“Seiko Epson is neither licensed nor authorized to license its customers under one or more patents held by
Motif Corporation to use this integrated circuit in the manufacture of liquid crystal display modules. Such
license, however, may be obtained directly from MOTIF by writing to: Motif, Inc., c/o In Focus Systems, Inc.,
27700A SW Parkway Avenue, Wilsonville, OR 97070-9215, Attention: Vice President Corporate
Development.”
Seiko Epson Corporation 2001, All rights reserved.
5. LIST OF DEVICE MODELS............................................................................................................................... 3
S1D15G00 series are the LCD drivers equipped with
the liquid crystal drive power circuit to realize color
display with one chip.
S1D15G00 can be directly connected to the MPU bus to
store parallel or serial gray-scale display data from
MPU on the built-in RAM and to generate liquid crystal
drive signals independent from MPU. S1D15G00
generates 396 segment outputs and 160
outputs for driving liquid crystal. It incorporates the
display RAM with capacity of 396 × 168 × 4 (16 grayscale). A single dot of pixel on the liquid crystal panel
corresponds to 4 bits of the built-in RAM, enabling to
display 132 (RGB) × 160 pixels with one chip.
Read or write operations from MPU to the display RAM
can be performed without resorting to external actuating
clock signals. S1D15G00 allows you to run the display
system of high performance and handy equipment at the
minimum power consumption thanks to its low-power
liquid crystal drive power circuit and oscillation circuit.
*1
:The S1D15G00D10*100 generates 300 segment
outputs and 120 common outputs. It incorporates
the display RAM with 300 × 168 × 4 capacity and
displays 100 (RGB) × 120 pixels.
*1
common
2. FEATURES
• Number of liquid crystal-drive outputs:
396 segment outputs and 160 common outputs.
• Low cross talk by frame rate modulation.
• 256 color from 4096-color display or full 4096-color
display.
When 256 color from 4096-color display is selected:
8 gray-scale for red and green and 4 gray-scale for
blue (intermediate tone is selected with the command).
When 4096-color display is selected: 16 gray-scale
for red, green and blue.
• Direct data display with display RAM
(When the LCD is set to normally black)
RAM bit Data “0000” ... OFF (Black)
“1111” ...ON (Maximum RGB display)
(Normally black LCD, using "inverse display" command)
• Partial display function: You can save power by
limiting the display space. This function is most
suited for handy equipment in the standby mode.
• Display RAM : 396 × 168 × 4 = 266,112 bits.*1
*1: The S1D15G00D10
× 4 = 144,000 bits.
• MPU interface: S1D15G00 can be directly connected
to both of the 8/16-bit parallel 80 and 68 series MPU.
Two type serial interface are also available.
• 3 pins serial : CS, SCL and SI (D/C + 8-bit data)
• 4 pins serial : CS, SCL, SI and A0
• Abundant command functions: Area scroll function,
automatic page & column increment function, display
direction switching function and power circuit control
function.
• Built-in liquid crystal drive power circuit: S1D15G00
is equipped the charge pump booster circuit, voltage
follower circuit and electric volume control circuit.
• Oscillation circuit with built-in high precision CR
(external clock signals acceptable)
• EEPROM interface functions
• Low current consumption
500µA (Conditions: S1D15G00D01B100, V
VDDI = 3.0V, frame frequency 130Hz, V2 = 6.0V, all
display RAM data is “0”)
• Supply voltage
Power for input/output system power:
VDDI–GND=1.7V to 3.6V
Power for internal circuit operation:
VDD–GND=2.6V to 3.6V
Reference power for booster circuit:
VDD2–GND=2.6V to 3.6V
Power for liquid crystal drive:
V3–MV3=12.0V to 21.0V
• Wider operational range: –40°C to 85°C.
• Shipping from: Chip with gold bump. COF.
• Note that the radiation resistant design or light
resistance design in strict sense is not employed for
S1D15G00.
Chip size25.04 mm × 2.70 mm
Chip thickness725 µm±25 µm (for reference)
Die No.See Section 5 “List of Device Models.”
Potential on board GND
Bump sizeTolerance: bump of the shorter side ±3 µm, bump of the longer side ±4 µm (reference)
S1D15G00D01*100 D15G0D1BExternal only×Unable to read
(#)
S1D15G00D06*100 D15G0D6Bvia VR pinRead enabled
S1D15G00D03*100 D15G0D3BExternal only×Unable to read180 Hz
(#)
S1D15G00D08*100 D15G0D8Bvia VR pinRead enabled
S1D15G00D10*100 D15G0DAB Segment: 300External only (voltage×Unable to read130 Hz
(#)Common: 120via VR pin resistance)/31.2 kHz
Output
count
Common: 160(voltage electronically/41.6 kHz
V2 voltage
External/Internal
electronic volume)
(voltage controlled
resistance)
(voltage controlled/57.6 kHz
resistance)
AccessMPU RAM
to EEPROM
read
(Note)
For “unable to read” models in the above diagram, the MPU cannot read the RAM. If the RAM must be read, use “read
enabled” models.
(#) : These models will be discontinued.
*1: You can determine the position on X coordinate from the formula “12159–42* (n–209)”, where the BUMP No. is “n”.
*2: You can determine the position on X coordinate from the formula “8841–42* (n–288)”, where the BUMP No. is “n”.
*3: You can determine the position on X coordinate from the formula “8211–42* (n–303)”, where the BUMP No. is “n”.
*4: You can determine the position on X coordinate from the formula “-8379–42* (n–698)”, where the BUMP No. is “n”.
*5: You can determine the position on X coordinate from the formula “-9009–42* (n–713)”, where the BUMP No. is “n”.
*6: This pin is used to pull up or pull down nearby pins. Thus, it can’t be used for feeding power.
*7: The pin function differs among device models.
External resisting device: It functions as the primary boost voltage output pin (VCLSR).
Internal resisting device: It functions as the regulator inverse input pin (VR).
*8: You can determine the position on X coordinate from formula “6145-42*(n–351)” where the Bump No. is “n”.
Rev. 1.0EPSON5
S1D15G00 Series
7. PIN DESCRIPTION
7.1 Power Supply Pins
Pin nameI/ODescription
Number of
pins
VDDIInputThey are used to connect the power for input signals.6
power
VDDPowerThey are connected to VCC - the system power. When the system4
supplypower is smaller than 2.6V, they must be connected another 2.6V
or greater power supply.
VDD2Step-up They are used to connect the power supply for the primary step-up.6
powerThe relative magnitude of potential among the pins, namely
VDD2≥VDD≥VDD1, must be observed.
VDD3,VDD5 PowerThey are power supply pins on the power circuit *1.4
supply
VDD4PowerThey are power supply pins on the oscillation circuit *1.2
supply
GNDPowerThey are connected to the system ground.7
supply
GND2,PowerThey are grounding pins on the power circuit *2.9
GND4supply
GND3PowerThey are grounding pins on the oscillation circuit *2.3
supply
V3L, V3RPowerThese pins are provided on the multi-level power supply for liquid44
V2L, V2Rsupplycrystal drive. Relative magnitude of potential among the pins,
V1L, V1Rnamely V3L(R)≥V2L(R)≥V1L(R)≥VCL(R)≥MV1L(R)≥GND≥MV3L(R),
VCL, VCRmust be observed.
MV1L, MV
MV3L, MV
1R
3R
When the master operation is turned on or the internal power supply
is turned on, predetermined voltage is output at respective pins.
When S1D15G00 series are used in the master/slave array, they
connect the pins on both the master and slave drivers.
VCLSLPowerThey are provided on the common driver operating power supply.4
supply
VCLSR,VRInputCommon driver operating power supply/regulator input pins *3.1
power
*1: Since VDD, VDD3, VDD4 and VDD5 are not internally connected, they must be externally connected to VCC - the
system power.
*2: Since GND, GND2, GND3 and GND4 are not internally connected, they must be externally connected to the system
They connect the positive going side of the primary step-up capacitor.
They connect the negative going side of the primary step-up capacitor.
They connect the positive going side of the secondary step-up capacitor.
They connect the negative going side of the secondary step-up capacitor.
They connect the positive going side of the tertiary step-up capacitor.
They connect the negative going side of the tertiary step-up capacitor.
They connect the positive going side of the tertiary step-up capacitor.
They connect the positive going side of the tertiary step-up capacitor.
Number of
pins
5
5
5
5
5
5
5
5
Rev. 1.0EPSON7
S1D15G00 Series
7.3 MPU Interface Pins
Pin nameI/ODescription
D15 to D0I/OThey connect to the standard 8-bit or 16-bit MPU bus via the16
8/16-bit bi-directional bus.
When the following interface is selected and the CS pin is high, the
impedance of the pin becomes high.
1 8-bit parallel: D15-D18 are in the state of high impedance
2 Serial interface: D15-D0 are in the state of high impedance
SII
SCLI
IF1, IF2IThese pins are used to select either of the MPU interfaces.3
IF3
A0INormally, the least significant bit of the MPU’s address bus is1
CSIThis pin is used to enter chip select signal. It is activated when1
RD (E)I• It goes active LOW when connected to the 80 series MPU.1
WR (R/W)I• It goes active LOW when connected to the 80 series MPU.1
RESICausing RES to LOW performs initialization.1
This pin is used to input serial data when the serial interface is selected
This pin is used to input serial clock when the serial interface is selected.
Depending on status of IF1, IF2 and IF3, following selection is made.
IF1IF2IF3MPU interface type
HIGHHIGHHIGH80 series 16-bit parallel
HIGHHIGHLOW80 series 8-bit parallel
HIGHLOWLOW68 series 16-bit parallel
LOWHIGHHIGH68 series 8-bit parallel
LOWLOWHIGH9-bit serial
LOWLOWLOW8-bit serial
connected to identify a parameter or display data from a command.
HIGH: Indicates that data entered to D15 to D0 or SI is a
parameter or display data.
LOW: Indicates that data entered to D15 to D0 or SI is a command.
This function is disabled when the 9-bit serial interface is selected.
CS = LOW, enabling interface with MPU.
This pin is used to connect RD signal from the 80 series MPU. The data
bus is maintained in the output status as long as this signal is LOW.
• It goes active HIGH when connected to the 68 series MPU.
In this case, this pin is used to enter the enable clock from 68 series MPU.
This pin connects WR signal from the 80 series MPU. Signal on
the data bus is latched at the positive going edge of WR signal.
•
This pin enters the read/write signal when connected to the 68 series MPU.
R/W = HIGH: Read
R/W = LOW: Write
Reset operation is performed according the level of RES signal.
Number of
pins
.1
1
8EPSONRev. 1.0
7.4 Liquid Crystal Drive Circuit Signals
S1D15G00 Series
Pin nameI/ODescription
M/SIThis pin is used to select either the master or slave operation.1
M/S = HIGH: Master operation
CLSIIt is used to select the display clock.1
CLS = HIGH: Built-in CR oscillation is used.
CLS = LOW: External clock is used.
When the external clock is used (CLS = LOW), the signal is
entered to CL pin.
