3A ADJUSTABLE LOW VOLTAGE LOW DROPOUT CMOS REGULATOR
Description
The PAM3131 is a 3A CMOS adjustable LDO regulator that features
a low quiescent current, ultra low input, output, and dropout voltages,
as well as over temperature protection. It is available in TO-263 and
PSOP-8 (Exposed Pad) packages. The output voltage is adjustable
from 0.9V to 3.3V. The PAM3131 is stable with a ceramic output
capacitor of 1.0μF or higher.
This family of regulators can provide either a stand alone power
supply solution or act as a post regulator for switch mode power
supplies. They are particularly well suited for applications requiring
low input and output voltages.
Features
• Low-Dropout Regulator Supports Input Voltages Down to 1.4V
• Low Dropout Voltage: 300mV@ 3A
• Output Voltage Adjustable from 0.9V-3.3V
• Stable with a Ceramic Output Capacitor of 1.0μF or Higher
• Low Quiescent Current
• Current Limit
• Over Temperature Shutdown
• Short Circuit Current Protection
• Low Temperature Coefficient
• Standard TO-263 and PSOP-8 (Exposed Pad) Packages
These are stress ratings only and functional operation is not implied. Exposure to absolute maximum ratings for prolonged time periods may
affect device reliability. All voltages are with respect to ground.
Parameter Rating Unit
Input Voltage 4.0 V
Output Pin Voltage
Operation Temperature Range -40 to +85 °C
Operation Junction Range -40 to +125 °C
Maximum Output Current
Storage Temperature -65 to +150 °C
Maximum Junction Temperature 150 °C
Soldering Temperature 300, (5sec) °C
The PAM3116 family of low-dropout (LDO) regulators have several features that allow them to apply to a wide range of applications. The family
operates with very low input voltage and low dropout voltage (typically 300mV at full load), making it an efficient stand-alone power supply or
post regulator for battery or switch mode power supplies. The 1.5A output current make the PAM3116 family suitable for powering many
microprocessors and FPGA suppl ies. The PAM3116 family also has low output noise (typically 50μVRMS with 4.7μF output capacitor), making it
ideal for use in telecom equipment.
External Capacitor Requirements
A 4.7μF or larger ceramic input bypass capacitor, connected between VIN and GND and located close to the PAM3116, is required for stability. A
4.7µF minimum value capacitor from V
additional 1 0μF or larger, low ESR capacitor is recommended at the output. A higher-value, low ESR output capacitor may be necessary if large,
fast-rise-time load transients are anticipated and the device is located several inches from the power source, especially if the minimum input
voltage of 2.5V is used.
Regulator Protection
The PAM3116 features internal current limiting, thermal protection and short circuit protection. During normal operation, the PAM3116 limits
output current to about 2.5A. When current limiting engages, the output voltage scales back linearly until the over current condition ends. While
current limiting is designed to prevent gross device failure, care should be taken not to exceed the power dissipation ratings of the package. If the
temperature of the device exceeds +150°C, thermal-protection circuitry will shut down. Once the device has cooled down to approximatel y +40°C
below the high temp trip point, regulator operation resumes. The short circuit current of the PAM3116 is about 0.7A when its output pin is shorted
to ground.
Thermal Information
The amount of heat that an LDO linear regulator generates is:
All integrated circuits have a maximum allowable junction temperature (T
must design the operating environment so that the operating junction temperature (T
). The two main environmental variables that a designer can use to improve thermal performance are air flow and external heat sinks.
(T
J(MAX)
The purpose of thi s information is to aid the designer in determining the proper operating environment for a linear regulator that is operating at a
specific power level.
In general, the maximum expected power (P
Where:
• V
• V
• I
• I
For most LDO regulators, the quiescent current is insignificant compared to the average output current; therefore, the term V
neglected. The operating junction temperature is computed by adding the ambient temperature (T
regulator's power dissipation. The temperature rise is computed by multiplying the maximum expected power dissipation by the sum of the
thermal resistances between the junction and the case R
resistances are measures of how effectively an object dissipates heat. Typically, the larger the device, the more surface area available for power
dissipation so that the object’s thermal resistance will be lowers.
()
−=
IVVP
OOIND
is the average input voltage.
I(AVG)
is the average output voltage.
O(AVG)
is the average output current.
O(AVG)
is the quiescent current.
(Q)
to GND is also required. To improve transient response, noise rejection, and ripple rejection, an
O
) above which normal operation is not assured. A system designer
J(MAX)
) does not exceed the maximum junction temperature
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