Epson SED1220 User Manual

SED1220

LCD Controller/Drivers

Technical Manual

Contents

OVERVIEW .........................................................................................................................................................2–1

FEATURES..........................................................................................................................................................2–1

BLOCK DIAGRAM .............................................................................................................................................. 2–2

CHIP SPECIFICATION........................................................................................................................................2–3

DESCRIPTION OF PINS ................................................................................................................................... 2–11

FUNCTIONAL DESCRIPTION ..........................................................................................................................2–14

COMMAND ........................................................................................................................................................ 2–21

CHARACTER GENERATOR.............................................................................................................................2–24

ABSOLUTE MAXIMUM RATINGS ....................................................................................................................2–31

DC CHARACTERISTICS...................................................................................................................................2–32

TIMING CHARACTERISTICS ...........................................................................................................................2–34

MPU INTERFACE (REFERENCE EXAMPLES) ...............................................................................................2–37

INTERFACE TO LCD CELLS (REFERENCE) ..................................................................................................2–38

LIQUID CRYSTAL DRIVE WAVEFORMS (B WAVEFORMS) ..........................................................................2–42

SED1220

– i –

SED1220

OVERVIEW

SED1220 is a dot matrix LCD controller/driver for
character display. Using 4bits data, 8bits data or serial
data being provided from the micro computer, it displays
up to 36 characters, 4 user defined characters and up to
120 symbols.
Up to 256 types of built-in character generator ROMs are
prepared. Each character font is consisted of 5 × 8 dots.
It also contains the RAM for displaying 4 user defined
characters each font consisting of 5 × 8 dots. It is symbol
register allows character display with high degree of
freedom. This handy equipment can be operated with
minimum power consumption with its low power
consumption design, standby and sleeping mode.

FEATURES

• Built-in data display RAM – 36 characters + 4 user
defined characters + 120 symbols.

• CG ROM (For up to 256 characters), CG RAM (for 4
characters) and symbol register (for 120 symbols).

• No. of display digit and lines
< In normal mode >

1

(12 digits + 4 segments for signal) × 3 lines + 120
symbols + 5 static symbols (SED1220D

2

(12 digits + 4 segments for signal) × 2 lines + 120
symbols + 5 static symbols (SED1221D**)

3

12 digits × 2 lines + 120 symbols + 5 static symbols
(SED1222D

4

(12 digits + 4 segments for signal) × 2 lines + 120

)

**

symbols + 10 static symbols (SED122AD

< In standby mode >

1

5 static symbols

2

5 static symbols

3

5 static symbols

4

10 static symbols

)

**

)

**

• Built-in CR oscillation circuit (C and R contained)

• Accepts external clock input

• High-speed MPU interface
Affords interface with both 68/80 system MPUs
Affords interface through 4 bits and 8 bits

• Affords serial interface

• Character font consists of 5 × 8 dots

1

• Duty ratio

1/26 (SED1220D**)

2

1/18 (SED1221D**, SED1222D**)

• Simplified command setting

• Built-in power circuit for driving liquid crystal
Power amplifier circuit, power regulation circuit and
voltage followers × 4

• Built-in electronic volume function

• Low power consumption

80 µA max. (In normal operation, including

operating current of the power
supply).

20 µA max. (In standby mode for displaying

static icon).

5 µA max. (In sleeping mode when display

is turned off).

• Power supply

DD - VSS –2.4 V ~ –3.6 V

V

DD - V5 –4.0 V ~ – 6.0 V

V

• Temperature range for wide range operation

Ta = –30 ~ 85°C

• CMOS process

• Shipping style

Chip (Al pad product) SED1222D
Chip (Au bump product) SED122*D
TCP SED122*T

A

*

B

*

**

• This unit does not employ radiation protection design

SED1220

EPSON 2–1

SED1220

Input buffer

MPU interface

Address counter

Command

decoder

Cursor control

SEG driving circuit

Static icon drive circuit

COM driving circuit

Refresh address counter

DD RAM

symbol

register

CG ROM
CG RAM

Timing generatinon circuit

Oscillator

LCD power circuit

IF

RES

CS

WR (E)

