Diodes AP65200 User Manual

C
C
Y
%
LIGHT LOAD IMPROVED 2A SYNCH DC/DC BUCK CONVERTER
high
Pin Assignments
Applications
 Gaming Consoles  Flat Screen TV Sets and Monitors  Set Top Boxes  Distributed Power Systems  Home Audio  Consumer Electronics  Network Systems  FPGA, DSP and ASIC Supplies  Green Electronics
Description
The AP65200 is a 340kHz switching frequency external compensated
synchronous DC/DC buck converter. It has integrated low R
DSON
and low side MOSFETs.
The AP65200 enables continues load current of up to 2A with
efficiency as high as 95%.
The AP65200 implements an automatic custom light load
efficiency improvement algorithm.
The AP65200 features current mode control operation, which enables
fast transient response times and easy loop stabilization.
The AP65200 simplifies board layout and reduces space
requirements with its high level of integration and minimal need for
external components, making it ideal for distributed power
architectures.
The AP65200 is available in a standard Green SO-8, MSOP-8EP,
NEW PRODUCT
U-DFN2626-10 and SO-8EP package and is RoHS compliant.
Features
 VIN 4.7V to 18V  2A Continuous Output Current, 3A Peak  Efficiency Up to 95% Automated Light Load improvement  V  340kHz Switching Frequency  External Programmable Soft-Start  Enable Pin  OCP and Thermal Protection  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3)
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
Adjustable to 0.925 to 16V
OUT
Typical Applications Circuit
100
5V
IN
95
P65200
)
(
IEN
EFFI
AP65200
Document number: DS35548 Rev. 6 - 2
12V
90
85
80
75
IN
LOAD CURRENT (A)
Effici ency vs . Load Current
V = 3.3V
OUT
2.01.80.20.0 0.60.4 1.00.8 1.41.2 1.6
January 2014
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Figure 1 Typical Application Circuit
© Diodes Incorporated
Pin Descriptions
Pin Number
Pin
Name
BS 1 2
IN 2 3
SW 3 4
GND 4 5. 6 Ground
FB 5 7
COMP 6 8
SO-8
SO-8EP
MSOP-8EP
NEW PRODUCT
EN 7 9
SS 8 10
AGND NA 1 Analog GND
PAD Exposed PAD for thermal performance improvement connect to GND
Functional Block Diagram
U-DFN2626-10
P65200
Function
High-Side Gate Drive Boost Input. BS supplies the drive for the high-side N-Channel MOSFET a
0.01µF or greater capacitor from SW to BS to power the high side switch.
Power Input. IN supplies the power to the IC, as well as the step-down converter switches. Drive IN with a 4.7V to 18V power source. Bypass IN to GND with a suitably large capacitor to eliminate noise on the input to the IC. See Input Capacitor.
Power Switching Output. SW is the switching node that supplies power to the output. Connect the output LC filter from SW to the output load. Note that a capacitor is required from SW to BS to power the high-side switch.
Feedback Input. FB senses the output voltage and regulates it. Drive FB with a resistive voltage divider connected to it from the output voltage. The feedback threshold is 0.925V. See Setting the Output Voltage.
Compensation Node. COMP is used to compensate the regulation control loop. Connect a series RC network from COMP to GND. In some cases, an additional capacitor from COMP to GND is required. See Compensation Components.
Enable Input. EN is a digital input that turns the regulator on or off. Drive EN high to turn on the regulator; low to turn it off.
Attach EN to IN with a 100k pull up resistor for automatic startup. With this configuration an internal voltage clamp ensures that a safe voltage is set for Enable not to exceed the absolute maximum voltage for this pin.
Soft-Start Control Input. SS controls the soft-start period. Connect a capacitor from SS to GND to set the soft-start period. A 0.1µF capacitor sets the soft-start period to 15ms. To disable the soft­start feature, leave SS floating.
AP65200
Document number: DS35548 Rev. 6 - 2
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Absolute Maximum Ratings (Note 4) (@T
Symbol Parameter Rating Unit
VIN
VSW
VBS
VFB
VEN
V
COMP
TST
TJ
TL
ESD Susceptibility (Note 5)
HBM Human Body Model 1.5 kV
MM Machine Model 150 V
Notes: 4. Stresses greater than the 'Absolute Maximum Ratings' specified above may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time.
5. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when
NEW PRODUCT
handling and transporting these devices.
Supply Voltage
Switch Node Voltage
Bootstrap Voltage
Feedback Voltage -0.3V to +6.0 V
Enable/UVLO Voltage -0.3V to +6.0 V
Comp Voltage -0.3V to +6.0 V
Storage Temperature -65 to +150 °C
Junction Temperature +160 °C
Lead Temperature +260 °C
= +25°C, unless otherwise specified.)
A
-0.3 to +20
-1.0 to V
V
-0.3 to VSW +6.0
SW
IN
+0.3
Thermal Resistance (Note 6)
P65200
V
V
V
Symbol Parameter Rating Unit
SO-8 119
θJA
θJC
Note: 6. Test condition: SO-8: Device mounted on 1"x1" FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.
SO-8EP: Device mounted on 2"x2" FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout and thermal vias to bottom layer GND
plane. MSOP-8EP: Device mounted on 2"x2" FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout. U-DFN2626-10: Device mounted on 2"x2" FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.
Recommended Operating Conditions (Note 7) (@T
Symbol Parameter Min Max Unit
VIN
TA
Note: 7. The device function is not guaranteed outside of the recommended operating conditions.
AP65200
Document number: DS35548 Rev. 6 - 2
Supply Voltage
Operating Ambient Temperature Range
Junction to Ambient
Junction to Case
= +25°C, unless otherwise specified.)
A
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SO-8EP 40
MSOP-8EP 48
U-DFN2626-10 53
SO-8 31
SO-8EP 9
MSOP-8EP 9
U-DFN2626-10 8.5
4.7
-40
18.0 V
+85 °C
°C/W
°C/W
January 2014
© Diodes Incorporated
Electrical Characteristics (@T
Symbol Parameter Test Conditions Min Typ Max Unit
IIN
IIN
R
DS(ON)1
R
DS(ON)2
I
LIMIT
I
LIMIT
Shutdown Supply Current
Supply Current (Quiescent)
High-Side Switch On-Resistance (Note 8) 130 m
Low-Side Switch On-Resistance (Note 8) 130 m
HS Current Limit Minimum Duty Cycle 4.4 A
LS Current Limit From Drain to Source 0.9 A
High-Side Switch Leakage Current
AVEA
Error Amplifier Voltage Gain (Note 8)
GEA Error Amplifier Transconductance
COMP to Current Sense Transconductance
Oscillator Frequency
Fold-back Frequency
Maximum Duty Cycle
Minimum On Time 130 ns
Feedback Voltage
NEW PRODUCT
GCS
FSW
FFB
D
MAX
TON
VFB
Feedback Overvoltage Threshold 1.1 V
V
EN_RISING
EN Rising Threshold 0.7 0.8 1.2 V
EN Lockout Threshold Voltage 2.2 2.5 2.7 V
EN Lockout Hysteresis 220 mV
INUV
INUV
V
VTH
VIN Under Voltage Threshold Hysteresis
HYS
Under Voltage Threshold Rising
IN
Soft-Start Current
Soft-Start Period
TSD
Note: 8. Guaranteed by design.
Thermal Shutdown (Note 8) 160 °C
AP65200
Document number: DS35548 Rev. 6 - 2
= +25°C, VIN = 12V, unless otherwise specified.)
A
VEN = 0V
VEN = 2.0V, VFB = 1.0V
V
= 0V, VSW = 0V, V
EN
SW
=12V
800 V/V
I
= ±10µA
C
2.8 A/V
V
= 0.75V
FB
V
= 0V
FB
VFB = 800mV
TA = -40°C to +85°C
3.80 4.05 4.40 V
250 mV
V
= 0V
SS
C
= 0.1µF
SS
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P65200
0.3 3.0 µA
0.6 1.5 mA
0 10 μA
1000 µA/V
300 340 380 kHz
0.30
90 %
900 925 950 mV
6 μA
15 ms
fSW
January 2014
© Diodes Incorporated
O
Y
C
R
R
OUTPU
T VOLTAG
F
C
OLT
G
Typical Performance Characteristics (@T
0.40
= +25°C, VIN = 12V, V
A
= 3.3V, unless otherwise specified.)
