L811-EA Module Hardware User Manual Page2of
Copyright ©2015 Fibocom Wireless Inc . All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to
excerpt, copy any part of or the entire document, or transmit the document in any form.
The document is subject to update from time to time owing to the product version upgrade or other
reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,
information and suggestions contained in the document do not constitute any explicit or implicit
The trademark is registered and owned by Fibocom Wireless Inc.
Modify descriptions for power on and RTC timing.
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The supported frequency bands of L811-EA wireless modules as shown in the following tables:
Band
1,2,3,4,5,7,8,13,17,
18,19,20
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1 Foreword.................................................................................................................................................................... 6
1.1 Introduction.....................................................................................................................................................6
1.2 Reference Standard......................................................................................................................................6
2 Product Overview..................................................................................................................................................... 8
2.1 Description......................................................................................................................................................8
2.2 Specifications................................................................................................................................................. 8
2.3 Appearance.................................................................................................................................................. 13
3 Structure...................................................................................................................................................................14
3.1 Dimension Diagram of Structure.............................................................................................................. 14
3.2 Recommended PCB Layout Design........................................................................................................15
4 Hardware Introduction........................................................................................................................................... 17
4.1 Pin Definition................................................................................................................................................17
4.1.1 Pin Map............................................................................................................................................. 17
4.1.2 Description of Pins...........................................................................................................................18
5 Hardware Interface.................................................................................................................................................24
5.1 Power Interface........................................................................................................................................... 24
5.1.1 Power Supply................................................................................................................................... 24
5.1.2 VSD2_1V8........................................................................................................................................ 24
5.1.3 VRTC................................................................................................................................................. 25
5.2 Power on/off and Reset Signal................................................................................................................. 26
5.2.1 Power on /off Signal........................................................................................................................ 26
5.2.1.1 Power on................................................................................................................................26
5.2.1.2 Power off................................................................................................................................27
5.2.1.3 The Recommended Design of Power on/off................................................................... 28
5.2.2 RESET Signal.................................................................................................................................. 28
5.3 Status Indicating Signals........................................................................................................................... 29
5.3.1 CORE DUMP Indicating................................................................................................................. 29
5.3.2 LPG Signal........................................................................................................................................29
5.3.3 WAKEUP_HOST Signal.................................................................................................................30
5.3.4 PA_BLANKING Signal....................................................................................................................30
5.4 Interrupt Control Signal.............................................................................................................................. 31
5.4.1 WAKE_UP Signal............................................................................................................................ 31
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5.4.2 W_DISABLE# Signal.......................................................................................................................31
5.4.3 Android & Linux / Win8 & Win10 Dual Systems Switch Control Signal................................. 31
5.5 USB Interface...............................................................................................................................................32
5.5.1 USB Interface Definition................................................................................................................. 32
5.5.2 USB Interface Application.............................................................................................................. 33
5.6 UART Interface............................................................................................................................................33
5.6.1 UART Interface Description........................................................................................................... 33
5.6.2 UART Interface Application............................................................................................................34
5.7 USIM Interface.............................................................................................................................................34
5.7.1 USIM Pins......................................................................................................................................... 34
5.7.2 USIM Interface Design....................................................................................................................35
5.7.2.1 “Normally Closed” SIM Card Circuit Design.................................................................... 35
5.7.2.2 “Normally Open” SIM Circuit Design.................................................................................35
5.7.3 Highlights for USIM Design............................................................................................................36
5.7.4 USIM Hot-Plugging..........................................................................................................................36
5.7.4.1 Hardware Connection..........................................................................................................36
5.7.4.2 Software Setup..................................................................................................................... 37
5.8 Digital Audio.................................................................................................................................................37
5.8.1 I2S Interface..................................................................................................................................... 37
5.8.2 PCM Mode Description...................................................................................................................38
5.9 I2C Interface.................................................................................................................................................38
5.10 Clock Interface.......................................................................................................................................... 39
5.11 Other Interfaces.........................................................................................................................................39
6 Electrical and Environmental Characteristic...................................................................................................... 40
6.1 Electrical Characteristic............................................................................................................................. 40
6.2 Environmental Characteristic....................................................................................................................40
7 RF Interface.............................................................................................................................................................41
7.1 RF PCB Design........................................................................................................................................... 41
7.1.1 Wire Routing Principle.................................................................................................................... 41
7.1.2 Impedance........................................................................................................................................ 42
7.2 Antenna Design...........................................................................................................................................42
7.2.1 Main Antenna Design Requirements........................................................................................... 42
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The document describes the electrical characteristics, RF performance, dimensions and application
environment, etc. of L811-EA wireless modules. With the assistance of the document and other
instructions, developers can quickly understand the performance of L811-EA wireless modules and
develop products.