P/S

A0

SEG1~60

SEGS1, 2, 4, 5

COMSA

SEGSA, B, C, D, E

SEGSA, B, C, D, E,

F, G, H, I, J (SED122A)

COM1~24

(SED1220/1221)

COM1~16

(SED1222/122A)

COMS1, 2

V

1

V

2

V

3

V

4

V

5

CAP1+CKCAP1–

CAP2+

CAP2–

V

R

V

OUT

V

S1

D6 (SCL)

D0D1D2

D3

D4

D5

D7 (SI)

BLOCK DIAGRAM

2–2 EPSON

CHIP SPECIFICATION

SED1220D**/1221D**/122AD

146

SED1220

**

74

147

165

1

SED122*D

**

↑

Digits prepared for CGROM pattern changes

Chip size: 7.70 × 2.77 mm
Pad pitch: 100 µm (Minimum)
Chip thickness (for reference): 625 ± 25 µm (SED122

1) A1 pad specifications

Pad size on Y side: 75 µm ×135 µm
Pad size on X side: 135 µm × 75 µm

2) Au bump specifications

Bump size on Y side: 69 µm × 129 µm
Bump size on X side: 129 µm × 69 µm
Bump height (for reference) 22.5 µm ± 5.5 µm

(SED122*D

*

73

SED1220

63
62

56
55

54
:DUMY PAD
:PAD

D

)

A

*

B

)

*

<Fuse Pines>

1) Al pad. pad size 86 µm × 75 µm

2) Au bump

Bump size 80 µm × 69 µm

EPSON 2–3

SED1220

SED1222D

109

. . .

125

SED1222D

**

108 52

. . . . . . . . .

y

x

Top View

. . . . . .

12 27

111

**

↑

Digits prepared for CGROM pattern changes

Chip size: 7.70 × 2.77 mm
Pad pitch: 124 µm (Minimum)
Chip thickness (for reference): 625 ± 50 µm (SED1222D

. . . . . . . . .

28 32

: PAD

A

)

*

51

. . .

41

40

. . .

34

33

1) A1 pad specifications

Pad size on Y side: 90 µm × 96 µm
Pad size on X side: 96 µm × 90 µm (PAD. No. 1 ~ 11, 28 ~ 32, 52 ~ 108)

175 µm ×135 µm (PAD. No. 12 ~ 27)

<Fuse Pines>

1) Al pad. pad size 86 µm × 75 µm

2–4 EPSON

SED1220

<SED1220D**/1221D**>

PAD COORDINATES

No. Name X Y

1 NC –3700 –1204
2 NC –3600
3 NC –3500
4 A0 –3252
5 WR –3132
6 CS –3012
7 D7 –2892
8 D6 –2772

9 D5 –2652
10 D4 –2532
11 D3 –2412
12 D2 –2292
13 D1 –2172
14 D0 –2052
15 V
16 V
17 VSS –1556
18 V
19 V
20 V5 –1176
21 V
22 V
23 V3 –716
24 V
25 V
26 V
27 V1 –156
28 V
29 V
30 V0 224
31 V
32 V
33 VOUT 684
34 V
35 CAP2– 964
36 CAP2– 1064
37 CAP2+ 1244
38 CAP2+ 1344
39 CAP1– 1524
40 CAP1– 1624
41 CAP1+ 1804
42 CAP1+ 1904
43 V
44 V
45 VDD 2364
46 V
47 CK 2693
48 VS1 2821
49 P/S 2949
50 I/F 3077
51 RES 3205
52 NC 3500
53 NC 3600
54 NC 3700 –1204

