Diodes AP386X User Manual

Preliminary Datasheet

Superior Multi-touch Capacitive Touch Screen Controller AP386X

General Description

The AP386X is a low-cost high-resolution single chip
solution for APA (All point addressable) capacitive
touch screen. It is an 8-bit single cycle 8051
microcontroller with ICP Interface. The chip includes
12-bit successive approximation analog-to-digital
converters with an I
multiplexer-switcher circuits for flexible
measurement of analog signal from APA panel. An
accurate switched-capacitor integrator is built-in and
it can auto calibrate the pixel parameters for a wide
range of capacitance on the touch screen (1pF to
32pF). This touch screen controller (TSC) with
CMOS integration circuit provides an ideal choice for
APA touch panel. The AP386X is specified over the
temperature range of -40°C to 85°C.

The AP386X is available in QFN-5×5-40 (for
AP3860) and QFN-6×6-48 (for AP3861) packages.

2

C interface and

Features

•

Mutual Capacitive Touch Sensing

•

Single Power Supply: 2.8V to 3.6V Operation

Voltage; LDO inside to Support 1.6V to 2.0V
Operation Voltage

•

Up to 17/23 Drive Lines and 10/12 Sense Lines

•

Charge Pump Support up to 6V, Doubling SNR

•

Internal Two-wire Serial Control Bus I

•

Single-end Integrator with Programmable Gain

Control

• Multiplexed Analog Digitization with 12-bit
Resolution Scan SAR ADCs and Its Dedicated
2X to 8X Accumulator XSRAM Buffers

Aug. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited

QFN-5×5-40

2

C

Figure 1. Package Types of AP386X

Features (Continued)

• Single Cycle 8051 CPU Core, Maximum Opera-

ting Clock up to 28MHz from IOSC (Zero Wait
State)

4 to 28MHz Internal Oscillator (IOSC)
32k-byte Flash ROM
6k-byte Internal SRAM
T wo 16-bit Timers T0/T1
Configurable I
Controller Shared with the Same Ports

 With Asynchronous I

Detection Logic Design
4 General Purpose GPIO Pins
One External Interrupt Pin

• ISP/IAP via I²C Port

• Operation Temperature Range: -40°C to 85°C

• Package Type Alternatives: QFN-5×5-40 and
QFN-6×6-48

• RoHS Compliance

•

Operating Mode:

Mode Description
Power-down No scan with power-down mode
Idle While only 8051 CPU core is idle,

Standard Higher scan rate when fingers are

2

C Slave Controller and SPI Slave

2

C Slave Address

all peripherals remain active

on panel, IOSC can up to 4MHz
to 28MHz

Applications

• Mobile Phones

• Personal Digital Assistants

• Smart Hand-held or Gaming Devices

1

QFN-6×6-48

Preliminary Datasheet

Superior Multi-touch Capacitive Touch Screen Controller AP386X

Pin Configuration

FN Package
(QFN-5×5-40)

Pin 1 Mark

D15
D14
D13

D12
D11
D10

D9
D8

D7
D6

D16

1
2
3
4
5
6
7
8
9

10

11 12

D5

S9

S8

13

D4

D3

S6

S7

15

14

D2

S4

S5

353637383940

16 17 18 19

D1

D0

S3

3334

41

VDD3V

VDDHV

S2

32

VSS

S1

31

20

VDD18

30

VDD3V

S0

29
28

INT/GPIO1

WAKE/GPIO0

27
26

RSTN
MISO/GPIO2

25
24

MOSI/SDA

23

SCK/GPIO3
SS/SCL

22
21

TESTEN

Figure 2. Pin Configuration of AP3860 (Top View)

Aug. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited

2

Preliminary Datasheet

Superior Multi-touch Capacitive Touch Screen Controller AP386X

Pin Configuration (Continued)

FN Package

(QFN-6×6-48)

D22

D9

S11

D8

S10

D7

S9

D6

S8

D5

S7

D4

S6

D3

S5

D2

S4

D1

S3

D0

S2

S1

VDD3V

VDDHV

Figure 3. Pin Configuration of AP3861 (Top View)