CLI/OThis pin inputs or outputs the display clock.1
It outputs the display clock only when M/S = HIGH and CLS = HIGH.
Other than the above: External clock input
FRI/OThis pin inputs or outputs the liquid crystal frame signal.1
M/S = HIGH: Outputs the signal
M/S = LOW: Inputs the signal
SYNCI/OThis pin inputs or outputs the liquid crystal synchronization signal.1
M/S = HIGH: Outputs the signal
M/S = LOW: Inputs the signal
CAI/OThis pin inputs or outputs the field start signal.1
M/S = HIGH: Outputs the signal
M/S = LOW: Inputs the signal
F1, F2I/OThis pin inputs or outputs the drive pattern signal.1
M/S = HIGH: Outputs the signal
M/S = LOW: Inputs the signal
DOFFI/OThis pin is used to control blanking of liquid crystal display.1
M/S = HIGH: Outputs the signal
M/S = LOW: Inputs the signal
YSCLI/OThis pin inputs or outputs the line clock.
M/S = HIGH: Outputs the signal
M/S = LOW: Inputs the signal
SEGnOThey output the signal for the segment drive of liquid crystal.396
COMnOThey output the signal for common drive of liquid crystal.160
Number of
pins
Rev. 1.0EPSON9
S1D15G00 Series
7.5 EEPROM Interface Pins
Pin nameI/ODescription
SDAOConnected to the SDA pin of S1F65170. *11
RESETOConnected to the XRST pin of S1F65170. *11
CLOCKOConnected to the SCK pin of S1F65170. *11
* Always open if the S1F65170 is not used.
Number of
pins
7.6 Control Signals
Pin nameI/ODescription
SLPOIt is the sleep control pin. It outputs LOW level when the sleep-in1
command is executed.
PO0OThis pin constantly outputs LOW level. It must be maintained open.1
Number of
pins
7.7 Test Signals
Pin nameI/ODescription
TESTA toOIt is the test pin.1
TESTGSince it outputs signals, it must be kept open.
TESTHIThis pin must be fixed at HIGH or LOW.1
TEST1IIt is the IC chip test pin. This pin must be fixed at LOW.1
Number of
pins
10EPSONRev. 1.0
S1D15G00 Series
8. FUNCTIONAL DESCRIPTION
8.1 MPU Interfaces
8.1.1 Selecting an MPU Interface Type
S1D15G00 transfers data via the 8/16-bit bi-directional data bus or serial data input.
You can select a desired interface face through the combinations of settings of IF1, IF2 and IF2 as shown in Table 8.1.1.
Table 8.1.1
IF1IF2IF3Interface typeCSA0RDWRD15 to D8D7 to D0SI SCL
ER/W
HIGH HIGH HIGH80 series 16-bit parallelCSA0RDWRD15 to D8D7 to D0––
HIGH HIGH LOW80 series 8-bit parallelCSA0RD WR(HZ)D7 to D0––
HIGH LOW LOW68 series 16-bit parallelCSA0ER/WD15 to D8D7 to D0––
LOW HIGH HIGH68 series 8-bit parallelCSA0ER/W(HZ)D7 to D0––
LOW LOW HIGH9-bit serialCS–––(HZ)(HZ)SI SCL
LOW LOW LOW8-bit serialCSA0––(HZ)(HZ)SI SCL
– : Must be fixed to either HIGH or LOW.
HZ is in the state of Hight Impedance.
8.1.2 8- or 16-bit Parallel Interface
S1D15G00 identifies type of the data bus signals according to combinations of A0, RD (E) and WR (R/W) signals as
shown in Table 8.1.2.
Table 8.1.2
68 series80 series
A0R/WERDWRFunction
10110Parameters or display data write.
11101Display data read.
01101Status read.
00110Control data write (command).
Except when the CS=LOW is taking place, D15 to D0 on S1D15G00 are caused to high impedance, disabling input of
A0, RD (E) and WR (R/W).
Relation between Data Bus and Gradation Data
S1D15G00 offers the 256-color display (8 gray-scale) out of 4096 colors as well as the 4096-color display (16 grayscale). When using 256-color display out of 4096 colors, you can specify color for each of R, G and B using the palette
function.
(1) 256-color display out of 4096 colors
Using RGBSET8 command enables you to set color for each of R, G and B by turning on the palette function
prepared to convert 3- or 2-bit data to 4-bit data.
1 8-bit mode
D7, D6, D5, D4, D3, D2, D1, D0: RRRGGGBB (8 bits) data is converted to RRRRGGGGBBBB (12 bits) and then
stored on the display RAM.
2 16-bit mode
D15, D14, D13, D12, D11, D10, D9, D8: RRRGGGBB (8 bits)
D7, D6, D5, D4, D3, D2, D1, D0: RRRGGGBB (8 bits)
Data of two pixels is respectively converted to RRRRGGGGBBBB (12 bits) data and then simultaneously written
to two addresses on the display RAM.
Rev. 1.0EPSON11
S1D15G00 Series
4096 color display
1 8-bit mode
D7, D6, D5, D4, D3, D2, D1, D0: RRRRGGGG (8 bits) 1st write
D7, D6, D5, D4, D3, D2, D1, D0: BBBBRRRR (8 bits) 2nd write
D7, D6, D5, D4, D3, D2, D1, D0: GGGGBBBB (8 bits) 3rd write
Data is acquired through write operations as shown above and then that of two pixels is written to the display RAM.
2 16-bit mode
D15, D14, D13, D12, D11, D10, D9, D8, D7, D6, D5, D4, D3, D2, D1, D0: RRRRGGGGBBBBXXXX (12 bits)
Data is acquired through single write operation and then written to the display RAM.
“XXXX” are dummy bits, and they are ignored for display.
8.1.3 8- and 9-bit Serial Interface
The 8-bit serial interface uses four pins - CS, SI, SCL and A0 - to enter commands and data. Meanwhile, the 9-bit serial
interface uses three pins - CS, SI and SCL - for the same purpose.
Data read is not available with the serial interface. Data entered must be 8 bits. Refer to the following chart for entering
commands, parameters or gray-scale data.
The relation between gray-scale data and data bus in the serial input is the same as that in the 8-bit parallel interface
mode (described in the preceding section) at every gradation.
(1) 8-bit serial interface
When entering data (parameters): A0 = HIGH at the rising edge of the 8th SCL.
CS
dot0(R)
R1R2R0G2G1G0B1B0R2R0R1G2G1G0
SI
SCL
12345 678123 4 56
A0
dot1(G)
dot2(B)
When entering command: A0 = LOW at the rising edge of the 8th SCL.
CS
commandcommand
SI
SCL
12345 678123 4 56
A0
dot3(R)dot4(R)
D2D3D4D5D6D7D0D1D2D3D4D5D6D7
D2D3D4D5D6D7D0D1D2D3D4D5D6D7
12EPSONRev. 1.0
(2) 9-bit serial interface
When entering data (parameters): SI = HIGH at the rising edge of the 1st SCL.
CS
S1D15G00 Series
SI
SCL
dot0(R)
R2R1R0G2G1G0B1B0R2R1R0
12345 678912 3 45
dot1(G)
dot2(B)
dot3(R)
D4D5D6D7D/CD0D1D2D3D4D5D6D7D/C
When entering commands: SI = LOW at the rising edge of the 1st SCL.
CS
commandcommand
SI
SCL
12345 678912 3 45
D4D5D6D7D/CD0D1D2D3D4D5D6D7D/C
* If CS is caused to HIGH before 8 bits from D7 to D0 are entered, the data concerned is invalidated. Before entering
succeeding sets of data, you must correctly input the data concerned again.
* In order to avoid data transfer error due to incoming noise, it is recommended to set CS at HIGH on byte basis to
initialize the serial-to-parallel conversion counter and the register.
Rev. 1.0EPSON13
S1D15G00 Series
8.2 Access to DDRAM and Internal Registers
S1G15G00 realizes high-speed data transfer because the access from MPU is a sort of pipeline processing done via the
bus holder attached to the internal, requiring the cycle time alone without needing the wait time.
For example, when MPU writes data to the DDRAM, the data is once held by the bus holder and then written to the
DDRAM before the succeeding write cycle is started. When MPU reads data from the DDRAM, the first read cycle
is dummy and the data read in the dummy cycle is held by the bus holder, and then it is read from the bus holder to the
system bus in the succeeding read cycle. Fig. 8.2.1 illustrates these relations.
* Write operation
A0
tcyc
WR
MPU
DATA
Bus holder
Internal
Data write
signal
* Read operation
A0
WR
RD
MPU
Command writeData writeData write
Command write
Dummy readData read
External pulse
Bus holder
Internal
Data Read
signal
Command
RAM dataRAM data
Fig. 8.2.1
* There is a restriction in the read sequence of the DDRAM. Namely, the data at the specified address is not output
in the first data read conducted immediately after the memory read command (dummy read). It is read in the second
data read.
14EPSONRev. 1.0
S1D15G00 Series
8.3 DDRAM
8.3.1 DDRAM
It is 396 × 168 × 4 bits capacity RAM prepared for storing dot data. You can access a desired bit by specifying the page
address and column address.
Since display data from MPU - D7 to D0 and D1 to D8 - correspond to one or two pixels of RGB, data transfer-related
restrictions are reduced, realizing the display flexibly.
The RAM on S1D15G00 is separated to a block per 4 line to allow the display system to process data on the block basis.
MPU’s read and write operations to and from the RAM are performed via the I/O buffer circuit. Reading of the RAM
for the liquid crystal drive is controlled from another separate circuit.
Refer to the following memory map for the RAM configuration.
1Models other than the S1D15G00D10*100 (models that have 132 RGB × 160 output)
Memory Map (When using the 8 gray-scale. 8-bit mode)
RGB alignment (Command of data control parameter2=000)
Column
LCD
read
direction
Block
00167
P11:0
P11:1
Color
Page
P10:0 P10:1
Data
D7
D6
D5
0
131
GB
D4
D1D0D7
D3
D2
D6
D5
1
132
D4
D3
D2
D1
D0
RGBRGBR
D7
D6
D5
131
0
D4
D3
D2
D1
D0
1
2
40
41
1166
2165
3164
4163
5162
6161
7160
8159
9158
1607
1616
1625
1634
1643
1652
1661
1670
SEGout
123456394395396
Each of RGB data entered to D7 to D0 (3 or 2 bits) is converted to 4 bits before written to the RAM. You can change
position of R and B with DATCTL command.
Rev. 1.0EPSON15
S1D15G00 Series
Memory Map (When using the 8 gray-scale, 16-bit mode)
RGB alignment (Command of data control parameter2=000)
Column
LCD
read
direction
Block
0
1
2
P11: 0
P11: 1
Color
Data
Page
P10:0 P10:1
0167
1166
2165
3164
4163
5162
6161
7160
8159
R
D15
D14
D13
0
65
G
BRGBRGBRGBRGB
D12
D9
D11
D8
D10
011
6564640
D15
D12
D7
D6
D5
D4
D3
D2
D1
D0
D14
D13
D9D8D7
D11
D10
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
65
D4
D3
D2
D1
D0
9158
40
41
SEGout
1607
1616
1625
1634
1643
1652
1661
1670
123456789101112394395396
Each of RGB data entered to D7 to D0 (3 or 2 bits) is converted to 4 bits before written to the RAM. You can change
position of R and B with DATCTL command.
