Epson RX-8564LC User Manual

RM0403-3-E01

Application Manua

Real Time Clock Module

RX-8564LC

Model Product Number RX-8564LC Q418564C0xxxx00

NOTICE

• The material is subject to change without notice.

• Any part of this material may not be reproduced or duplicated in any form or any means without the written permission of EPSON TOYOCOM.

• The information, applied circuit, program, usage etc., written in this material is just for reference.

EPSON TOYOCOM does not assume any liability for the occurrence of infringing any patent or copyright of a third party. This material does not authorize the licensing for any patent or intellectual copyrights.

• Any product described in this material may contain technology or the subject relating to strategic

products under the control of the Foreign Exchange and Foreign Trade Law of Japan and may require an export licence from the Ministry of International Trade and industry or other approval from another government agency.

• These products are intended for general use in electronic equipment. When using them in specific

applications that require extremely high reliability such as applications stated below, it is required to obtain the permission from EPSON TOYOCOM in advance. / Space equipment (artificial satellites, rockets, etc) / Transportation vehicles and related (automobiles, aircraft, trains, vessels, etc) / Medical instruments to sustain life / Submarine transmitters / Power stations and related / Fire work equipment and security equipment / traffic control equipment / and others requiring equivalent reliability.

• In this manual for EPSON TOYOCOM, product code and marking will still remain as previously

identified prior to the merger.Due to the on going strategy of gradual unification of part numbers, please review product code and marking as they will change during the course of the coming months. We apologize for the inconvenience, but we will eventually have a unified part numbering system for Epson Toyocom which will be user friendly.

RX − 8564 LC

CONTENTS

1. Overview

2. Block diagram

3. Terminal description

3.1. Terminal connections

3.2. Pin Functions

...................................................................................................................1

.........................................................................................................1

.............................................................................................2

..............................................................................................................2

.............................................................................................................................2

4. External Dimensions / Marking Layout

4.1. External Dimensions

4.2. Marking Layout

5. Absolute Maximum Ratings

6. Recommended operating conditions

7. Frequency Characteristics

8. Electrical Characteristics

8.1. DC characteristics

8.2. AC electrical characteristics

9. Reference data

......................................................................................................7

................................................................................................................3

..........................................................................................................................3

..............................................................................4

.............................................................4

.................................................................................4

....................................................................................5

....................................................................................................................5

..................................................................................................6

..........................................................3

10. External connection example

11. Application notes

................................................................................................9

.........................................................................8

12. Overview of Functions and Description of Registers

12.1. Overview of Functions

12.2. Register table

........................................................................................................................11

13. Description of Functions

13.1. Description of register s

13.1.1. Control register 1 ( Reg − 00 [h] ) ...................................................................................12

13.1.2. Control register 2 ( Reg − 01 [h] ) ...................................................................................13

13.1.3. Clock counter ( Reg − 02 [h] to 04 [h] )...........................................................................14

13.1.4. Calendar counter ( Reg − 05 [h] , 07 [h] , 08 [h] )............................................................15

13.1.5. Day counter ( Reg − 6[h] ) .............................................................................................15

13.1.6. Alarm registers ( Reg − 09 [h] to 0C [h] ) ........................................................................16

13.1.7. Timer setting register ( Reg − 0E [h] )............................................................................16

13.1.8. Down counter for fixed-cycle timer ( Reg − 0F [h] ).........................................................16

13.1.9. CLKOUT output register (Reg - 0D [h]) ..........................................................................17

13.2. Fixed-cycle Timer Interrupt Function

13.3. Alarm Interrupt Funct ion

13.4. /INT "L" Inter r upt Output When Interrupt Function Operat es

13.5. Flow Charts

13.6. Reading/Writing Data via the I2C Bus Interface

............................................................................................................................29

........................................................................................................10

................................................................................12

.......................................................................................................12

.............................................................................18

....................................................................................................25

.........................................................32

..........................10

.................................28

RX − 8564 LC

Low power consumption / Small size thin model package I2C-Bus Interface Real Time Clock Module

RX −−−− 8564 LC

• Built in frequency adjusted 32.768 kHz crystal unit.