DD –1836
DD –1736

SS –1456

5 –1276
4 –996

4 –896
3 –616

2 –436
2 –336

1 –56
0 124

R 404
R 504

OUT 784

SS 2084
SS 2184

DD 2464

Unit: µm

PAD COORDINATES

No. Name X Y

55 VDD 3670 –910
56 (FSA) 3603 –796
57 (FSB) –696
58 (FSC) –596
59 (FS0) –496
60 (FS1) –396
61 (FS2) –296
62 (FS3) 3603 –196
63 V

DD 3670 –82

64 COMSA 61
65 COMS1 203
66 COM1 303
67 COM2 403
68 COM3 503
69 COM4 603
70 COM5 703
71 COM6 803
72 COM7 903
73 COM8 3670 1003
74 NC 3700 1204
75 NC 3600
76 NC 3500
77 SEGS1 3319
78 SEGS2 3219
79 SEG1 3119
80 SEG2 3019
81 SEG3 2919
82 SEG4 2819
83 SEG5 2719
84 SEG6 2619
85 SEG7 2519
86 SEG8 2419
87 SEG9 2319
88 SEG10 2219
89 SEG11 2119
90 SEG12 2019
91 SEG13 1919
92 SEG14 1819
93 SEG15 1719
94 SEG16 1619
95 SEG17 1519
96 SEG18 1419
97 SEG19 1319
98 SEG20 1219

99 SEG21 1119
100 SEG22 1019
101 SEG23 919
102 SEG24 819
103 SEG25 719
104 SEG26 619
105 SEG27 519
106 SEG28 419
107 SEG29 319
108 SEG30 219 1204

SED1220

(FS*) : Being fuse adjusting pins, maintain them on floating state.
CK pins : Should be V

DD when not being used.

EPSON 2–5

SED1220

PAD COORDINATES

No. Name X Y

109 SEG31 119 1204
110 SEG32 19
111 SEG33 –81
112 SEG34 –181
113 SEG35 –281
114 SEG36 –381
115 SEG37 –481
116 SEG38 –581
117 SEG39 –681
118 SEG40 –781
119 SEG41 –881
120 SEG42 –981
121 SEG43 –1081
122 SEG44 –1181
123 SEG45 –1281
124 SEG46 –1381
125 SEG47 –1481
126 SEG48 –1581
127 SEG49 –1681
128 SEG50 –1781
129 SEG51 –1881
130 SEG52 –1981
131 SEG53 –2081
132 SEG54 –2181
133 SEG55 –2281
134 SEG56 –2381
135 SEG57 –2481
136 SEG58 –2581
137 SEG59 –2681
138 SEG60 –2781
139 SEGS4 –2881
140 SEGS5 –2981
141 COM24 –3081
142 COM23 –3181
143 COM22 –3281
144 NC –3500
145 NC –3600
146 NC –3700 1204
147 COM21 –3670 1000
148 COM20 900
149 COM19 800
150 COM18 700
151 COM17 600
152 COM16 500
153 COM15 400
154 COM14 300
155 COM13 200
156 COM12 100
157 COM11 0
158 COM10 –100
159 COM9 –200
160 COMS2 –300
161 SEGSA –433
162 SEGSB –533
163 SEGSC –633
164 SEGSD –733
165 SEGSE –3670 –833

2–6 EPSON

SED1220

<SED1222D**>

PAD COORDINATES

No. Name X Y

1 A0 –3312 –1228
2 WR –3180
3 CS –3048
4 D7 –2916
5 D6 –2784
6 D5 –2652
7 D4 –2520
8 D3 –2388

9 D2 –2256
10 D1 –2124
11 D0 –1992 –1228
12 V
13 V
14 V5 –1226
15 V
16 V
17 V2 –386
18 V
19 V
20 VR 454
21 V
22 CAP2– 1014
23 CAP2+ 1294
24 CAP1– 1574
25 CAP1+ 1854
26 V
27 VDD 2414 –1204
28 CK 2692 –1228
29 VS1 2836
30 P/S 2980
31 I/F 3124
32 RES 3268 –1228
33 V
34 (FSA) 3603 –796
35 (FSB) –696
36 (FSC) –596
37 (FS0) –496
38 (FS1) –396
39 (FS2) –296
40 (FS3) 3603 –196
41 V
42 COMSA 63
43 COMS1 199
44 COM1 323
45 COM2 447
46 COM3 571
47 COM4 695
48 COM5 819
49 COM6 943
50 COM7 1067
51 COM8 3694 1191
52 SEG1 3472 1228
53 SEG2 3348 1228
54 SEG3 3224 1228

