Diodes AP3616 User Manual

Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

General Description

The AP3616 is an sixteen-channel constant current
sink with current match used for LED driver. It uses an
external resistor to set the current for sixteen LED
strings with an accuracy of ±1.5%. The full scale LED
current can be adjusted from 20mA to 75mA for each
channel. The LED lightness can be adjusted by PWM
dimming function.

The device can keep working normally without any
damage when LEDs are short or open. It features under
voltage lockout protection and over temperature pro­tection.

The AP3616 has three interface terminals (FB, SYN
and FBX pins). The FB and SYN pins allow the device
to work with a DC/DC converter to drive LED arrays
for good performance. And the FBX pin enables the
device to be connected in parallel.

The AP3616 is available in SOIC-28 and HSOP-28
packages.

Features

· Input Voltage Range: 4.2V to 27V

· Maximum Output Current: Typical 1.2A (75mA

per Channel)

· Current Match Accuracy (Typical): ±1.5%

· PWM / Linear Dimming Control

· Open LED Self-check and Protection

· Flexible Short LED Protection

· Under Voltage Lockout Protection

· Over Temperature Protection

· FBX and SYN Pins Enable Parallel Application

· Over Voltage Protection

Applications

· LCD Display Modules

· LCD Monitor

· LCD TV

SOIC-28 HSOP-28

Figure 1. Package Types of AP3616

BCD Semiconductor Manufacturing LimitedJul. 2012 Rev. 1. 2

1

Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Pin Configuration

CH1
CH2
CH3

CH4
CH5
CH6

CH7
CH8

FLAG

FB

FBX

EN

VIN

GND

10

11

12

13

14

M Package
(SOIC-28)

1

2

3

4

5

6

7

8

9

28

27

26

25

24

23

22

21

20

19

18

17

16

15

CH9

CH10
CH11

CH12
CH13
CH14

CH15

CH16
OVP
SCP

SYN

SYNF

DIM

ISET

CH1
CH2
CH3

CH4
CH5
CH6
CH7

CH8

CH9
CH10
CH11

CH12
CH13
CH14

M28 Package

(HSOP-28)

1

2

3

4

5

6

7

8

9

10

11

12

13

14

28

27

26

25

24

23

22

21

20

19

18

17

16

15

CH16
OVP
SCP
SYN
SYNF

DIM

ISET

GND

VIN
EN
FBX
FB
FLAG

CH15

Figure 2. Pin Configuration of AP3616 (Top View)

BCD Semiconductor Manufacturing LimitedJul. 2012 Rev. 1. 2

2

Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Pin Description

Pin Number

Pin Name Function

SOIC-28 HSOP-28

1 to 8

28 to 21

916FLAG

10 17 FB

11 18 FBX

12 19 EN Enable pin. Logic high enables the IC and logic low disables the IC

13 20 VIN Input voltage pin

14 21 GND Ground pin

15 22 ISET

16 23 DIM

17 24 SYNF

1 to 8

9 to 15 & 28

CH1 to CH8

CH9 to CH16

White LED cathode connection pins. If not used, leave them uncon­nected

Error flag pin. When LED load goes to error (short or open ), the flag
open drain output will close

Feedback pin. This pin is an interface terminal, which samples the
voltage of each channel, and outputs the lowest voltage of the string
to DC/DC converter

This pin is an interface terminal. Connect it to FB pin can achieve
parallel application. If not used, leave it unconnected

LED current setting pin. An external resistor is connected to this pin.
Current on each channel can be expressed by I

=1.194*1560/R

NEL

Dimming control pin. Adding a PWM signal or DC signal to this pin
to control LED dimming. Connect it to high voltage level if not used

Synchronous PWM frequency setting pin. A nF level of capacitor
should be connected to this pin to set PWM frequency at about 80Hz
to 25kHz

