The AP7175 is a 3.0A ultra low-dropout (LDO) linear regulator that
features an enable input and a power-good output.
The enable input and power-good output allow users to configure
power management solutions that can meet the sequencing
requirements of FPGAs, DSPs, and other applications with different
start-up and power-down requirements.
The AP7175 features two supply inputs, for power conversion supply
and control. With the separation of the control and the power input
very low dropout voltages can be reached and power dissipation is
reduced.
A precision reference and feedback control deliver 1.5% accuracy
over load, line, and operating temperature ranges.
The AP7175 is available in SO-8EP and MSOP-8EP package with an
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exposed PAD to reduce the junction to case resistance and extend
the temperature range it can be used in.
• Halogen and Antimony Free. “Green” Device (Note 3)
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Feedback to set the output voltage via an external resistor divider between V
Power Output Pin. Connect at least 10µF capacitor to this pin to improve transient response and
required for stability. When the part is disabled the output is discharged via an internal pull-low
MOSFET.
Power Input Pin for current supply. Connect a decoupling capacitor (10µF) as close as possible to
the pin for noise filtering.
BIAS supply for the controller, recommended 5V. Connect a decoupling capacitor (1µF) as close
as possible to the pin for noise filtering.
Power Good output open drain to indicate the status of V
pulled low when the voltage is outside the limits, during thermal shutdown and if either V
go below their thresholds.
Enable pin. Driving this pin low will disable the part. When left floating an internal current source will
pull this pin high and enable it.
Note: 4. Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may
be affected by exposure to absolute maximum rating conditions for extended periods of time.
Power Dissipation (SO-8EP) 1.7 W
Power Dissipation (MSOP-8EP) 1.5
Maximum Junction Temperature 150 °C
Storage Temperature -65 to +150 °C
Maximum Lead Soldering Temperature, 10 Seconds 260 °C
-0.3 to V
CNTL
+0.3
V
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Recommended Operating Conditions(@T
= +25°C, unless otherwise specified.)
A
Symbol Parameter Min Max Unit
V
V
CNTL
VIN V
V
V
OUT
I
V
OUT
C
V
OUT
E
ESR of V
SRCOUT
TA
TJ
CNTL
IN
OUT
OUT
OUT
Ambient Temperature -40 +85 °C
Junction Temperature -40 +125
Symbol Parameter Test Conditions
THERMAL CHARACTERISTIC
Notes: 6. Device mounted on 2"*2" FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground
plane.
7. Device mounted on 2"*2" FR-4 substrate PC board, 2oz copper,with minimum recommended pad layout.
Thermal Resistance Junction-to-Ambient
JA
Thermal Resistance Junction-to-Ambient
JC
= 1.2V and TA = -40 to +85°C, @TA = +25°C, unless otherwise specified.)