The design of the product complies with the following standards :
3GPP TS 27.007 -v6.9.0: AT command set for User Equipment (UE)
3GPP TS 27.005 -v6.0.1: Use of Data Terminal Equipment -Data Circuit terminating Equipment
(DTE-DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)
3GPP TS 23.040 -v6.9.0: Technical realization of Short Message Service (SMS)
3GPP TS 24.011 -v6.1.0: Point- to - Point (PP) Short Message Service (SMS) support on mobile
3GPP TS 27.010 -v6.0.0: Terminal Equipment to User Equipment (TE-UE) multiplexer protocol
3GPP TS 27.060 -v6.0.0: Packet domain; Mobile Station (MS) supporting Packet Switched services
3GPP TS 25.304-v6.10.0: User Equipment (UE) procedures in idle mode and procedures for cell
reselection in connected mode
3GPP TS 25.308 -v6.4.0: High Speed Downlink Packet Access (HSDPA); Overall description;
3GPP TS 25.309 -v6.6.0: FDD enhanced uplink; Overall description; Stage 2
3GPP TS 23.038 -v6.1.0: Alphabets and language - specific information
3GPP TS 21.111 -v6.3.0: USIM and IC card requirements
3GPP TS 31.111 -v6.11.0 "USIM Application Toolkit (USAT)"
3GPP TS 45.002 -v6.12.0: Multiplexing and multiple access on the radio path
3GPP TS 51.014 -v4.5.0: Specification of the SIM Application Toolkit for the Subscriber Identity
Module - Mobile Equipment (SIM-ME) interface
3GPP TS 51.010 -1 -v6.7.0: Mobile Station (MS) conformance specification; Part 1: Conformance
3GPP TS 22.004 -v6.0.0: General on supplementary services
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3GPP TS 23.090 -v6.1.0: Unstructured Supplementary Service Data (USSD); Stage 2
3GPP TS 24.008 v6.19, Mobile radio interface Layer 3 specification;
3GPP TS 25.101 V7.18.0: User Equipment (UE) radio transmission and reception (FDD)
3GPP TS 36.101V9.18.0: User Equipment (UE) radio transmission and reception
3GPP TS 36.104V9.13.0: Base Station (BS) radio transmission and reception
3GPP TS 36.106V9.4.0: FDD Repeater radio transmission and reception
3GPP TS 36.113V9.5.0: Base Station (BS) and repeater ElectroMagnetic Compatibility (EMC)
3GPP TS 36.124V9.2.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals
3GPP TS 36.133V9.18.0:Requirements for support of radio resource management
3GPP TS 34.121-1 version 7.2.0: The requirements and this test apply to all types of UTRA for the
3GPP TS 36.521-1 User Equipment (UE) conformance specification; Radio transmission and
reception; Part 1: Conformance testing
3GPP TS 34.122V5.7.0: Technical Specification Group Radio Access Network; Radio transmission
3GPP TS 45.005 9.4.0: Digital cellular telecommunications system (Phase 2+);Radio transmission
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The L811-EA modules are highly integrated wireless communication LTE modules, which support three
modes and twelve bands, including the 4G/3G/2G mainstream modes (LTE FDD/WCDMA/GSM) for
Europe and North America and cover a wide range of frequency bands. The modules support the cellular
communication networks of Europe, North America as well as the mobile operators in some regions of
Operating
Frequency Range
LTE FDD: Band 1,2,3,4,5,7,8,13,17,18,19,20
WCDMA HSPA+: Band 1,2,4,5,8
GSM/GPRS/EDGE: 850/900/1800/1900MHz
Category 4 (150Mbps DL,50Mbps UL)
UMTS/HSDPA/HSUPA
3GPP Rel.8
DC-HSDPA 42Mbps(Cat24)
HSUPA 11.5Mbps(Cat7)
EDGE (E-GPRS) multi-slot class 33(296kbps DL,
236.8kbps UL)
GPRS multi-slot class 33 (107kbps DL,85.6kbps UL)
Dimension:32 x 26 x 2.0mm
Operating Temperature:-40℃ ~ +85℃
Storage Temperature:-40℃ ~ +85℃
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Voltage: 3.3V ~ 4.4V Normal: 3.8V
Current
Consumption
(Typical Value)
Antenna:Main x1,Diversity x1
USB 2.0 x1,Multiple Profiles over USB