Aug. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited

3

Preliminary Datasheet

Superior Multi-touch Capacitive Touch Screen Controller AP386X

Pin Description

Pin Number

QFN-5×5-40

AP3860

QFN-6×6-48

AP3861

Pin

Name

Pin

Type

Pin Function

40, 1 to 16 6 to 22

- 48, 1 to 5

D16 to

D0

D22 to

D17

I/O, A

I/O, A

17 23 VDDHV O

18, 30 24, 35 VDD3V P

19 25 VSS P

20 26 VDD18 O

21 27 TESTEN I

22 28 SS/SCL I/O

23 29

24 30

25 31

SCK/

GPIO3

MOSI/

SDA

MISO/
GPIO2

I/O

I/O

I/O

Driving Lines 16 to 0

These pins can also be configured as I/O
bi-directional ports for test

Driving Lines 22 to 17

These pins can also be configured as I/O
bi-directional ports for test

High Voltage. 6V
Charge pump high Voltage. This output pin can be

configured as VDD3V or 6V accordingly

Supply Voltage. 2.8V to 3.6V

A good decoupling capacitor between VDD3V and
VSS pins is critical for good performance

Ground Voltage. 0V
Internal Regulator Output. 1. 6V to 2.0V

Typical decoupling capacitors of 0.1F and 10F
should be connected between VDD18 and VSS

Test Mode Enable High Active

This pin has an internal weakly pull low resistor
connected. If it is connected high, the chip enters into
Test Mode condition

SS/SCL

This pin can be configured as the SCL signal of the
I

2

C master or I2C slave controller. When I2C is
enabled, the pin is configured as an open-collector.
While in SPI mode, this pin is configured as the
slave chip select pin

Port 1.3 GPIO

8051 P1.3 GPIO. This pin can also be configured as
the serial clock from SPI master while SPI interface
is activated

SDA

This pin can be configured as the SDA signal of the

2

I

C master or I2C slave controller. In this operation
mode, this pin should also be configured as
open-collector. While SPI interface is selected, the
pin serves as the data port from SPI master to SPI
slave

Port 1.2 GPIO

8051 P1.2 GPIO. This pin can also be configured as
the output data pin from slave to master for SPI
interface

Aug. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited

4

Preliminary Datasheet

Superior Multi-touch Capacitive Touch Screen Controller AP386X

Pin Description (Continued)

Pin Number

QFN-5×5-40

AP3860

QFN-6×6-48

AP3861

Pin

Name

Pin

Type

Pin Function

Reset Low Active

Typically connect a resistor to VDD3V and a

26 32 RSTN I

capacitor to VSS. Low asserted and threshold at

0.5*V

. When forced low, the chip enters into reset

DD

condition. This pin should not be connected to any

27 33

28 34

WAKE/

GPIO0

INT/

GPIO1

I/O

I/O

level above V

Port 1.0 GPIO

8051 P1.0 GPIO. This pin can also be configured as
the wakeup pin from the host

Port 1.1 GPIO

8051 P1.1 GPIO. Open Drain output. This pin can
also be configured as the interrupt pin to notify the
host

DD

Sensing Lines 0 to 9

29, 31 to 39 36 to 45 S0 to S9 I/O, A

These pins can also be configured as I/O
bi-directional ports for test

Sensing Lines 10 to 11

- 46, 47 S10, S11 I/O, A

These pins can also be configured as I/O
bi-directional ports for test

41 49 EP

Exposed Pad

“I/O” means input/output; “I” means input; “O” means Output; “P” means power; “A” means analog.

SCL and SDA Pin Description

Pull-up Enable

The pull-up enable for SCL and SDA is activated for AP386X, meaning that AP38 6X always has pull-up SCL
and SDA to VDD3V. During reset, SCL and SDA are as input pin. Moreover, if the pin connecting to the system
is floating, the internal pull-up will tie the pin to VDD3V (10k). After AP386X is reset, SCL and SDA are
input until its corresponding register is configured.