16EPSONRev. 1.0
Memory Map (When using the 16 gray-scale 8-bit mode)
RGB alignment (Command of data control parameter2=000)
S1D15G00 Series
Column
LCD
read
direction
Block
0
1
2
P11: 0
P11: 1
Color
Data
Page
P10:0 P10:1
0167
1166
2165
3164
4163
5162
6161
7160
8159
0
65
R1 G1 B1 R2 G2 B2 R1 G1 B1 RG2 B2R2 G2 B2
D7
D3
D7
D6
D2
D6
D5
D1
D5
D4
D0
D4
011
6564640
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
D3
D2
D1
D0
65
D7
D6
D5
D4
D3
D2
D1
D0
9158
40
41
SEGout
1607
1616
1625
1634
1643
1652
1661
1670
12345678910 11 12394 395 396
You can change position of R and B with DATCTL command.
Rev. 1.0EPSON17
S1D15G00 Series
Memory Map (When using the 16 gray-scale 16-bit mode)
RGB alignment (Command of data control parameter2=000)
LCD
read
direction
Block
00167
P11:0
P11:1
Color
Data
Page
P10:0 P10:1
1166
2165
3164
D15
D14
D13
D12
0
131
GB
D11
D7
D10
D6
D9
D5
D8
D4
D15
D14
D13
D12
1
130
D11
D10
D9
D8
D7
D6
D5
D4
Column
RGBRG BR
D15
D14
D13
D12
131
D11
D10
D9
D8
0
D7
D6
D5
D4
1
2
40
41
4163
5162
6161
7160
8159
9158
1607
1616
1625
1634
1643
1652
1661
1670
SEGout
123456394395396
You can change position of R and B with DATCTL command
RGB alignment (Command of data control parameter2=000)
LCD
read
direction
Block
00167
P11:0
P11:1
Color
Page
P10:0 P10:1
1166
2165
3164
Data
D7
D6
D5
16
115
GB
D4
D1D0D7
D3
D2
D6
D5
17
114
D4
D3
D2
D1
D0
Column
S1D15G00 Series
115
16
RGBRGBR
D7
D4
D1
D6
D3
D0
D5
D2
1
2
28
29
SEGout
4163
5162
6161
7160
8159
9158
11255
11354
11453
11552
11651
11750
11849
11948
495051525354346 347348
Although data is described as D7 - D0 (3 bits or 2 bits), all RGB data will be converted to 4 bits and written to the RAM.
Positions of R and B can be changed using the DATCTL command.
Rev. 1.0EPSON19
S1D15G00 Series
Memory map (when 8-tone, 16-bit mode is used)
RGB alignment (Command of data control parameter2=000)
Column
LCD
read
direction
Block
0
1
2
P11: 0
P11: 1
Color
Page
P10:0 P10:1
0167
1166
2165
3164
4163
5162
6161
7160
8159
9158
Data
R
D15
D14
D13
8
57
BRGBRGBRGBRGB
G
D9
D12
D8
D11
D10
899
5756568
D1
D7
D6
D5
D4
D3
D2
D0
D15
D14
D13
D12
D11
D10
D9D8D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
57
D4
D3
D2
D1
D0
28
29
SEGout
11255
11354
11453
11552
11651
11750
11849
11948
49 50 51 52 53 54 55 56 57 58 59 60346 347 348
Although data is described as D7 - D0 (3 bits or 2 bits), all RGB data will be converted to 4 bits and written to the RAM.
Positions of R and B can be changed using the DATCTL command.
20EPSONRev. 1.0
Memory map (when 16-tone, 8-bit mode is used)
RGB alignment (Command of data control parameter2=000)
S1D15G00 Series
Column
LCD
read
direction
Block
0
1
2
P11: 0
P11: 1
Color
Data
Page
P10:0 P10:1
0167
1166
2165
3164
4163
5162
6161
7160
8159
8
57
R1 G1 B1 R2 G2 B2 R1 G1 B1 R2 G2 B2R2 G2 B2
D7
D3
D7
D6
D2
D6
D5
D1
D5
D4
D0
D4
899
5756568
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
D3
D2
D1
D0
57
D7
D6
D5
D4
D3
D2
D1
D0
9158
28
29
SEGout
11255
11354
11453
11552
11651
11750
11849
11948
49 50 51 52 53 54 55 56 57 58 59 60346 347 348
Positions of R and B can be changed using the DATCTL command.
Rev. 1.0EPSON21
S1D15G00 Series
Memory map (when 16-tone, 16-bit mode is used)
RGB alignment (Command of data control parameter2=000)
LCD
read
direction
Block
00167
P11:0
P11:1
Color
Page
P10:0 P10:1
Data
1166
2165
3164
D15
D14
D13
D12
16
115
GB
D7
D11
D6
D10
D5
D9
D4
D8
D15
D14
D13
D12
17
114
D11
D10
D9
D8
D7
D6
D5
D4
Column
D1
D1
D1
D1
115
16
RGBRG BR
D7
D11
D6
D10
D5
D9
D4
D8
1
2
28
29
4163
5162
6161
7160
8159
9158
11255
11354
11453
11552
11651
11750
11849
11948
SEGout
495051525354346 347 348
Positions of R and B can be changed using the DATCTL command.
22EPSONRev. 1.0
S1D15G00 Series
8.3.2 Page Address Control Circuit
This circuit is used to control the address in the page direction when MPU accesses the DDRAM or when reading the
DDRAM to display image on the LCD.
You can specify a scope of the page address (start and end page) with PASET (page address set) command. When the
page-direction scan is specified with DATCTL (data control) command and the addresses are incremented from the start
up to the end page, the column address is incremented by 1 and the page address returns to the start page.
The DDRAM supports up to 168 lines
*1: S1D15G00D10*000 supports up to 120 lines and the total number of pages is 120.
In the read operation, as the end page is reached, the column address is automatically incremented by 1 and the page
address is returned to the start page.
Using the address normal/inverse parameter of DATCTL command allows you to inverse the correspondence between
the DDRAM address and common output.
8.3.3 Column Address Control Circuit
This circuit is used to control the address in the column direction when MPU accesses the DDRAM. You can specify
a scope of the column address (start and end column) using CASET (column address set). When the column-direction
scan is specified with DATCTL command and the addresses are incremented from the start to the end up to the end
column, the page address is incremented by 1 and the column address returns to the start column.
In the read operation, too, the column address is automatically incremented by 1 and returns to the start page as the end
column is reached.
Just like the page address control circuit, using the column address normal/inverse parameter of DATCTL command
enables to inverse the correspondence between the DDRAM column address and segment output. This arrangement
relaxes restrictions in the chip layout on the LCD module.
*1
, and thus the total page becomes 168.
8.3.4 I/O Buffer Circuit
It is the bi-directional buffer used when MPU reads or writes the DDRAM. Since MPU’s read or write of the DDRAM
is performed independently from data output to the display data latch circuit, asynchronous access to the DDRAM while
the LCD is turned on does not cause troubles such as flicking of the display images.
8.3.5 Block Address Circuit
This circuit associates pages on the DDRAM with COM output. S1D15G00 processes signals for the liquid crystal
display on 4-page basis (block basis). Thus, when specifying a specific area in the area scroll display or partial display,
you must designate it in block.
8.3.6 Display Data Latch Circuit
This circuit is used to temporarily hold display data to be output from the DDRAM to the SEG decoder circuit. Since
DISNOR/DISINV (display normal/inverse) and DISON/DISOFF (display on/display off) commands are used to
control data in the latch circuit alone, they do not modify data in the DDRAM.
Rev. 1.0EPSON23
S1D15G00 Series
8.4 Area Scroll Display
Using ASCSET (area scroll set) and SCSTART (scroll start set) commands allows you to scroll the display screen
partially. You can select any one of the following four scroll patterns.
Center screen scrollTop screen scrollBottom screen scrollWhole screen scroll
: Fixed area
: Scroll area
Fig. 8.4.1
When, for example, 1/128 duty (Display area: 32 blocks = 128 lines) is selected, and the top 2 blocks = 8 lines and bottom
2 blocks = 8 lines are specified as the fixed areas and the remaining 28 blocks = 112 lines as the scroll area, 10 blocks
= 40 lines on the DDRAM can be used as the background area.
DDRAM block
0
1
2
LCD panel
32 blocks
=128 line
29
30
39
40
41
Fixed area
Display area
Scroll area
Background area
24EPSONRev. 1.0
S1D15G00 Series
8.5 Partial Display
Using PTLIN (partial in) command allows you to turn on the partial display (division by line) of the screen. This mode
requires less current consumption than the whole screen display, making it suitable for the mobile equipment in the
standby state.
: Display area (partial display area)
: Non-display area
8.6 Gray-Scale Display
This function represents gray-scale by frame modulating the gray-scale date written on the display data RAM. In the
256-out-of-4096 colors (8 gray-scale) display, you can specify display colors using the command.
Normally black liquid crystal in the reverse display mode - 8 gray scale display
Respective data on red, green and blue are converted to the display data to be specified by the parameters of RGBSET8
command, and then written to the DDRAM. Blue is displayed in 4 gray-scale.
8.7 Oscillation Circuit
S1G15G00 contains the oscillation circuit whose operation does not require any external part. The oscillation circuit
is enabled only when M/S = HIGH and CLS = HIGH. When the external clock signal is (CLS = LOW or M/S = LOW),
the clock is entered from CL pin.
8.8 Display Timing Generation Circuit
This circuit generates the timing signal for display (CL, FR, SYNC, CA, F1, F2, DOFF) using the clock from the builtin oscillation circuit or the external clock.
It is also used to generate the clock to turn on the liquid crystal-drive power circuit.
When using S1D15G00 in multi-chip array, the display timing signal (CL, FR, SYNC, CA, F1, F2, DOFF) must be sent
from the master to the slave.
8.9 SEG Decoder Circuit
This circuit outputs the segment driver control signal based on display data for 4-page and the timing signal.
8.10 Liquid Crystal Drive Circuit
It outputs liquid crystal drive voltage. Responding to the decoder output signal and the display-timing signal, the
segment output pin outputs one of potentials V2, V1, VC, MV1 or MV2 and the common output pin outputs one of
potentials V3, VC or MV3.
Rev. 1.0EPSON25
S1D15G00 Series
8.11 Liquid Crystal-Drive Power Circuit
The power circuit contained in S1D15G00 generates voltage required to drive liquid crystal. This low power
consumption type power circuit is consisted the voltage regulator, booster circuits (primary, secondary) and voltage
follower. The power circuit is enabled only when the master operation mode is turned on.
The power control circuit turns on or off the voltage regulator, booster circuits, Reference voltage generation circuit
and voltage follower responding to PWRCTR (power control set) command. Thus, function of the external and internal
power supplies can be partly used in parallel.
