Epson QX10 Owner's Manual

TECHNICAL MANUAL

TROUBLESHOOTING

EPSON

08290002-0

TECHNICAL

MANUAL

TROUBLESHOOTING

QX~O

This Technical Manual provides technical information on the structure, maintenance, and repairs
the QX-10.
For

the

details
ation).
Major technical modifications, if made
Technical Manual should be revised accordingly. The. details
withOl,!t notice.
All the information given in the Manual concerns the QX-1

All rights reserved. No part

mitted,
out the prior written permission by

in

of

the operation, refer

of

this publication may be reproduced, stored

any form or by any means, electronic, mechanical, photocopying, recording

to

the Technical Manual

in

the future, will be notified through Service Bulletins, and the

EPSON

CORPORATION.

of

QX-1

of

0

to

others.

Copyright ©

0 (Principles

the Manual are subject

in

a retrieval system,

1983

by

EPSON CORPORATION

of

Hardware Oper-

to

or

or

otherwise,

change

trans-

with-

Nagano, Japan

of

CONTENTS

CHAPTER 1 GENERAL
CHAPTER 2
CHAPTER 3
CHAPTER 4 REPAIRS
CHAPTER 5 TROUBLESHOOTING

DiSASSEMBLY
ADJUSTMENT

AND

AND

REASSEMBLY

MAINTENANCE

CHAPTER

1

GENERAL

CONTENTS

1.1 Features.......................................... ................ ................................................. 1-1

1.2

Hardware

1.2.1 General ................................................................................................... 1-1

1.2.2

1.3

Specifications

1.3.1 External Dimensions and

1.3.2 Environmental Conditions ....................................................................

Configuration................................................................................ 1-1

Hardware ............................................................................................... 1-1

..................................................................................................

Weight

.........................................................

1-2
1-2
1-2

1.1

Features

The OX-1 0 is an all business computer system.
256

KB

maximum,
full-graphic
The standard configuration includes a programmable timer, Centronics-compatible
RS-232C interface, C-MOS RAM backed up
has five card slots
Optional cards available include character generators
er interface,

1.2

Hardware

1.2.1 General
The OX-1 0 is composed of three units:
The main system unit,
board,
stallation
The keyboard
be transmitted in any direction.
The standard

1.2.2

Hardware

CRT

color

power

of

optional cards.

two

floppy disk drivers

display

with

which

permit installation

CRT

interface, and pulse transformer interface.

configuration

the

heart

supply,

unit

monitor

two

5-1/4"

is connected

unit

is a

a resolution

of

floppy

to

12"

of

the

the

QX-10

disk

the main system

high resolution green

It

consists

of

double-sided, double-density,

640

by

400

by

battery, clock and calendar, and separate keyboard.

of

optional cards

main system unit,

system, includes the main

drives developed

unit

of a Z80A-compatible

dots.

as

required.

of

varying fonts, IEEE-488 interface, optical fib-

the

keyboard unit, and

by

Epson, and five slots

with

a curled cord

monitor

capable

5-1/4"

circuit

through

of

displaying

CPU,

a memory

disks, and a

printer

the

board, sub

which

interface,

monitor

permitting

signals may

bit

images.

of

12"

It

unit.

circuit

in-

Main system

CPU
Memory

Clock
Speaker
Interfaces

DMA
Interrupt levels
Counter/timer
FDD

Card slots
Monitor

Keyboard

.uPD780AC-1
RAM :
VIDEO RAM :
C-MOS RAM : 2

EPROM :
C-MOS real-time clock (backed up by battery)
Permanent magnet speaker
Printer interface (Centronics-compatible)

RS-232C communications interface
7 channels

15
6 channels
5-1/4"
320

KB x 2 drives

48

TPI, double sided & double density

FDD

(Z80A

x 2

compatible, 4 MHz)

256

KB

(maximum

128

KB

(maximum on

KB

(standard, backed up by battery)

2/4/8

K8

(for

IPL)

on

main board)
CRT

board)

5

1

2"

green

monitor

640 x 400
ASCII, HASCI

dots

1-1

1.3

Specifications

1.3.1 External

(1) External dimensions

(2)

1.3.2

Environmental

(1) Temperature .................... during operation

(2) Humidity ........................... during operation

(3) Resistance

(4) Resistance

Dimensions

Main system unit ca.
Green

monitor

Keyboard

Optional card
Weight:

unit

to

to

and

Weight

unit ca.

ca.

approx. 1 Skg

Conditions

storage

storage

shock ........ during operation

storage

vibration .... during operation

storage

(W)

50S

312

50S

(510)

2S0

(0)

x

340

x

340

x

224

x

80

(H)

x

103

x

270

48

x

:

5°C

to

:

-30°C

:

20 -80%
10 -90%

:
: max. 1
: max. 5

0.25

: max.
: max. 3

(mm)
(mm)
(mm)

(mm)

40°C

to

70°C

(no condensation)
(no condensation)

G,

1 msec

G,

1 msec

G,

5-50

Hz

G,

5-50Hz

MainSY~

Greeninitor

unit

Fig 1-1

Hardware

configuration

1-2

of

QX-10

Q10GMS

Board

U9h8

CRT

AC

IN

Q10PS

board

Fig

,uP0765

(Channel A)

MPD7210

(Channel

JLPD8255

1-2

Block diagram of main component

B)

~

FOO

(SO-321 )

Keyboard

RS-232C

Printer

(centronics type)

Open card

1-3

(A)

Q10S

SYM

board

This is a main control board including

CPU,

compatible

with

Z80A,

Z80A

family

LSI

and main memory.

Name

CPU

DMA

controller

Interrupt controller

Interval

timer

Serial controller

Printer controller

Real

time clock

Floppy

disk

controller

Model

.uPD780C

8237A

8259AC

8253C

7201C

8255AC

46818P

765AC

Q'ty

CPU

1

2

2

(4MHz) compatible

Provided
tor

Controls

with

and options.

the

total

interrupt priority
interrupt including PWD output keyboard inter­rupt.

2

Controls

the

boud rate
RS-232C.

1 Allocates channel a

RS-232C, and controls serial data transfer
CPU.

1

1

1

Provided
interface

Provided

Interface

with
with

with

with

an
printer

clock

FOO

Function

with

Z80A.

of

7 channels

of

to

the

8-bit

parallel port.

conformable

keyboard

for

of

total

clock

keyboard and B

Acts

to

and calendar functions.

(SO-321 )

FDD,

moni-

15

levels

and

to

with

as an

Centronix.

I/O selector

Main memory

P-ROM

C-MOS RAM

LS154

416/4164

2716/32/

1 Accesses each

low

order address (A2

Dynamic RAM is used.

8

Provided

32

1 Stores IPL programs.

64

449

1

Protects

an

NiCd battery.)

Table 1-1 Primary configuration

I/O

point

with

4 banks maximum.

the

data on

of

Q1

0 SYM

by decoding the

,...

A5)

of

CPU.

power

failure. (Backed up by

4-bit

1-4

Fig.

1-3

1 ,uPD780C

2

8237

3

8259AC

4

8253C

5

7201 C (Multi-protcol Serial Controller)

6

8255AC

7

46818P

8

765AC

9

LS 1 54

10

416/4164

11

2716/32/04

12

449

(Z80A

A (Programmable

compatible

DMA

CPU)

Controller)

(Programmable Interrupt Controller)

(Programmable Interval Timer)

(Programmable peripheral Interface)

(Real-time clock plus RAM)

(Programmable Floppy Disk Controller)

(I/O Selector)

(D-RAM)

(P-ROM

for

IPL)

(C-MOS RAM)

1-5

(B)

Q10

GMS

board

includes

graphic

display

controller

The board includes graphic display controller ,uPD7220 and V-RAM, and controls display
monitor.

of

the green

Name

Graphic display
controller

Video RAM

Character generator

7220

416/4164

2732/64

Table

Model

1-2

Q'ty

Primary configuration

1

A display controller
magnifying functions.

16

Dynamic RAM is used.

1

ROM

storing display

play unit.

of

Q1

0 GMS

Function

with

high speed

fonts

to

be sent

drawing

to

the

and

dis-

1-4

Fig.

1

7220

(Graphic Display Controller)
2 V-RAM
3

P-ROM (Character Generator)

(16/64 k bit

1-6

dynamic RAM)

(e)

Q10

PS

board
This is a
It

power

supply

accommodates

to

Specifications
(1)

Input voltage:

(2)

Frequency:
(3) Power cosumption:
(4)

Input serge current:
(5) Leak current:
(6)

Insulation strength:

(7)

Insultation

resistance~

(8) Output Voltage:

unit

power

for

the

OX-1

0 system and a

supplies

of 1 OOV

and

100V-10% -120V+10%
200V
50/60

channel

Hz

220V -10%

Approx.75W
30A

for

20

ms maximum

1 rnA maximum
1

OOV

channel Can

and case

200V

channel

Can

supply and case

10

M.Q

for

500V

switching

200V

levels by

withstand

for

withstand

DC

minimum.

regulator

switching

'"

240V + 10%

1 kV applied between

with

a flyback transformer.

jumper wire J

AC

1 minute.

1 .25 kV applied between AC

for

1 minute.

1.

power

power

supply

Output
voltage

+5
+12(C)
+12(F)
+12(L)

-12

Limits of output

voltage current

5.0

'"

5.1

V

,....

12.4

11.6

V

11.4 -12.6V
11 -13V

-11

--13V
Table

1-3

Standard

3.6A
O.9A

1.2A
a.45A
a.a2A

USE

logic circuit

green

monitor

floppy

disk

drive

keyboard, RS-232C

D-RAM, RS-232C

Fig.

1-5

1-7

(D) CRT

Fig.
The

flection.

display

1-6

CRT

unit

shows the standard green

is characterized by high resolution

monitor

unit

of

of

640 x 400

OX-1

O.

dots

and non-glare coating, preventing re-

1

CRT
2 Anode cap
3

Deflection yoke
4 Flyback transformer
5

CRT

drive unit

(DY)

(FBT)

(CDU)

1) Pin

Definition

Pin

No. Function

1 Video

2

3

4 Power supply + 12 V

5

6

7

8

(E)

Frame ground

(7) Ground (power, hor.)