• Interface type : 400 kHz two-wire I2C-bus interface

• Wide operating voltage range : 1.8 V to 5.5 V

• Wide timekeeper voltage range : 1.0 V to 5.5 V ( at Ta = +25 °C )

• Low backup current : 275 nA

• 32.768-kHz clock frequency output

: C-MOS output with output control

• Real-time clock function Clock/calendar function, auto leap year correction function, alarm interrupt function, etc.

1. Overview

This module is an I2C bus interface real-time clock that has bult-in 32.768-kHz crystal oscillator. In addition to a calendar (year, month, day, weekday, hour, minute, second) function and a clock counter function, this module's real-time clock functions include an alarm function and a fixed-cycle timer interrupt function. The devices in this module are fabricated via a C-MOS process for low current consumption, which enables long-term battery back-up. All of these many functions are implemented in a compact package, which makes it suitable for various kinds of mobile telephones, handy terminals and other small electronic devices.

2. Block diagram

( Typ. )

/ 3 V

The I2C-BUS is a trademark of PHILIPS ELECTRONICS N.V.

CLKOUT CLKOE

/ INT

SCL SDA

32.768 kHz CRYSTAL

OUTPUT CONTROL

C-BUS

INTERFACE

OSC

POR

Voltage Detector

DIVIDER

CONTROL LOGIC

ADDRESS REGISTER

Control 1 Control 2

Seconds

Minutes

Hours

Days

Weekdays

Month / Century

Years

Minutes Alarm

Hour Alarm

Day Alarm

Weekday Alarm

CLKOUT frequency

Timer Control

Timer

Page − 1

ETM12E-01

RX − 8564 LC

3. Terminal description

3.1. Terminal connections

N.C.

5. /INT 8. SCL

# 1

# 6

−

8564 LC

# 12

# 7

12.

11. CLKOE

10. VDD

9. CLKOUT

N.C.

6. GND

VSOJ

−

12pin

7. SDA

3.2. Pin Functions

Signal

name

SCL Input This is the serial clock input pin for I2C Bus communications.

SDA Bi-Directional

CLKOUT Output

CLKOE Input

I/O Function

This pin's signal is used for input and output of address, data, and ACK bits, synchronized with the serial clock used for I2C communications.

Since the SDA pin is an N-ch open drain pin during output, be sure to connect a suitable pull-up resistance relative to the signal line capacity.

The CLKOUT pin is a clock output pin (C-MOS output) with the output control function. The CLKOE pin can be used in combination with the FE bit, FD1 bit, and FD0 bit to control the output mode of the CLKOUT output pin.

The CLKOE input pin can be used in combination with the FE bit, FD1 bit, and FD0 bit to select the frequency output from the CLKOUT output pin (32.768 kHz, 1024 Hz, 32 Hz, or 1 Hz) or to stop output. When output is stopped, the CLKOUT output pin is at low level ( = " L " ).

CLKOE pin

input

" H "

" L "

During the initial power-on (when power is applied from 0 V), if the CLKOE input pin is at high level ( = " H " ), the power-on reset function selects 32.768 kHz as the frequency.

CLKOUT pin

bit

1 Output 0 1 0

OFF OFF OFF

output

( C-MOS ) ( " L " ) ( " L " ) ( " L " )

/INT Output

VDD

GND

N.C.

−

This pin outputs alarm signals, fixed timer interrupt signals, and other interrupt signals at low level ( = " L " ). This pin is an open drain pin.

This pin connects to the plus side of the power. This pin connects to the minus side (ground) of the power. This pin is not connected internally. Be sure to connect using OPEN, or GND or VDD.

Note : Be sure to connect a bypass capacitor rated at least 0.1 µF between VDD and GND.

Page − 2

ETM12E-01

RX − 8564 LC

4. External Dimensions / Marking Layout

4.1. External Dimensions

RX − 8564 LC

( VSOJ − 12pin )

• External dimensions • Recommended soldering pattern

# 12 # 7

# 1 # 6

0.2

3.6

0.5 0.22

2.4

0.08 M

Min. 0

± 0.1

1.1

0.08

2.5

± 0.2

( 0.4 )

2.8

0.8 1.6 0.8

3.2

2.77

0.270.5

Unit : mm

2.4

4.2. Marking Layout

RX − 8564 LC

( VSOJ − 12pin )

Logo

#1 Pin Mark

Type

E 8564

A123B

Production lot

∗ Contents displayed indicate the general markings and display, but are not the standards f or the fonts, sizes and positioning.