Table 8.11.1 lists the functions controlled by the 4-bit data - parameter of PWRCTR. Table 8.11.2 shows combinations
of 4 bits (combinations shown in Table 8.11.2 alone are valid).
Table 8.11.1
ItemState
“1”“0”
D3 Primary booster circuits control bitONOFF
D2 Secondary booster circuit control bitONOFF
D1 Reference voltage generation circuit control bitONOFF
D0 Voltage adjusting circuit/Voltage follower control bitONOFF
Table 8.11.2
Function turned onD3D2D1D0
External power input pins
1. Entire built-in power circuit is turned on1111–
2. Other than the secondary booster and step-down circuits1011V3, MV3
3. External power supply alone0000V3, V2, VC, MV1, MV3
8.11.2 Voltage Transform Circuit
The charge pump booster circuit and the operational amplifier’s voltage follower generate each potential required to
drive the liquid crystal based on the reference voltage generated by the voltage regulator.
Ground potentials (abbreviated as GND in the following description) of the power circuit in the IC are GND2 and
GND4.
Fig. 8.11.1 illustrates mutual relationship between potentials.
Secondary
Primary
boorster circuit
V
DD2
VCLS
V2 V1, VC, MV1,
generation circuit
boorster circuit
V
V2
V1
VC
3
MV1
GND
Secondary
boorster circuit
MV2
MV3
Fig. 8.11.1 Mutual Relationship between Voltage Transform Circuits
26EPSONRev. 1.0
S1D15G00 Series
Table 8.11.3 shows the theoretical expression of respective potentials. Since these are theoretical values, they can differ
from actual voltages depending on load on the liquid crystal.
Table 8.11.3 Theoretical Expression of Potentials
Signal nameTheoretical expressionTheoretical expression
(relative to GND = 0V)(relative to VC = 0V)
V32×(V2–GND)2×(VC–GND)
V2Output from voltage regulatorVC–GND
V13/4×(V2–GND)1/2×(VC–GND)
VC2/3×(V2–GND)0V
MV11/3×(V2–GND)–1/2×(VC–GND)
GND(MV2)0V–(VC–GND)
MV3–(V2–GND)–2×(VC–GND)
8.11.3 Primary Booster Circuit
The built-in booster circuit triples the voltage of VDD2-GND.
VDD2-GND voltage is tripled by capacitor C connected across CAP1+ and CAP1,CAP2+ and CAP2- as well as VCSL
and GND (or VDD2), and then output at VCSL pin.
In the case of double boosting, short circuit the CAP2+ and VCSL pin.
Fig. 8.11.2 shows how the voltage is stepped up by the capacitors connected.
CSL=
3xV
C
+
C
+
C
+
GND or V
V
CAP2—
CAP2+
CAP1—
CAP1+
CSL
DD2
V
DD2
GND
V
DD2
C
+
C
+
GND or V
V
CAP2—
CAP2+
CAP1—
CAP1+
CLS
DD2
V
DD2
GND
V
CLS=
2xV
DD2
Fig. 8.11.2 Relation between Capacitors and Voltage Step-up
8.11.4 Voltage Regulator Circuit
The voltage regulator circuit generates the liquid crystal drive voltage V2 using VCSL from the primary booster circuit.
S1D15G00 incorporates the high-precision constant voltage source, 64-step electronic volume control function and
resistor to regulate V2 voltage. The voltage regulator circuit covers a wider temperature range with fewer numbers of
parts thanks to the temperature gradient control function as well as the temperature sensing function.
However, capacitors may be required for voltage regulation between V2 and GND pins due to the load of LCD panel.
Insert the capacitors, if necessary, by observing the voltage waveforms and current consumption.
1 Built-in Resistor for V2 Voltage Regulation
The contents described in this document apply only to models that use a V2 voltage control resistor inside the IC.
Using this resistor and the electronic volume control function allows you to control the liquid crystal drive voltage V2
to an optimum level for the LCD panel with the command alone, without resorting to external resistors.
V2 output voltage can be determined from Equation A-1 as long as the relation V2 < VCSL is met.
However, set the voltage of V2 by allowing for a drop in the voltage due to load, so that it becomes at or below 80 %
of VCSL.
Rb
V
111
=+
V
EVREG2
•=+
Ra
Rb
Ra
•
α
218
2
+
•–
(Equation A-1)
V
Note: VREG is the constant voltage source inside the IC. It is 1.2V (Typ.) at Ta = 25°C.
Rev. 1.0EPSON27
S1D15G00 Series
VCSL
VEV (Constant voltage source +
Electronic volume controller)
Built-in Rb
Built-in Ra
GND
V2
Fig. 8.11.3 Voltage Regulator Circuit
Rb/Ra in Equation A-1 is the resistance ratio of the built-in V2 voltage-regulating resistance. This ratio can be varied
in 8 levels by changing parameters 2(P2) of electronic volum control command. Reference ratios of “1 + Rb/Ra” are
shown in Table 8.11.4.
Table 8.11.4 Resistance Ratio of Built-in V2 Voltage-Regulating Resistance: Parameters and “1+
2V2 voltage control external resistor
The contents described in this document apply only to models that use an external V2 voltage control resistor.
If you use an external resistance control model, you can set the V2 voltage using an external resistor.
Use a semi-fixed resistor for V2 voltage regulation.
CSL
V
VEV
(Fixed voltage source and
Electronic volume control)
GND
+
–
VR
V
2
GND
V
2
External resistor Rb
External resistor Ra
Fig. 8.11.4 Voltage Regulator Circuit
Select the external Ra and Rb values to allow stable voltage supply by observing the V2 voltage waveforms.
As the VR pin has a high input impedance and it is susceptible to ambient noise, the resistors and their leads must be
placed in a short distance and they must be away from the clock source.
3Constant Voltage Source and Electronic Volume Control Circuit
The constant voltage source generates V
REG - the reference voltage inside the IC. You can specify one of four types
of temperature gradients with parameters of electronic volum control command. See Fig. 8.11.5.
28EPSONRev. 1.0
Table 8.11.5 Parameters and VREG Temperature Gradient
S1D15G00 Series
Parameter
Temperature gradient (%/C)
00–0.05
01–0.1
10–0.15
11–0.2
The electronic volume control circuit varies α in Equation A-1 according to parameters 1(P1) of electronic volum
control command. Table 8.11.6 lists relation between the parameters and α.
Table 8.11.6 Parameters and Electronic Volume
Parameter
P15P14P13P12P11P10
α
V1 voltage value
00000063Small
00000162
00001061
•••
•••
•••
1111012
1111101
1111110
Large
8.11.5 Voltage Divider/Voltage Follower Circuit
The voltage divider/voltage follower circuit V2 output from the voltage regulator circuit and then generates liquid
crystal drive voltages V1,VC and MV1 using the operational amplifier-featured voltage follower.
Capacitors may be required for voltage regulation between the GND and each of V1, VC and MV1 pins due to the load
of LCD panel. Insert the capacitors, if necessary, by observing the voltage waveforms and current consumption.
V1 = 3/4×V2
VC = 2/4×V2
MV1 = 1/4×V2
8.11.6 Secondary Booster Circuit and Tertiary Booster/Step-Down Circuit
The secondary booster circuit boosts or steps down based on V2 and produces V3 and MV3.
Their potential relationship is expressed with the following theoretical equation:
V3 = 2×V2
MV3 = –V2
8.11.7 Samples of Connections Peripheral to Power Circuit (For your information)
Following illustrates the connections when the entire power circuit is used.
Sample of common setting
ItemSettingUnit
C11.0 to 4.7µF
C20.47 to 1.0
Optimum values of C1 and C2 above vary
depending on the LCD panel to be driven.
Above values should be referenced as
information only. It is recommended to
check how patterns with high load are
displayed before finalizing the values.
C between V
DD2 and GND signifies a
C1
C1
C1
C1
+
+
+
+
CAP1+
CAP1–
CAP2+
CAP2–
CAP4+
CAP4–
CAP5+
CAP5–
VDD2
VCSL
GND
V
V2
V1
VC
MV1
MV3
+
+
3
+
C1
C2
2
2
bias capacitor.
Rev. 1.0EPSON29
S1D15G00 Series
9. COMMANDS
9.1 Command List
Following table lists the control signals and commands using the 80 series interface as the example.
Increment electronic control by 1
Decrement electronic control by 1
D6None
D7None
35 STREAD001 StatusStatus read
30EPSONRev. 1.0
S1D15G00 Series
(1) Display ON (DISON) Command: 1 Parameter: None
It is used to turn the display on. When the display is turned on, segment outputs and common outputs are generated
at the level corresponding to the display data and display timing. You can’t turn on the display as long as the sleep mode
is selected. Thus, whenever using this command, you must cancel the sleep mode first.
A0RD WRD7D6D5D4D3D2D1D0
Command01010101111
(2) Display OFF (DISOFF) Command: 1 Parameter: 0
It is used to forcibly turn the display off. As long as the display is turned off, every segment and common outputs are
forced to VC level and DOFF pin is caused to LOW.
A0RD WRD7D6D5D4D3D2D1D0
Command01010101110
(3) Normal display (DISNOR) Command: 1 Parameter: 0
It is used to normally highlight the display area without modifying contents of the display data RAM.
A0RD WRD7D6D5D4D3D2D1D0
Command01010100110
(4) Inverse display (DISINV) Command: 1 Parameter: 0
It is used to inversely highlight the display area without modifying contents of the display data RAM. This command
does not invert non-display areas in case of using partial display.
A0RD WRD7D6D5D4D3D2D1D0
Command01010100111
(5) Common scan (COMSCAN) Command: 1 Parameter: 1
It is used to specify the common output scan direction. This command helps increasing degrees of freedom of wiring
on the LCD panel.
A0RD WRD7D6D5D4D3D2D1D0Function
Command01010111011
Parameter1 (P1)
When 1/160 is selected for the display duty, pins and common output are scanned in the order shown below.
(6) Display control (DISCTL) Command: 1 Parameter: 3
This command and succeeding parameters are used to perform the display timing-related setups. This command must
be selected before using SLPOUT. Don’t change this command while the display is turned on.
A0RD WRD7D6D5D4D3D2D1D0Function
Command01011001010
Parameter1 (P1)
Parameter2 (P2)
Parameter3 (P3)
P1: It is used to specify the CL dividing ratio, F1 and F2 drive-pattern switching period.
P13, P12: CL dividing ratio. They are used to change number of dividing stages of external or internal clock.
DOFF (LCD panel blanking control pin) on S1D15G00 is caused to LOW when the sleep in mode is turned on.
The LCD power supply and the boost circuit output is jumpered with GND during Sleep In.
32EPSONRev. 1.0
S1D15G00 Series
(8) Sleep out (SLPOUT) Command: 1 Parameter: 0
Entering this command generates HIGH at SLP pin.