(3)

Horizontal sync

(5) Ground (power, hor.)

Fig.

1-6

signal
Vertical synchronizing signal
Horizontal synchronizing signal

DC

Grounding (power supply, horizontal)

1-4

vertical)

(6) Ground (video, vert.)

(1) Video

(4)

+12

signal

VDC

Grounding (video
Grounding (power supply, horizontal)
Frame grounding

Table

Fig-

1-7

1-8

2)

Input

Conditions

(1) Video signal:

(2)

Video input impedance:

(3)

Horizontal driving signal:

.

(4)

Horizontal input impedance:

(5)

Vertical driving signal:

(6)

Vertical input impedance:

3)

Input

signal

timing

(a) Horizontal driving signal

19.3

kHz

--------

--

..

-----

0

Fig 1

8

300

a min.

TTL (positive)
l:

0 ­500amin.
TTL (positive)

l:

0 -

3.0

kamin.

0,8

0.8

40

V

V

pF

max.

H:

2.4 - 5.5 V .

H:2.4 -5.5V

~nt-----\((~

I I »

-;

t--

1.44)AS

51.84.uS

5.0V

4.0V

--OV

---In"'---_

Full Bright
Half Bright

Dark

Video signal

(b) Vertical driving signal

45.8

Hz

Video signal

(c)

Video signal

13.44.u

____

~Il~----

--l

I-

0.83 mS

1.09 mS

Fig. 1

__

Fig.

Fig.

38.40.u

=9

~({~------~rl~------

21.83 mS

20.74mS

1-10

Dot clock = 16.667 MHz

1-11

1-9

(El

Keyboard

of

The keyboard
These

two

Keyboard data transfer is
from the main

Data transfer is made
BPS.

QX-1 0 is available in ASCII type and HASCI type, according

types are almost the same in hardware.

CPU.

to

applications.

controlled by the

with

the main system unit in the start-stop turning system at the rate

CPU

,uPD8049 used as a keyboard controller separately

of

1200

Pin

Definition

Pin No.

1
2

3

4
5
6

7

8

Note: The direction

Signal Direction

OUT
OUT
OUT

IN

-

-

-

-

of

signal

is

as viewed from the

Fig

1-12

1 Keyboard controller (,uPD8049)

2 Key scan signal decoder (LS145)

Description

Q1

OSYM board

Table

1-5'

2

of

Signal

Received data

Clock

(1200

BPS)

+12

V

Transmitted data

Ground
Ground
Ground
Ground

3

Fig.

E 6

1-13

Pin

1-10

locations

(F)

Floppy

Double sided, double density type
below:
SO-321 produces an ultra

1)
In order

2)
to

two

Disk

Drive

SO-321

to

miniaturize the circuit board and get high reliability,

lSls.

thin

of

5-1/4"

structure

of

1/2 -1/3

floppy

disk drive SO-321 has the features

the

convertional models.

most

of

the control circuit is integrated

as

described

Fig.

1-14

1

Head pad

2

VCM

3 Drive
4

Main

motor
PCB

1-11

~

Specifications

1.

Memory

of

50-321

capacity
(1) Unformatted
(2)

Fo~matted

(1

6 sectors/track)

2. Recording density (side

1,

trk

39)

500 k byte
328 k byte

5876

BPI

(Double density recording)
(Double density recording)

(Double density recording)

3. Transmission speed

Track mean speed

4.

waiting

5. Access time

(1

)

Between tracks

(2)

Between tracks mavin g average

(3)

6.

7.

Settling

Motor

Motor

time

starting

speed

time

8. Track density

9. Total number

of

tracks

10. Inner circumference

11

..

Outer circumference

12. Recording system

track

track

time

radius

radius

250 k bit/sec

100

msec

15

msec

220

msec

15

msec

0.5 sec

:,300

rpm

48TPI

80

36.52

55.03

36.52

34.40

MFM

mm
mm

mm
mm

(Double density recording)

(trk

39,

side 0)

(trk

00,

side 1 )

(trk

39,

side 0)

(trk

39,

side 1)

13.

R/W

head

positioning

14.

Main axis

15.

Detectors

(1

)

Index hole

(2)

Track

(3)

Wright

(4)

Track address

16.

Ambient

(1

)

Temperature

(2)

Relative

(3)

Maximum

(4)

Vibration

17.

Transportation and storage

(1

)

Temperature

(2)

Relative

(3)

Vibration

(4)

Impact

motor

detector

No.OO

protect

conditions

humidity

wet-bulb

humidity

detector

detector

detector

temperature

condition

Voice

coil

motor

Outer

rotor-type

brush less

Photoelectric conversion
Photoelectric conversion
Photoelectric conversion
Photoelectric conversion

4°C

to

43°C

20%

to

80%

(no condensation)

29°C

0.6G,5

-40°C
less than
less than 3G,

,less than

,..,.

60

Hz

to

65"C

95

% (no condensation)

50

,...

60

50

G

transistor

Hz

motor

1-12

18.

Power supply

(1

)

+12V(±5%-)

(2)

+5V(±5%)

0.7 A (typ) (at reading/writing)

1.9 A (max) (at

0.25

A (typ) (at reading/writing)

0.4

A (max) (at

motor

motor

starting)

starting)

19.

Power consumption

: . 9.7 W (typ)

20. Reliability
(1

)

MTBF

(2)

MTIR

(3)

Soft

error rate

(4)

Hard error rate

(5)

Seek error rate less than once every 1

1000

HOURS

30

minutes
less than once every 1
less than once every

21. Connectors
(1

)

Power supply

(2)

Signal

connector

connector

AMP.
3 M

PIN

PIN

3463-0001

1-480424-0

(POH)

09 bits

12

10

bits

06 seeks

or

equivalent

or

equivalent

1-13

CHAPTER 2

DISASSEMBLY

2.1

Precautions

2.2

Disassembly

2.2.1 Optional cover and upper case .........................................................

2.2.2

2.2.3 Q10SYM board .................................................................................

2.2.4

2.2.5

2.2.6 Power lamp ............................... .................................... ......... ...... .....

2.3

Disassembly
monitor

2.3.1 Cover .................................................................................................

2.3.2

2.3.3 Board

2·.4

Disassembly

keyboard

2.4.1 Cover ................................................................................................ 2-1 2

2.4.2 Replacement

2.5

SO-321

2.5.1 Main board set .......................................................

2.5.2 Voice coil

2.5.3 Sub-frame, collet set, collet lever

2.5.4 Front panel ......................................................................................

2.5.5 Disk guide

2.5.6 Disk drive

2.5.7 Disk guide

2.5.8 Index

2.5.9 Index

2.5.10 Eject lock lever set ..........................................................................

for

disassembly

and

reassembly

Q1

OGMS board ..................................................................................

Q1

OPS

board (Power supply unit) ......................................................

FDO

(SO-321 ) unit ............................ ,.......................................... .....

and

reassembly

unit}

..................................................................................................

CRT

..................................................................................................

(CRT

drive unit) ..................................................................... 2-11

and

reassembly

unit

................................................................................................ 2-1 2

of

key switches and

LED

lamps ....................................................................................... 2-1 3

mechanism

and pad arm .......................................................................... : .........

and eject transmission

pulley set .........................................................................................

.....................................................................................

motor

unit (VCM unit) ....................................................

(L)

unit,

motor

and endless belt ..................................................

(R),

idler set and

detector
detector

A set ........................................................................

B set ........................................................................

ANDREASSEMBL

Y

CONTENTS

and

reassembly

of

the

main

of

CRT (green

of

the

write

protector set

level ........................................................... 2-21

disk

............................................

unit

...........................................

00

.......................

drive

2-1
2-2
2-2

2-4
2-5
2-6
2-7
2-8

~.

2-9
2-9

2-10

2-14
2-14
2-16

2-18

2-20

2-24

2-26
2-28
2-30
2-32

2.1

Precautions

Before

for

disassembly

disassembling

or

reassembling

and

reassembly

the

QX-1

0,

pay

attention

to

the

following.

1) Make sure
Disconnect the AC cable

2) Disconnect the cables of the keyboard,

3) Power is charged in the electrolytic condenser in
the

power

4) Take special care
If

the anode cap is removed,

posed between the cap and GND.

5)

When
with

6)

Be

sure

7) Do

not

When

8)

Abbrevia-

tion

the

power

switch

a substrate using ICs such

your hands

to

use

the

touch

the

the Q 10

switch

from

is turned off. So take care

to

keep the CRT unit away

to

discharge static electricity

specified screws. (See Table 2-1 )

contact

SYM

surfaces

substrate

Abbreviations

is turned off.

the AC inlet.

CRT

it

must

be properly discharged

as a circuit

of

connectors

is

removed

Name

or

unit, etc. connected

the

power

to

avoid electric shock.

from

cathode rays

board is handled, be sure

prior

to

handling.

with

bare hands.

transported,

for

screws

and

to

supply unit

or

with

disconnect

small

the

OX-1

O.

for a few

the yoke coil.

a resistor

to

touch

the

battery

parts

minutes after

of

about

10m

inter-

a grounded device

connector

Rough Sketc h

CN

1 2.

CS

CP

CB

CPO
CTB

CTC

CTBR

CO

HH

PW

SW

OW

CW

HN

Cup

screw

Cross-recessed pan head machine

Cross-recessed head

Cross-recessed head C.P.screw
Cross-recessed head
Cross-recessed head

Cro~s-recessed

Cross-recessed head oval counter sunk
Hexagon

PI

ane

Sprinc

socket

washer

-·;-,.3sher

bind

tapping

bind

tapping

cup

tapping

head Brajier head

half-point

set

screw

screw

(with

screw
screw

tapping

screw

outside

-

Outside

Conical

Hexagon

toothed

toothed

nut

lock washer

lock washer

screw

screw

toothed

lock

washer)

(@

@

@

@
@

(@

@

©

@

@

©

@

©

@

~

~

~

(J::EJ

~

dfm-

~

.~

~

~

~

I

D

g

Table

2-1

2-1

2.2

Disassembly

2.2.1

Optional

1.

Remove
Fig.

