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Description
The PAM2800 is a high power white LED driver with 350mA constant
rated source current. It features high efficiency and low quiescent
current, making it ideal for battery powered applications.
Features
• High Efficiency 92%
• Up to 350mA Constant Source Current
• Low Quiescent Current: Typ. 65µA
• 0.5µA Shutdown Current
• Short Circuit Protection
• Open Load LED Protection
• Thermal Protection
• Space Saving Package SOT23-5
• Pb-Free Package
Typical Applications Circuit
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Pin Assignments
Applications
• High Power White LED Driver
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PAM2800
HIGH POWER WHITE LED DRIVER
PAM2800
Document number: DSxxxxx Rev. 1 - 3
Figure 1
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PAM2800
Pin Description
Pin
Number
1
2
3
4
5 VOUT Output
Absolute Maximum Ratings (@T
These are stress ratings only and functional operation is not implied. Exposure to absolute maximum ratings for prolonged time periods may
affect device reliability. All voltages are with respect to ground.
Input Voltage 6 V
Output Current 350 mA
Output Pin Voltage
Lead Soldering Temperature 300, (5sec) °C
Storage Temperature -65 to +150 °C
Recommended Operating Conditions (@T
Maximum Supply Voltage 5.5 V
Junction Temperature -40 to +125
Operation Temperature -40 to +85
Pin
Name
VIN Input
GND Ground
EN Chip Enable (Active High)
FB Feedback
Parameter Rating Unit
GND -0.3 to V
Parameter Rating Unit
Function
= +25°C, unless otherwise specified.)
A
+0.3
IN
= +25°C, unless otherwise specified.)
A
V
°C
Thermal Information
Parameter Symbol Package Max Unit
Thermal Resistance (Junction to Case)
Thermal Resistance (Junction to Ambient)
Internal Power Dissipation
Electrical Characteristics (@T
Parameter Symbol Test Conditions Min Typ Max Units
Input Voltage
Output Current
Quiescent Current
Efficiency 90 92 %
Over Temperature Shutdown OTS
Over Temperature Hysteresis OTH
V
IN
I
O
I
Q
JC
JA
P
D
= +25°C, VIN = 3.7V, CIN = 1µF, CO = 2.2µF, unless otherwise specified.)
A
300 mA
No Load 65 90 µA
I
= 1mA
O
I
= 1mA
O
PAM2800
Document number: DSxxxxx Rev. 1 - 3
SOT23-5 130
SOT23-5 250
SOT23-5 400 mW
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°C/W
5.5 V
150 °C
30 °C
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Typical Performance Characteristics
(@TA = +25°C, CIN =1µF, CO = 2.2µF, R1 = 62k, R2 = 33k, RS = 0.22, unless otherwise specified.)
PAM2800
PAM2800
Document number: DSxxxxx Rev. 1 - 3
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(
)
(
)
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PAM2800
Application Information
In the typical application (see Figure 1), the LED current will come to constant current level little by little after the device is powered. A 62
resistor is recommended for R1, the value for R2 should be adjusted around 33 due to LED forward voltage from lot-to-lot or brand-to-brand.
Power Dissipation and Thermal Consideration
Thermal protection limits power dissipation in the PAM2800. When the operation junction temperature exceeds +150°C, the OTP (Over
Temperature Protection) starts the thermal shutdown and turns the pass transistor off. The pass transistor resumes operation after the junction
temperature drops below +120°C.
For continuous operation, the junction temperature should be maintained below +125°C. The power dissipation is defined as:
The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surrounding airflow and temperature
difference between junction and ambient. The maximum power dissipation can be calculated by the following formula:
()
*
VVP
−=
*
+−=
I
VI
GNDINOOUTIND
/
θ
TTP
A)MAX(J)MAX(D
JA
Where T
junction to the ambient.
For example, as
dissipation for SOT-23 package at T
To calculate the junction temperature of the PAM2800 SOT-23 package, if we use input voltage V
the case temperature T
PAM2800
Document number: DSxxxxx Rev. 1 - 3
is the maximum operation junction temperature +125°C. TA is the ambient temperature, and is the thermal resistance from the
J(MAX)
is +250°C/W for SOT-23, based on the standard JEDEC 51-3 for a single layer thermal test board, the maximum power
JA
= +25°C can be calculated by following formula:
A
W4.0250/C25C125
P
)MAX(D
= 40°C measured by the thermal couple while operating, the power dissipation is defined as:
A
()
P
D
=°−°=
mW360A70*V4mA300*V8.2V4
≈μ+−=
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= 4V at an output current IO = 300mA and
IN
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Ordering Information
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PAM2800
Part Number Output Current Marking Package Type Standard Package
PAM2800AABR 350mA EGAYW SOT23-5 3000 Units/Tape&Reel
Marking Information
PAM2800
Document number: DSxxxxx Rev. 1 - 3
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Package Outline Dimensions (All dimensions in mm.)
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PAM2800
PAM2800
Document number: DSxxxxx Rev. 1 - 3
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PAM2800
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and
any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or
systems.
Copyright © 2012, Diodes Incorporated
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IMPORTANT NOTICE
LIFE SUPPORT
PAM2800
Document number: DSxxxxx Rev. 1 - 3
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