A0RD WRD7D6D5D4D3D2D1D0
Command01010010100
(9) Page address set (PASET) Command: 1 Parameter: 2
When MPU makes access to the display data RAM, this command and succeeding parameters are used to specify the
page address area. As the addresses are incremented from the start to the end page in the page-direction scan, the column
address is incremented by 1 and the page address is returned to the start page. Note that the start and end page must
be specified as a pair. Also, the relation “start page < end page” must be maintained.
(10) Column address set (CASET) Command: 1 Parameter: 2
When MPU makes access to the display data RAM, this command and succeeding parameters are used to specify the
column address area. As the addresses are incremented from the start to the end column in the column-direction scan,
the page address is incremented by 1 and the column address is returned to the start column. Note that the start and end
page must be specified as a pair. Also, the relation “start column < end column” must be maintained.
(11) Data control (DATCTL) Command: 1 Parameters: 2
This command and succeeding parameters are used to perform various setups needed when MPU operates display data
stored on the built-in RAM.
A0RD WRD7D6D5D4D3D2D1D0Function
Command01010111100
Parameter1 (P1)
Parameter2 (P2)
Parameter3 (P3)
P1: It is used to specify the normal or inverse display of the page address and also to specify the page address scanning
direction.
P10: Normal/inverse display of the page address. P10 = 0: Normal and P10 = “1”: Inverse.
P11: Normal/reverse turn of column address. P11 = “0”: Normal rotation and P11 = “1”: Reverse rotation
P12: Address-scan direction. P12 = “0”: In the column direction and P12 = “1”: In the page direction.
P2: RGB arrangement. This parameter allows you to change RGB arrangement of the segment output according to RGB
arrangement on the LCD panel. In this case, writing position of data {R = (D7, D6, D5), G = (D4, D3, D2), B =
(D1, D0)} on the display memory is changed.
110*****P12 P11 P10
Normal/inverse display of page
address and page-address
In the default, (P22, P21, P20) = (0, 0, 0) is selected.
SEG395
P3: Gray-scale setup. Using this parameter, you can a select desired display colors between the 256 colors (8 gray-scale)
or 4096 colors (16 gray-scale) for the display color. For 16 gray-scale display, you can select the Type-A or Type-B
display mode depending on the difference in RGB data arrangement you use.
P32 P31 P30Numbers of gray-scale
0018 gray-scale
01016 gray-scale display
34EPSONRev. 1.0
S1D15G00 Series
(12) 256-color position set (RGBSET8) Command: 1 Parameter: 0
When turning on 256-color display (8 gray-scale), this command allows you to choose colors to represent each of red,
green and blue from 4096 colors.
A0RD WRD7D6D5D4D3D2D1D0Function
Command01011001110
Parameter1 (P1)
110****P13 P12 P11 P10 Intermediate red tone 000
Parameter4 (P8)
Parameter9 (P9)
Parameter16 (P16)
Parameter17 (P17)
Parameter20 (P20)
110****P83 P82 P81 P80 Intermediate red tone 111
110****P93 P92 P91 P90 Intermediate green tone 000
110****
110****
110****
P163 P162 P161 P160
P173 P172 P171 P170
P203 P202 P201 P200
Intermediate green tone 111
Intermediate blue tone 00
Intermediate blue tone 11
Data (Red and Green: 3 bits and Blue: 2 bits) to be written from the MPU to the DDRAM are converted to 4-bit data
before the write operation takes place. When reading data from the DDRAM, data on red and green are converted to
3 bits and that on blue are converted to 2 bits before the output.
(13) Memory write (RAMWR) Command: 1 Parameter: Numbers of data written
When MPU writes data to the display memory, this command turns on the data entry mode. Entering this command
always sets the page and column addresses at the start address. You can rewrite contents of the display data RAM by
entering data succeeding to this command. At the same time, this operation increments the page or column address as
applicable. The write mode is automatically cancelled if any other command is entered.
1 8-bit bus
A0RD WRD7D6D5D4D3D2D1D0Function
Command01001011100
Parameter110Data to be writtenData to be written
2 16-bit bus
Command name
A0 RD WR
D15 D14 D13 D12 D11 D10
D9 D8 D7 D6 D5 D4 D3 D2 D1 D0Function
Command01 0********0 1011100Memory write
Data to be written
110Data to be writtenWrite data
(14) Memory read (RAMRD) Command: 1 Parameter: Numbers of data read
When MPU reads data from the display memory, this command turns on the data read mode. Entering this command
always sets the page and column addresses at the start address. After entering this command, you can read contents of
the display data RAM. At the same time, this operation increments the page or column address as applicable. The data
read mode is automatically cancelled if any other command is entered.
1 8-bit bus
A0RD WRD7D6D5D4D3D2D1D0Function
Command01001011101
Parameter101Data to be readData to be read
2 16-bit bus
Command name
A0 RD WR
D15 D14 D13 D12 D11 D10
D9 D8 D7 D6 D5 D4 D3 D2 D1 D0Function
Command01 0********0 1011101Memory read
Data to be read
101Data to be readRead data
Rev. 1.0EPSON35
S1D15G00 Series
(15) Partial in (PTLIN) Command: 1 Parameter: 2
This command and succeeding parameters specify the partial display area. This command is used to turn on partial
display of the screen (dividing screen by lines) in order to save power. Since S1D15G00 processes the liquid crystal
display signals on 4-line basis (block basis), the display and non-display areas are also specified on 4-bit line (block
basis).
A block address that can be specified for the partial display must be the displayed one (don’t try to specify an address
not to be displayed when scrolled).
When the partial display mode is turned on, following state is introduced to S1D15G00 in the non-display area:
* LOW is output to DOFF pin.
* All COM pins output V
* All SEG pins output V1 or MV1.
SEG output is forced to V1 or MV1 depending on state of FR in the last display line. When FR is HIGH, V1 is output
and when FR is LOW, MV1 is output. Phase of FR is constantly reversed at start of a frame.
(16) Partial out (PTLOUT) Command: 1 Parameter: 0
This command is used to exit from the partial display mode.
(17) Read modify write in (RMWIN) Command: 1 Parameter: 0
This command is used along with the column address set command, page address set command and read modify write
out command. This function is used when frequently modifying data to specify a specific display area such as blinking
cursor. First set a specific display area using the column and page address commands. Then, enter this command to
set the column and page addresses at the start address of the specific area. When this operation is complete, the column
(page) address won’t be modified by the display data read command. It is incremented only when the display data write
command is used. You can cancel this mode by entering the read modify write out or any other command.
A0RD WRD7D6D5D4D3D2D1D0
Command01011100000
Page address set
No
Column address set
Read modify write in
Is modification
complete?
Yes
Read modify write out
Dummy read
Data read
Data write
36EPSONRev. 1.0
S1D15G00 Series
(18) Read modify write out (RMWOUT) Command: 1 Parameter: 0
Entering this command cancels the read modify write mode.
A0RD WRD7D6D5D4D3D2D1D0
Command01011101110
(19) Area scroll set (ASCSET) Command: 1 Parameter: 4
It is used when scrolling only the specified portion of the screen (dividing the screen by lines). This command and
succeeding parameters specify the type of area scroll, FIX area and scroll area.
Center screen scrollTop screen scrollBottom screen scrollWhole screen scroll
: Fixed area
: Scroll area
Since S1D15G00 processes the liquid crystal display signals on the four-line basis (block basis), FIX and scroll areas
are also specified on the four-line basis (block basis).
DDRAM address corresponding to the top FIX area is set in the block address incrementing direction starting with 0
block. DDRAM address corresponding to the bottom FIX area is set in the block address decreasing direction starting
with 41st block. Other DDRAM blocks excluding the top and bottom FIX areas are assigned to the scroll + background
areas.
P1: It is used to specify the top block address of the scroll + background areas. Specify the 0th block for the top screen
scroll or whole screen scroll.
The scroll start block address is also set at this top block address until the scroll-start block set command specifies
the address.
P2: It specifies the bottom address of the scroll + background areas. Specify the 41st block for the bottom or whole
screen scroll.
Required relation between the start and end blocks (start block < end block) must be maintained.
P3: It specifies a specific number of blocks {Numbers of (Top FIX area + Scroll area) blocks - 1}. When the bottom
scroll or whole screen scroll, the value is identical with P2.
You can turn on the area scroll function by executing the area scroll set command first and then specifying the display
start block of the scroll area with the scroll start set command.
Rev. 1.0EPSON37
S1D15G00 Series
[Area Scroll Setup Example]
In the center screen scroll of 1/128 duty (display range: 128 lines = 32 blocks), if 8 lines = 2 blocks and 8 lines = 2 blocks
are specified for the top and bottom FIX areas, 112 lines = 28 blocks is specified for the scroll areas, respectively, 40
lines = 10 blocks on the DDRAM are usable as the background area. Value of each parameter at this time is as shown
below.
A0RD WRD7D6D5D4D3D2D1D0
P1110**000010Top block address = 2
P2110**100111Bottom block address = 39
P3110**011101Number of specific blocks = 29
P4110******00Area scroll mode = Center
*: Invalid bits irrelevant to the operations.
(20) Scroll start address set (SCSTART) Command: 1 Parameter: 1
This command and succeeding parameter are used to specify the start block address of the scroll area. Note that you
must execute this command after executing the area scroll set command. Scroll becomes available by dynamically
changing the start block address.
A0RD WRD7D6D5D4D3D2D1D0Function
Command01010101011
Parameter1 (P1)
110**P15 P14 P13 P12 P11 P10Start block address
*: Invalid bits irrelevant to the operations.
(21) Internal oscillation on (OSCON) Command: 1 Parameter: 0
This command turns on the internal oscillation circuit. It is valid only when the internal oscillation circuit of CLS =
HIGH is used.
A0RD WRD7D6D5D4D3D2D1D0
Command01011010001
(22) Internal oscillation off (OSOFF) Command: 1 Parameter: 0
It turns off the internal oscillation circuit. This circuit is turned off in the reset mode.
A0RD WRD7D6D5D4D3D2D1D0
Command01011010010
(23) Power control set (PWRCTR) Command: 1 Parameter: 1
This command is used to turn on or off the liquid crystal driving power circuit, booster/step-down circuits and voltage
follower circuit.
A0RD WRD7D6D5D4D3D2D1D0Function
Command01000100000
Parameter1 (P1)
*: Invalid bits irrelevant to the operations.
110****P13 P12 P11 P10LCD drive power
P10:It turns on or off the Reference voltage generation circuit.
P10 = “1”: ON. P10 = “0”: OFF.
P11:It turns on or off the voltage regulator and circuit voltage follower.
P11 = “1”: ON. P11 = “0”: OFF.
Note: 2 bits of P10 and P11 must be turned on or off simultaneously.
P12:It turns on or off the secondary booster/step-down circuit.
P12 = “1”: ON. P12 = “0”: OFF.
P13:It turns on the primary booster circuit.
38EPSONRev. 1.0
S1D15G00 Series
(24) Electronic volume control (VOLCTR) Command: 1 Parameter: 2
This command is used to specify the voltage regulator circuit’s electronic volume value α and resistance ratio of builtin voltage regulating resistor.
*: Invalid bits irrelevant to the operations.
P1: It is used to specify V2 electronic volume value.