DD –1786 –1204

SS –1506

4 –946
3 –666

1 –106
0 174

OUT 734

SS 2134

DD 3694 –919

DD 3694 –73

Unit: µm

PAD COORDINATES

No. Name X Y

55 SEG4 3100 1228
56 SEG5 2976
57 SEG6 2852
58 SEG7 2728
59 SEG8 2604
60 SEG9 2480
61 SEG10 2356
62 SEG11 2232
63 SEG12 2108
64 SEG13 1984
65 SEG14 1860
66 SEG15 1736
67 SEG16 1612
68 SEG17 1488
69 SEG18 1364
70 SEG19 1240
71 SEG20 1116
72 SEG21 992
73 SEG22 868
74 SEG23 744
75 SEG24 620
76 SEG25 496
77 SEG26 372
78 SEG27 248
79 SEG28 124
80 SEG29 0
81 SEG30 –124
82 SEG31 –248
83 SEG32 –372
84 SEG33 –496
85 SEG34 –620
86 SEG35 –744
87 SEG36 –868
88 SEG37 –992
89 SEG38 –1116
90 SEG39 –1240
91 SEG40 –1364
92 SEG41 –1488
93 SEG42 –1612
94 SEG43 –1736
95 SEG44 –1860
96 SEG45 –1984
97 SEG46 –2108
98 SEG47 –2232

99 SEG48 –2356
100 SEG49 –2480
101 SEG50 –2604
102 SEG51 –2728
103 SEG52 –2852
104 SEG53 –2976
105 SEG54 –3100
106 SEG55 –3224
107 SEG56 –3348
108 SEG57 –3472 1228

SED1220

(FS*) : Being fuse adjusting pins, maintain them on floating state.
CK pins : Should be V

DD when not being used.

EPSON 2–7

SED1220

PAD COORDINATES

No. Name X Y

109 SEG58 –3694 1191
110 SEG59 1067
111 SEG60 943
112 COM16 819
113 COM15 695
114 COM14 571
115 COM13 447
116 COM12 323
117 COM11 119
118 COM10 75
119 COM9 –49
120 COMS2 –173
121 SEGSA –335
122 SEGSB –459
123 SEGSC –583
124 SEGSD –707
125 SEGSE –3694 –831

2–8 EPSON

SED1220

<SED122AD**>

PAD COORDINATES

No. Name X Y

1 NC –3700 –1204
2 NC –3600
3 NC –3500
4 A0 –3252
5 WR –3132
6 CS –3012
7 D7 –2892
8 D6 –2772

9 D5 –2652
10 D4 –2532
11 D3 –2412
12 D2 –2292
13 D1 –2172
14 D0 –2052
15 V
16 V
17 VSS –1556
18 V
19 V
20 V5 –1176
21 V
22 V
23 V3 –716
24 V
25 V
26 V
27 V1 –156
28 V
29 V
30 V0 224
31 V
32 V
33 VOUT 684
34 V
35 CAP2– 964
36 CAP2– 1064
37 CAP2+ 1244
38 CAP2+ 1344
39 CAP1– 1524
40 CAP1– 1624
41 CAP1+ 1804
42 CAP1+ 1904
43 V
44 V
45 VDD 2364
46 V
47 CK 2693
48 VS1 2821
49 P/S 2949
50 I/F 3077
51 RES 3205
52 NC 3500
53 NC 3600
54 NC 3700 –1204