Page − 3

ETM12E-01

RX − 8564 LC

5. Absolute Maximum Ratings

Parameter Symbol Condition Rating Unit

GND = 0 V

Supply Voltage VDD Between VDD and GND Supply Voltage IDD VDD pin Input Voltage VI Input pin Output Voltage VO /INT pin DC Input Current II DC Output Current IO

Storage Temperature Range

STG

Stored bare product after

unpacking

6. Recommended operating conditions

Item Symbol Condition Rating Unit

Operating supply voltage VDD

Clock supply voltage VDD

Operating temperature T

OPR

No condensation

I2C-BUS access

at 400 kHz

to +6.5 V

−0.5 to 50 mA

−50 GND−0.5 GND−0.5

to VDD+0.5 V to VDD+0.5 V to 10 mA

−10

to 10 mA

−10

to +125

−55

1.8 to 5.5 V

(∗1)

LOW

to 5.5 V to +85

−40

°C

GND = 0 V

°C

∗1)

See " 8.1. DC Electrical Characteristics ".

7. Frequency Characteristics

* Unless otherwise specified, GND = 0 V

Item Symbol Comments Min. Typ. Max. Unit

Output frequency fo 32.768 Frequency precision

∆ f / f

Frequency voltage

f / V characteristics Frequency temperature

Top characteristics

Oscillation startup-up time

STA

Aging fa

∗1 )

This difference is 1 minute by 1 month. ( excluding offset )

∗2 )

Includes variation in frequency during two rounds of reflow processing. ∗ Reflow processing is performed under conditions specified by Seiko Epson Corporation.

(See the relevant specifications.)

Ta = +25 °C VDD = 3.0 V

Ta = +25 °C VDD = 1.8 V to 5.5 V

Ta = −20 °C to +70 °C, VDD = 3.0 V ; Reference at +25 °C

Ta = +25 °C VDD = 1.8 V Ta = −40 °C to +85 °C, VDD = 3.0 V

Ta = +25 °C , VDD = 3.0 V ; first year −5

−120

5 ± 23

± 2

+10

3.0 s

, Ta = +25 °C , VDD = 3.0 V

( Typ. )

(∗1) (∗2)

( Max. )

kHz

× 10−6

× 10−6 / V

× 10−6

/ year

Page − 4

ETM12E-01

RX − 8564 LC

8. Electrical Characteristics

8.1. DC characteristics

Item Symbol Condition Min. Typ. Max. Unit

* Unless otherwise specified, GND = 0 V , VDD = 1.8 V to 5.5 V

, Ta = −40 °C to +85 °C

Current consumption

IDD

∗ interface active

Current consumption

∗ interface inactive ( f

SCL

= 0 Hz )

IDD

∗ CLKOUT = disabled ( CLKOE = GND )

Current consumption

∗ interface inactive ( f

SCL

= 0 Hz )

DD32K

∗ CLKOUT = 32 kHz output ( LOAD is 0 pF )

"L" input voltage VIL

"H" input voltage VIH

"L" output current

( SDA )

SCL

= 400 kHz

SCL

= 100 kHz

SCL

= 0 Hz, VDD = 5.0 V

SCL

= 0 Hz, VDD = 3.0 V

SCL

= 0 Hz, VDD = 2.0 V

SCL

= 0 Hz, VDD = 5.0 V

SCL

= 0 Hz, VDD = 3.0 V

SCL

= 0 Hz, VDD = 2.0 V

GND − 0.5

0.7 × V

VOL = 0.4 V, VDD = 5 V −3

800

200

µA

330 800 nA

275 700 nA

250 650 nA

2.5 3.4

1.5 2.2

1.1 1.6

0.3 × V

VDD + 0.5

µA

"L" output current

"H" output current

( /INT )