P2: It specifies resistance ratio of the internal resistor.
(25) Increment Electronic Control (VOLUP) Command: 1 Parameter: No
This command increments Electronic Control value α of voltage regulator circuit by 1.
Command01011010110
If you set the Electronic Control value to 111111, the control value is set to 000000 after this command has been
executed.
(26) Decrement Electronic Control (VOLDOWN) Command: 1 Parameter: No
This command decrements Electronic Control value α of voltage regulator circuit by 1.
If you set the Electronic Control value to 000000, the control value is set to 111111 after this command has been
executed.
(27) Temperature gradient set (TMPGRD) Command: 1 Parameter: 5
This command is used to specify the average temperature gradient of liquid crystal drive voltage as well as the correction
value β of the electronic volume value at the predetermined 10 temperature levels.
A0RD WRD7D6D5D4D3D2D1D0Function
Command01010000010
Parameter1 (P1)
P11P10Average temperature gradient [%/°C]
00–0.05
01–0.1
10–0.15
11–0.2
(28) Control EEPROM (EPCTIN) Command: 1 Parameter: 1
This command with its parameter selects the EEPROM (S1F65170) Control mode. The parameter can be set to either
Write or Read.
110******P11 P10
Average temperature gradien
A0RD WRD7D6D5D4D3D2D1D0Function
Command01011001101
Parameter1 (P1)
* Invalid bit; it is ignored during operation.
P5: Specifies data writing into or reading from the EEPROM (S1F65170) as follows.
If P5=0: Read; if P5=1: Write
Rev. 1.0EPSON39
110**P5***** Selects Write or Read.
S1D15G00 Series
(29) Cancel EEPROM Control (EPCOUT) Command: 1 Parameter: 0
This command cancels the EEPROM (S1F65170) Control mode. If data is read from the EEPROM, both of Electronic
Control value and built-in resistance ratio are updated by the read data.
A0RD WRD7D6D5D4D3D2D1D0
Command01011001100
(30) Write Into EEPROM (EPMWR) Command: 1 Parameter: 0
This command writes the Electronic Control value and built-in resistance ratio into the EEPROM (S1F65170).
A0RD WRD7D6D5D4D3D2D1D0
Command01011111100
(31) Read From EEPROM (EPMRD) Command: 1 Parameter: 0
This command reads the Electronic Control value and built-in resistance ratio from the EEPROM (S1F65170), and
temporarily stores them in S1D15G00 registers.
A0RD WRD7D6D5D4D3D2D1D0
Command01011111101
(32) Read Register 1 (EPSRRD1) Command: 1 Parameter: 0
Issue the EPSRRD1 and STREAD (Status Read) commands in succession to read the Electronic Control value.
A0RD WRD7D6D5D4D3D2D1D0
Command01001111100
Issue the Status Read command immediately after this command. Also, always issue the NOP command after the
STREAD (Status Read) command.
(33) Read Register 1 (EPSRRD2) Command: 1 Parameter: 0
Issue the EPSRRD1 and STREAD (Status Read) commands in succession to read the built-in resistance ratio.
A0RD WRD7D6D5D4D3D2D1D0
Command01001111101
Issue the Status Read command immediately after this command. Also, always issue the NOP command after the
STREAD (Status Read) command.
(34) Non-operating (NOP) Command: 1 Parameter: 0
This command does not affect the operation.
A0RD WRD7D6D5D4D3D2D1D0
Command01000100101
This command, however, has the function of canceling the IC test mode. Thus, it is recommended to enter it periodically
to prevent malfunctioning due to noise and such.
40EPSONRev. 1.0
(35) Status read (STREAD)
It is the command for the IC chip test. Don’t try to use this command.
A0RD WRD7D6D5D4D3D2D1D0
Command001Status data
1 Status after reset or after NOP operation
D7: Area scroll modeRefer to P37 (ASCSET).
D6: Area scroll modeRefer to P37 (ASCSET).
D5: Read modify write0: In1: Out
D4: Scan direction0: Page1: Column
D3: Display ON/OFF0: OFF1: ON
D2: EEPROM access0: Out of access1: In access
D1: Display normal/inverse0: Inverse1: Normal
D0: Partial display0: OFF1: ON
2 Status after EPSRRD1 operation
D7, D6: Undefined (1 or 0)
D5 to D0: Electronic volume control values
3 Status after EPSRRD2 operation
D7 to D3: Undefined (1 or 0)
D2 to D0: Built-in resistance ratio
S1D15G00 Series
Rev. 1.0EPSON41
S1D15G00 Series
10.ABSOLUTE MAXIMUM RATING
ItemSymbolRatingUnit
Source voltage (1)VDD,VDD2–0.3 to 4.0V
Input source voltageVDDI–0.3 to 4.0V
Source voltage (2)V3,VOUT–0.3 to 25.0V
V2,V1,VC–0.3 to V3
Source voltage (3)MV1–0.3 to VDD2V
MV3–10.0 to +0.5
Input voltageV IN–0.3 to VDDI+0.5V
Output voltageVO–0.3 to VDDI+0.5V
Operating temperatureTopr–40 to +85°C
Storage
temperature
Potential Relation
Bare chipTstr–65 to +150°C
VDD2,
VDD
VCC
GND
System (MPU) side
VDDI
GND
Notes: 1. Voltages are all indicated relevant to GND = 0V.
2. Voltage of V 3, V2, V 1, VC, MV1 , MV2 (GND) and MV3 must constantly meets the requirement V3 ≥
V2≥V1 ≥VC≥ MV1≥MV2 (GND) ≥MV3.
3. VDD and VOUT1 voltages must constantly meets the requirement V OUT1 ≥VDD.
4. If LSI is operated beyond the absolute maximum rating, it can be damaged permanently. Normal operating
conditions should conform to the electric characteristics of LSI, otherwise malfunctioning of LSI can result
in addition to deterioration of its reliability.
5. Definition of VDD is applicable to VDD3, VDD4 and V DD5 pins.
6. Definition of GND is applicable to GND2, GND3 and GND4 pins.
VOUT
V2
S1D15G00 side
V3
MV2
MV3
V
1, VC, MV1
42EPSONRev. 1.0
S1D15G00 Series
11.ELECTRIC CHARACTERISTICS
11.1 DC Characteristics
Except where otherwise specified, GND = 0V, VDD = 2.75V, VDDI = 1.8V and Ta = 20°C to 85°C.
Table 11.1
ItemSymbolConditionStandard valueUnit
Min.Typ.Max.pin
OperatingOperableVDD2.62.753.6VVDD*1
voltage (1)
OperatingOperableVDDI1.71.8VDDVVDDI
voltage (2)
OperatingOperableV3V3 to MV312.0–21.0VV3
voltage (3) OperableV38.0–14.0VV3
Reference voltageVREGTa=25°C1.161.201.24V*7
Voltage adjustingV2no load4.0–7.0VV2
circuit output voltage
Secondary boostingV38.0–14.0VV3
output voltage
Built-in power supply circuit
Secondary step-downMV3–7.0––4.0VMV3
output voltage
Static current consumption: While the display is in operation and the built-in power supply is turned on.
Current consumed by total IC including the built-in power supply.
1200
Horizontal stripe per 4 dots
1000
Applicable
800
600
IDD [µA]
400
200
0
45678
V2 voltage [V]
Display RAM all "0"
Condition: VDD = 2.75V, VDDI = 1.8V, frame frequency 130Hz
During display, built-in power supply and built-in oscillation circuit on, built-in power supply triple
boosting voltage
Typical value when Ta = 25°C
Fig. 11.1 Dynamic current consumption (During display, liquid crystal drive voltage dependent)
44EPSONRev. 1.0
1400
S1D15G00 Series
IDD [µA]
1200
1000
800
600
400
200
0
50100150200250
Frame frequency [Hz]
Horizontal stripe per 4 dots
Display RAM all "0"
Condition: VDD = 2.75V, VDDI = 1.8V, V2 = 6.0V
During display, built-in power supply and built-in oscillation circuit on, built-in power supply triple
boosting voltage
Typical value when Ta = 25°C
Fig. 11.2 Dynamic current consumption (During display, frame frequency dependent)
Table 11.3 Current Consumption in Power Save Mode GND = 0V, VDD = V
DDI
= 1.8V, VDD = 2.75V and Ta = 25° C.
ItemSymbolConditionStandard valueUnit
Min.Typ.Max.pin
Sleep modeIDDS–1.010.0µA
Applicable
VDD, VDDI
4000
3000
2000
IDD [µA]
1000
012345678910
Cycle time [MHz]
Condition: VDD = VDDI = 3.0V, built-in power supply and built-in oscillation circuit off
Fig. 11.3 Dynamic current consumption (During display RAM access)
Rev. 1.0EPSON45
S1D15G00 Series
Table 11.4 Relation between Oscillated Frequency fOSC, Display Clock Frequency fCL and Frame
Frequency of Liquid Crystal
ItemfCLfFR
When built-in oscillation circuit is used41.6kHz (Typ.) *1fCL/Dividing ratio
57.6kHz (Typ.) *22 × Display duty
31.2kHz (Typ.) *3
When built-in oscillation circuitExternal input (fCL)fCL/Dividing ratio
is not used2 × Display duty
*1: When 130Hz frame frequency device is used.
*2: When 180Hz frame frequency device is used.
*3: When S1D15G00D01
fFR represents cycle of framing, not cycle of FR signal.
Dividing ratio and display duty are set with the display control command.
DC Characteristics - Supplementary Description
*1: Operation is warranted if radical voltage fluctuations occur while MPU is in the process of access.
*2: This applies only to RES.
*3: D15 to D0 (Input mode)
SI, SCL IF1 to IF3, A0, CS, RD (E), WR (R/W), RES, M/S and CLS.
*4: D15 to D0 (Input and Output mode)
CL, FR SYNC, CA, F1, F2 and DOFF.
*5: It represents the resistance value when 0.5V is applied across the output pin SEGn or COMn and respective power
terminals (V
3, V2, V1, VC, MV1 and MV2). It is specified within the range of the operating voltage (3).
RON = 0.5V/∆I (∆I is the current conducted when 0.5V is applied across the power supply and output pin).
*6: For the relation between oscillated frequency and frame frequency, refer to Table 11.4. The standard value listed
in relation to the external input is a recommended value.
*7: This is the reference voltage source built into the IC. It is not output to the pin.
*8: It indicates the current consumed by the IC alone when the built-in oscillation circuit is in operation and the display
is turned on. Condition: display RAM all “0”, V
not include current consumed by the LCD panel capacity and wiring capacity.
000 is used.
*
2 = 6.0V, triple boosting voltage, no access to the MPU. It does
46EPSONRev. 1.0
11.2 AC Characteristics
System Bus
Read/write characteristics I (80 series MPU)
A0
t
AW8
CS
*1
WR, RD
CS
*2
WR, RD
t
CCLW, tCCLR
t
AH8
t
CCHW, tCCHR
t
CYC, tCYC2
S1D15G00 Series
t
CW8
D0 to D7
(Write)
D0 to D7
(Read)
t
ACC8
t
DS8
t
t
OH8
DH8
*1 is when access is made with WR and RD when CS is LOW.