ISET

CHAN-

18 25 SYN

19 26 SCP

20 27 OVP

PWM dimming synchronous pin, this pin outputs DC transformed
PWM signal to synchronize parallel AP3616 and power converter, if
not used, leave it unconnected

LED short trigger voltage setting pin. This pin is used to set the LED
short circuit protection voltage level

This pin is used to trigger OVP condition. OVP triggering voltage
should be lower than the OVP voltage of its cascade chip, such as ,
AP3039A in Figure 19

BCD Semiconductor Manufacturing LimitedJul. 2012 Rev. 1. 2

3

Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Functional Block Diagram

CH1_I

CH1

CH16

FLAG

FB

FBX

EN

(

1

1

8

8

28

9

21

15

&

28

9(16)

10(17)

11(18)

12(19)

(

VCH 16 to 1

REF

VDD

SCP

200mV

V

DS1=VDD

Open LED

Short LED

LOW

SEL

EN

Bandgap

VDS1

x3120

AMP

x7

PGND

x1

µ

2 A

AGND

x1

AGND

COMP

Short

Detectio n

COMP

Open

Detectio n

OVP_EN

SCP

V

1.194V

REF

COMP

V

=5V

DD

_

VDD

+

COMP

0.26V

V

REF

SCP Open

Detect ion

+
_

COMP

20(27)

OVP

19(26)

SCP

18(25)

SYN

16(23)

Latch
Block

UVLO

PWM

COMP

µ

13 A

+_2.2V
_

SET

RS

Q_BAR

RESET

V

REF

VDD

Regula tor

AMP

COMP

+

0.5V

COMP

µ

13 A

x4

x1

x4

17(24)

DIM

SYNF

13(20)

VIN

14(21)

GND

A(B)

A for SOIC-28

B fro HSOP-28

CH_I

AGND

PGND

Figure 3. Functional Block Diagram of AP3616

4

1 to 16

REF

15(22)

ISET

BCD Semiconductor Manufacturing LimitedJul. 2012 Rev. 1. 2

Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Ordering Information

AP3616 -

Circuit Type

Package

M: SOIC-28

G1: Green

Blank: Tube

M28:HSOP-28

Package Temperature Range Part Number Marking ID Packing Type

SOIC-28

HSOP-28 AP3616M28-G1 AP3616M28-G1

-40 to 85

o

C

AP3616M-G1 AP3616M-G1 Tube

Tube

BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green.

Absolute Maximum Ratings (Note 1)

Parameter Symbol Value Unit

Input Voltage V

FLAG Pin Voltage V

EN Pin Voltage V

Voltage on Each Channel V

IN

FLAG

EN

CHX

Voltage on Other Seperate Pins -0.3 to 6 V

Thermal Resistance (Junction to
Ambient, No Heat Sink)

Operating Junction Temperature T

Lead Temperature (Soldering, 10sec)

SOIC-28

HSOP-28 59

T

θ

STG

JA

J

ESD (Human Body Model) 2000 V

ESD (Machine Model) 200 V

30 V

30 V

30 V

-0.3 to 60 V

72

o

o

150

-65 to 150

C/W

C/W

o

C

o

C

Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated
under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods
may affect device reliability.

Jul. 2012 Rev. 1. 2

BCD Semiconductor Manufacturing Limited

5

Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Recommended Operating Conditions

Parameter Symbol Min Max Unit

V

Input Voltage

CC

4.2 27 V

Recommended PWM Dimming Frequency f

Full Scale Setting Current per Channel

=0.5V

V

CHX

V

=0.8V 20 60

CHX

=1.2V 20 75

V

CHX

Operating Temperature Range

PWM

I

CHX

T

A

0.08 25 kHz

20 40

mA

-40 85

o

C

Electrical Characteristics

VIN=24V, VEN=5V, TA=25

ture range (T

=-40

A

Parameter Symbol Conditions Min Typ Max Unit

VCC SECTION

Quiescent Current I

Shutdown Supply Current I

Under Voltage Lockout Threshold V

Under Voltage Lockout Hysteresis V

CHANNEL SECTION

o

C, unless otherwise specified. Boldface type apply over the full operating tempera-

o

C to 85oC).

