How it Works
Fibocom Wireless
Loading...
H330
Users Manual
44 pgs800.34 Kb0

Fibocom Wireless H330 Users Manual

H330 HSPA+ Module
Hardware User Manual
Version: V1.0.0
Date: 2012-05-29
n
m
g
t
,
n
a
©
n
V
1
a
m
©
t
s
f
t
c
o
c
e
s
y
s
a
n
o
o
n
o
G
9
b
o
G
n
a
g
o
o
h
r
n
e
r
S
o
o
p
t
b
m
s
m
G
e
n
p
o
e
a
t
a
o
t
a
o
p
s
h
p
t
s
t
s
m
o
b
t
O
u
e
d
l
This docu
(Fibocom).
engineerin
requiremen
subject to c
of G&T.
Copyrig
Transmittal
contents a
be held liab
or design p
Copyright
tial Ma
ent contain
Fibocom of
efforts that
s specifical
hange. Dis
ht
reproducti
d communi
le for paym
tent are re
1999-2010
erial
informatio
ers this inf
use the pr
ly provided
losure of th
n, dissemi
ation there
nt of dama
erved.
Shenzhen
highly co
rmation as
ducts desi
to Fibocom
is informati
ation and/
f to others
ges. All rig
&T Indust
fidential to
service to
ned by Fib
by the cust
n to other
r editing of
without exp
ts created
ial Develop
henzhen
its custom
com. The i
mers. All s
arties is pr
his docum
ress authori
y patent gr
ent Co., L
&T Industri
rs, to supp
formation
ecification
hibited wit
nt as well a
zation are
nt or regist
d. All right
l Develop
rt applicati
rovided is
supplied h
out the writ
s utilization
rohibited.
ration of a
reserved.
ent Co., Lt
n and
ased upon
erein are
en consent
of its
ffenders wi
tility model
l
Revisio
Tradem
The FIBOC
service na
Copyright
Histor
e
rsion
V
.0.0
rks Not
OM Logo is
es or Logo
1999-2012
Date
2012-05-2
ice
registered
are the pr
Shenzhen
Initial
y Shenzhe
perty of th
&T Indust
G&T Indu
ir respectiv
ial Develop
Rem
trial Devel
e owners.
ent Co., L
rks
pment Co.,
d. All right
Ltd. All oth
reserved.
r product o
r
H330 HSPA+
Module Hard
ware User M
nual
Page 2 of 44
e
S
S
P
P
P
n
D
R
a
B
P4.24.2
a
P5.15.1
1
1
O
2
25.25.2
3
3
U5.4
4
s
e
p
d
a
o
M
D
e
f
T
e
C
e
D
e
e
e
g
D
a
c
a
g
p
p
c
p
C
.
.
.
.
.
.
.
.
.
g
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
s
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
5
5
5
6
6
6
0
1
1
2
3
3
4
4
4
0
0
0
1
4
4
5
5
6
6
7
8
8
9
0
0
0
1 Prefac
1.1
1.2
2 Introdu
2.1
2.2
2.3
3 Macha
3.1
3.2
4 Hardw
4.1
4.2
.................
cope ........
tandards ..
ction ..........
roduct De
roduct Sp
roduct Ap
ical ...........
imension .
ecommen
re Scope ..
lock Diagr
in Definiti
.1 Pin
..................
..................
..................
..................
cription .....
cification ...
earance ....
..................
..................
PCB Desi
..................
m .............
n ...............
ap ............
..................
..................
..................
..................
..................
..................
..................
..................
..................
n ..............
..................
..................
..................
..................
ontent
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
................
................
................
................
................
................
.............. 1
............... 1
............... 1
.............. 1
.............. 1
.............. 1
.............. 1
.............. 1
5 Hardw
5.1
5.
5.
5.2
5.
5.
5.3
5.
5.
.2 Pin
re Interfac
ower Inter
.1 VBA
.2 Pow
.3 VIO .
.4 VRT
n/Off/Res
.1 Pin
.2 Pow
.3 Pow
.4 Res
Indicator Si
.1 Pin
.2 Indic
escription ..
.................
ace ...........
.................
r Consum
..................
................
t................
escription ..
r on ..........
r off ...........
t ................
nal ............
escription ..
tor Descri
..................
..................
..................
..................
tion ...........