*2 is when access is made with CS when WR and RD are LOW.
* Rise and fall time of input signal (tr, tf) must be 15 ns maximum.
* All timings must be specified using 30% and 70% of VDD-GND as the reference.
* tCCLW and tCCLR are specified by the duration during which CS as well as WR and RD are LOW.
* A0 timing is specified by the duration during which CS as well as WR and RD are LOW.
Rev. 1.0EPSON47
S1D15G00 Series
Ta=–40 to +85°C, VDD=2.6 to 3.6V, VDDI=1.7 to 2.6V
SignalSymbolParameterMin.Max.Unit
A0tAH8Address hold time10–ns–
tAW8Address setup time0–ns
WR,tCYCWrite cycle130–ns–
RD,CStCYC2Read cycle300–ns
tCCHWControl pulse HIGH width (write)90–ns
tCCHRControl pulse HIGH width (read)90–ns
tCCLWControl pulse LOW width (write)30–ns
tCCLRControl pulse LOW width (read)200–ns
tCW8CS–WR, RD time30–ns
D0 to D7tDS8Data setup time10–ns–
tDH8Data hold time20–ns
tACC8Read access time–200nsCL=10 to 100pF
tOH8Output disable time560ns
* Rise and fall time of input signal (tr, tf) must be 15 ns maximum.
* All timings must be specified using 30% and 70% of VDD-GND as the reference.
* tCCLW and tCCLR are specified by the duration during which CS as well as WR and RD are LOW.
* A0 timing is specified by the duration during which CS as well as WR and RD are LOW.
Measuring conditions
and others
48EPSONRev. 1.0
* Read/write characteristics II (68 series MPU)
A0, R/W
CS
*1
E
CS
*2
E
D0 to D7
(Write)
tCCHW, tCCHR
DS6tDH6
t
tAH6tAW6
tCCLW, tCCLR
tCYC, tCYC2
S1D15G00 Series
tCW6
D0 to D7
(Read)
tOH6tACC6
* 1 is when access is made with E when CS is LOW.
* 2 is when access is made with CS when E is LOW.
Ta =–40 to +85°C, VDD=2.6 to 3.6V, VDDI=2.6 to VDD
SignalSymbolParameterMin.Max.Unit
Measuring conditions
and others
A0, R/WtAH6Address hold time10–ns–
tAW6Address setup time0–ns
E, CStCYCWrite cycle130–ns–
tCYC2Read cycle250–ns
tCCLWControl pulse LOW width (write)90–ns
tCCLRControl pulse LOW width (read)70–ns
tCCHWControl pulse HIGH width (write)30–ns
tCCHRControl pulse HIGH width (read)170–ns
tCW6CS–E time30–ns
D0 to D7tDS6Data setup time10–ns–
tDH6Data hold time20–ns
tACC6Read access time–170nsCL=10 to 100pF
tOH6Output disable time560ns
* Rise and fall time of input signal (tr, tf) must be 15 ns maximum.
* All timings must be specified using 30% and 70% of VDD–VSS as the reference.
* tCCHW and tCCHR are specified by the duration during which CS is LOW and E is HIGH.
* A0 and R/W timings are specified by the duration during which CS is LOW and E is HIGH.
Rev. 1.0EPSON49
S1D15G00 Series
Ta =–40 to +85°C, VDD=2.6 to 3.6V, VDDI=1.7 to 2.6V
tCCLRControl pulse LOW width (read)70–ns
tCCHWControl pulse HIGH width (write)30–ns
tCCHRControl pulse HIGH width (read)200–ns
tCW6CS–E time30–ns
D0 to D7tDS6Data setup time10–ns–
tDH6Data hold time20–ns
tACC6Read access time–200nsCL=10 to 100pF
tOH6Output disable time560ns
* Rise and fall time of input signal (tr, tf) must be 15 ns maximum.
* All timings must be specified using 30% and 70% of VDD–VSS as the reference.
* tCCHW and tCCHR are specified by the duration during which CS is LOW and E is HIGH.
* A0 and R/W timings are specified by the duration during which CS is LOW and E is HIGH.
Measuring conditions
and others
50EPSONRev. 1.0
* Reset timing
tRW
RES
tRT
Reset in operationNormal operationInternal control
Ta =–40 to +85°C, VDD=2.6 to 3.6V, VDDI=1.7 to VDD
SignalSymbolParameterMin.Max.Unit
REStRWReset pulse width350–ns
tRTReset cancel350–ns
Rise and fall time of input signal (tr, tf) must be 15 ns maximum.
All timings must be specified using 20% and 80% of VDD–VSS as the reference.
S1D15G00 Series
Measuring conditions
and others
Rev. 1.0EPSON51
S1D15G00 Series
* Serial input characteristics
CS
A0
SCL
t
t
CSS
t
SAS
t
SCYC
t
SLW
f
t
SDS
t
t
SAH
SDH
t
SHW
t
CSH
t
r
SI
Ta =–40 to +85°C, VDD=2.6 to 3.6V, VDDI=1.7 to VDD
SignalSymbolParameterMin.Max.Unit
Measuring conditions
CStCSSCS setup time10–ns*1, *2
tCSHCS hold time30–ns
A0tSASAddress setup time90–ns
*3tSAHAddress hold time20–ns
SCLtSCYCClock cycle50–ns
tSLWLOW width15–ns
tSHWHIGH width15–ns
SItSDSData setup time10–ns
tSDHData hold time10–ns
* 1: Rise and fall time of every input signal (tr, tf) must be 15 ns maximum.
* 2: All timings must be specified using 30% and 70% of VDDI as the reference.
* 3: tSAS and tSAH are applicable to the 8-bit serial interface alone.
and others
52EPSONRev. 1.0
S1D15G00 Series
12.MPU INTERFACES (EXAMPLES FOR YOUR REFERENCE)
S1D15G00 series can be directly connected to 80 series and 68 series MPU. Using a serial interface allows you to
operate S1D15G00 series with fewer signal lines. In addition to interfaces (1) to (3) given below, using IF1 to IF3 pins
enables to employ the 16-bit interface and 9-bit serial interface.
When initialization with RES is complete, make sure that input pins of S1D15G00 series are correctly controlled.
(1) 80 series MPU – 8-bit interface
DD
V
V
CC
A0
A0
V
DD
A1 to A7
IORQ
MPU
D0 to D7
RD
WR
RES
GNDV
(2) 68 series MPU – 8-bit interface
VCC
A0
A1 to A15
VMA
MPU
D0 to D7
E
R/W
RES
GND
Decoder
RESET
Decoder
RESET
CS
D0 to D7
RD
WR
RES
A0
CS
D0 to D7
E
R/W
RES
VSS
S1D15G00
SS
VDD
S1D15G00
IF1
IF2
IF3
IF1
IF2
IF3
V
SS
DD
V
V
SS
(3) 8-bit serial interface
V
DD
V
CC
MPU
GND
A0 to A7
Port1
Port2
RES
Decoder
RESET
A0A0
CS
SI
SCL
RES
S1D15G00
V
SS
V
DD
IF1
IF2
IF3
SS
V
Rev. 1.0EPSON53
S1D15G00 Series
12.1 Software Setup Examples
12.1.1 When Power is Turned On
Input power (VDDI, VDD).
Be sure to apply POWER-ON RESET (RES = LOW)
<Display Setting> <<State after resetting>>
Display control (DISCTL)
Setting clock dividing ratio and F1/F2 drive selection: 2 dividing, 8 h
Duty setting:1/4
Setting reverse rotation number of line:11h reverse rotations
Common scan direction (COMSCN)
Setting scan direction:COM1 -> COM80, COM80 -> COM160
Oscillation ON (OSCON)Oscillation OFF
Sleep-out (SLIPOUT)Sleep-in
<Power Supply Setting><<State after resetting>>
Electronic volume control (VOLCTR)
Setting volume value a :0
Setting built-in resistance value :0 (3.95)
Temperature gradient set (TMPGRD)
Setting mean temperature gradient :0 (-0.05%/°C)
Power control (PWRCTR)
Setting operation of power supply circuit:All OFF
<Display Setting 2> <<State after resetting>>
Normal rotation of display (DISNOR)/Inversion of display (DISINV):
Partial-in (PTLIN)/Partial-out (PTLOUT)Partial-out
Setting fix area:0
Area scroll set (ASSET)
Setting area scroll region:0
Setting area scroll type:Full-screen scroll
Scroll start set (SCSTART)
Setting scroll start address: 0
<Display Setting 3><<State after resetting>>
Data control (DATCTL)
Setting normal rotation/inversion of page address:Normal rotation
Setting normal rotation/inversion of column address: Normal rotation
Setting direction of address scanner:Column direction
Setting RGB arrangement:RGB
Setting gradation:8 gradations
256-color position set (RGBSET8)
Setting color position at 256-colorAll 0
54EPSONRev. 1.0
S1D15G00 Series
<RAM Setting><<State after resetting>>
Page address set (PASET)
Setting start page address:0
Setting end page address:0
Column address set (CASET)
Setting start column address:0
Setting end column address:0
<RAM Write><<State after resetting>>
Memory write command (RAMWR)
Writing displayed data:Repeat as many as the number needed and exit by
entering other command.
<Waiting (approximately 100ms)>
Wait until the power supply voltage has stabilized.
Enter the power supply control command first, then wait at least
100ms before entering the display ON command when the built-in
power supply circuit operates.
If you do not wait, an unwanted display may appear on the
liquid crystal panel.
Display ON (DISON):Display OFF
*1: When the IC is in Sleep In state, the liquid crystal drive power supply and the boosting power output and GND pin
are jumpered, therefore, the Sleep Out command must be entered to cancel the Sleep state prior to turning on the
built-in circuit.
(Note) If changes are unnecessary after resetting, command input is unnecessary.
Rev. 1.0EPSON55
S1D15G00 Series
12.2.2 Command Input Procedure During Power Off
•When power-on reset is not used
<< IC status>>
Display off (DISOFF): display is turned off, and all of the common and segment pins become VC potential.
Liquid crystal drive power supply circuit off (PWRCTR): built-in power supply circuit stops.
Oscillation off (OSCOFF): built-in oscillation circuit stops and all the circuits inside the IC also stop.
Sleep In (SLPIN) *2
Stop the power supply (VDDI, VDD).
*2: In order to discharge the capacitor connected to the liquid crystal drive power supply circuit, execute the Sleep In
command to put the IC in Sleep state prior to stopping the power supply. Stop VDDI and VDD when the output of
the liquid crystal drive power supply circuit has dropped sufficiently.
•When power-on reset is used
Turn on the power-on reset (RES = LOW) *3
Stop the power supply (VDDI, VDD).
*3: Stop VDDI and VDD when the output of the liquid crystal drive power supply circuit has dropped sufficiently.