SIM Support,I2C Support,I2S/PCM Support
Embedded TCP/IP and UDP/IP protocol stack
Multi-slot class 33 (5 Down; 4 Up; 6 Total)
Multi-slot class 33 (5 Down; 4 Up; 6 Total)
UMTS(14.4kbps),GSM(9.6kbps)
MO / MT Text and PDU modes
Voice Coders: EFR/HR/FR/AMR
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FIBOCOM proprietary AT commands
Firmware Loader Tool over USB/UART
1. Please make sure the temperature for device will not be higher than 85˚C.
2. The minimum distance between the user and/or any bystander and the radiating structure of the
3. Assessment of compliance of the product with the requirements relating to the Radio and
Telecommunication Terminal Equipment Directive (EC Directive 1999/5/EC) was performed by
PHOENIX TESTLAB (Notified Body No.0700),
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Federal Communications Commission (FCC) Declaration of Conformity
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
This device has been tested and found to comply with the limits for a Class B digital , pursuant to Part 15
of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiated radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help.
Changes or modifications not expressly approved by the party responsible for compliance could void the
user‘s authority to operate the equipment.
This device meets the government’s requirements for exposure to radio waves.
This device is designed and manufactured not to exceed the emission limits for exposure to radio
frequency (RF) energy set by the Federal Communications Commission of the U.S. Government.
This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In
order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to
the antenna shall not be less than 20cm (8 inches) during normal operation.
This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC
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compliance requirement of the end product, which integrates this module. 20cm minimum distance has to
be able to be maintained between the antenna and the users for the host this module is integrated into.
Under such configuration, the FCC radiation exposure limits set forth for an population/uncontrolled
environment can be satisfied.
Any changes or modifications not expressly approved by the manufacturer could void the user's authority
to operate this equipment.
USERS MANUAL OF THE END PRODUCT:
In the users manual of the end product, the end user has to be informed to keep at least 20cm separation
with the antenna while this end product is installed and operated. The end user has to be informed that
the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end
user has to also be informed that any changes or modifications not expressly approved by the
manufacturer could void the user's authority to operate this equipment. If the size of the end product is
smaller than 8x10cm, then additional FCC part 15.19 statement is required to be available in the users
manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference and (2) this device must accept any
interference received, including interference that may cause undesired operation.
LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area with the following " Contains TX FCC ID:
ZMOL811". If the size of the end product is larger than 8x10cm, then the following FCC part 15.19
statement has to also be available on the label: This device complies with Part 15 of FCC rules.
Operation is subject to the following two conditions: (1) this device may not cause harmful interference
and (2) this device must accept any interference received, including interference that may cause
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