..................
..................
..................
..................
..................
..................
..................
..................
..................
tion ...........
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
.............. 1
.............. 2
.............. 2
.............. 2
.............. 2
.............. 2
.............. 2
.............. 2
.............. 2
.............. 2
.............. 2
.............. 2
.............. 2
.............. 2
.............. 2
5.4
H330 HSPA+
SB Interfa
.1 USB
5.
.2 USB
Module Hard
e ..............
Pin Descri
Design ......
ware User M
..................
tion ...........
..................
nual
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
.............. 3
.............. 3
.............. 3
Page 3 of 44
U5.55.5
U5.65.6
6
6
A
7
7
D5.85.8
O
c
E
E
e
O7.1
1
R7.2
2
A7.37.3
T
T
M
M
M
M
i
D
o
o
h
n
r
e
r
a
o
c
e
e
e
a
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
1
1
2
3
3
3
4
5
5
5
6
7
8
8
8
9
9
9
0
0
0
0
1
1
1
1
1
3
5.5
5.6
5.7
5.8
5.9
ART .........
.1 UAR
.2 UAR
SIM .........
.1 USI
.2 USI
5.
.3 USI
5.
.4 USI
nalog Aud
5.
.1 Pin
5.
.2 Audi
igital Audi
.1 I2S ..
.2 I2C ..
ther .........
..................
Interface .
Design ....
..................
Interface ..
Design .....
Design N
Hot Plug ..
o ...............
escription ..
Descriptio
................
..................
..................
..................
..................
..................
..................
..................
..................
..................
tice ...........
..................
..................
..................
n ................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
.............. 3
.............. 3
.............. 3
.............. 3
.............. 3
.............. 3
.............. 3
.............. 3
.............. 3
.............. 3
.............. 3
.............. 3
.............. 3
.............. 3
.............. 3
6 Electri
6.1
6.2
7 RF Int
7.1
7.
7.2
7.
7.3
al and Envi
lectrical C
nvironme
rface .........
perational
.1 Main
.2 Dive
F PCB De
.1 Layo
.2 Impe
ntenna D
.1 Main
.2 Dive
ronmental ..
aracteristi
tal Charact
..................
Band ........
Antenna ....
sity ............
sign ...........
ut Guidelin
dance ........
sign ...........
Antenna D
sity antenn
..................
.................
ristic .........
..................
..................
..................
..................
..................
.................
..................
..................
sign Requi
design ....
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
rement .......
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
..................
.............. 3
.............. 3
.............. 3
.............. 4
.............. 4
.............. 4
.............. 4
.............. 4
.............. 4
.............. 4
.............. 4
.............. 4
.............. 4
H330 HSPA+
Module Hard
ware User M
nual
Page 4 of 44
a
o
a
a
o
r
n
T
T
D
T
T
n
T
T
c
T
2
T
T
T
T
T
T
e
T
c
T
T
T
h
u
r
f
c
0
n
E
a
o
H
c
c
r
U
e
g
D
p
S
M
(
e
n
b
a
d
+
s
e
S
n
p
n
m
o
d
c
S
a
a
o
i
S
e
o
n
S
h
r
a
r
c
v
m
n
y
a
B
S
n
p
o
n
o
s
a
e
o
S
S
M
m
O
p
e
n
D
y
w
q
S
o
p
h
r
o
e
n
s
1 Pref
1.1 Sc
This manu
the H330 H
This manu
availability
and softwa
1.2 Sta
3GPP
3GPP
(DTE-
3GPP
3GPP
radio i
SPA+ mod
ce
pe
l provides t
l gives a co
f any featu
e version o
dards
S 27.007
S 27.005
CE) interfa
S 23.040
S 24.011
terface
e electrical
le in a host
mplete set
e or functio
a specific
-v6.9.0: AT
-v6.0.1: Us
e for Short
-v6.9.0: Te
-v6.1.0: Po
, mechanic
application.
f hardware
n, which is
330 HAPA
command
e of Data T
Message
hnical reali
int- to - Poi
l and envir
features a
escribed in
module.