Q

STBY

UVLO

UVLO_HYS

ISET, SYN and FB

24mA

Pin Floating

VEN=0V, ISET,SYN

0.1 1 µA

and FB Pin Floating

VIN Falling Edge 3.65 3.9 4.15 V

300 mV

Maximum Output Current per Channel I

Current Sink Saturation Voltage per
Channel

Current Matching Accuracy between Any
Two Channels

CHX_MAXVCHX

V

CHX_SATICHX

I

CH_MATCHING

Output Current Load Regulation V

Output Current Line Regulation (Note 2) V

Note 2: Guaranteed by design (GBD).

=0.8V, R

=0 75 mA

ISET

=60mA

I

=60mA,

CHX

=0.8V

V

CH

=0.5V to 2.8V 4 %

CHX

=4.2V to 2.8V 2 %/V

CHX

BCD Semiconductor Manufacturing LimitedJul. 2012 Rev. 1. 2

6

0.6 V

3%

Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Electrical Characteristics (Continued)

VIN=24V, VEN=5V, TA=25

ture range (T

A

=-40

Parameter Symbol Conditions Min Typ Max Unit

DIMMING SECTION

o

C, unless otherwise specified. Boldface type apply over the full operating tempera-

o

C to 85oC).

PWM High Level Threshold Voltage V

PWM Low Level Threshold Voltage V

Linear Dimming Level V

LED SHORT PROTECTION SECTION

SCP Current I

CURRENT SINK SECTION

ISET Reference Voltage V

I

CHX/ISET

Current Multiplication Ratio k R

ENABLE SECTION

EN Pin High Level Threshold V

EN Pin Low Level Threshold V

OVP SECTION

Threshold Voltage V

THRESHOLD

FLAG SECTION

Saturation Voltage V

SYN SECTION

IH_PWM

IL_PWM

L_DIM

SCP

ISET

IH_EN

IL_EN

SAT

2.5 V

0.5 2.2 V

10.5 12.5 14.5 µA

R

=30k, CH1 to

ISET

1.170 1.194 1.218 V

CH16 Floating

ISET

=30k, V

=1V 1615

CHX

2.0 V

1.130 1.194 1.250 V

I

=2mA 0.3 V

SINK

0.3 V

0.8 V

PWM Frequency f

SYNF High Level Output Voltage V

SYNF Low Level Output Voltage V

FB SECTION

Feedback Output Current I

TOTAL DEVICE

Thermal Shutdown Temperature T

Thermal Shutdown Hysteresis T

Jul. 2012 Rev. 1. 2

PWM

OUT_H

OUT_L

FB

OTSD

HYS

0.08 25 kHz

2.4 V

0.4 V

VFB Drop to 97% 13 17 µA

CHX Pin Left Foating 160

20

BCD Semiconductor Manufacturing Limited

7

o

C

o

C

Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Typical Performance Characteristics

VIN=24V, VEN=5V, R

=30kΩ,, TA=25

ISET

o

C, unless otherwise specified.

200

180

160

140

120

100

80

60

40

Maximum Channel Current (mA)

20

0

0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6

Channel Voltage (V)

Figure 4. Maximum Channel Current vs. Channel Voltage

Figure 5. Feedback Voltage vs. Feedback Current

70

60

50

40

30

20

Current per Channel (mA)

10

0

0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2

Linear Dimming Voltage (V)

0.56

0.54

0.52

0.50

0.48

0.46

0.44

Feedback Voltage (V)

0.42

0.40
4 6 8 10 12 14 16 18 20

Feedback Current (µA)

65

60

55

50

45

40

35

30

25

20

15

10

Current per Channel (mA)

5

0

-5

0 102030405060708090100

f=100Hz
f=20kHz

Duty Cycle (%)

Figure 6. Channel Current vs. Linear Dimming Voltage

Figure 7. Current per Channel vs. Duty Cycle
(PWM Dimming)

BCD Semiconductor Manufacturing LimitedJul. 2012 Rev. 1. 2

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Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Typical Performance Characteristics (Continued)

VIN=24V, VEN=5V, R

=30kΩ,, TA=25

ISET

o

C, unless otherwise specified.