DD –1836
DD –1736

SS –1456

5 –1276
4 –996

4 –896
3 –616

2 –436
2 –336

1 –56
0 124

R 404
R 504

OUT 784

SS 2084
SS 2184

DD 2464

Unit: µm

PAD COORDINATES

No. Name X Y

55 VDD 3670 –910
56 (FSA) 3603 –796
57 (FSB) –696
58 (FSC) –596
59 (FS0) –496
60 (FS1) –396
61 (FS2) –296
62 (FS3) 3603 –196
63 V

DD 3670 –82

64 COMSA 61
65 COMS1 203
66 COM1 303
67 COM2 403
68 COM3 503
69 COM4 603
70 COM5 703
71 COM6 803
72 COM7 903
73 COM8 3670 1003
74 NC 3700 1204
75 NC 3600
76 NC 3500
77 SEGS1 3319
78 SEGS2 3219
79 SEG1 3119
80 SEG2 3019
81 SEG3 2919
82 SEG4 2819
83 SEG5 2719
84 SEG6 2619
85 SEG7 2519
86 SEG8 2419
87 SEG9 2319
88 SEG10 2219
89 SEG11 2119
90 SEG12 2019
91 SEG13 1919
92 SEG14 1819
93 SEG15 1719
94 SEG16 1619
95 SEG17 1519
96 SEG18 1419
97 SEG19 1319
98 SEG20 1219

99 SEG21 1119
100 SEG22 1019
101 SEG23 919
102 SEG24 819
103 SEG25 719
104 SEG26 619
105 SEG27 519
106 SEG28 419
107 SEG29 319
108 SEG30 219 1204

SED1220

(FS*) : This is a fuse adjusting terminal. Set it to floating state.
CK pins : Set it to V

DD when not used.

EPSON 2–9

SED1220

PAD COORDINATES

No. Name X Y

109 SEG31 119 1204
110 SEG32 19
111 SEG33 –81
112 SEG34 –181
113 SEG35 –281
114 SEG36 –381
115 SEG37 –481
116 SEG38 –581
117 SEG39 –681
118 SEG40 –781
119 SEG41 –881
120 SEG42 –981
121 SEG43 –1081
122 SEG44 –1181
123 SEG45 –1281
124 SEG46 –1381
125 SEG47 –1481
126 SEG48 –1581
127 SEG49 –1681
128 SEG50 –1781
129 SEG51 –1881
130 SEG52 –1981
131 SEG53 –2081
132 SEG54 –2181
133 SEG55 –2281
134 SEG56 –2381
135 SEG57 –2481
136 SEG58 –2581
137 SEG59 –2681
138 SEG60 –2781
139 SEGS4 –2881
140 SEGS5 –2981
141 NC –3081
142 NC –3181
143 NC –3281
144 NC –3500
145 NC –3600
146 NC –3700 1204
147 COM16 –3670 1000
148 COM15 900
149 COM14 800
150 COM13 700
151 COM12 600
152 COM11 500
153 COM10 400
154 COM9 300
155 COMS2 200
156 SEGSA 67
157 SEGSB –33
158 SEGSC –133
159 SEGSD –233
160 SEGSE –333
161 SEGSF –433
162 SEGSG –533
163 SEGSH –633
164 SEGSI –733
165 SEGSJ –3670 –833

2–10 EPSON

SED1220

DESCRIPTION OF PINS

Power Pins

Pin name I/O Description Q’ty

V

DD

V

SS

V

0, V1

V

2, V3 The voltage determined in the liquid crystal cell is resistance-

V

4, V5 divided or impedance-converted by operational amplifier, and the

VS1 O Power supply voltage output pin for oscillating circuit, and DC/DC 1

Power supply
Power supply
Power supply

Connected to logic supply. Common with MPU power terminal VCC.1
0V power terminal connected to system ground. 1
Multi-level power supply for liquid crystal drive. 6

resultant voltage is applied.
The potential is determined on the basis of V

DD and the following

equation must be respected.

