instruction A0》.

Fibocom Wireless L816AM Users Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Applicability Table

Copyright

Notice

Trademark

Version Record

1 Foreword

1.1 Introduction

1.2 Reference Standard

1.3 Related Documents

2 Overview

2.1 Introduction

Specification

2.3 Warnings

2.4 Application Framework

2.5 Hardware Framework

3 Application Interface

3.1 LGA Interface

3.1.1 Pin Distribution

3.1.2 Pin Definition

3.2 Power Supply

3.2.1 Power Supply

3.2.2 Power Consumption

3.3 Control Signal

3.3.1 Module Start-up

3.3.1.1 Start-up Circuit

3.3.1.2 Start-up Timing

3.3.2 Module Shutdown

3.3.3 Module Reset

3.4 USB Interface

3.4.1 USB Interface Definition

3.4.2 USB Interface Application

3.5 USIM Interface

3.5.1 USIM Pins

3.5.2 USIM Interface Circuit

3.5.2.1 N.C. SIM Card Slot

3.5.2.2 N.O. SIM Card Slot

3.5.3 USIM Hot-Plugging

3.6 GPIO

3.6.1 FW_Ready

3.6.2 SMS_Ready

3.6.3 Wakeup_Host

3.6.4 PA_Blanking

3.7 Interrupt Control

W_Disable#

3.8 Other Interfaces

4 RF Interface

4.1 Operating Band

4.2 Transmitting Power

4.3 Receiver Sensitivity

4.4 RF PCB Design

4.4.1 Trace Routing Principle

4.4.2 RF Impedance Design

4.5 Antenna Design

4.5.1 Antenna Design Requirements

5 Structure Specification

5.1 Product Appearance

5.2 Dimension of Structure

5.3 Recommended Design for PCB Bonding Pad

5.4 SMT Paster

5.5 Storage

5.5.1 Storage Life

5.5.2 Workshop Life

5.5.3 Recommended baking standards:

5.6 Packing

5.6.1 Tray Package