PRV : 50 - 1000 Volts
* High case dielectric strength
* High surge current capability
* Low forward voltage drop
* ldeal for printed circuit board
mounted in the bridge encapsulation
* Epoxy : UL94V-O rate flame retardant
* Terminals : plated .25" (6.35 mm). Faston
* Polarity : Polarity symbols marked on case
* Mounting position : Bolt down on heat-sink with
silicone thermal compound between bridge
and mounting surface for maximum heat
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
C ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
1 ) Thermal resistance from junction to case with units mounted on a 7.5" x 3.5" x 4.6" ( 19 x 9 x 11.8 cm )Al. plate.
Io : 35 Amperes
BR50
0.728(18.50)
* Case : Molded plastic with heatsink integrally
RATING
SYMBOL
0.570(14.50)
0.658(16.70)
0.032(0.81)
0.310(7.87)
0.685(16.70)
0.210(5.30)
0.252(6.40)
0.248(6.30)
0.905(23.0)
0.826(21.0)
φ
Dimensions in inches and ( millimeters )
1.130(28.70)
0.100(2.50)
0.090(2.30)
UNIT
Maximum Recurrent Peak Reverse Voltage V
Maximum RMS Voltage V
Maximum DC Blocking Voltage VDC 50 100 200 400 600 800 1000 Volts
Minimum Avalanche Breakdown Voltage at 100 µA
Maximum Avalanche Breakdown Voltage at 100 µA
Maximum Average Forward Current Tc = 50°C I
Peak Forward Surge Current Single half sine wave
Superimposed on rated load (JEDEC Method) I
Rating for fusing at ( t < 8.3 ms. )
Maximum Forward Voltage per Diode at IF
Maximum DC Reverse Current Ta = 25 °C
at Rated DC Blocking Voltage Ta = 100 °C I
Typical Thermal Resistance (Note 1)
Operating Junction Temperature Range T
Storage Temperature Range TSTG - 40 to + 150
RRM
RMS
VBO(min.) 100 150 250 450 700 900 1100 Volts
VBO(max.) 550 600 700 900 1150 1350 1550 Volts
F(AV)
FSM
2
VF 1.1 Volts
IR 10 µ
R(H)
RθJC
J
50 100 200 400 600 800 1000 Volts
35 70 140 280 420 560 700 Volts
35 Amps.
400 Amps.
660
200
1.5
- 40 to + 150
A2S
µ
°
C/W
A
A
°
C
°
C
RATING AND CHARACTERISTIC CURVES ( ABR3500 - ABR3510 )
FIG.1 - DERATING CURVE FOR OUTPUT FIG.2 - MAXIMUM NON-REPETITIVE PEAK
RECTIFIED CURRENT FORWARD SURGE CURRENT
HEAT-SINK MOUNTING, Tc
7.5"x3.5"x4.6" THK
(19cm x 9cm x 11.8cm)
Al. Finned Plate
TJ = 55 °C
CURRENT, AMPERES
CURRENT, AMPERES
PEAK FORWARD SURGE
8ms SINGLE HALF SINE WAVE
JEDEC METHOD
AVERAGE FORWARD OUTPUT
0 25 50 75 100 125 150 175 1 2 4 6 10 20 40 60 100
CASE TEMPERATURE, ( °C)
NUMBER OF CYCLES AT 60Hz
FIG.3 - TYPICAL FORWARD CHARACTERISTICS FIG.4 - TYPICAL REVERSE CHARACTERISTICS
PER DIODE
TJ = 100 °C
Pulse Width = 300 µs
1 % Duty Cycle
TJ = 25 °C
TJ = 25 °C
FORWARD CURRENT, AMPERES
REVERSE CURRENT, MICROAMPERES
PERCENT OF RATED REVERSE
100 140
VOLTAGE, (%)
0.01
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
FORWARD VOLTAGE, VOLTS
120