V

DD = V0 ≥ V1 ≥ V2 ≥ V3 ≥ V4 ≥ V5

VDD ≥ VSS ≥ V5 ≥ VOUT
When the built-in power supply is ON, the following voltages are
given to pins V1 to V4 by built-in power circuit:

V

1 = 1/5 V5 (1/4 V5)

V

2 = 2/5 V5 (2/4 V5)

V

3 = 3/5 V5 (3/4 V5)

V

4 = 4/5 V5 (4/4 V5)

voltage ratings in ( ) are for optinal choices.

source. Don’t connect this pin to an external load.

SED1220

LCD Power Circuit Pins

Pin name I/O Description Q’ty

CAP1+ O Capacitor positive side connecting pin for boosting. 1

This pin connects the capacitor with pin CAP1–.

CAP1– O Capacitor negative side connecting pin for boosting. 1

This pin connects a capacitor with pin CAP+.

CAP2+ O Capacitor positive side connecting pin for boosting. 1

This pin connects a capacitor with pin CAP2–.

CAP2– O Capacitor negative side connecting pin for boosting. 1

This pin connects a capacitor with pin CAP2+.

V

OUT O Output pin for boosting. This pin connects a smoothing capacitor 1

with V

DD pin.

V

R I Voltage regulating pin. This pin gives a voltage between VDD and 1

V

5 by resistance-division of voltage.

EPSON 2–11

SED1220

Pins for System Bus Connection

Pin name I/O Description Q’ty

D7 (SI) I 8-bit input data bus. These pins are connected to a 8-bit or 16-bit 8

D6 (SCL) standard MPU data bus.

D5 ~ D0 When P/S = “Low”, the D7 and D6 pins are operated as a serial data

input and a serial clock input respectively.

P/S RES I/F D7 D6 D5 D4 D3-D0 CS A0 WR

“L” — — SI SCL — — OPEN CS A0 —
“H” “H” “H” D7 D6 D5 D4 D3-D0 CS A0 E
“H” “L” “H” D7 D6 D5 D4 D3-D0 CS A0 WR
“H” “L” “L” D7 D6 D5 D4 OPEN CS A0 WR

RES: Indicates the active potential.
OPEN:Though “OPEN” is available, fixing the potential is

recommended for noise-withstnading characteristical reason.

—: Indicates that it can be set at either “H” or “L”, but fixing the

potential is required.

A0 I Usually, this pin connects the least significant bit of the MPU address 1

bus and identifies a data command.

0 : Indicates that D0 to D7 are a command.
1 : Indicates that D0 to D7 are display data.

RES I In case of a 68 series MPU, initialization can be performed by 1

changing RES
initialization can be performed by changing
A reset operation is performed by edge sensing of the RES signal.
An interface type for the 68/80 series MPU is selected by input level
after initialization.

“L” : 68 series MPU interface
“H” : 80 series MPU interface

CS I Chip select signal. Usually, this pin inputs the signal obtained by 1

decoding an address bus signal. At the “Low” level, this pin is
enabled.

WR I <When connecting an 80 series MPU>

Active “Low”. This pin connects the WR signal of the 80 series 1

(E) MPU. The signal on the data bus is fetched at the rise of the WR

signal.

<When connecting a 68 series MPU>

Active “High”. This pin becomes an enable clock input of the 68
series MPU.

P/S I This pin switches between serial data input and parallel data input. 1

. In case of an 80 series MPU,

.

P/S

“High” CS A0 D0~D7 –

“Low” CS A0 SI SCL

IF I Interface data length select pin for parallel data input. 1

“High”: 8-bit parallel input
“Low”: 4-bit parallel input

When P/S = “Low”, connect this pin to V

CK I External input terminal

It must be fixed to “High” when the internal oscillation circuit is used. 1

2–12 EPSON

Chip Select Data/Command

Data Serial Clock

DD or VSS.