Mode Selection

SCL and SDA can be used in I
open drain pin) by register setting.

Wakeup

SCL and SDA can be used for wakeup input signals in different mode. While I
protocol (SDA is low and SCL is high) on SCL and SDA is a wakeup signal to AP386X. While SPI mode is
enabled, an active low on the pin of SCL (serving as a slave select in SPI) is a wakeup signal to AP386X.
Moreover, a wakeup signal can be asserted by host from GPIO0.

INT/GPIO1

GPIO1 can be configured as open-drain or push-pull mode. Furthermore, GPIO1 pin has internal pull-up to
VDD3V (60k) or VDD18 (10k) based on different register definition.

2

C and SPI mode. AP386X can enable I2C mode (SCL and SDA configured as

2

C mode is enabled, a START

Aug. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited

5

Preliminary Datasheet

Superior Multi-touch Capacitive Touch Screen Controller AP386X

Functional Block Diagram

SWITCH MATRIX

Figure 4. Functional Block Diagram of AP386X

Aug. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited

6

Preliminary Datasheet

Superior Multi-touch Capacitive Touch Screen Controller AP386X

Ordering Information

AP386 -

Circuit Type

0: AP3860
1: AP3861

G1: Green

Blank: Tray
TR: Tape & Reel

Package
FN: QFN-5×5-40

/QFN-6×6-48

Package Temperature Range Part Number Marking ID Packing Type

QFN-5x5-40

QFN-6x6-48

BCD Semiconductor's Pb-free products, as designated with "G1" in the part number, are RoHS compliant and
green.

-40 to 85°C

AP3860FNTR-G1 3860FN Tape & Reel
AP3861FN-G1 3861FN Tray
AP3861FNTR-G1 3861FN Tape & Reel

AP386X Support 3” to 8” Touch Panel, Listed Below:

PN TX/RX Multi-touch Package Panel size

AP3860 17/10 10 points 100Hz QFN-5x5-40 3” to 7”
AP3861 23/12 10 points 100Hz QFN-6x6-48 4” to 8”

Aug. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited

7

Preliminary Datasheet

Superior Multi-touch Capacitive Touch Screen Controller AP386X

Absolute Maximum Ratings (Note 1)

Parameter Symbol Value Unit

Supply Voltage (Pin VDD3V) VDD 0 to 4 V
Analog Input Voltage (Other pins) -0.3 to VDD+0.3 V
Logic Input Voltage -0.3 to VDD+0.3 V

Thermal Resistance (Simulation,
Junction to Ambient)

Maximum Junction Temperature TJ 100 °C
Operating T em perature TOP -40 to 85 °C
Storage Temperature T
ESD (Human Body Model) ESD HBM 8000 V



JA

-65 to 150 °C

STG

TBD °C/W

Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only, and functional operation of the device at these or any other conditions
beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute
Maximum Ratings” for extended periods may affect device reliability.

Recommended Operating Conditions

Parameter Symbol Min Max Unit

Supply Voltage (Pin VDD3V) VDD 2.8 3.6 V
Operating Ambient Temperature TA -40 85 ºC

Aug. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited

8

Preliminary Datasheet

Superior Multi-touch Capacitive Touch Screen Controller AP386X

Electrical Characteristics

TA=25°C, VDD=2.8V to 3.6V, I2C bus frequency=400kHz, 12-bit mode, unless otherwise noted.

Parameter Symbol Conditions Min Typ Max Unit

mA

A
A

Quiescent Current

VDD18 Output Voltage V
Charge Pump Voltage V

Internal Operating
Frequency

DD18

DDHV

f

OSC

Standard mode f
28MHz
Power-down mode
Idle mode

Charge pump enable 5.8 6 6.3 V

OSC

=4 to

5

1.6 1.8 2.0 V

4 28 MHz

60

1

DA/AC Characteristics for AFE

Parameter Symbol Conditions Min Typ Max Unit

ADC DC Accuracy

Resolution 12 Bits
No Missing Codes Standard modes 11 12 Bits
Integral Linearity Error INL Standard modes ±3
Differential Linearity