2-1.

cs:

M4 x 12

cover

Disassembly

two

screws

x 4

and

reassembly

and

upper

case

procedure

of

the optional cover shown in

of

the

main

unit

Notes

on

disassembly

2. Remove the connector cap A between the option
cover and

3. Remove
end

lower case.

two

screw hole caps located in the right

of

the upper case

top

with a (-)

screwdriver.

~~~~~r-OI:>ticmaJ

Fig. 2-1

• To replace connector cap A,
tional cover and
nector cap A
push

the

Screw hole cap

Uppercase

~hen

into

the groove

upper part.

insert the lower part

first

replace the op-

of

the

lower

cover

of

con-

case and

4. Remove the the four set screws
shown in
CS:

5. Remove the
2-4.(CN6 and CN7 on the

Fig.

M4 x 12

2-3.

x 4

two

connectors

shown

Q1

0 SYM substrate)

of the upper case

in

Fig.

Fig

Upper case

Q10

SYM

Fig.

Fig

2-2

2-3

BOARD

2-4

2-2

Disassembly

procedure

Notes

on

disassembly

6. Note: Upper and
grounding wire.

lift

the

upper case

the

rear part come

the

lower

case.

lower

cases are connected via the

by

hand and remove

to

the

front, and

put

• The CN6 us 1 Upper case
removed

•

When

CN7 are
board.

it

so

that

it

in

front

of

Lower
case

by

opening left and

replacing, make sure the cables

not

trapped by

Fig.

lock

type, and should be

right

levers.

the

case

or

2-5

Q 1 0

of

CN7

GMS

and

7.

Remove
speaker
the

grounding wire.

CTC:

the

screw

of Q 10

M3 x 12

SYM

x 1

on

the

board, and

right

side

of

the

disconnect

Groundi

wire

Upper

•

When
CN7 are
board.

1"::1<::1"-----

replacing, make sure

not

trapped by the case

Fig.

2-6

the

cables

or Q 10

of

CN7 and

GMS

• Carry
reassembly.

out

above procedure in reverse

for

2-3

• The

tightening

Fig.

2-7

torque is 5

kg·cm.

2.2.2

Q10

GMS

board

Disassembly

1.

Remove the upper case referring

2.

Remove screws No. 1 ~ 4

',he right.

CTB:

M3 x 10

CPO:

M3

3. Hold the

straight up. Then the connector on the right
screw 1 shown in Fig. 2-8 comes off.

4. Remove grounding plate C and shielding plate at-

tached

to

cpo:

M3

OW: M3

HN: M3

x 1

x 8 x 3

Q1

0 GMS board

the

Q1 0 GMS

x8

x3

x3

x3

procedure

shown

by

both hand and

board.

to

2.2.1 .

in drawing· on

lift

of

it

the

Notes

on

disassembly

• Before handling the board. be sure
static

electricity from your body.

•

To

replace the board. set connectors CN9 and

CN

1 0 correctly and securely

board.

• When replacing the board. pay attention
ection

of

grounding plate

Note:

When

a defective 01 0 GMS board is re-

placed.

grounding plate C and shielding plate are

not

included in spare parts.

• The tightening torque

is 5 kg·cm.

C.

of

screw 1 shown

to

discharge the

in

the 01 0 SYM

to

in

Fig.

the dir-

2-8

• Carry
bly.

~CPO

_......;;;;

I.....--

___

\MINN-QW

o:D--HN

Fig.

2·9

out

above procedure in reverse

Grounding plate C

g

......

<

__

~

O:hieldin

GMS

for

plate

reassem-

2-4

2.2.3

Q10

SYM

board

Disassembly

1.

Remove the upper case and

to

2.2.1 and 2.2.2.

ring

2.

Remove the four screws indicated by arrow

marks ian the drawing on the right.
CTB:

M3 x 10

3. Remove the connector on the
CNS

- Power supply
CN13 ­CN

1 2 - Battery

4. Remove the board by opening the claws provided
on the

left and right sides

x4

FAN

procedure

Q1

0 GMS board refer-

Q1

0 SYM board.

of

the board.

Notes

on

Fig.

• The tightening torque

Note: The connector
CN

1 2 and battery must also

is

board itself
the battery

transported

disassembly

2-10

of

the screws is 5 kg.m.

for

connection between

be

removed when the

to

prevent

sh<;>rting

of

5. Take

• Carry
bly.

off

the board.

out

above procedure in reverse

for

reassem-

• Before holding the board,
static electricity from your body.

• Take

•

off

the board lifting the

To

replace it, insert the rear side

be

sure

front

first

to

discharge the

side first.

.

2-5

2.2.4 Q10PS board (Power supply

Disassembly

1.

Remove the upper case according

procedure

unit)

to

2.2.1 .

Notes

on

disassembly

2. Disconnect the AC input
connector connected
board.

connector

to

CN8 of the

CN
Q1

3. Remove the four screws shown in the

the right.
CS:

M4x8

x4

OW:M4x4

4. Remove the grounding plate.

5.

Lift the

power

supply

unit

and take

it

1 and the
0 SYM

drawing

off.

on

Insulating paper A

Fig.2-11

•

To

replace the grounding plate, pay attention to the

direction

• In the part A
grounding
in

that

(with

wire

order.

the

tooth

tip facing up and left).

shown

in

Fig.

2-11,

press terminal and

attach screws,

toothed

CS;$

Grounding

terminal-_oe:::~=::;od

Ow-

washer

• Carry
bly.

out

above procedure in reverse

for

reassem-

•

When

a defective
sulating paper A
in spare parts.

Fig.

power

shown

2-12

supply

unit

in Fig. 2-11 is

is

replaced, in-

not

included

2-6

2.2.5

FOD (SO-321)

unit

Disassembly

1.

Remove the upper case according

in

Fig.

x5

x 8 '( 1

x 1

two

A.B and C

2-13

Fig.

2-13)

connectors of

2. Remove screws
side)

shown

CPO:

M4x8

(Screws B ~ F in Fig. 2-13)

CS:

M4
M4

OW:

,..Jcrew A in

3. Remove the

procedure

to

or

D,E

and F JFDD-A/B

FDD.

2.2.1.

Notes

on

disassembly

Il

1!=::===i1

~A

/J

~

~-~=---------~~----+-----~

FDD-A FDD-B

BJlo

*~

Grounding

plate B

I ii

E

c

[ ]

iJ

Fig.

2-13

• The lead
be attached in

• Grounding plate B is mounted like a wave.

of

the grounding wire

the

direction

of

shown

screw

A should

in Fig.2-13

4. Pull

shown

• Carry
bly.

out

the FDD in the direction

in Fig. 2-1 3 (case

out

above procedure in reverse

front

of

side).

the

arrow

for

reassem-

•

When

a defective FDD is replaced, make secure

setting

of

the following

of

the terminator.

FDD-A

.:1.:10

I

~'j'G

NO

Only 1 ON

UOgn1~

,....------,

I

I

L

______

1

NO

Without
terminator

I

I

.J

Fig.

DIP

2-14

switch and mounting

FDD-B

.:1.:10

~I

t«)

Only 2 ON

Uogl\,~

NO

With
terminator

5

2-7

2.2.6

Power

lamp

Disassembly procedure

* Disassembly

found to

1.

Remove the upper case according to

2. Remove the

2.15.

CTC:

3. Remove the solder
and remove the

M3

is

necessary when the power lamp is

be

defective.

two

screws indicated by arrows in Fig.

x8

x 2

of

A and K shown in

LED

lamp.

2.2.1

Fig.

.

2-16,

Notes on disassembly

POWER

LAMP

I

Fig.

2-15

roo--

o
o

(LED)

i

i ,""""Upper

case

4. The pole
2-1
Insert
2-16
tact.

5.

Solder the lamp

6. Tighten the

with

7 is the anode

the lamp into the TFLD board shown in

in the correct direction, ensuring close con-

the longer lead wire

of

the

LED

lamp.

two

screws mentioned in step 2.

as

shown in Fig.

Fig.

~L;ED~:~=----~

BLACK

Fig.

Fig.

~TFLDBOARD

~~

----

2-16

2-17

2-8

2.3

Disassembly and reassembly

2.3.1 Cover

of

CRT (green monitor unit)

Disassembly procedure

1.

Set the

2. Remove the four screws indicated

2-18.

CTBR:M4 x 16

unit

with

the

x 4

CRT

screen down.

by

arrows

in Fig.

Notes on disassembly

• There are many high voltage parts in the green
Be

careful

not

to

monitor.

touch them.

l

Fig.2-18

Lift the cover.

3.

• Carry

out

bly.

above procedure in reverse

for

reassem-

2-9

2.3.2

CRT

Disassembly

1. Discharge through a resistor
serted between the anode cap terminal and GND

(ground frame).

procedure

of

about

25

Anode

MD

in-

Cap

Notes

•.

High voltage is applied
mind and take care.

D.Y.

on

Screw 2

disassembly

to

the

CRT.

Keep

this in

Screw

2.

Disconnect the cable connectors (2) coming from

the

DY

(deflection yoke) shown in

the board.

3.

Disconnect the grounding wire connector coming
from the
tion between
the board.

4. Remove the socket shown in

5.

Remove four screws 1 - 4 shown

CTC:

OW:

PW:

• Carry out above procedure in reverse
bly.

middle

the

M4xl16
M4

x2

M4

x 0.8 x 1 6 x 2

of

the wire which makes connec-

CRT

fixing screws 2 and 3, from

x4

Fig.

Fig.

2.19.
in

fig. 2-19.

for

2-19

reassem-

from

Fig.

2-19

•

Screws 3 and 4 should be used

CRT

as

shown below.

2-10

Case

F'W

Fig.

Grounding

Terminal

2-20

2.3.3

Board (CRT

drive

unit)

Disassembly

1.

Carry

out

steps 1 ~ 4

2. Remove screws 1

procedure

of

2.3.2.

~

4 shown in Fig.

2-21.

Notes

oil

• High voltage is applied
Keep in mind and take care.

Fig. 2-21

disassembly

to

the board.

2-11

2.4

Disassembly and reassembly of

2.4.1 Cover

the

keyboard unit

Disassembly procedure

1.

Set the unit

2. Remove the six screws shown in

CTC

3. Remove upper and
keyboard unit.

M4

x

with

12

the key

x 4

top

lower

cases, and take

down.

Fig.

2-21

off

the

Notes on disassembly

Fig.

2-22

2-12

2.4.2

Replacement

of

key

switches

and

LED

lamps

Disassembly

procedure

* Replacement is necessary when the key

malfunctions.
Check continuity using a circuit tester.

1.

Remove all the the screws (cup and tapping
screws) on the soldered surface
unit.

2. Lift the unit straight up holding part {

Fig.

2-23

with

the

ke'l!

top

up.

of

the

switch

keyboa~d

} shown in

Notes

on

disassembly

3. Key

switch

Desolder the defective key

LED

lamp

Desolder the defective

• Carry
bly.

out

above procedure in reverse

switch

LED

and replace it.

and replace

for

reassem-

it.

Fig.

2-23

2-13

2.5

2.5.1

SO-321

Main

board

mechanism

set

1)

Remove
(See Fig.

2)

lift

the main frame.

3)

Disconnect the

(See Fig. 2-25.)

the

2-24)

A) Front panel CTC
B)

Disk guide R CTC

C) Disk drive

0)

Radiator plate

the

main board

Disassembly

main board fixing screws.

motor

connector

M2.5

M2.5

CS

CS

M2.5 x 25

so

that

procedure

x 6

x 6

M2.5

x 4

it

is

almost

of

the

head lead wire.

D)

parallel

to

Notes

on

disassembly

~

~~~QOQ~~

Fig.