OUT
0.024
P65200
NEW PRODUCT
0.35
0.30
0.25
0.20
0.15
0.10
QUIESCENT SUPPLY CURRENT (mA)
0.05
0.00 0 5 10 15 20
Quiescent Supply Current vs. Input Voltage
4.65
4.60
4.55
4.50
4.45
4.40
INPUT VOLTAGE (V)
0.022
0.020
0.018
ENT (µA)
U
0.016
0.014
0.012
0.010
WN SUPPL
0.008
SHUTD
0.006
0.004 0 5 10 15 20
3.330
3.329
3.328
3.327
E (V)
3.326
3.325
Shutdown Supply Current vs. Input Voltage
INPUT VOLTAGE (V)
V = 12V
IN
4.35
4.30
CURRENT LIMIT (A)
4.25
4.20
4.15
-50 0 50 100 TEMPERATURE (°C)
Current Limit vs. Temperature
0.932
0.930
0.928
E (V)
0.926
A
0.924
K V
0.922
EEDBA
0.920
0.918
3.324
3.323
3.322
3.321
3.320
4.75 9.75 14.75 19.75 24.75
344
343
342
341
340
339
338
OSCILLATOR FREQUENCY (KHZ)
337
INPUT VOLTAGE (V)
Line Regulation
0.916
-50 0 50 100
AP65200
Document number: DS35548 Rev. 6 - 2
TEMPERATURE (°C)
Feedback Voltage vs. Temperature
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336
-50 0 50 100 TEMPERATURE (°C)
Oscillator Frequency vs. Temperature
© Diodes Incorporated
January 2014
F
FIC
N
C
Y
F
FICIENCY
C
C
Y
Typical Performance Characteristics (cont.) (@T
95
5V
85
IN
12V
IN
75
(%)
65
IE
E
55
18V
IN
= +25°C, VIN = 12V, V
A
100
95
(%)
90
85
E
= 3.3V, unless otherwise specified.)
OUT
5V
IN
12V
IN
18V
IN
P65200
80
75
LOAD CURRENT (A)
Efficiency vs. Load Current
V = 3.3V
OUT
2.01.80.20.0 0.60.4 1.00.8 1.41.2 1.6
NEW PRODUCT
45
35
100
1.0
1.20.00.20.40.6 1.82.01.4 1.60.8
LOAD CURRENT (A)
Efficiency vs. Load Current
V = 1.2V
OUT
95
12V
IN
90
18V
IN
(%)
IEN
EFFI
85
80
75
70
65
60
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 2.01.81.6 LOAD CURRENT
Efficiency vs. Load Current
V = 5V
OUT
AP65200
Document number: DS35548 Rev. 6 - 2
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© Diodes Incorporated
Typical Performance Characteristics (cont.)
(@TA = +25°C, VIN = 12V, V
Steady State Test 2A
= 3.3V, L = 3.3µH, C1 = 22µF, C2 = 47µF, unless otherwise specified.)
OUT
Startup Through Vin No Load
P65200
Startup Through Vin 2A Load
NEW PRODUCT
Time-2µs/div
Load Transient Test 0.15 to 2A
Time-500µs/div
Short Circuit Test
Time-20µs/div
Load Transient Test 2A to 0.15A
Time-5ms/div
Shutdown Through Vin no load
Time-20ms/div
Short Circuit Recovery
Time-50µs/div
Time-5ms/div
Shutdown Through Vin 2A
Time-100µs/div
Load Transient Test 0.15 to 2A
Time-20µs/div
Time-20µs/div
AP65200
Document number: DS35548 Rev. 6 - 2
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Application Information
Theory of Operation
The AP65200 is a 2A current mode control, synchronous buck regulator with built in power MOSFETs. Current mode control assures excellent
line and load regulation and a wide loop bandwidth for fast response to load transients. The Figure 1 depicts the functional block diagram of
AP65200.
The operation of one switching cycle can be explained as follows. At the beginning of each cycle, HS (high-side) MOSFET is off. The error
amplifier (EA) output voltage is higher than the current sense amplifier output, and the current comparator’s output is low. The rising edge of the
340kHz oscillator clock signal sets the RS Flip-Flop. Its output turns on HS MOSFET. The current sense amplifier is reset for every switching
cycle.
