Ericsson AXE 810 Service Manual
OBJECTIVES:
Improvements Within APZ
Chapter 3
This chapter is designed to provide the student with knowledge
about the main changes within the APZ system. The chapter
describes important improvements within all different areas of
APZ, not only the Central Processor.
Upon completion of this chapter the student will be able to:
• account for improvements in capacity in APZ 212 33
• account for improvements in capacity and footprint for all
types of regional processors such as RPP, RPG, EMRP and
RP
• account for improvements in the APG40.
AXE 810 Delta
Intentionally Blank
EN/LZT 123 6389 R1A
3 Improvements Within APZ
3 Improvements Within APZ
Table of Contents
Topic Page
CENTRAL PROCESSORS, CP.............................................................1
CAPACITY ......................................................................................................................1
HARDWARE ...................................................................................................................1
NEW HARDWARE .........................................................................................................4
OTHER NEWS AND IMPROVEMENTS ........................................................................4
COMPATIBILITY ............................................................................................................5
REGIONAL PROCESSOR, RP .............................................................6
RPP, PCI BUS BASED REGIONAL PROCESSOR .............................. 7
THE BASIC CONFIGURATION .....................................................................................7
THE MODEM CONFIGURATION ..................................................................................8
THE PMC CONFIGURATION ........................................................................................8
THE EPSB, ETHERNET PACKET SWITCH BOARD .................................................... 9
APPLICATIONS..............................................................................................................9
RPG .....................................................................................................11
EMRP...................................................................................................12
APG40 .................................................................................................13
SYSTEM CAPABILITIES ..............................................................................................13
THE HARDWARE.........................................................................................................14
EN/LZT 123 6389 R1A – i –
AXE 810 Delta
Intentionally Blank
– ii
– EN/LZT 123 6389 R1A
3 Improvements Within APZ
CENTRAL PROCESSORS, CP
CAPACITY
The main improvement within the CP area is a new Central
Processor referred to as APZ 212 33. It is basically the same
hardware as APZ 212 30 but with some improvements.
Increased clock speed and the removal of some internal
bottlenecks are the two main reasons for the improved capacity.
The capacity increase from APZ 212 30 to 212 33 is some 70%
and the first field trials of the system will be during end of year
2000.
A completely new central processor is being developed at the
same time. The name will be APZ 212 40 (not part of AXE 810)
and it will be the first CP from Ericsson built with a commercial
micro processor. By using a commercial CPU, the hardware
development of external CPUs can be followed and Ericsson
does not need to keep up with this pace (doubled capacity every
18 month as in Moore’s law). The price for the processor can
also be reduced with this solution. The capacity comparison
between all available processors can be seen in the figure below.
Please note that the capacity comparison is only valid within
this figure and cannot be used to compare, for example, a CP
with an RP.
HARDWARE
212 11 212 20 212 25 212 30 212 33 212 40
Rel ati ve
Capacity
DS Memory
(M word)
Power (W) 1750 800 60 470 470 510
Number in
Service
Figure 3- 1 Capacity of different APZ versions
141.7142342
228 1532 252 4096 4096 8000
3000 4500 1000 500 - -
The hardware of APZ 212 33 is on high level exactly the same
as the hardware in APZ 212 30. The figure below gives an
overview of the cabinet.
EN/LZT 123 6389 R1A – 1 –
AXE 810 Delta
Front View Side View
FAN FAN
FAN
FAN FAN
The CPU Subrack
CPU-A
FAN FAN FAN
CPU-B
FAN FAN FAN
RPH-A
600 mm 800 mm
CPU-A
FAN FAN
CPU-B
FAN FAN
RPH-A RPH-B
1800 mm
Figure 3- 2 The APZ 212 33 cabinet
On a subrack level, the hardware of the CPU Subrack looks like
in the figure below.
MAU
STUDI-0
STUDI-1
STUDI-2
IPU
STUDI-3
STUDI-4
STUDI-5
STUDI-6
SPU
STUDI-7
POU
POWC (MAI)
Figure 3- 3 The CPU Subrack
There are basically three processor boards:
• Instruction Processor Unit (IPU)
• Signal Processor Unit (SPU)
• Power Control Unit (POWC) including the Maintenance
Interface (MAI)
There is one power unit (POU) in each subrack. The MAU,
Maintenance Unit, is only present in the B-side (CP-B) as there
is one MAU per CP pair. The eight slots for Data Store boards
(STUD, Storage Unit Data) can either be of DRAM or SRAM
type. In both APZ 212 30 and in 212 33 there are three different
types of boards that can be used:
– 2
– EN/LZT 123 6389 R1A
Loading...