Diodes PDR3G User Manual
e3
PDR3G
E
E1
b1
A
A2
A2
D
b2
b1
e
L1
L1
E
b1
D
b2
b1
e
D2
L
E2
L1
LEFT PIN
RIGHT PIN
Note: Pins Left & Right must
be electrically connected
at the printed circuit board.
BOTTOMSIDE
HEAT SINK
W
Features
· Glass Passivated Die Construction
· Low Leakage Current
· High Forward Surge Current Capability
· Lead Free Finish, RoHS Compliant (Note 1)
· "Green" Molding Compound (No Br, Sb)
· Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
· Case: PowerDI
· Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
· Moisture Sensitivity: Level 1 per J-STD-020C
· Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
· Polarity: See Diagram
· Marking: See Page 3
· Weight: 0.095 grams (approximate)
ä
5
3A GLASS PASSIVATED RECTIFIER
PowerDI
ä
PowerDIä5
A
A2
b1
b2
D
D2
E
e
E1
E2
L
L1
W
Min Max
1.05 1.15
0.33 0.43
0.80 0.99
1.70 1.88
3.90 4.05
3.05 NOM
6.40 6.60
1.84 NOM
5.30 5.45
3.55 NOM
0.75 0.95
0.50 0.65
1.20 1.50
Dim
All Dimensions in mm
5
Maximum Ratings
@ TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic Symbol
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (See also figure 4)
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
V
V
V
R(RMS)
I
RRM
RWM
V
R
I
O
FSM
Value
400 V
283 V
3 A
100 A
Thermal Characteristics
Characteristic Symbol Typ Max Unit
Thermal Resistance Junction to Soldering Point
Thermal Resistance Junction to Ambient Air (Note 2)
Thermal Resistance Junction to Ambient Air (Note 3)
Thermal Resistance Junction to Ambient Air (Note 4)
Operating Temperature Range
Storage Temperature Range
Notes: 1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
2. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf. T
3. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf. T
4. Polymide PCB, 2 oz. Copper. Cathode pad dimensions 9.4mm x 7.2mm. Anode pad dimensions 2.7mm x 1.6mm. T
R
R
R
R
T
qJS
qJA
qJA
qJA
T
STG
¾ 2.0 °C/W
75 ¾ °C/W
65 ¾ °C/W
45 ¾ °C/W
j
-65 to +150 °C
-65 to +150 °C
= 25°C
A
= 25°C
A
= 25°C
A
Unit
DS30547 Rev. 7 - 2 1 of 3 PDR3G
PowerDI is a trademark of Diodes Incorporated. www.diodes.com ã Diodes Incorporated
I , INSTANTANEOUS FORWARD CURRENT (A)
F
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
Fig. 1 Typical Forward Characteristics
10
1
100
0
0.2
0.4
0.6
0.8
1.0 1.2
100m
1m
10m
T = 25°C
j
T = 85°C
j
T = 150°C
j
T = -65°C
j
0
80
160
240
400
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
Fig. 2 Typical Reverse Characteristics
320
10n
1n
100n
I , INSTANTANEOUS REVERSE CURRENT (A)
R
T = +125°C
j
T = +150°C
j
T = +85°C
j
T = +25°C
j
T = -65°C
j
C , TOTAL CAPACITANCE (pF)
T
V , REVERSE VOLTAGE (V)
R
Fig. 3 Typical Total Capacitance vs. Reverse Voltage
0
10
20
30
40
0 5
10
15
20
25
30
f = 1 MHz
0
0.75
1.5
2.25
3.75
3.0
0
25
50
75
100
125
150
I , DC FORWARD CURRENT (A)
F
T , AMBIENT TEMPERATURE (°C)
A
Fig. 4 DC Forward Current Derating
Note 2
Note 4
Electrical Characteristics
@ TA = 25°C unless otherwise specified
Characteristic Symbol
Reverse Breakdown Voltage (Note 5)
Forward Voltage
Reverse Leakage Current (Note 5)
Reverse Recovery Time
Notes: 5. Short duration test pulse used to minimize self-heating effect.
V
(BR)R
V
F
I
R
t
rr
Min Typ Max Unit
400 ¾ ¾ V
¾ 0.92 1.15 V
¾¾0.015610
250
mA
¾ 3.0 ¾ ms
Test Condition
IR = 10mA
IF = 3A, TS = 25°C
TS = 25°C, VR = 400V
TS = 125°C, VR = 400V
IF = 0.5A, IR = 1.0A,
Irr = 0.25A
DS30547 Rev. 7 - 2 2 of 3 PDR3G
PowerDI is a trademark of Diodes Incorporated. www.diodes.com
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