2-24

liDO

~~

I I

I;

; ; ; ; ; ;

Fig.

2-25

~

~~

;1

2-14

Disassembly

procedure

Notes

on

disassembly

1) Check the head lead wire follows the specified
(Fig.

route.

Check each connector

2)

and set the main board set.

3) Tighten the main board set fixing screws.

Tightening

2-25)

torC"ue:

is

in the correct position,

4.0

kg· m

for

A -- 0

Note

Note

Note

1.

Take care
when the connector is connected or dis­connected.

21.

If

the VCM connector does not coincide
with
VCM flexible lead plate fixing
tle, adjust the connectors and then re­tighten the screw. (Fig. 2-26)

3.

Before tightening the main board fixing
screws, make sure that the head lead
is

not

not

to

damage the terminal

the main board connector, loosen the

screw a lit-

trapped by the

front

panel.

wire

Fig.

2-26

2-15

2.5.2

Voice

coil

motor

unit

(VCM

unit)

Disassembly

1)

Take

off

the

main board set.

2) Remove the clamp

3)

Remove the VCM fixing screws and cross-recessed

oval counter-sunk screw, and take

head

VCM unit from the main frame.

(Fig.

2-28)

Cross-recessed head oval counter-sunk screw

of

the

head lead wire.

Conical

procedure

(See

2.5.1.)

Base fixing

toothed

off

the

screw

look

waSh~

~

~

~

Notes

on

disassembly

• Insert insulating paper between upper and lower
heads.

~VCM

~

fixing

screw

,

~

Fig.

2-27

Fig.

2-28

2-16

Disassembly

1)

Set the VCM unit so

procedure

that

it

fits in the guide hole

the main frame.

2)

Set the base fixing screw, VCM fixing screws, coni-

toothed lock washer and cross-recessed head

cal
oval counter-sunk screw. Fix the VCM unit while

it

pushing

toward the disk guide

(Screw tightening toqrque:

3)

Co~-

. -t the head lead wire to the disk guide

and the specified positions

2-25

and

(Figs.

2-26)

(R)

and rear side.

5.0 kg·cm)

of

the main board set.

(R)

of

Notes

on

disassembly

4)

Mount

the main board set. (Refer

2-28)

(Fig.

* Method

guide

1.

Set the head lead wire

ing position

Set the head lead wire

of

clamping the head lead wire

(R)

Fig.

2-29

to

the head lead wire clamp-

of

the disk guide

as

follows:

A) Move the VCM drive coil to track

B)

Set the upper head lead wire so

front

end

of

the
disk guide

C)

Hold the

and wall

the clamp position wall

(R)

part

making contact between the

with

tweezers, move
the clamping position and set
position as

D) Hook the

raised part
to

the disk guide

E)

Set the

tweezers

wire and

1.

Note

it

is.

lower

head lead wire on the bent and

of

,the slide axis holder B and bring

(R)

clamping position.

wire

in the clamping position

so

that the clearance between the

the

clamping position is about 2 mm.

In

the lower head holder and disk guide
clamping position, upper and
lead wires are upside down.

Note 2. The upper head

lower

head lead wire from the

lead wire crossed the

side.

(R).

to

that

it
it

2.5.1 )

to
in

to

the

00.
it

touches

the right

the

clamping

with

lower

front

of

head

panel

disk

the

wire

of

(R)

• The base fixing spring should
the VCM base. (Fig.

it

2-27)

not

incline beyond

of

2. Check sliding

1)

The lead wire should

track

00.

2) The lead wire should

the head lead wire.

not

be

over tightened

not

come

out

of

axis holder B in track 39.

3. Connect the head

lead wire

to

the disk guide

Route the head lead wire through the lead wire

the

guide provided on

disk guide

(R).

in

the slide

(R).

2-17

Fig.

2-29

2.5.3

Sub-frame,

1)

Remove the main board set. (Refer

2) Remove the slide lever spring.

collet

Disassembly

set,

collet

procedure

lever

to

2.5.1)

and

pad

arm

Notes

on

disassembly

3) Remove the sub-frame

(Fig.

2-30)

CS

M2.

5 x

19

x 3

4)

Remove the sub-frame

5) Remove

frame unit, and pull
direction
M2

6) Push the collet lever

engaged in
shaft.
tion
let lever.

7)

Remove
and take

the

pad

of

the

x 4

(P

0.25)

arrow

Move

shown

in

the

E stopper ring

off

the

RE

ETWJ-2.3 x 1

arm

fixing

the

arrow

x 1

down

A direction from the collet guide

the

collet set gently in

Fig.

2-31 and remove

shaft.

unit

fixing screws.

unit

from the main unit.

screw

from

pad arm

shown

to

in

Fig.

until the collet set

of

the collet lever

the sub-

the

front

2-30). SF

arrow

it

from

(in the

thin

is

B direc-

the

col-

shaft

dis-

• Since the upper head arm
bar arm, care should

onto

head

the

lower

be

taken

head.

is

placed on the collet

not

to

drop the upper

Fig.

2-18

Collet set

Fig. 2-31

2-30

Disassembly

1)

Set the collet lever and collet lever spring
sub-frame, and fix the unit
through the

2) Rotate the
let

lever groove.

Adjust

3)
shaft, and

4) Che(' ;.e collet rotation and collet lever operation.

5) Make sure the disk guide sleeves have been set in
the disk guide

the

6) Set

sub-frame

unit, and fix

screws.

(Screw tightening torque:

7)

Hook the slide lever spring between the sub-frame

and slide lever.

Mount

8)

collet lever shaft.

collet lever and set the collet

the collet center hole to the sub-frame guide

set

the collet

(L)

and

sub-frame

unit

backward

it

with

the main board set. (Refer

procedure

with

in

the sub-frame.

(R)

units.

unit

in

the

main unit, Push

toward

the sub-frame

6.0 kg-em)

in

the

the E stopper ring

in

the col-

the

the disk guide

unit

fixing

to

2.4.1 )

(L)

•

Pay
(Fig. 2-32).

attention

Notes

to

the set

on

disassembly

of

the collet lever spring

Collet

lever/spring

I positioned

~-/-f-"",.)

(View of sub-frame unit

Fig.

2-19

-I--Sub-frame

seen

from the bottom)

2-32

The

spring

end

should

in

the notch.

be

securely

2.5.4

Front

panel

Disassembly

1)

Remove the main board set. (Refer

2)

Remove the
the

front

es

front

panel fixing screws, and take

panel by pulling

M2.5

x 4 x 2

procedure

it

to

2.5.1 )

to the front.

Lead wire clamp

off

Fig.

• The
it not caught by
located under the

2-33

Notes

on

front

panel should be taken

the

front

disassembly

off

taking care

lead wire

of

index detecto.r B

panel lead wire clamp.

that

1)

Set

the

front

detector

Fix

2)
panel fixing screws.
(Screw
Mount

3)

8 on

the

front

tightening

the

main board set. (Refer

panel, and

the

panel

hook

front

panel lead

to

the main

torque: 4.0 kg-cm)

the lead wire

wire

clamp.

unit

with

the

to

2.5.1 )

of

front

index

• Insert the lead wire
the

claws (2)

(Refer

to

Fig.

of

the lead

2-33)

of

the

index

wire

detector

clamp.

B inside

2-20

2.5.5

Disk

guide

(L)

unit,

write

protect

detector

set

and

eject

transmission

level

Disassembly

1) Remove the main board set (Refer

2) Remove the sub-frame unit. (Refer

front

3) Remove the
the

front

panel by pulling

2.5.4)

CS

M2.5

4)

Remove the

off

take

5) Remove the

and take
disk guide

6)

Push the slide lever push button hook up, and re­move the pushbutton.

the disk guide

off

panel fixing screws and take

x 4 x 2

disk

guide (L) unit fixing screw, and

write

the

write

(L).

procedure

it

to

the front. (Refer

(L)

unit from the main unit.

protect

detector fixing screw,

protect

detector

to

to

2.5.1 )

2.5.3)

from

the

to

off

Notes

~DiSk

on

disassembly

guide

(Ll

unit fixing screw

'Disk

guide

sleeves

Pushbutton

hook

~/

PUShbutton"" /

. Write protect

~

detector.

.

~

Fig.

I

i

2-34

2-21

Disassembly

procedure

Notes

on

disassembly

1)

Lubricate the latch receiver

2)

Lubricate the part making

fety lever add disk guide

of

the disk guide

contact

(L).

between

(L).

~

)

Fig.

the

sa- I

I

t--

2-35

Lubricate

L~ch

Disk guide

(L)

3) Lubricate the eject transmission lever bearing
the

disk

guide

(L).

Eject transmission lever

of

Fig.

Fig.

Lubricate

Safety

2-36

Lubricate

2-37

4) Push

the

pushbutton

into

the

disk

guide

(L).

2-22

.

Disassembly

procedure

Notes

on

disassembly

5) Set the
guide(L) and fix
(Screw tightening torque:

6)

Route the cable connecting the index
and
eject
(Fig.

write

protect

detector board in the disk

it

with

screw.