When the HS MOSFET is on, inductor current starts to increase. The current sense amplifier senses and amplifies the inductor current. Since
the current mode control is subject to sub-harmonic oscillations that peak at half the switching frequency, ramp slope compensation is utilized.
This will help to stabilize the power supply. This ramp compensation is summed to the current sense amplifier output and compared to the error
amplifier output by the PWM comparator. When the sum of the current sense amplifier output and the slope compensation signal exceeds the
EA output voltage, the RS Flip-Flop is reset and HS MOSFET is turned off.
For one whole cycle, if the sum of the current sense amplifier output and the slope compensation signal does not exceed the EA output, then the
falling edge of the oscillator clock resets the Flip-Flop. The output of the error amplifier increases when feedback voltage (VFB) is lower than the
NEW PRODUCT
reference voltage of 0.925V. This also increases the inductor current as it is proportional to the EA voltage.
If in one cycle the current in the power MOSFET does not reach the COMP set current value, the power MOSFET will be forced to turn off. When
the HS MOSFET turns off, the synchronous LS MOSFET turns on until the next clock cycle begins. There is a “dead time” between the HS turn
off and LS turn on that prevents the switches from “shooting through” from the input supply to ground.
The voltage loop is compensated through an internal transconductance amplifier and can be adjusted through the external compensation
components.
Enable
Above the ‘EN Rising Threshold’, the internal regulator is turned on and the quiescent current can be measured above this threshold. The enable
(EN) input allows the user to control turning on or off the regulator. To enable the AP65200, EN must be pulled above the ‘EN Lockout Threshold
Voltage’ and to disable the AP65200, EN must be pulled below ‘EN Lockout Threshold Voltage - EN Lockout Hysteresis’
(2.2V - 0.22V = 1.98V).
Automated No-Load and Light-Load Operation
The AP65200 operates in Light load high efficiency mode during light load operation. The advantage of this light load high efficiency mode is low
power loss at no-load and light-load conditions.
The AP65200 automatically detects the output current and enters the light load high efficiency mode. The output current reaches a critical level
at which the transitions between the light-load and heavy current mode occurs. Once the output current exceeds the critical level, the AP65200
transitions from light load high efficiency mode to continuous PWM mode.
External Soft Start
Soft start is traditionally implemented to prevent the excess inrush current. This in turn prevents the converter output voltage from overshooting
when it reaches regulation. The AP65200 has an internal current source with a soft start capacitor to ramp the reference voltage from 0V to
0.925V. The soft start current is 6µA. The soft start sequence is reset when there is a Thermal Shutdown, Under Voltage Lockout (UVLO) or
when the part is disabled using the EN pin.
AP65200
Document number: DS35548 Rev. 6 - 2
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© Diodes Incorporated
P65200
January 2014
Application Information (cont.)
External Soft Start (cont.)
External Soft Start can be calculated from the formula below:
DV
I
Where;
I
C = External Capacitor
DV=change in feedback voltage from 0V to maximum voltage
DT = Soft Start Time
SS
SS
Current Limit Protection
In order to reduce the total power dissipation and to protect the application, AP65200 has cycle-by-cycle current limiting implementation. The
voltage drop across the internal high-side MOSFET is sensed and compared with the internally set current limit threshold. This voltage drop is
sensed at about 30ns after the HS turns on. When the peak inductor current exceeds the set current limit threshold, current limit protection is
activated. During this time the feedback voltage (VFB) drops down. When the voltage at the FB pin reaches 0.3V, the internal oscillator shifts
the frequency from the normal operating frequency of 340kHz to a fold-back frequency of 102kHz. The current limit is reduced to 70% of nominal
current limit when the part is operating at 102kHz. This low fold-back frequency prevents runaway current.
Under Voltage Lockout (UVLO)
NEW PRODUCT
Under Voltage Lockout is implemented to prevent the IC from insufficient input voltages. The AP65200 has a UVLO comparator that monitors
the input voltage and the internal bandgap reference. If the input voltage falls below 4.0V, the AP65200 will latch an under voltage fault. In this
event the output will be pulled low and power has to be re-cycled to reset the UVLO fault.