( CLKOUT )

Leakage current ILO

Low voltage detection V

IOL

IOH

LOW

VOL = 0.4 V, VDD = 5 V −1

VOH = 4.6 V, VDD = 5 V

VO = VDD or GND −1

Ta = +25 °C

Ta = −20 °C to +70 °C

Ta = −40 °C to +85 °C

1 mA

µA

0.9 1.0 V

0.9 1.2 V

0.9 1.3 V

Page − 5

ETM12E-01

RX − 8564 LC

8.2. AC electrical characteristics

Item Symbol Condition Min. Typ. Max. Unit

* Unless otherwise specified, GND = 0 V , VDD = 1.8 V to 5.5 V

, Ta = −40 °C to +85 °C

SCL clock frequency f Start condition set-up time t Start condition hold time t Data set-up time t Data hold time t Stop condition set-up time t

Bus free time between a STOP and START condition

SCL "L" time t SCL "H" time t

SCL

400 kHz

SU; STA

0.6

HD; STA

0.6

SU; DAT

100 ns

HD; DAT

0 ns

SU; STO

0.6

BUF

1.3

LOW

1.3

HIGH

0.6 SCL and SDA rise time tr 0.3 SCL and SDA fall time tf 0.3 Tolerance spike time on bus tSP 50 ns

Timing chart

µs µs

µs µs µs µs µs µs

Protocol

STAR T

CONDITION

(S)

SU ; STA

LOW tHIGH

BIT 7

MSB (A7)

BIT 6

1 / f

SCL

(A6)

BIT 0

LSB

(R/W)

ACK

(A)

STOP

CONDITION

(P)

START

CONDITION

(S)

SU ; ST

SCL

(S)

(P)

(S)

BUF

(A)

HD ; STA

SU ; DAT

HD ; DAT

SU ; STO

HD ; STA

Note : I2C access time between a START and a START condition or between a START and a STOP condition to this

device must be less than one second.

Page − 6

ETM12E-01

RX − 8564 LC

9. Reference data

(1) Example of frequency and temperature characteristics

-6

× 10

∆

-50

-100

Frequency

-150

-50 0 50 100

θT = +25 °C Typ.

α = -0.035 × 10

Temperature [°C]

-6

Typ.

[ Fin ding the fr equency st ability ]

Freq u e ncy and temperature characteristics c an be

approximated using the following equations.

∆fT = α ( θT − θX ) 2

∆f

: Frequency deviation in any temper ature

α [ 1 / °

( −0.035 ± 0.005 ) × 10

: Coeff icient of sec o ndary temper a ture

]

: Ultimate temperature

[ °C ]

: Any temperature

[ °C ]

−

+25

(

2. To determine overall clock accuracy, add the frequency precision an d voltage ch aracteri stics.

f/f = ∆f/fo + ∆f

∆

∆f/f : Cl o c k accuracy (st a ble frequency)

f/fo : Frequency pr ecision

∆

: Frequency deviation in any tem perature.

∆

: Frequency deviation in any voltage.

∆

+ ∆

in any temperature and voltage.

3. Ho w to find the date differenc e

Date Difference = ∆f/f × 86400(Sec)

For example: ∆f/f = 11.574

∗

approximately 1 second/day.

-6

is an error of

/ °C2

± 5 °C )

(2) Current and voltage consumption characteristics

(2-1) Current consumption when non-accessed (i)

when CLKOUT=OFF

1.0

0.5

Current consumption [

Condition :

SCL

=0 Hz, Ta=+25 °C, CLKOUT=OFF

34 5

Supply Voltage VDD[V]

IDD[µA]

(2-2) Current consumption when non-accessed (ii)

when CLKOUT=32.768kHz

Condition :

SCL

=0 Hz, Ta=+25 °C, CLKOUT=32.768 kHz

Current consumpt ion [

Supply Voltage VDD[V]

CL=30 pF

32K[µA]

CL=0 pF

345

Page − 7

ETM12E-01

RX − 8564 LC

10. External connection example

VDD

8564

SLAVE ADRS = 1010001

GND

SCL

SDA

SCL

I C-BUS

Master

SDA

Pull up Registor

R =

BUS

I C-BUS

device

GND

SCL

SDA

Page − 8

ETM12E-01

RX − 8564 LC

11. Application notes

1) Notes on handling

This module uses a C-MOS IC to realize low power consumption. Carefully note the following caut ions when handling.