1.0 kg-cm)

Disk

write

protect detector board pass under the

lock lever.

2-39)

guide

(L)

detector

Fig.

B

2-38

7)

Fix the
disk guide
(See A

Mount

8)

Mount

9)

0)

Mount

1

disk

guide

(L)

unit

to

the main unit

(L)

unit fixing screws.

of

Fig. 2-39.)

the

front

panel. (Refer to 2.5.4)

the sub-frame unit. (Refer

the

main board set. (Refer

to

to

2.5.3)

2.5.1 )

with

Fig.

the

2-39

• Insert the cable connecting the
tor

board and iodex

the

disk

guide

(L)

unit.

2-23

detector

write

protect detec-

A into the groove

of

2.5.6

Disk

drive

motor

Disassembly

1)

Remove the main board set. (Refer

2)

Remove the sub-frame unit. (Refer

and

procedure

endless

belt

to

to

2.5.3)

2.5.1 )

Notes

on

disassembly

3) Remove the disk drive

(Fig. 2-39)

CS M2.5 x 6 x 2

4) Remove the slide shaft B holder fixing screw, and

off

take
unit.

5) Remove

motor

6) Route the cable connecting the index

and
eject
(Fig.

the slide

(Fig.

2-40)

the

endless belt. Remove

from

the main unit.

write

protect detector board pass under the

lock lever.

2-39)

motor

shaft

B holder from the

fixing screws.

VCM

the

disk drive

detector

B

Fig.

2-40

Fig. 2-41

2-24

1)

Fix

the disk

Disassembly

motor

procedure

with

the disk drive

screws. (Screw tightening torque:

2)

Mount

the endless belt on the disk drive
pulley, idler bearing and disk drive pulley in
order. (Fig.

3)

Fix

2-42)

the slide shaft 8 holder to the VCM unit

the slide shaft 8 holder fixing screw.

4)

Mount

the sub-frame. (Refer to 2.5.3)

5)

Mount

the main board' set. (Refer

to

6) Check the disk speed. (Refer to 3.4.2)
Note

1.

Check the

disk

rotates smoothly

generating abnormal noise .

is

not

. Note 2 Check the belt

frayed or cracked.

motor

fixing

5.0 kg-cm)

motor

that

with

2.5.1 )

without

Notes

on

disassembly

Idler

Disk drive

Disk drive pulley

motor

2-25

2.5.7

Disk

guide

(R),

idler

set

and

disk

Disassembly

1)

Remove the main board set. (Refer

2)

Remove the sub-frame unit. (Refer

3)

Remove the endless belt.

4)

Remove the idler fixing screw. Remove the
washer and idler bearing. (Fig.

CP:

M3

x 7 x 1

5)

Remove the disk guide sleeve from the disk guide

(R).

procedure

2-43)

drive

to

2~5.1

to

2.5.3)

pulley

)

flat

set

Notes

on

disassembly

6) Remove the disk guide
2-44)

7)

Remove the disk drive pulley screw. Remove the
disk drive

.

cs:

M2.5 x 8 x 2

pulley set.

(R)

fixing screws. (Fig.

@

I

Idl~~~

Fig.

I

2-43

2-26

Fig.

2-44

Resassembly

1)

Make sure the

drive

pulley shaft. Put the disk drive pulley set on

pulley shaft

the
shaft.

2)

Tighten the disk drive pulley and fix
screw.
(Screw tightening torque:

3)

Rotate the disk drive pulley 2
sure

it

rotates smoothly without abnormal noise

or

uneveness.

flat

by

washer

mounting

procedure

has

been set

it

downward on the

5.0 kg-em)

"'"

times to make

it

in

with

the disk

a

Notes

on

resassembly

4) Set the disk guide
Tighten
(Screw tightening torque:

6)

Mount

7)

Mount

8)

Mount

9)

Check the disk speed. (Refer to 3.4.2)

the

the endless belt. (Refer

the sub-frame unit. (Refer

the main board set (Refer

(R)

disk guide

and disk guide pulley.

(R)

fixing screws.

3.5 kg-em)

to

2.5.6)

to

2.5.3)

to

2.5.1 )

~

I

@

I

~

I

~

'®

'W

j

I

El

~

Oiskdrivepulley

Fig.

2-27

2-45

2.5.8 I ndex

1)

Remove the main board set. (Refer to 2.5.1 )

2)

Remove the index
(Fig.

3)

Remove the sub-frame unit (Refer

4) Remove the

5)

Remove the disk guide

6)

Remove

detector A set

Disassembly

3-23)

CP:

M2.5

x 4 x 1

front

the

write

procedure

detector

panel. (Refer

protect

A set fixing screw.

(L)

unit. (Refer

detector. (Refer

to

2.5.5)

7)

Desolder the cable
from the

write

of

protect

the index

detector

to

2.5.3)

2.5.4)

to

detector

board.

2.5.5)

to

A set

Notes

on

disassembly

Fig.

Index detector A

2-46

2-28

Resassembly

1}

Solder the cable
protect

detector

2}

Carry

out

3}

Fix

the index

sub-frame

screw.

41

Route the lead
the specified circuit. (Fig.

51

Mount

the main board set. (Refer

6)

Adjust

the

of

disassembly procedure in reverse.

detector

with

the

wire

index. (Refer

procedure

index detector A

board.

A set temporarily

index detector A set fixing

of

the

index

to

the

detector

2.47)

to

2.5.1)

to

3.4.5)

write

to

the

through

Notes

on

• Solder the black wire

resassembly

of

the

cable

to

"B".

~

Fig.

2-47

_ Lead wire connected

2-29

2.5.9

Index

detector B set

Disassembly

1)

Remove the main board set.

2)

Remove the sub-frame unit. (Refer

procedure

(F

efer

to

to

1.5.1)

2.5.3)

Notes

on

disassembly

3) Remove the index

3-25)

(Fig.

CP:

M2.5

x 8 x 1

4) Remove the

5)

Remove the

6) Remove
(Refer

7)

Desolder the cable
from the

to

the

2.5.5)

write

front

disk

write

protect

detector

panel. (Refer

guide

(L)

unit. (Refer

protect

detector.

of

the

index

detector

B fixing screw

to

2.5.4)

to

detector

board.

2.5.5)

B set

Index detector B

IT

I

Fig.

2-48

2-30

Resassembly

1)

Solder the cable
protect detector board. wire to

2)

Fix

the index detector B set to the main unit
the index detector B set fixing screws.
(Screw tightening torque: 3.5 kg-cm)

3)

Route the lead wire
the specified circuit.

Mount

4)

5)

6)

7)

the disk guide

Mount

the

Mount

the sub-frame unit. (Refer

Mount

the main board set. (Refer

front

of

panel. (Refer

procedure

index detector B

of

the index detector B through

(L)

unit. (Refer to 2.5.5)

to

2.5.4)

to

2.5.3)

to

2.5.1 )

to

the write

•

with

Notes

Solder the red wire

"W".

on

resassembly

of

the cable

to

"R" and white

8) Adjust the index. (Refer

9)

Eject lock lever set

to

3.4.2)

2.5.10

Eject lock

1)

Remove the main board set. (Refer to 2.5.1)

2)

Remove the sub-frame unit. (Refer to 2.5.3)

3)

Remove the

lever

set

Disassembly

front

panel. (Refer

procedure

to

2.5.4)

Notes

on

disassembly

4) Remove the disk guide

5)

Remove the ejector spring.

6)

Loosen and remove the E stopper ring

drive pulley side

RE:

ElWJ

- 2.3 x 1

Resassembly

1)

Set the eject lock lever set
the eject
unit and fix

lock lever shaft from the disk guilde

it

with

(L)

unit. (Refer

of

the eject lock lever.

procedure

in

the main unit. Insert

the E stopper ring.

to

of

2.5.5)

the disk

(L)

Notes

on

resassembly

Check the eject lock lever spring

•

eject lock lever set.

is

attached

to

the

2)

Hook the eject spring between
main unit.

3)

Mount

the disk guide

4)

Mount

the

front

5)

Mount the sub-frame unit. (Refer

6)

Mount

the main board set. (Refer

(L)

unit (Refer

panel (Refer

to

the

2.5.4)

ejector and

to

2.5.5)

10

2.5.3)

to

2.5.1 )

2-32

CHAPTER 3

ADJUSTMENT

3.1

Handling

3.2

Adjustment

3.3

Operation

3.4

Adjustment

3.4.1 Positions and functions

3.4.2 Adjustment

3.4.3 Adjustment

3.4.4 Azimuth adjustment ..............................................................................

3.4.5 Adjustment

3.5

Maintenance

3.5.1 Periodic maintenance ............................................................................

3.5.2 Check items ...........................................................................................

3.5.3 Cleaning ................................................................................................. 3-8

3.5.4 Head cleaning ..............

3.5.5 Lubrication .............................................................................................

3.5.6 Bonding .................................................................................................. 3-9

3.5.7 Maintenance Tools and measuring

......................................................

of

VFO circuit........ ....... ...... .... ..... ....... ........................... .... ......

check

of

Q1

OPS board.................................................................

of

FOD SO-321 ..........................................................................

of

disk speed .....................................................................

of

off-track................................. .....................................

of

index position ................................................................ 3-7

of

FDO SO-321 .......................................................................

instruments ..........................................................................................

AND

MAINTENANCE

CONTENTS

'"

.......

...

............. .............. ............ 3-1

of

test

points ..................................................

~

......................................................................... 3-8

...

...

3-10

3-1
3-2
3-2
3-2

3-4
3-5
3-6

3-8
3-8

3-8

3-8

3.1

HANDLING

(1)

(2) Handling

Ambient

• Avoide use and storage in a humid place because moisture can cause troubles.