Over Voltage Protection
When the AP65200 FB pin exceeds 20% of the nominal regulation voltage of 0.925V, the over voltage comparator is tripped and the COMP pin
and the SS pin are discharged to GND, forcing the high-side switch off.
Thermal Shutdown
The AP65200 has on-chip thermal protection that prevents damage to the IC when the die temperature exceeds safe margins. It implements a
thermal sensing to monitor the operating junction temperature of the IC. Once the die temperature rises to approximately +160°C, the thermal
protection feature gets activated. The internal thermal sense circuitry turns the IC off thus preventing the power switch from damage.
A hysteresis in the thermal sense circuit allows the device to cool down to approximately +120°C before the IC is enabled again through soft
start. This thermal hysteresis feature prevents undesirable oscillations of the thermal protection circuit.
Setting the Output Voltage
The output voltage can be adjusted from 0.925V to 16V using an external resistor divider. Table 1 shows a list of resistor selection for common
output voltages. Resistor R1 is selected based on a design tradeoff between efficiency and output voltage accuracy. For high values of R1 there
is less current consumption in the feedback network. However the trade off is output voltage accuracy due to the bias current in the error
amplifier. R1 can be determined by the following equation:
*C
DT
= Soft Start Current
V
R
2
1
0.925
OUT
R
1
 
 
P65200
Figure 2 Feedback Divider Network
AP65200
Document number: DS35548 Rev. 6 - 2
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V
(V)
OUT
5 44.2 10
3.3 26.1 10
2.5 16.9 10
1.8 9.53 10
1.2 3 10
R1 (k) R2 (kΩ)
Table 1 Resistor Selection for Common Output
Voltages
January 2014
© Diodes Incorporated
Application Information (cont.)
Compensation Components
The AP65200 has an external COMP pin through which system stability and transient response can be controlled. COMP pin is the output of the
internal trans-conductance error amplifier. A series capacitor-resistor combination sets a pole-zero combination to control the characteristics of
the control system. The DC gain of the voltage feedback loop is given by:
V
FB
Where V
amplifier voltage gain. The control loop transfer function incorporates two poles one is due to the compensation capacitor (C3) and the output
resistor of error amplifier, and the other is due to the output capacitor and the load resistor. These poles are located at:
Where G
One zero is present due to the compensation capacitor (C3) and the compensation resistor (R3). This zero is located at:
NEW PRODUCT
The goal of compensation design is to shape the converter transfer function to get a desired loop gain. The system crossover frequency where
the feedback loop has the unity gain is crucial.
A rule of thumb is to set the crossover frequency to below one-tenth of the switching frequency. Use the following procedure to optimize the
compensation components:
1. Choose the compensation resistor (R3) to set the desired crossover frequency. Determine the R3 value by the following equation:
Where f
2. Choose the compensation capacitor (C3) to achieve the desired phase margin set the compensation zero, f crossover frequency to provide sufficient phase margin. Determine the C3 value by the following equation:
Where R3 is the compensation resistor value.
is the feedback voltage (0.925V), R
FB
G
f
P1
is the error amplifier trans-conductance.
EA
f
Z1
3R
is the crossover frequency, which is typically less than one tenth of the switching frequency.
C
3C
EA
A3C2
1
3R3C2
fc2C2
GG
CSEA
2
fc3R
VEA
V
V
OUT
FB
AGRA
VEACSLOADVDC
f
P2
G
EA
V
V
OUT
is the load resistor value, GCS is the current sense trans-conductance and A
LOAD
OUT
(V)
1.2 22 47 3.24 6.8 3.3
1.8 22 47 6.8 6.8 3.3
2.5 22 47 6.8 6.8 10
3.3 22 47 6.8 6.8 10
5 22 47 6.8 6.8 10
12 22 47 6.8 6.8 15
Table 2 Recommended Component Selection
1
R2C2
V
fs1.02C2
G
CS
CIN/C1
(µF)
LOAD
OUT
V
FB
C
OUT
(µF)
/C2
RC/R3
(k)
CC/C3
(nF)
L1
(µH)
, to below one fourth of the
Z1
Inductor
Calculating the inductor value is a critical factor in designing a buck converter. For most designs, the following equation can be used to calculate
the inductor value;
)V(VV
OUTINOUT
Where
And
L
I
is the inductor ripple current.