SED1220

Liquid Crystal Drive Circuit Signals

Dynamic drive terminal (SED1220D**/1221D**/122AD**)

Pin name I/O Description Q’ty

COM1~
COM24

COMS1,

CMOS2 CMOS1, CMOS2: Common output for symbol display

SEG1~
SEG60

SEGS1, 2

4, 5 SEGS1, SEGS2: Segment output for signal output

Dynamic drive terminal (SED1222D**)

Pin name I/O Description Q’ty

COM1~
COM16

COMS1,

CMOS2 CMOS1, CMOS2: Common output for symbol display

SEG1~
SEG60

O Common signal output pin (for characters) 24

O

O Segment signal output pin (for characters) 60

O

O Common signal output pin (for characters) 16

O

O Segment signal output pin (for characters) 60

Common signal output pin (except for characters)

Segment signal output pin (except for characters)

Common signal output pin (except for characters)

2

SED1220

4

2

Static drive terminal

Pin name I/O Description Q’ty

COMSA O Common signal output pin (for icon) 1

SEGSA, B

C, D, E O

F, G, H, I, J

Note: For the electrode of liquid crystal display panel to be connected to the static drive terminal, we recommend

you to use a pattern in which it is separated from the electrode connected to the dynamic drive terminal.
When this pattern is too close to the other electrode, both the liquid crystal display and electrode will be
deteriorated.

Segment signal output pin (for icon) 5 to
SEGSF, G, H, I, J (only SED122A) 10

EPSON 2–13

SED1220

FUNCTIONAL DESCRIPTION

MPU Interface

Selection of interface type

In the SED1220 Series, data transfer is performed through a 8-bit or 4-bit data bus or a serial data input (SI). By selecting
“High” or “Low” as P/S pin polarity, a parallel data input or a serial data input can be selected as shown in Table 1.

Table 1

P/S Type CS A0 WR SI SCL D0~D7

“High” Parallel Input CS A0 WR — — D0~D7

“Low” Serial Input CS A0 H, L SI SCL —

Parallel Input
In the SED1220 Series, when parallel input is selected (P/S = “High”), it can be directly connected to the 80 series MPU
bus or 68 series MPU bus, as shown in Table 2, if either “High” or “Low” is selected as RES pin polarity after a reset input,
because the RES pin has an MPU select function.
Selection between 8 bits and 4 bits is performed by command.

Table 2

RES input polarity Type A0 WR CS D0~D7

↓ active 68 series A0 E CS D0~D7

↓

active 80 series A0 WR CS D0~D7

Interface with 4-bit MPU interface

When data transfer is performed by 4-bit interface (IF = 0), an 8-bit command, data and address are divided into two parts.

CS

WR

D7 to D4 Upper (D7 to D4) Lower (D3 to D0)

Note: When performing writing in succession, reverse a time exceeding the system cycle time (t

perform writing.

Serial interface (P/S = “Low”)

The serial interface consists of a 8-bit shift register and a 3-bit counter and acceptance of an SI input or SCL input is enabled
in the ship selected status (CS = “Low”).
When no chip is selected, the shift register and counter are reset to the initial status.

Serial data is input in the order of D7, D6 .... D0 from the serial data input pin (SI) at the rise of Serial Clock (SCL).

At the rising edge of the 8th serial clock, the serial data is converted into 8-bit parallel data and this data is processed.
The A0 input is used to identify whether the serial data input (SI) is display data or a command. That is, when A0 = “High”,
it is regarded as display data. When A0 = “Low”, it is regarded as a command.
The A0 input is read in and identified at the rise of the 8 x n-th clock of Serial Clock (SCL) after chip selection.
Fig. 1 shows a timing chart of the serial interface.
Regarding the SCL signal, special care must be exercised about terminal reflection and external noise due to a wire length.
We recommend the user to perform an operation check with a real machine.
We also recommend the user to periodically refresh the write status of each command to prevent a malfunction due to noise.

cyc) and then

2–14 EPSON