(1) St atic electricity

(2) Noise

(3) Voltage levels of input pins

(4) Handling of unused pins

2) Notes o n pa ckaging

(1) Soldering heat resistance.

(2) Packaging equipment

(3) Ultrasonic cleaning

(4) Mounting orientation (5) Leakage between pins

(6) Use of adhesive after packaging product

While this module has built-in circuitry designed to p rote ct it against elec trostatic discharge, the chip could s till be damage d by a large discharge of static electricity. Containers used for packing and transport should be constructed of conductive materials. In addition, only soldering irons, measurement circuits, and other such devices which do not leak high voltage should be used with this module, which should also be grounded when such devices are being used.

If a signal with excessive exte rnal noise is applied to the powe r supply or input pins, the de vice may malfunction or " latch up." In order to ensure stable operation, connect a filter capacitor (preferably ceramic) of greater that 0.1 µF as close as possible to the power supply pins (between VDD and GNDs). Also, avoid placing any device that generates high level of electronic noise near this module. * Do not connect signal lines to the shaded area in the figure shown in Fig. 1 and, if possible, em bed this area in a GND land.

When the input pins are at the mid-level, this will cause increased current consumption and a reduced noise margin, and can impair the functioning of the device. Therefore, try as much as possible to apply the voltage level close to VDD or GND.

Since the input impedance of the input pins is extremely high, operating the device with t hese pins in the open cir cuit stat e can lead to unstable voltage level and malfunctions due t o noise. Therefore, pull-up or pull-down resistors should be provided for all unuse d input pins.

If the temperature within the package exceeds +260 °C, the characteristics of the cryst al oscillator will be degraded and it may be damaged. The reflow conditions within our reflow profile is recommended. Therefore, always check the mounting temperature and time before mounting this device. Also, check again i f the mounting conditions are later changed. * See Fig. 2 profile for our evaluation of Soldering heat resistance for reference.

This product uses a molded pack age whose back contains glass. Therefore, it is possible for shocks during packaging to cause product breakage, depending on the packaging machinery and conditions. Please be sure to check that the load placed on products during packaging is as low as possible (low speeds during loading onto the substrate, low chuck forces, etc.) before using packaging equipment. Carry out the same checks when c hanging packaging conditions. The presence of foreign objects between this product and the packaging substrate may result in product breakage. Guard against introduction of foreign objects during packaging. Also, carry out measures to eliminate static electricity during packaging of and op erati ons with this product.

Depending on the usage conditions, there is a possibility that the crystal oscillator will be damaged by resonance during ultrasonic cleaning. Since the conditions under which ultrasonic cleaning is carried out (the type of cleaner, power level, time, state of the inside of the cleaning vessel, etc.) vary widely, this device is not warranted against damage during ultrasonic cleaning.

This device can be damaged if it is mounted in the wrong ori ent ati on. Always confirm the orientation of the device before mounting. Leakage between pins may occur if the power is turne d on w h ile the de vice has condensation or d irt on it. Make sure the de vice is d r y

and clean before supplying power to it. This product uses a molded pack age whose back contains glass.

Please check that use of the adhesive does not cause problems before adopting any adhesive as a measure to reinforce the packaging for your product.

Fig. 1 : Example GND Pattern

RX − 8564 LC

( VSOJ − 12 pin )

∗ The shaded part ( ) indicates where a GND pattern should be set without getting too close to a signal line

Fig. 2 : Reference profile for our evaluation of Soldering heat resistance.

Tem perature [ °C ]

+1 ∼ +5 °C/ s

Page − 9

+1 ∼ +5 °C / s

+170 °C +220

100 s

Pre-heating area

+260 °C Max.

35 s

Stable Melting area

−1 ∼ −5 °C / s

time [ s ]

ETM12E-01

+ 27 hidden pages