Diodes PD3S0230 User Manual

Features
Low Forward Voltage Drop
Fast Switching
Ultra-Small Surface Mount Package
PN Junction Guard Ring for Transient and ESD Protection
Lead Free Finish/RoHS Compliant (Note 1)
"Green" Molding Compound (No Br, Sb)
Ultra-Small Surface Mount Package
PD3S0230
SURFACE MOUNT SCHOTTKY BARRIER DIODE
POWERDI
Mechanical Data
Case: POWERDI®323
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Polarity: Cathode Band
Weight: 0.005 grams (approximate)
Top View
®
323
Ordering Information (Note 2)
Part Number Case Packaging
PDS3S0230-7
Notes: 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
2. For packaging details, go to our website at http://www.diodes.com.
POWERDI
®
323
3000/Tape & Reel
Marking Information
Date Code Key
Year 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015
Code T U V W X Y Z A B C
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
36
YM
PD3S0230
Document number: DS30722 Rev.9 - 2
36 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: T = 2006) M = Month (ex: 9 = September)
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)
θ
(BR)
T
T
O
US FORWAR
C
U
R
RENT
TANT
O
US R
R
C
URR
T
PD3S0230
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage
RMS Reverse Voltage Continuous Forward Current Repetitive Peak Forward Current Non-Repetitive Peak Forward Surge Current @ tp < 10ms I
V V
V
R(RMS
I
RRM RWM
VR
I
FM FRM FSM
30 V
21 V 200 mA 300 mA 600 mA
Thermal Characteristics
Thermal Resistance, Junction to Ambient Air (Note 3) Operating Temperature Range Storage Temperature Range
Electrical Characteristics @T
Reverse Breakdown Voltage (Note 4)
Forward Voltage
Leakage Current (Note 4) Total Capacitance
Reverse Recovery Time
Notes: 3. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com. TA = 25°C.
4. Short duration pulse test used to minimize self-heating effect.
10,000
(A)
1,000
Characteristic Symbol Value Unit
242
-65 to +125
-65 to +150
= 25°C unless otherwise specified
A
R
T
T
STG
JA J
Characteristic Symbol Min Typ Max Unit Test Condition
V
V
I
R
C
t
rr
30
R
F
T
217 280 350 400 485
10.7
240 320 400 500 800
2.0
5.0 ns
V
IRS = 100μA I
= 0.1mA
F
= 1mA
I
F
mV
I
= 10mA
F
= 30mA
I
F
I
= 100mA
F
μA pF
= 25V
V
R
VR = 1.0V, f = 1.0MHz
= 10mA through IR = 10mA
I
F
= 1.0mA, RL = 100Ω
to I
R
100
(uA) EN
10
°C/W
°C °C
D
100
SE
EVE
1
0.1
10
0.01
ANE AN
F
I, INS
1
0.1
0
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
0.2
0.4
0.6
0.8
11.2
Fig. 1 Typical Forward Characteristics
1.4
1.6
ANE
R
I, INS
0.0001
0.001
0
V , INSTANT ANEOUS REVERSE VOLTAGE (V)
R
10
Fig. 2 Typical Reverse Characteristics
20
30
PD3S0230
Document number: DS30722 Rev.9 - 2
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C TOT
CAPACITANC
pF)
C FORWARD C
URR
N
T
T
RAT
T TEMPERATUR
C
P
, FORWARD P
OWER DISSI
PATIO
N
)
PD3S0230
20
0.25
18
E (
16 14
(A)
0.2
E 12 10
8
AL
6
,
T
4
F
I, D
0.1
2
0
10
5
V , DC REVERSE VOLTAGE (V)
R
15 20 25
Fig. 3 T otal Capacitance vs. Reverse Voltage
175
) E (°
150
30
0
025
0.6
(W
0.5
75 100 125
50
T , AMBIENT TEMPERATURE (°C)
A
Fig. 4 DC Forward Current Derating
I
PK
=1 (DC)
I
AV
150
125
100
75
0.4
0.3
0.2
ED AMBIEN
50
, DE
A
25
0102030
V , DC REVERSE VOLTAGE (V)
R
Fig. 5 Op er at i ng Temperature Derating
Notes: 5. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com.
0.1
F
0
0
0.2 I , FORWARD CURRENT (A)
F
0.4
0.6
0.8
Fig. 6 Forward Power Dissipation
Package Outline Dimensions
C
B
D
L
H
L
E
E2
E1
L4
L1
L1
L3
A
PD3S0230
Document number: DS30722 Rev.9 - 2
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POWERDI®323
Dim Min Max Typ
A 2.40 2.60 2.50 B 1.85 1.95 1.90 C 1.20 1.30 1.25 D 0.60 0.70 0.65
E 0.78 0.98 0.88 E1 0.50 0.70 0.60 E2 0.60 1.00 0.80
H 0.08 0.18 0.13
L 0.20 0.40 0.30 L1 L3
⎯ ⎯
1.40
0.20
L4 0.40 0.80 0.60
All Dimensions in mm
November 2011
© Diodes Incorporated
PD3S0230
Suggested Pad Layout
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document o r products described herein in such applica tions shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
www.diodes.com
Y2
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
X1
X2
G
Y1
IMPORTANT NOTICE
LIFE SUPPORT
Dimensions Value (in mm)
G 0.5 X1 2.0 X2 0.8 Y1 0.8 Y2 1.1
PD3S0230
Document number: DS30722 Rev.9 - 2
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November 2011
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