This family of MOS gated high voltage switching devices
combine the best features of MOSFETs and bipolar
transistors . These devices have the high i nput impedance of
a MOSFET and the low on-s tate con ductio n loss of a bi polar
transistor. The much lower on-state voltage drop varies only
moderately between 25
o
C and 150oC.
The IGBT is ideal for many high voltage switching
applications operating at moderate frequencies where low
conduction losses are essential, such as: AC and DC motor
controls, pow er su ppl ies and drivers for solenoids, relays
and contactors.
Formerly developmental type TA49171.
Ordering Information
PART NUMBERPACKAGEBRAND
HGTG12N60B3TO-247G12N60B3
NOTE: When ordering, use the entire part number.
Symbol
C
Features
• 27A, 600V, TC = 25oC
• 600V Switching SOA Capability
• Typical Fall Time. . . . . . . . . . . . . . . . 112ns at T
• Short Circuit Rating
• Low Conduction Loss
Packaging
JEDEC STYLE TO-247
E
C
G
COLLECTOR
(BOTTOM SIDE METAL)
= 150oC
J
G
E
FAIRCHILD CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS
Short Circuit Withstand Time (Note 2) at V
Short Circuit Withstand Time (Note 2) at V
CAUTION: Stresses above those listed in “A bsolute Maximu m Rating s” may cause per manent d amage to t he device. This is a str ess on ly rating and operation o f the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
1. Pulse width limited by maximum junction temperature.
2. V
Electrical SpecificationsT
= 360V, TJ = 125oC, RG = 25Ω.
CE(PK)
= 25oC, Unless Otherwise Specified
C
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Collector to Emitter Breakdown VoltageBV
Emitter to Collector Breakdown VoltageBV
Collector to Emitter Leakage CurrentI
Collector to Emitter Saturation VoltageV
Gate to Emitter Threshold VoltageV
Gate to Emitter Leakage CurrentI
CES
ECS
CES
CE(SAT)IC
GE(TH)
GES
Switching SOASSOAT
Gate to Emitter Plateau VoltageV
On-State Gate ChargeQ
Current Turn-On Delay Timet
Current Rise Timet
Current Turn-Off Delay Timet
Current Fall Timet
Turn-On Energy (Note 4)E
Turn-On Energy (Note 4)E
Turn-Off Energy (Note 3)E
GEP
g(ON)
d(ON)I
rI
d(OFF)I
fI
ON1
ON2
OFF
IC = 250µA, VGE = 0V600--V
IC = -10mA, VGE = 0V20--V
VCE = 600VTC = 25oC--250µA
Current Fall Timet
Turn-On Energy (Note 4)E
Turn-On Energy (Note 4)E
Turn-Off Energy (Note 3)E
Thermal Resistance Junction To CaseR
rI
fI
ON1
ON2
OFF
θJC
IGBT and Diode at TJ = 150oC
= 12A
I
CE
= 480V
V
CE
V
= 15V
GE
= 25Ω
R
G
L = 1mH
Test Circuit (Figure 17)
NOTES:
3. Turn-Off Energy Loss (E
at the point where the collector current equals zero (I
of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.
) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and ending
OFF
= 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement
CE
4. Values for two Turn-On loss conditions are shown for the convenience of the circuit designer. E
is the turn-on loss when a typical diode is used in the test circuit and the diode is at the same T
Figure 17.