et for User
rminal Equ
ervice (SM
zation of S
t (PP) Sho
nmental re
d functions
this manua
Equipment
pment -Dat
) and Cell
ort Messag
t Message
quirements
that may b
l, depends
(UE)
a Circuit ter
roadcast
e Service (
ervice (S
for properl
provided b
n the hard
minating E
ervice (CB
MS)
S) support
integrating
y H330. Th
are revisio
uipment
)
n mobile
3GPP
3GPP
3GPP
resele
3GPP
Stage
3GPP
3GPP
3GPP
3GPP
3GPP
3GPP
Modul
3GPP
specifi
TS 25.3
S 27.010
S 27.060
tion in con
S 25.308
S 25.309
S 23.038
S 21.111
S 31.111
S 45.002
S 51.014
- Mobile
S 51.010
ation
-v6.0.0: Te
-v6.0.0: Pa
4-v6.10.0:
ected mod
-v6.4.0: Hi
-v6.6.0: F
-v6.1.0: Al
-v6.3.0: US
-v6.11.0 "U
-v6.12.0:
-v4.5.0: Sp
quipment
-1 -v6.7.0:
minal Equi
cket domai
ser Equip
h Speed D
D enhance
habets and
IM and IC
IM Applic
ultiplexing
ecification
SIM-ME) in
Mobile Stat
ment to Us
; Mobile St
ent (UE) p
wnlink Pa
uplink; O
language -
ard require
tion Toolkit
nd multip
f the SIM A
terface
on (MS) co
er Equipme
tion (MS) s
ocedures i
ket Access
erall descri
specific inf
ents
(USAT)"
le access o
pplication T
formance
nt (TE-UE)
upporting P
idle mode
(HSDPA);
tion; Stage
rmation
the radio
olkit for th
pecificatio
ultiplexer
acket Switc
and proced
verall desc
2
ath
Subscribe
; Part 1: C
rotocol
ed service
ures for cell
ription;
Identity
nformance
3GPP
3GPP
3GPP
H330 HSPA+
S 22.004
S 23.090
S 24.008
Module Hard
-v6.0.0: G
-v6.1.0: U
v6.19, Mo
ware User M
neral on su
structured
ile radio int
nual
pplementar
upplement
rface Laye
services
ry Service
r 3 specific
Data (USS
tion;
); Stage 2
Page 5 of 44
o
d
S
0
d
F
e
：
m
n
s
z
e
U
0
G
0
5
2
G
E
m
3
g
a
n
A
D
z
o
A
0
0
5
C
2
a
u
s
.
t
A
m
C
/
e
s
A
z
1
S
a
S
A
2 Intr
2.1 Pro
H330 is a h
GSM/GPR
850/900/19
2.2 Pro
Product
Support
ductio
uct De
igh integrity
/EDGE GS
0/2100MH
uct Sp
eatures
d Bands：
• 4 Band
850/90
• 4 Band
850/90
criptio
3G WCDM
M850/900/
.
cificati
MTS/HSP
/1900/210
SM
/1800/190
wireless
CS1800/P
n
(WCDMA
MHz
MHz
odule, LG
S1900MH
FDD)
package,
and UMT
20 pin. It c
/HSDPA/H
n support
UPA/HSP
+
Data：
Physical
• UMTS/H
• HSUPA
• HSDPA
• GSM 3
• EDGE (
• GPRS
• Size：3
• Height：
• Mountin
• Weight：
SDPA/HSU
.76Mbps (
1Mbps (C
PP release
-GPRS) m
ulti-slot cla
.8mm x 27
2.45 mm
：LGA
< 6 grams
PA 3GPP r
at 6)
t 14)
7
lti-slot clas
s 12
8mm
lease 7
12
Environ
H330 HSPA+
ental
• Operatin
Module Hard
g Tempera
ware User M
ure：-30℃
nual
~ +65℃
Page 6 of 44
a
g
C
r
t
o
v
o
e
0
0
5
8
c
1
u
t
y
v
a
r
S
3
C
H
z
d
d
3
2
2
m
P
Perform
Operatin
Current
Tx Powe
• Storage
nce
Voltage
• Voltage:
onsumpti
• 2mA (Sl
• 3G Idle:
• 3G Talk:
• 2G Talk:
(Typical)