•

Storage

•

•

• The

Care

•

•

Conditions

Avoide
sharp temperature change.
(Avoid use in a place where the system may

PI~-'"

Be

it

When
vent.
If
time

use and storage

and

the

ax-1

careful

ax-1

0 is composed

without

an

the

cleaning

option

to

time.

at

extremely high

·Jse

0 on a

flat

surface such as a

not

to

place a heavy

of

precision-made parts so

case cover. Otherwise,

the

OX-1

0, use a

or

the cable

for

an

object

dry

option

or

on

the

dust

cloth

and

is

connected

low

temperatures, and be careful

be

exposed

table

machine

and

static

wipe

or

to

much

the like.

or

twist

do

not

subject

can adversely

it

gently. Do

to

the

ax-1

it

0, check

vibration

during

it

to

affect

not

use alcohol

or

storage

shock, and avoid using

it

to

the

connections

not

to

expose

shock.

or

transit.

cause troubles.

or

volatile sol-

from

to

3.2

Adjustment

1. Check the GND terminal and TP terminal (check
board)

2.

Adjust

3.

Read

and

of

VFO

circuit

with

the

synchroscope probe.

the synchroscope range as specified in Table

Range
AC-GND-OC
VOL T

lOIN

(on the screen)

TIME/DIV

write

the

floppy

disk

drive, and adjust

""111111

"'"

points

3-1

Table.

3-1

it

to

obtain

~

rn

between ICBB and ICBD on

.

Setting

DC

1

50.uS

2.6 --

2.7V

as

shown

-2.6V-

in fig. 3-1.

2.7V

the

Q10

SYM

r-----------------------------------~GND

Fig.

3-1

3-1

3.3

Operation

After

the

(1) Make connection between the

the
(2) Check pin
(3) Check
(4) Check the
(5) Turn the

(6)

Short

(7) Turn the

If

any abnormality

board unit.

3.4

Adjustment

The SO-321 is made

by

the user

reassembled, the

check

Q1 0 PS

power

switch.

15

R2

(1

OQ)

output

power

pins 4 and 5

power

as

long as

of

board is repaired, check the operation according

of

IC 1 to
for

any abnormal heat.

voltages ( +5, + 1

on and off, and check

of

on and off, and check the voltages are

is

detected

of

FCC SO-321

of

it

following

Q1

0 PS

see

PCl , and check all the

precision parts and assembled

is used normally.

adjustments are necessary:

board

Q1 0 PS

if

a normal

by

the above checks, re-check

board and

waveform

2(C),

+ 12(F), + 12(L) and 12V).

the

PWO

When

is

waveform

out

put

it

is

connector

to

CN1

obtained there.

normally appears.

voltages are

normally

with

disassembled

restores then.

according

high precision. It needs no re-adjustment

the

following

(Q10 SYM board), and turn on

not

obtained.

to

troubleshooting

for

replacement

procedure:

for Q 10

of

parts and then

PS

1 ) Disk speed

2)

3)

4)

3.4.1

The
for
of

Off-track
Azimuth
Index

timing

Positions

control

adjustment

the

main unit.

adjustment

adjustment

adjustment

adjustment

and

functions

circuit

of

SO-321 is provided

and inspection. All

of

test

-1

-f

-1

-1

points

with 8 test

the

electronic elements

l-

t-

.f-

l-

[

I

R301

c::

IC

points

of

3

for

observing singal

SO-321 are incorporated in the

waveforms

~~.

I

needed
interior

Fig.

3-2

I;

8 7 6

Location

3,.2

; ; ; ; ; ; ; I

of

543

test

2 1

points

Test point

TP

1

TP

2/TP 3

Video amplifier outputs

A zero

volt

line

of

the signal channel. Used as a reference point in observation

nal waveforms
Test points

has

two

1 OOmVp-p

These test points are used
adjustment

ofTP2

- TP7.

for

observing the video amplifier

outputs: one is displaced

or

greater. Each output can

of

the head access mechanism (off-track and azimuth).

Function

(J.JA

733) outputs. the video amplifier

180

in

phase (differential) and the other

be

observed

for

checking the read/write head characteristics and

at

TP

2 and

TP

3.

of

sig-

is

TP

4/TP

5

Differential amplifier
outputs

TP

6

TP7

Index

Test points
the differentail amplifier has
and the other
and TP5. These test points are used
amplifier and adjustment

Apply a false index signal
body.

A test

the index output signal and.is set
This test point is used
nal observation

for

observing the differential amplifier outputs. Like the video amplifier,

two

outputs:one is displaced

is

greater than about

of

to

Not

used for adjustment and inspection.

point

for

observing the index detection output. Indicates the level inverse

for

checking the disc speed period and trigger signals

of

off-track, azimuth, etc.

500mVp-p.

the head access mechanism.

this

test

to

high level while the index hole is being detected.

Each

for

general checking

point

when the main

180·

in phase (differential)

output can

be

observed

of

the read/write head and

PCB

is checked as a single

Jl_-----'n ____ _

at

for

TP4

to

sig

TP8

Drive select

A

test

signal

....

\(')int

for

observing a drive select signal. Set

i!:i

transmitted from the host controller

Not selected

Table

3-2

3-3

to

the

to

low

FDD.

Selected

level when a drive select

3.4.2

Adjustment

A)

Tools

1)

(-)

2) Disk

3) Frequency

4)

FDD

B)

Procedure

1)

Connect the frequency

2)

Rotate the

3) Rotate the
Set the head

4)

5)

Adjust

C)

Procedure

1)

Raise the main

2)

Adjustment

2) Rotate the

3) Rotate the

4) Set the head

5)

Adjust

so

of

disk

speed

to

be

used

screwdriver (2mm

counter

controller

(when

VR2 on the

(when

VR2 on

that

the

the

disk

drive

disk

drive

to

track

the

unit

will be easy

disk

drive

disk

drive

to

track

the

motion

or

equivalent tip size)

frequency

counter

motor

and set the disk.

motor

and load

20.

disk

drive

motor

strobo
so

disk
of

disk

that

the

if

the

motor

and set the disk.

motor

and load

20.
drive

motor

the

stripe

counter

to

is

storobo

unit

become.s less than one frame per 3 seconds.)

point

the

PCB,

used)

is

set

the

PCB

is used)

TP7

onthe

control

head

and set the pulse interval at TP7

disk

can be seen.

with

the

pushbutton

head.

and set

it

so

that

circuit.

switches

the

stripe is seen stationary. (Adjust VR2

down.)

to

200

± 0.6 mS.

Strobo

disk

CJ

0

C)

tJ

Speed control (VA2)

~

0

0

0

G

Fig.

3-3

G

0

0

°

0

°0°

0
0
0

3-4

3.4.3

Adjustment

of

off-track

A)

Tools

to

be

used

1 ) ( + )

screwdriver

2)

CE

disk

3) Osciloscope

4) FDD

B)

Procedure

1) Make

2)

Controller

connections

and

TP7,

respectively.

(The

trigger

Set the oscilloscope signal

Switch
AC-GNO-OC
VERT
INVERT
VOLT
TIME/OIV

#

between

should be in

MODE

lOIN

(on

Fig.

3-4

CH 1 of

the

conditions

the

the

positive direction.)

screen)

~~"'----'7f:7~--";;':~-lnterruPter

Adjustment

oscilloscope and TP2,

as specified

of

below.

CH

1

AC

-

50mV

off-track

CH

ADD

20mS

2 and

CH

AC

ON

50mV

TP3

2

and

fixing

the

screw

external

trigger

3) Rotate

4)

Set

the

5)

Move

6) Observe

7)

When

rupter

8)

Move
becomes 1

9)

Tighten

10)

Apply

the

disk

drive

CE

disK.

the

head

to

track

the

waveforms

the

ratio (small/large)

fixing

screws

the

interrupter

-- 0.7.

the

interrupter

Neji-Iock green

motor.

34.
on

(2) on

forward

fixing

to

the

the

oscilloscope.

of

the

the

VCM unit.

and

backward

screw

interrupter

Table.

3-3

Fig.3-5

waveforms A to

taking

TP2 + TP3

B in Fig. 3.5 is

using

the

care

not

to

fixing screw. (Seea 3.5.6.)

3-5

( - )

screwdriver

move

the

lower

so

adjusted

than

0.7,

that

position

the

tighten

ratio

of A to

of

the

the

inter-

B

interrupter.

'3.4.4

A)

Tools

1)

Azimuth

(-)

adjustment

to

be used

screwdriver # 1

2) Hexagonal wrench key

3)

CE

disk

4)

Oscilloscope

5)

FDD

controller

6) Neji-Iock green

B)

Procedure

1)

Make connections between
and

TP7, respectively.

Set the oscilloscope signal conditions

2)

1.5

CH1

of

the oscilloscope and TP2, CH2 and TP3 and

as

specified below.

the

external trigger

Switch
AC-GNO-OC
VERT MODE
INVERT
VOL T

/DIN

(on

the

screen)

TIME/DIV

Table.

3) Rotate

4)

Set the

5)

Move

the

disk drive motor.

CE

disk.

the head

to

track

34.

6) Observe the waveforms on the oscilloscope.

7)

When
to

C is

8)

Adjust

becom~s

9) Tighten

Fig.3-6

the ratio (small/large)

lower

than 0.8, loosen

the eccentric pin

so

that

1.0 - 0.8.

the

eccentric pin fixing screw taking care

Waveforms

of

the

waveforms A

the

eccentric pin fixing

t'he ratio

of A to

CH

1

AC

ADD

-

50mV 50mV

O.5mS

3-4

of

TP2 + TP3

to

0 in Fig.

screw

0 becomes 1.0 -

not

to

3-6

with

move

is

the

the

CH

2

AC

ON

lower

than

hexagonal

0.65

and

setting.

0.65,

the

and

wrench

ratio

of 8 to

the

key.

ratio

C

of

8

Fig.

3-7

Azimuth

3-6

adjustment

3.4.5

Adjustment

A)

Tools

1 ) ( + ) screwdriver #
1 ) ( - ) screwdriver #

2)

CE

3)

Osciloscope

4)

FDD

5)

FDD

6)

Neji-Iock green

B)

Procedure

1)

Make connections between

and

2)

Set the oscilloscope
direction.

of

index

to

be

used

disk

Controller
controller

TP7, respectively.

position

sign~1

CH1

of

the oscilloscope and TP2, CH2 and TP3 and

conditions

the

external trigger

as

specified below. The trigger should be in the positive

(+)

Switch
AC-GND-DC
VERT MODE
INVERT
VOL T

IDIN

(on

the screen)

TIME/DIV

3) Rotate the

4)

Set the
Move

5)

6)

Observe the waveforms on the oscilloscope.