L
f
is the buck converter switching frequency.
SW
AP65200
Document number: DS35548 Rev. 6 - 2
f∆IV
SWLIN
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P65200
is the error
VEA
January 2014
© Diodes Incorporated
Application Information (cont.)
Inductor (cont.)
Choose the inductor ripple current to be 30% of the maximum load current. The maximum inductor peak current is calculated from:
I
II
LOADL(MAX)
Peak current determines the required saturation current rating, which influences the size of the inductor. Saturating the inductor decreases the
converter efficiency while increasing the temperatures of the inductor and the internal MOSFETs. Hence choosing an inductor with appropriate
saturation current rating is important.
A 1µH to 10µH inductor with a DC current rating of at least 25% percent higher than the maximum load current is recommended for most
applications.
For highest efficiency, the inductor’s DC resistance should be less than 200m. Use a larger inductance for improved efficiency under light load
conditions.
Input Capacitor
The input capacitor reduces the surge current drawn from the input supply and the switching noise from the device. The input capacitor has to
sustain the ripple current produced during the on time on the upper MOSFET. It must hence have a low ESR to minimize the losses.
NEW PRODUCT
The RMS current rating of the input capacitor is a critical parameter that must be higher than the RMS input current. As a rule of thumb, select an
input capacitor which has RMs rating that is greater than half of the maximum load current.
Due to large dI/dt through the input capacitors, electrolytic or ceramics should be used. If a tantalum must be used, it must be surge protected.
Otherwise, capacitor failure could occur. For most applications, a 4.7µF ceramic capacitor is sufficient.
Output Capacitor
The output capacitor keeps the output voltage ripple small, ensures feedback loop stability and reduces the overshoot of the output voltage. The
output capacitor is a basic component for the fast response of the power supply. In fact, during load transient, for the first few microseconds it
supplies the current to the load. The converter recognizes the load transient and sets the duty cycle to maximum, but the current slope is limited
by the inductor value.
Maximum capacitance required can be calculated from the following equation:
ESR of the output capacitor dominates the output voltage ripple. The amount of ripple can be calculated from the equation below:
L
2
P65200
I
out
inductorcapacitor
inductor
2
2
V)V V(
out
An output capacitor with ample capacitance and low ESR is the best option. For most applications, a 22µF ceramic capacitor will be sufficient.
L(I
out
o
is the maximum output voltage overshoot.
Where
C
V
AP65200
Document number: DS35548 Rev. 6 - 2
ESR*∆IVout
2
)
2
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© Diodes Incorporated
P65200
Application Information (cont.)
PC Board Layout
This is a high switching frequency converter. Hence attention must be paid to the switching currents interference in the layout. Switching current
from one power device to another can generate voltage transients across the impedances of the interconnecting bond wires and circuit traces.
These interconnecting impedances should be minimized by using wide, short printed circuit traces.
NEW PRODUCT
External Bootstrap Diode
It is recommended that an external bootstrap diode be added when the input voltage is no greater than 5V or the 5V rail is available in the
system. This helps to improve the efficiency of the regulator. This solution is also applicable for D > 65%. The bootstrap diode can be a low cost
one such as BAT54 or a Schottky that has a low V
Figure 7 External Bootstrap Compensation Components
Recommended Diodes:
AP65200
Document number: DS35548 Rev. 6 - 2
.
F
Part Number
B130 30V, 1A Diodes Inc
SK13 30V, 1A Diodes Inc
Voltage/Current
Rating
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Vendor
January 2014
© Diodes Incorporated
Ordering Information
P65200
NEW PRODUCT
Part Number Package Code
AP65200S-13 S SO-8 NA 2500 -13
AP65200SP-13 SP SO-8EP NA 2500 -13
AP65200MP-13 MP MSOP-8EP NA 2500 -13
AP65200FK-7 FK U-DFN2626-10 R2 3000 -7
Note: 9. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
Marking Information
(1) SO-8
Packaging
(Note 9)
Identification Code
Tape and Reel
Quantity Part Number Suffix
AP65200
Document number: DS35548 Rev. 6 - 2
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© Diodes Incorporated
Marking Information (cont.)