• UMTS/H
• GSM 85
Temperatu
3.6 ~ 4.2V
n(Typical)
ep Mode)
35mA
500mA
260mA (G
SPA Class
/900 MHz
e：-40 ~℃
M PCL5)
(24dBm)
lass4 (33
+85℃
Bm)
Rx Sensi
Interface
Connect
Connecti
• GSM 18
• EDGE 8
• EDGE 1
ivity(Typi
• UMTS/H
• GSM：-
rs
• RF Thro
• Main An
• Diversit
ity
0/1900 M
0/900 MH
00/1900 M
al)
SPA：-109
07dBm
gh Pads in
enna
Antenna
z Class1 (
Class E2 (
Hz Class E
Bm
LGA, 2 x
0dBm)
7dBm)
(26dBm)
ini-UFL in
CIe model
• 1*USB 2
.0
• 2*UART
H330 HSPA+
Module Hard
ware User M
nual
Page 7 of 44
t
V
a
p
p
p
e
n
w
t
4
S
t
4
S
T
a
n
a
a
p
t
a
C
t
a
1
P
a
Data Fea
HSPA+
EDGE
• MUX Ov
• Multiple
• SPI Sup
• I2C Sup
• I2S Sup
ures
• Embedd
• Max upli
• Max do
• Multi-slo
er UART1
Profiles ove
ort
ort
ort
d TCP/IP
k 5.76Mbp
nlink 21Mb
class 12
r USB
nd UDP/IP
s
s
protocol st
ck
GPRS
CSD
SMS
(4 Down;
• Coding
• Multi-slo
(4 Down;
• Coding
• UMTS
• GSM
• MO / M
• Cell bro
Up; 5 Tot
cheme M
class 12
Up; 5 Tot
cheme CS
Text and
dcast
l)
S1-MCS9
l)
-CS4
DU modes
oice Fe
H330 HSPA+
tures
• Telepho
Module Hard
y
ware User M
nual
Page 8 of 44
o
S
m
r
a
o
a
p
u
e
c
.
.
e
e
p
a
A
H
o
B
Audio C
Characte
• Analog
• Voice c
ntrol
• Broad g
• Echo su
• Noise s
• Side ton
r Set
• IRA
• GSM
• UCS2
• HEX
nd Digital
ders EFR/
in control
pression
ppression
udio
R/FR/AMR
Control/
AT Com
Accesso
tatus Indi
• GPIO’s
• A/D
• RTC
and Set
• G&T pro
• GSM 07
• GSM 07
ies
• Firmwar
• User Ma
• Develop
ations
prietary AT
05
07
Loader T
nual
r Kit
commands
ol over US
/UART
Regulato
ry and Ap
rovals
• FCC
H330 HSPA+
Module Hard
ware User M
nual
Page 9 of 44
d
H
e
m
w
• RoHS
p
u
w
a
e
a
w
4
• CE
• RRB
2.3 Pro
H330
Top Vi
Botto
uct Ap
SPA+ Mod
w：
View：
earanc
le Appear
nce is belo
。
H330 HSPA+
Module Hard
are User M
nual
Page 10 of 4
h
m
w
w
w
4
3 Mec
3.1 Di
anical
ension
Top View
Side View
Bottom Vie
H330 HSPA+
Module Hard
are User Manual
Page 11 of 4
c
w
d
w
a
e
4
3.2 Re
ommen
PCB D
sign
H330 HSPA+
Module Hard
are User M
nual
Page 12 of 4
d
c
w
c
a
w
a
a
4
4 Har
4.1 Blo
ware S
k Diagr
ope
m
H330 HSPA+
Module Hard
are User M
nual Page 13 of 4
n
n
3
e
P
V
V
V
V
V1 V
w
o
i
c
w
a
s
t
u
u
u
t
t
t
A
t
a
A a
4
4.2 Pin
4.2.1 Pi
Definiti
Map
n
4.2.2 Pi
Notice: H3
H330 Pin d
Pin#
Power
59
60
61
62
64
Descript
0 logic ele
scription：
in Name
BAT
BAT
BAT
BAT
PA
TRX
on
trical level i
1.8V.
I/O
I
I
I
I
O
O
Descrip
Power s
Power s
Power s
ion
pply
pply indica
pply indica
or for RF P
or for RF tr
nsceiver
H330 HSPA+
Module Hard
are User M
nual
Page 14 of 4
Loading...
+ 30 hidden pages
Buy Points How it Works FAQ Contact Us Questions and Suggestions Privacy Policy Cookie Policy Terms of Use