When T of

7)
index

8) Adjust index
into

9) Tighten the index
Apply

10)

disk

drive motor.

CE

disk.

the

head

to

track 34.

the

waveform

detector A fixing

detector A by

the range

150

detector

Neji-Iock green

screw.

.....,

500,uS in

to

the

Fig.3-8

shown

Waveforms

in Fig. 3.8 is

inserting the screwdriver ( - ) in

both

A fixing

index

screw

detector

CH

1

AC

-

50mV

Table.

SIDE 0 and SIDE 1.

3-5

~~

of

TP2 + TP

not

the

range

taking care

A fixing screw.

not

CH2

AC

ADD

ON

50mV

50

,uS

3

150

.....,

500,uS in SIDE 1, loosen the

to

the triangular hole so

to

move the set value.

that

T comes

Fig.

3-9

3-7

3.5

Maintenance

3.5.1

Periodic

maintenance

of

FDD

50-321

Check and lubricate the SD-321 periodically every
mance for a long period

3.5.2

Check

items

of

time

and prevent faults.

two

years

in

order to maintain the initial perfor-

Item

Presence
Presence
Smudged head
Smudged belt
Damaged
Presence

3.5.3

of

foreign

of

oil

or

worn

of

dust

Cleaning

matter

in

at

lubrication points

belt parts

and nap

the main

The SD-321 should be carefully cleaned.
Except
dust
cleaning disk

Note:

Note: 2.

3.5.4

the head, wipe

and nap using an electric cleaner. The head has been precisely adjusted

to

clean

1.

Thinner, trichloroethylene and ketone solvents may damage

Head

be used
After

moval

cleaning

for

cleaning, check

of

dust

off

the

head. Avoid cleaning

cleaning.

and nap.

for

The head should be cleaned in the

Set the head cleaning disk in

1)

2)

Start

the disk drive motor.

When

20

3)

4)

Set the disk and read and

seconds have passed

unit

Table

3-6

smudges

the

write

with

the gauze or

oil quantity and replenish the oil

following

the

main unit.

after
it

to

manner.

starting the disk drive

check

Remove the foreign matter.
Lubricate.
Clean the head.
Clean
Replace
Clean.

Check

if

items

it

in

by other methods.

any smudges remain.

the belt.

the

belt.

cotton

motor,

Action

bar soaked

the

if

it

is found insufficient after re-

take

with

alcohol.

in

the

Absorb

factory. Use a

plastic parts, and

out

the head cleaning disk.

must

the

not

3.5.5

Note:

If

the

smudges are

not

Lubrication

the

head should be cleaned in

A) Type

The

of

type

oil

of

oil has a large influen:;:e on performance and durability.
temperature characteristic. The
lysis

of

much techn ical information on various types

B)

Lubrication standard
Use G-51
When

for

lubrication

lubricating parts before starting lubrication.
For the lubricating parts, see
Lubricate periodically according

* For details

of

lubrication parts, see

removed, repeat the procedure

the

following

type

manner.

of

oil used

for

the

of

of

the

50-321.

the

table

of

lubrication, parts

to

the

table

of

lubrication parts.

the

disassembly diagram provided in CHAPTER 2.

3-8

from

step 1).

Pay

50-32

'I

is specified

oil and on tests.

or

lubrication diagram.

special

by

attention

us,

to

based on our ana-

the

low

C)

Lubrication parts

The type

low

temperature characteristic. The type

our analysis

of

oil has a large influence on performance and durability.

of

oil used

of

much technical information on various types

for

the

50-321

Pay

special attention

is specified

of

oil and on tests.

by

us, based on

to

the

Position in diagram

G-1
G-2

G-3
G-4
G-5

G-6

G-7

G-8
G-9 Collet lever fulcrums (2)
G-10

G-11

G-12
G-13

G-14

Sliding parts (2)
Latch fulcrum and latch tail
Latch groove and latch pin head

roller

Slide
Part making contact between the ejector and ejector
guide
Part making contact between the ejector and eject lock
pin
Part making contact between the ejector and eject

transmission lever shaft

Eject lock lever flucums (2)

Parts making contact between the slide lever and

safety lever

Part making contact between the slide lever and eject
transmission lever
Safety lever shaft

Part making contact between the disk guide
eject transmission lever

Ejector spring and spring hook

Parts

to

be lubricated

of

the slide lever and washer

Table

3-7

Lubrication

parts

(L)

,

and

Classifica-

tion

A B
A

B B

""'

,

B

B B

B

B
B B

A

A B

B

A

B

Quantity

A

B

B

B

B

B

A

B

A

Classification: A: Lubricate every 2 years

B:

Lubricate at overhaul

Quantity: A: 1

3.5.6

Bonding

(3:

2

'"

2 drops

'" 3 drops

An adhesive is used in some parts and screws
vent

screws being loosened during transportation. 50,

hesive

to

these parts according

The adhesive used in the

Position

50-321

in

drawing

to

the

is Neji-Iock green (Threebond).

F-1
F-2

* For

the

bonding parts, see

or

table

Table

or

5,000

every 1

of

of

bonding

3-8

hours.

5,000

hours.

50-321

Index

for

the

after

disassembly

parts and

Port

to

detector

purpose

the

drawings.

be bonded

A

Interrupter fixing screw (2)

Bonding

parts

the

disassembly diagram.

of

reinforcement and to pre-

or

reassembly, apply the ad-

3-9

3.5;7

Maintenance

The

minimum

tools

required

and

tools

measuring

and

instruments

Name

of

instruments

are

shown

tool Commercial availability

in

the

following

table:

B)

List

of

Soldering iron
Oblique blade nippers
Tweezers
Screwdriver
Screwdriver (-) # 2
Screwdriver (-) # 1
ET

holders # 2 and 5

ET

holder # 3

Hexagonal wrench key
Writing brush # 1
Writing
Washing bucket

Head
Adjusting disk DYMEK No.0592-11

Precion screwdriver (-) # 3

maintenance

Cotton bar
Gauze

Pure

alcohol

Oil

(G-S1,

Adhesive (Neji-Iock green)

(+)

# 1

brush'

# 2

cleaning disk

Table

parts

Name

Plus

guard

of

Yes

"

"

"

"
"
"

"

1.5

"

"

"

"

"

"

"

3-9

List

of

maintenance

part Commercial availability

tools

Yes

"

"

SG)

"
"

C)

List

of

measuring

Table

instruments

Table

3-10

List

of

maintenance

Measuring instrument

FDD

controller
Oscilloscope (2-channel)
Frequency counter

3-11

List

of

measuring

parts

instruments

3-10

CHAPTER 4

REPAIRS

CONTENTS

4.1

Repairs ............................................................................................................. 4-1

4.2

Repair

4.2.1 Tools and Instruments ..........................................................................

4.2.2 Test Items ..............................................................................................

4.3 Soldering.........................................................................................................

4.3.1 Parts Removal and Installation ...................... : ......................................

4.3.2 Soldering ...............................................................................................

4.3.3 Unrepairable. ................................... ................................... ................

4.3.4

4.3.5 Terms .....................................................................................................

Tools

and

Instruments

After

Repairs ............. : ............................................................................

.......................................................................

...

4-2
4-2
4-2
4-3
4-3

4-3
4-5
4-5
4-6

4.1

Repairs

Before
(1)

(2) Circuits

(3) Soldering

starting

Static

• Human bodies carry
charge touches circuit elements
elements. Before starting repairs,
that

•

When
contact

ers, and then connect

• Even

teries.
wait

•

Follow

Refer

repairs

electricity

the

static generated by

you may have in

using

an

the conductive

if

the

power

When

conducting a continuity

for

about

the

same procedure

to

the section on soldering before making repairs on the circuit boards.

the

oscilloscope

part

it

to

switch

30

seconds before

body.

the GND terminal on

is pushed off,

with

touch

or

other

of

the

ground terminal

starting

when

replacing

friction

his fingers,

the case

instrument

the

RAMs and

test

on circuits,
the

test.

circuit

of

the clothes, etc.

for

exemple, the static can break

cover

with

both

hands

whose

the

ground terminal

with

the

ci:J~ing

ci'"

;;t

board.

some

of

disconnect

elements on

of

the

the ICs are backed up

the

battery

the

control

If

a man

to

discharge

must

0)(-10

circuit

with

a static

down

the

be grounded,

or

your

by

the

connector

board.

the

static

fing-

bat-

and

4-1

4.2

4.2.1.

Repair

Tools

Tools

and

Instruments

and

Instruments

NO.

Tool/Instruments

.

1 Oscilloscope

Digital voltmeter 5V range, 3 digits

2

.Multi-tester

3

Electric soldering iron

4

Solder

wick

5

Nippers Midishure

6

Philips screwdriver No.2

7

Tweezers

8

ET

9
10
11
12

13

holder

ET

holder

ET

holder No.2

Philips precision screwqriver
set

Regular precision screw­driver set

(or pump)

No.

1.2

No.1

.5

50

Resistance
100V

made by
100
MM
ETH
ETH1.5
ETH

Spec.

MHz 2-channel

1 5W,

80W

1178

EPE

mm .

125

mm

1.2

2

Use

Control
Battery voltage measurement
Continuity test. element check
Coantrol circuit board repair
Removing (unsoldering) elements

from circuit board
Removing (unsoldering)

elements from circuit board

FDD
FDD
FDO
FOO

FDD

circuit board repair

SO-321 repair
SO-321
SO-321 repair
SO-321 repair Yes

SO-321 repair

r~pair

Commercial

available

Yes
Yes
Yes
Yes
Yes

Yes,

Yes
Yes
Yes
Yes
Yes

Yes

14

Pliers
Brush (medium)

15

Brush (fine)

16

Tension gauge

17
18

Solder
Safety goggles

19

Gloves

20

No.O

200g

Table

FDO

SO-321 repair

FDO

SO-321 repair

FDD

50-321

FDD

50-321
Control
Protection during soldering and

use

of

Soldering Yes

repair
repair Yes

circuit board repair

oil, grease, chemicals Yes

4-1

Yes
Yes
Yes

Yes
Yes

4.3

Soldering

4.3.1 Parts Removal and Installation

(1)

When

leads

due

removing an

with

nippers and unsolder the part. (Reason: To prevent lengthening

to

heat absorption by

Ie

or

transistor

the

from a circuit

part.)

board,

it

is necessary,

as

a rule,

of

solder

to

cut

off

melting

its

time

(2) Solder parts as quickly as possible.

vent

the

parts

from

overheating. (Reason:- To

(3)

When

removing parts, remove the solder adhering

the

leads

without

using undue force. (Reason:

printed pattern can be stripped.