Error
Offset Error
Gain Error

Analog Input

Full-scale Input Span 0 VDD V
ADC Sampling Dynamics
Throughput Rate 500 ksps

Switched-capacitor Integrator

Output Voltage Range 0.3 VDD-0.3 V
Integrator Capacitor C

DNL

40 pF

INT

±1.5

±6
±4

LSB
LSB

LSB
LSB

Aug. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited

9

Preliminary Datasheet

Superior Multi-touch Capacitive Touch Screen Controller AP386X

Electrical Characteristics (Continued)

DA/AC Characteristics for 8051 CPU Core, Digital GPIO Pins, Digital Peripherals

Parameter Symbol Conditions Min Typ Max Unit

V

RSTN Input Voltage
Threshold

Input High Voltage VIH 0.7*V
Input Low Voltage VIL -0.3 0.5 V
Output High Voltage VOH VDD-0.6 V
Output Low Voltage VOL 0.4 V
High Level Output Current IOH @VOH(Min) 1 mA
Low Level Output Current IOL @VOL(Max) 1 mA

Internal Pull-up Resistance RPU
Internal Pull-down

Resistance
Output Rise Time t

Output Fall Time t
GPIO Output Operating

Frequency
SCK Frequency f

SCL Clock Frequency f

RSTN_H

V

RSTN_L

R

PD

RISE

FALL

C

SCK

SCLI2C

Low to high level 1.56 1.71
High to low level 1.16 1.30

DD

SCL, SDA, INT 10
Other Pins 34 74

29 86

=20pF and

C

LOAD

10% to 90%
C
10% to 90%

=20pF and

LOAD

=20pF 0 5 MHz

LOAD

5 ns

5 ns

2 MHz

0 400 kHz

V

V

DD

V

k

k

Aug. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited

10

Preliminary Datasheet

Superior Multi-touch Capacitive Touch Screen Controller AP386X

Typical Application

AP3860

Figure 5. Typical Application Schematic of AP3860 (For QFN-5×5-40 Package)

AP3861

Figure 6. Typical Application Schematic of AP3861 (For QFN-6×6-48 Package)

Aug. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited

11

Preliminary Datasheet

Superior Multi-touch Capacitive Touch Screen Controller AP386X

Mechanical Dimensions

QFN-5×5-40 Unit: mm(inch)

Aug. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited

12

Preliminary Datasheet

Superior Multi-touch Capacitive Touch Screen Controller AP386X

Mechanical Dimensions (Continued)

QFN-6×6-48 Unit: mm(inch)

5.900(0.232)

6.100(0.240)

0.300(0.012)

0.500(0.020)

N25

J

N37

5.900(0.232)

6.100(0.240)

A

Pin 1 Mark

0.000(0.000)

0.050(0.002)

Symbol

Option1
Option2

N13

0.400(0.016)
BSC

DETAIL A

46
47
48

12

0.031

0.035

123

0.800

0.900

46

47
48

3

Pin 1 Options

A

0.028

0.031

0.200(0.008)

0.150(0.006)

0.250(0.010)

J=K

min(mm) max(mm) max(mm)min(mm)min(inch) min(inch)max(inch) max(inch)

4.400

4.150

4.600

4.450

REF

0.173 0.181

0.163 0.175

0.700

.

0.800

K

N48

N1

PIN #1 IDENTIFICATION

See DETAIL A

46
47
48

123

Aug. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited

13

Preliminary Datasheet

Superior Multi-touch Capacitive Touch Screen Controller AP386X

Mounting Pad Layout

QFN-5×5-40

Dimensions

Option1 5.400/0.213 0.250/0.010 0.650/0.026 3.500/0.138 0.400/0.016
Option2 5.400/0.213 0.250/0.010 0.650/0.026 3.600/0.142 0.400/0.016
Option3 5.400/0.213 0.250/0.010 0.650/0.026 3.800/0.150 0.400/0.016

X=Y

(mm)/(inch)

