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Description
The AP65200 is a 340kHz switching frequency external compensated
synchronous DC/DC buck converter. It has integrated low R
DSON
and low side MOSFETs.
The AP65200 enables continues load current of up to 2A with
efficiency as high as 95%.
The AP65200 implements an automatic custom light load
efficiency improvement algorithm.
The AP65200 features current mode control operation, which enables
fast transient response times and easy loop stabilization.
The AP65200 simplifies board layout and reduces space
requirements with its high level of integration and minimal need for
external components, making it ideal for distributed power
architectures.
The AP65200 is available in a standard Green SO-8, MSOP-8EP,
NEW PRODUCT
U-DFN2626-10 and SO-8EP package and is RoHS compliant.
Features
VIN 4.7V to 18V
2A Continuous Output Current, 3A Peak
Efficiency Up to 95%
Automated Light Load improvement
V
340kHz Switching Frequency
External Programmable Soft-Start
Enable Pin
OCP and Thermal Protection
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
PAD Exposed PAD for thermal performance improvement connect to GND
Functional Block Diagram
U-DFN2626-10
P65200
Function
High-Side Gate Drive Boost Input. BS supplies the drive for the high-side N-Channel MOSFET a
0.01µF or greater capacitor from SW to BS to power the high side switch.
Power Input. IN supplies the power to the IC, as well as the step-down converter switches. Drive
IN with a 4.7V to 18V power source. Bypass IN to GND with a suitably large capacitor to eliminate
noise on the input to the IC. See Input Capacitor.
Power Switching Output. SW is the switching node that supplies power to the output. Connect the
output LC filter from SW to the output load. Note that a capacitor is required from SW to BS to
power the high-side switch.
Feedback Input. FB senses the output voltage and regulates it. Drive FB with a resistive voltage
divider connected to it from the output voltage. The feedback threshold is 0.925V. See Setting the
Output Voltage.
Compensation Node. COMP is used to compensate the regulation control loop. Connect a series
RC network from COMP to GND. In some cases, an additional capacitor from COMP to GND is
required. See Compensation Components.
Enable Input. EN is a digital input that turns the regulator on or off. Drive EN high to turn on the
regulator; low to turn it off.
Attach EN to IN with a 100kΩ pull up resistor for automatic startup. With this configuration an
internal voltage clamp ensures that a safe voltage is set for Enable not to exceed the absolute
maximum voltage for this pin.
Soft-Start Control Input. SS controls the soft-start period. Connect a capacitor from SS to GND to
set the soft-start period. A 0.1µF capacitor sets the soft-start period to 15ms. To disable the softstart feature, leave SS floating.
Notes: 4. Stresses greater than the 'Absolute Maximum Ratings' specified above may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may
be affected by exposure to absolute maximum rating conditions for extended periods of time.
5. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when
NEW PRODUCT
handling and transporting these devices.
Supply Voltage
Switch Node Voltage
Bootstrap Voltage
Feedback Voltage -0.3V to +6.0 V
Enable/UVLO Voltage -0.3V to +6.0 V
Comp Voltage -0.3V to +6.0 V
Storage Temperature -65 to +150 °C
Junction Temperature +160 °C
Lead Temperature +260 °C
= +25°C, unless otherwise specified.)
A
-0.3 to +20
-1.0 to V
V
-0.3 to VSW +6.0
SW
IN
+0.3
Thermal Resistance(Note 6)
P65200
V
V
V
Symbol Parameter Rating Unit
SO-8 119
θJA
θJC
Note: 6. Test condition: SO-8: Device mounted on 1"x1" FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.
SO-8EP: Device mounted on 2"x2" FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout and thermal vias to bottom layer GND
plane.
MSOP-8EP: Device mounted on 2"x2" FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.
U-DFN2626-10: Device mounted on 2"x2" FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.
Recommended Operating Conditions(Note 7) (@T
Symbol Parameter Min Max Unit
VIN
TA
Note: 7. The device function is not guaranteed outside of the recommended operating conditions.