(4)

When

(5)

installing parts,

will

not

contact

the

back)

When

install a register on a

other

be

lands

the circuit board surface. (Reason:
of

the

parts)

(6)

When

4.3.2

shortest

•

If

a long

• Do

not

•

Wind

Soldering

using a

wire

for

route, select

wire

must

lay a

wire

the

wire

around

other
be used,

parallel

(1) Through-hole soldering

a)

Solder part leads as shown in
45°

to

the

land.)

careful

on

the back

of

circuit

repair, make

route.

bond

to

a printed pattern

the

part lead.

the

In

some cases, a cooling agent may have

protect

the

lead bending direction and lead length so

of

the

circuit

board; make sure

To

protect

it

as

it

to

center

the

short

as possible. If the leads

the

circuit

of

the

the

parts and circuit board)

to

the

through-holes and lands, and remove

If

the

leads are

forcibly

board. (Reason: To prevent

that

the parts are

circuit

board

from

damage due

board surface

over

a long distance. (Reason: To prevent noise)

below

sketch. (Solder builds up

with

to

be used

to

pulled out, the lands

that

the

short

circuit

not

in

direct

contact

to

the heating

of

other

parts stand in

an epoxy adhesive.

about

30'

pre-

or

leads

on

with

the

to

Excessive

Correct

Fig.

4-3

~-1

Not

enough

Lead

of

part

-Circuit

board

b)

Through-holes

must

be fully filled

with

solder.

c)

x

• Through-hole
with

Leads

must

solder.

be

of

proper

not

x X X

-]

• Lead end
through-hole bent.

Must

be

more than

filled.

~[r-----]rr~]

must

be

out

3/4

~

fully filled

length, and clear

of

• Leads

• Correct

Fig.

must

o

4-2

of

not

other

• Through-hole
pinholes.

land.

normally

x

[.------

be

• Leads

must

must

be

not

free

be

of

too

long.

(2) Parts

Installation

Correct

@

Parts must be installed parallel
(Allowable limit: 30')

to

the circuit board surface.

Fig.

Fig.

4-3

@)

Parts

must

(to prevent shortcircuit

4-4

Parts must be clear

not

be

too

far away

with

other parts).

of

the circuit board.

from

the circuit board surface

4-4

(3)

Wire

Not

wound enough

•

Wind

•

Wire
half

connection

wire

more than

ends

must

the

land length.

Correct

~-~

3/4

of

a turn

be covered

to a point

Wound

too

'III

Fig.

4-5

or

about a turn around leads

near the land. Exposed wire ends

much

(lC

pins) .

Not

wound

must

be less than one

4.3.3 U nrepairable

Dispose
repairs are attemted.

• Through-hole

• Peeled land

• Peeled printed pattern

• Burnt

• Cracked

of

circuit

* Replace the

4.3.4

After

Repairs

Take

the

following

• Completely

•

If

patterns are touched

•

Wipe

the

• Dry.

*

If

the above steps are

which

causes troubles.

the

following

with

board

circuit

circuit

wipe

connectors clean, and apply a

peeled

board

board

steps

off

without

after

the

flux

by

not

repairing because quality and durability problems remain even

copper

itself

hand,

taken,

lining

if

it

has any

repairing (soldering).

from

soldered

wipe

the

of

the

above defects.

points

with a brush

them

clean.

contact

patterns can corrode due

lubricant

where

or

the

necessary.

to

oxidation,

if

like.

4-5

4.3.5

Terms

Enlarged view -= Land

Through-hole

Fig.4.6

~

Circuit board

Fig.

4.7

Cross

\.+.-------------

Parts leads go

Front

of

1!::::r==:~==c:J

Section

into

the through-holes

Cicuit

Board

Pr.inted pattern

t-'~-----~-:'-:'--ThrOUgh-hOle

Printed pattern

of

Circuit

Board

Land

(Copper

copper)

Printed pattern

shown

at

left.

or

solder-coated

4-6

CHAPTERS

Q1

OGMS

CONTENTS

5.1

Guideline

5.2

Check-out

5.3

Unit

5.3.1

5.3.2 Q 1 OSYM board entry table ................................................................. 5-21

5.3.3

5.3.4 CRT drive

5.3.5 Keyboard

5.3.6 FDD unit level troubleshooting guideline table ..................................

for

Troubleshooting

Procedure

Troubleshooting

Q1

OPS

board entry table ....................................................................

Q1

OGMS board entry table .................................................................

.....................................................................................

...................................................................................

unit

entry table ................................................................... 5-81

unit

entry table ....................................................................

......................................................... , .............

BOARD

5-1

5-2

5-1

5-10

5-62

5-90
5-95

0

5.1

Guideline

for

Troubleshooting

Troubleshooting is

troubleshooting

1 . Check

?.

out

Purpose:
Level:

Unit

troubleshooting
Purpose:
Level:

Troubleshooting

o As the

sponding units.
(This is done

first

not

easy, because

is easily provided

procedure

Guideline
Replace corresponding units. (Repairable
knowledge.)

Repair individual
Since

technical skill.

for

flowchart

troubleshooting

Method

step( use the check

In

this

case, be sure

to

distingwish

o As the second step, replace

flowchart

Notes

or

1:

2:

table

When

replaced
When
first

entry

of

faults.

a checking item appears

without

the

troubleshooting

and restart the procedure.

symptoms

by

the

following

troubleshooting

faulty

unit

is made

out

procedure and perform

to

check again

the

fault

from

the

defective element in the corresponding

checking,

the

procedure becmes indefinite halfway, be sure

differ

according

two

means:

for

faults

with

at

part level.

at

part level,

that

those caused

in

the

flowchart,

new

part

or

indefinite symptoms.

by

persons

it

requires deep knowledge and high

troubleshooting

the replaced

by

contact

unit

may be damaged again.

to

the faulty parts. A guide line

who

have a basic mechanical

by

replacing

unit

is

not

defective.

failure

of

connectors.)

unit

according

be sure

to

do

it.

If a part

to

the

to

the

or

return

corre-

unit

unit

to

for

is

the

Step

1

Check-out
procedure

Troubleshooting by
replacing the cor­responding unit.

Step

2

Unit

trouble-

shooting

Troubleshooting at
part

flowchart

level.

5-1

5.2

Check-out

START

Turn on the
switch.

Procedure

power

Adjust

the sub bright-

ness control

of

CRT.

Connect

the

securely.

y

cable

.y

Insert the diskette
containng

the

system

Replace

the block.

5·2

Measure the supply

voltage

at vltage check

terminal

eN

11

Q10SYM board.

on

Y

N

Y

Replace fuse F 1 .

Replace the

board.

Q1

OPS

N

Y

Replace the

LED.

Y

5·3

Disconnect the cable
connected
unit

eN7

from

on

Ql

to

the FDD

eN6

and

OSYM board.

Execute
program.

the

diagnqstic

N

• Remove the
if it

is mounted.

•

If

the

short-circuit
corrected as a
replace

the

fuse

F1, arid then chec
again according
check

out

Q 1 OSYM board.

Replace

option

is

result,

option

and

to

the

procedure.

N

Y

Replace the FDD unit.

Replace

Ql

OSYM board.

Replace

Ql

OSYM board.

Check again according
to

the

check

procedure.

out

5-4

FDD

fails t read the

floppy disk contents.

N

Perform the read/write

check

of

the floppy disk.

floppy disk.

Defective

Do

the check out
procedure again
a normal floppy disk.

with

FDD reads

(No sound is heard.)

no

contents.

5-5

FDD

fails to read the

floppy disk contents.

Check the supply voltage.

y

Replace the

in-use lamp.

y

Replace drives A and B
the FDD signal cable CN7.

the

Insert
check
drive

floppy disk and

if

it

is read

B.

of

with

y

The

floppy

disk is
drive A,
drive

B.

AI

not
but

read

with

read

with

(Defective drive

Replace the drive
A unit.

Check again according
the

check

out

procedure.

5-6

N

to

Floppy disk contents are

not

read

with

FDD

8.

Replace Q 1 OSYM board.

A and

N

Y

Check again according
the check

out

procedure

to

Replace FDD A
and

FDD

B.

Y

N

Replace

the

cable.

cqnnection

5-7

Read

the diagnostic

program.

all the items

Execute
of

the diagnostic program.

Check again according
the

check out procedure.

5·8

to

Replace the keyboard
unit.

Replace

01

OSYM board.

Replace the

CRT

unit.

Replace

01

OGMS board.

Replace

01

OSYM board.

Replace the

FDD

unit.

Replace

01

OSYM board.

Check again according

the

check

out

procedure.

Replace the speaker.

Replace

to

01

OSYM board.

Replace
option.

the

5-9

external

Replace

01

OSYM board.

Replace the RAM leading
into

a defective bit.

Replace

01 OSYM board.

EPSON

EPSON

BUSINESS

EPSON OVERSEAS MARKETING LOCATIONS
EPSON AMERICA,

23155 Kashiwa Court. Torrance, CA. 90505 U.S.A.
Phone:

[phone]

EPSON DEUTSCHLAND GmbH

Am Seestern

Phone:

24

0211-5961001

& INDUSTRIAL INSTRUMENT DIVISION

INC. (L.A.)

Telex:

4000

Dusseldorf 11.

Telex:

CORPORATION

9103496217

F.R.

Germany

8584786

EPSON

Dorland House. 1 F
Phone:

EPSON ELECTRONICS (SINGAPORE) PTE. L TO.

Suite
No
Phone:

U.K.

LTD.

(01)

813.

1.

Maritime Square Telok

2786071/2

388

900-0466/9

8th Floor. World Trade Centre

High

Telex:

Road.

Wembley London

Telex:

8814169

61angah

RS39536

Road.

Singapore

0409

EPSON

EPSON

CORPORATION

Printed

in

83·5-1

Japan