(2) SO-8EP
P65200
(3) MSOP-8EP
NEW PRODUCT
(4) U-DFN2626-10
AP65200
Document number: DS35548 Rev. 6 - 2
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© Diodes Incorporated
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
(1) SO-8
E1
E
A1
h
Detail ‘A’
°
45
e
D
A2
A3
A
b
L
0.254 Gauge P lane
Seating Plane
7°~9
°
(2) SO-8EP
NEW PRODUCT
Detail ‘A’
Dim Min Max
SO-8
A - 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25
b 0.3 0.5
D 4.85 4.95
E 5.90 6.10 E1 3.85 3.95
e 1.27 Typ
h - 0.35
L 0.62 0.82
0 8

All Dimensions in mm
P65200
9° (All side s)
(3) MSOP-8EP
D
x
y
1
e
A1
A
85
E1
14
b
4° ± 3°
A
e
A1
D
D1
E
E2
8Xb
A3
A2
D
E3
E1
F
Bottom View
E
N
45
7
°
See Detail C
°
E0
Gauge Plane Seating Plane
4
c
0.25
X
1
0
Exposed Pad
H
Q
L
°
Detail C
C
Gauge Plane Seating Plane
4
X
1
0
°
L
SO-8EP (SOP-8L-EP)
Dim Min Max Typ
A 1.40 1.50 1.45
A1 0.00 0.13 -
b 0.30 0.50 0.40
C 0.15 0.25 0.20
D 4.85 4.95 4.90
E 3.80 3.90 3.85
E0 3.85 3.95 3.90 E1 5.90 6.10 6.00
e - - 1.27
F 2.75 3.35 3.05
H 2.11 2.71 2.41
L 0.62 0.82 0.72
N - - 0.35
Q 0.60 0.70 0.65
All Dimensions in mm
MSOP-8EP
Dim Min Max Typ
A - 1.10 ­A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39
b 0.22 0.38 0.30
c 0.08 0.23 0.15
D 2.90 3.10 3.00
a
D1 1.60 2.00 1.80
E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E2 1.30 1.70 1.50 E3 2.85 3.05 2.95
e - - 0.65
L 0.40 0.80 0.60
a 8° 4°
x - - 0.750
y - - 0.750
All Dimensions in mm
AP65200
Document number: DS35548 Rev. 6 - 2
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© Diodes Incorporated
Package Outline Dimensions (cont.) (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
(4) U-DFN2626-10
NEW PRODUCT
A
A1
D
D2
C'0.2x45°
(Pin #1 ID)
D2/2
E
E2
0
0
1
.
0
R
e
b
A3
Seating Pla ne
E2/2
L
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) SO-8
X
C2
C1
Y
(2) SO-8EP
X2
Y2
Y1
X1
C
Y
X
AP65200
Document number: DS35548 Rev. 6 - 2
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U-DFN2626-10
Dim Min Max Typ
A 0.57 0.63 0.60 A1 0 0.05 0.03 A3 - - 0.15
b 0.20 0.30 0.25
D 2.55 2.675 2.60 D2 2.05 2.25 2.15
E 2.55 2.675 2.60
E2 1.16 1.36 1.26
e 0.50 BSC
L 0.30 0.40 0.35 All Dimensions in mm
Dimensions Value (in mm)
X 0.60
Y 1.55 C1 5.4 C2 1.27
Dimensions Value (in mm)
C 1.270
X 0.802 X1 3.502 X2 4.612
Y 1.505 Y1 2.613 Y2 6.500
P65200
January 2014
© Diodes Incorporated
Y
Suggested Pad Layout (cont.)
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
3) MSOP-8EP
X C
G
Y
Y2
Y1
X1
NEW PRODUCT
(4) U-DFN2626-10
Y2
Pin1
X2
Dimensions Value (in mm)
X1
Y1
C
X
Dimensions
C 0.650
G 0.450
X 0.450
X1 2.000
Y 1.350 Y1 1.700 Y2 5.300
X 0.45
Y 1.4 C1 4.4 C2 0.65
P65200
Value
(in mm)
AP65200
Document number: DS35548 Rev. 6 - 2
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© Diodes Incorporated
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated.
NEW PRODUCT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
IMPORTANT NOTICE
LIFE SUPPORT
P65200
AP65200
Document number: DS35548 Rev. 6 - 2
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January 2014
© Diodes Incorporated
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