(Note)
This IC is the logic circuit of the VDD-GND and VDDI-GND power supplies, and it controls the liquid crystal output
driver. If the VDDI-GND and VDD-GND power supplies are stopped with residual voltage in the liquid crystal drive
power supply circuit, the liquid crystal output driver (COM, SEG) may output uncontrolled voltage. Stop VDDI and
VDD when the output of the liquid crystal drive power supply circuit has dropped sufficiently.
12.2.3 Sleep state
This IC goes into Sleep state when the Sleep In command and several other commands are executed. When in the Sleep
state, IC power consumption will be kept to a minimum. Also, internal status including the display RAM will be
maintained, the Sleep Out and several commands will resume the display state.
•Setting the Sleep state
<< IC status>>
11
1
11
Display off (DISOFF): display is turned off, and all the common segment and pins become VC potential.
22
2
22
Liquid crystal drive power supply circuit off (PWRCTR): built-in power supply circuit stops.
33
3
33
Oscillation off (OSCOFF): built-in oscillation circuit stops and all the circuits inside the IC also stop.
Sleep In (SLPIN): commands other than 1 to 3 and display RAM content are maintained. Commands can be entered.
•Releasing the Sleep state
<<IC status>>
Sleep Out (SLPOUT)
Oscillation on (OSCON): built-in power supply circuit operates and liquid crystal drive potential is supplied.
Wait (approx. 100ms): wait until liquid crystal drive power supply boots and stabilizes. Wait until the power supply
voltage stabilizes.
Display on (DISON): display comes on and the display RAM content is output.
56EPSONRev. 1.0
S1D15G00 Series
12.2.4 Refresh Sequence
Refreshing of the state setup is recommended by reentering the command parameters and the display data in order to
recover from improper IC operations due to such reasons as noise.
Reconfigure the following commands and parameters.
Common scan direction (COMSCN)
Oscillation on (OSCON)
Sleep Out (SLPOUT)
Electronic volume control (VOLCTR)
Temperature gradient (TMPGRD)
Power supply control (PWRCTR)
Normal (DISNOR)/Inverted display (DISINV)
Partial in (PTLIN)/Partial out (PTLOUT)
Area scroll set (ASCSET)
Scroll start set (SCSTART)
Data control (DATCTL)
256-color position set (RGBSET8)
NOP instruction (NOP) *1
Page address set (PASET)
Column address set (CASET)
Memory write command (RAMWR): display data write
Display on (DISON)
*1: IC shipment inspection test state can be escaped with NOP instruction. Add this to the refresh sequence.
If display control (DISCTL) is reconfigured during display, noise may occur on the display, so omit this from the refresh
sequence. Reconfigure with the display off.
Rev. 1.0EPSON57
S1D15G00 Series
13. PERIPHERAL CONNECTION EXAMPLES
13.1 When EEPROM is used
In the following example, the S1D15G00D00B100 chip is used and the following parameters are set.
Power voltages: VDDI=1.8 V, VDD=2.7 V
Interface: 8-bit parallel interface
Primary boosting: 3 times
Clock: The built-in oscillator circuit is used.
V2 voltages: Set by the peripheral EEPROM
Capacitors: A bypass capacitor is used between VDD and GND pins. A voltage regulator capacitor is used between GND
and each of V2, V1, VC and MV1 pins.
Connect them by observing the current consumption and voltage waveforms.
S1D15G00D00B100
Connected to V
Connected to V
Connected to V
Connected to V
Connected to MV
Connected to MV
Signals to/from
S1F65170
Signals from MPU
Connected to MV
Connected to MV
3R
2R
1R
CR
1R
3R
1.8V
D0 to D7
Connected to V
Connected to V
Connected to V
Connected to V
RES
3L
1L
CL
1L
2L
3L
2.7V
CS
A0
RD
WR
V
3L
V
2L
V
1L
V
CL
V
CLSL
MV
1L
MV
3L
+
TESTA
++++
+
TESTB
TESTC
TESTD
TESTE
TESTF
TESTG
CAP2+
CAP2–
CAP1+
CAP1–
GND2
GND3
GND
V
DD3
V
DD4
V
DD
V
DDI
FR
YSCL
F1
F2
DOFF
CA
SYNC
SLP
SDA
RESET
CLOCK
TEST1
GND
V
DDI
CL
CLS
GND
DDI
V
CS
A0
GND
DDI
V
SCL
S1
GND
DDI
V
D0 to D7
GND
DDI
V
D8 to D15
GND
DDI
V
RD
WR
GND
V
DDI
IF1
IF2
IF3
GND
DDI
V
RES
TESTH
M/S
V
DDI
GND
GND4
DD
V
V
DD5
V
DD2
CAP4+
CAP4–
CAP5+
CAP5–
3R
MV
MV
1R
V
CLSR/VR
V
CR
V
1R
V
2R
V
3R
COM160
·
·
·
COM81
SEG1
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
SEG396
COM80
·
·
·
COM1
LCD Panel
132 RGB × 160 dots
+
+
58EPSONRev. 1.0
S1D15G00 Series
13.2 When peripheral split resistor is used
In the following example, the S1D15G00D01B100 chip is used and the following parameters are set.
Power voltages: VDDI=1.8 V, VDD=2.7 V
Interface: 8-bit parallel interface
Primary boosting: 3 times
Clock: The built-in oscillator circuit is used.
V2 voltages: Set by external split resistors
Capacitors: A bypass capacitor is used between VDD and GND pins. A voltage regulator capacitor is used between GND
and each of V2, V1, VC and MV1 pins.
Connect them by observing the current consumption and voltage waveforms.
S1D15G00D01B100
Connected to V
Connected to V
Connected to V
Connected to V
Connected to MV
Connected to MV
Signals from MPU
Connected to MV
Connected to MV
Connected to V
Connected to V
Connected to V
Connected to V
1.8V
3R
2R
1R
CR
1R
3R
3L
1L
CL
1L
2L
3L
D0 to D7
RD
WR
RES
2.7V
CS
A0
V
3L
V
2L
V
1L
V
CL
V
CLSL
MV
1L
MV
3L
+
TESTA
++++
+
TESTB
TESTC
TESTD
TESTE
TESTF
TESTG
CAP2+
CAP2–
CAP1+
CAP1–
GND2
GND3
GND
V
DD3
V
DD4
V
DD
V
DDI
FR
YSCL
F1
F2
DOFF
CA
SYNC
SLP
SDA
RESET
CLOCK
TEST1
GND
V
DDI
CL
CLS
GND
V
DDI
CS
A0
GND
DDI
V
SCL
S1
GND
DDI
V
D0 to D7
GND
DDI
V
D8 to D15
GND
DDI
V
RD
WR
GND
V
DDI
IF1
IF2
IF3
GND
V
DDI
RES
TESTH
M/S
V
DDI
GND
GND4
V
DD
V
DD5
V
DD2
CAP4+
CAP4–
CAP5+
CAP5–
MV
3R
MV
1R
V
CLSR/VR
V
CR
V
1R
V
2R
V
3R
COM160
·
·
·
COM81
SEG1
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
·
SEG396
COM80
·
·
·
COM1
LCD Panel
132 RGB ´ 160 dots
+
+
Rev. 1.0EPSON59
S1D15G00 Series
V
DD
GNDVDDGND
SDA
SCK
XRST
SDA
CLOCK
RESET
S1D15G00D00B100
S1F65170M0A00
14. EEPROM INTERFACE
The S1D15G00D00*100 and S1D15G00D05*100
series chips provide the Write and Read functions to
write the Electronic Control value and built-in resistance
ratio into and read them from the peripheral EEPROM
(S1F65170). Using the Write and Read functions, you
can store these values appropriate to each LCP panel.
14.1 Conditions when EEPROM read/write
is performed
1 The built-in oscillator circuit is already operating.
2 The CL division by 2 and 160 display lines have
been set by the Display Control command.
14.2 EEPROM writing instructions
1. Issue the VOLCTR command to set the appropriate
Electronic Control value and built-in resistance
ratio.
2. Issue the EPCTIN command to select the Control
EEPROM mode (for data writing).
3. Issue the EPMWR command to write data into the
EEPROM.
4. Issue the EPCTOUT command to cancel the
EEPROM Control mode.
Notes: As the EPCTIN, EPCWR and EPCRD
commands require the following processing
times, use a software timer or insert a process
to loop the operation by monitoring the status
read value of D2 (Access to EEPROM). If
these times are insufficient, the Read or Write
operation may fail.
5
sec
1 EPCTIN
()
4fosc/
2 EPCWR
10
sec
()
320fosc/
3 EPCRD
10
sec
()
4fosc/
14.4 Connection example
S1D15G00 and S1F65170 connection example.
VDD for both chips is connected to the same potential.
14.3 EEPROM data reading instructions
1. Issue the EPCTIN command to select the EEPROM
Control mode (for data reading).
2. Issue the EPMRD command to read data from the
EEPROM.
3. Issue the EPCTOUT command to cancel the
EEPROM Control mode and updates the Electronic
Control value and built-in resistance ratio using the
read data.
Miscellaneous:
The MPU can read the Electronic Control value and
built-in resistance ratio by issuing a combination of
EPSRRD1 or EPSRRD2 and STREAD (Status Read)
commands.
60EPSONRev. 1.0
S1D15G00 Series
15. CAUTIONS
Concerning this development specification, users are
advised to pay attention to the following precautions.
1. This development specification is subject to
modifications without previous notice.
2. This development specification does not grant the
industrial property right or any other right, or
exercising such rights.
Application examples contained in this document are
intended only to help users to understand the product
better. SEIKO EPSON shall not be liable to any circuitrelated problem resulted from using these examples.
Users are requested to pay attention to the following
points when using S1D15G00 series.
Precautions on Light
Characteristics of semiconductor devices can be changed
when exposed to light as described in the operational
principles of solar batteries. Exposing this IC to light,
therefore, can potentially lead to its malfunctioning.
1 Care must be exercised in designing the operation
system and mounting the IC so that it may not be
exposed light during operation
2 Care must be exercised in designing the inspection
process and handling the IC so that it may not be
exposed to light during the process.
3 The IC must be shielded from light in the front, back
and side faces.
Precautions on External Noises
1 Internal state of S1D15G00 can be changed when
exposed to adversely affecting external factors such
as excessive noises though it can maintain the
command-instructed operational status and display
data. Thus, you must make sure when mounting the
IC and designing the operation system that measures
for eliminating noises or measures protecting the IC
from noises are prepared.
2 In order to be prepared against sudden noise, it is
recommended to prepare the software to perform
periodic refreshing of operational state (re-setting
of commands and re-transfer of display data).
Precautions on Mounting COG
When mounting COG, you must take into consideration
of resistance component generated across the driver
chip and externally connected parts (capacitor and
resistor) resulting from ITO wiring. This resistance
component can interfere with high-speed operation of
liquid crystal display or MPU.
When mounting COG, you must take into consideration
of the following three points in the module design:
1. To minimize resistance between the driver chip pin
to the external part.
2. To minimize resistance at the power terminal of the
driver chip.
3. To develop sample COG modules with varying
degrees of ITO sheet resistance in order to select
one with the sheet resistance allowing sufficient
operational margins.
Rev. 1.0EPSON61
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