X1=Y2

(mm)/(inch)

Y1=X2

(mm)/(inch)

X3=Y3

(mm)/(inch) E (mm)/(inch)

Aug. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited

14

Preliminary Datasheet

Superior Multi-touch Capacitive Touch Screen Controller AP386X

Mounting Pad Layout (Continued)

QFN-6×6-48

Dimensions

Value 6.300/0.248 0.250/0.010 0.600/0.024 4.600/0.181 0.400/0.016

X=Y

(mm)/(inch)

X1=Y2

(mm)/(inch)

Y1=X2

(mm)/(inch)

X3=Y3

(mm)/(inch) E (mm)/(inch)

Aug. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited

15

BCD Semiconductor Manufacturing Limited

IMPORTANT NOTICE

http://www.bcdsemi.com

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi­cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any

IMPORTANT NOTICE

IMPORTANT NOTICE

particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use
of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-

other rights nor the rights of others.

cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any

cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any

particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use

particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use

MAIN SITE

of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or

of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or

- Headquarters
BCD (Shanghai) Micro-electronics Limited

other rights nor the rights of others.

other rights nor the rights of others.

No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, P. R.C.
Tel: [phone], Fax: [phone]

MAIN SITE

MAIN SITE

REGIONAL SALES OFFICE

- Headquarters

BCD Semiconductor Manufacturing Limited

BCD Semiconductor Manufactur ing Limited

Shenzhen Office

- Wafer Fab

No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China

Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office

Shanghai SIM-BCD Semiconductor Manufacturing Limited

Tel: [phone], Fax: [phone]

Unit A Room 1203,Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District

800, Yi Shan Road, Shanghai 200233, China

Shenzhen 518057, China

Tel: [phone], Fax: [phone]

REGIONAL SALES OFFICE

Tel: [phone], Fax: [phone]

Shenzhen Office

REGIONAL SALES OFFICE

Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office

Taiwan Office (Hsinchu)

Shenzhen Office

Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen,

BCD Semiconductor (Taiwan) Company Limited

Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office

China

8F, No.176, Sec. 2, Gong-Dao 5th Road, East District

Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office

Tel: [phone]

HsinChu City 300, Taiwan, R.O.C

Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China

Fax: [phone]

Tel: [phone], Fax: [phone]

Tel: [phone]
Fax: [phone]

- Wafer Fab
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yishan Road, Shanghai 200233, China
Tel: [phone], Fax: [phone]

- Wafer Fab

BCD Semiconductor Manufacturing Limited

Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

Taiwan Office (Taipei)

- IC Design Group

800 Yi Shan Road, Shanghai 200233, China

BCD Semiconductor (Taiwan) Company Limited

Advanced Analog Circuits (Shanghai) Corporation

Tel: [phone], Fax: [phone]

3F, No.17, Lane 171, Sec. 2, Jiu-Zong Rd., Nei-Hu Dist., Taipei(114), Taiwan, R.O.C

8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China

Tel: [phone]

Tel: [phone], Fax: [phone]

Fax: [phone]

Taiwan Office
BCD Semiconductor (Taiwan) Company Limited

USA Office

Taiwan Office

4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei,

BCD Semiconductor Corp.

BCD Semiconductor (Taiwan) Company Limited

Tai wan

48460 Kato Road, Fremont, CA 94538, USA

4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei,

Tel: [phone]

Tel: [phone]

Taiwan

Fax: [phone]

Fax: [phone]

Tel: [phone]
Fax: [phone]

USA Office

Korea Office
BCD Semiconductor Limited Korea office.

Room 101-1112, Digital-Empire II, 486 Sin-dong,
Yeongtong-Gu, Suwon-city, Gyeonggi-do, Korea
Tel: [phone]

BCD Semiconductor Corp.

USA Office

30920 Huntwood Ave. Hayward,

BCD Semiconductor Corporation

CA 94544, USA

30920 Huntwood Ave. Hayward,

Tel : [phone]

CA 94544, U.S.A

Fax: [phone]

Tel : [phone]
Fax: [phone]