65

64

63

62

61

60

59

58

Channel Current (mA)

57

56

55

-50 -25 0 25 50 75 100 125 150

Temperature ( oC)

Figure 8. Channel Current vs. Temperature

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Saturation Voltage (V)

0.1

0.0

-50 -25 0 25 50 75 100 125 150

Temperature (oC)

1.4

1.3

1.2

1.1

1.0

0.9

ISET Reference Voltage (V)

0.8

-50 -25 0 25 50 75 100 125 150

Temperature (oC)

Figure 9. ISET Reference Voltage vs. Temperature

2.2

2.1

2.0

1.9

1.8

1.7

1.6

1.5

1.4

1.3

Quiescent Current (mA)

1.2

1.1

1.0

3 6 9 12 15 18 21 24 27

Input Voltage (V)

Figure 10. Saturation Voltage vs. Temperature Figure 11. Quiescent Current vs. Input Voltage

Jul. 2012 Rev. 1. 2

BCD Semiconductor Manufacturing Limited

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Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Typical Performance Characteristics (Continued)

VIN=24V, VEN=5V, R

=30kΩ,, TA=25

ISET

o

C, unless otherwise specified.

63.6

63.4

63.2

63.0

62.8

62.6

62.4

62.2

62.0

61.8

61.6

61.4

61.2

61.0

60.8

Current per Channel (mA)

60.6

60.4

60.2

60.0

0 2 4 6 8 10 12 14 16

Channel

TA=-40oC

TA=125oC

TA=25oC

V
5V/div

V

SYN

5V/div

V

GATE

10V/div

I

50mA/div

DIM

CH

Time 4ms/div

Figure 12. Current per Channel vs. Channel Figure 13. PWM Dimming (f=100Hz, Duty Cycle=50%)

V

SYNF

V

5V/div

V

SYN

5V/div

V

GATE

10V/div

I

CH

50mA/div

DIM

Time 20µs/div

1V/div

V

SYN

5V/div

V

GATE

10V/div

I

CH

100mA/div

Time 80 0µs/div

Figure 14. PWM Dimming (f=20kHz, Duty Cycle=50%) Figure 15. Linear Dimming (V

BCD Semiconductor Manufacturing LimitedJul. 2012 Rev. 1. 2

10

DIM

=1.4V)

Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Typical Performance Characteristics (Continued)

VIN=24V, VEN=5V, R

=30kΩ,, TA=25

ISET

o

C, unless otherwise specified.

V

OVP

1V/div

I
50mA/div

V
1V/div

V

FLAG

5V/div

CH

FB

Time 400 µs/div

V

SCP

1V/div

I

100mA/div

V
5V/div

V

FLAG

5V/div

CH

CH

Time 4µs/div

Figure 16. LED Open Protection Figure 17. LED Short Protection

V

GATE

5V/div

I

CH

50mA/div

Time 2s/div

Figure 18. OTP and Recovery

Jul. 2012 Rev. 1. 2

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BCD Semiconductor Manufacturing Limited

Data Sheet

+

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Function Description

1. LED Current Setting

The maximum LED current per channel can be
adjusted up to 75mA via ISET pin. When ≥ 75mA

current is needed in application, two or more channels
can be paralleled to provide larger drive current. Con­nect a resistor R

set the reference current I
determined by the following equation.

)(

=

mAI

LED

2. Dimming Control

The AP3616 provides two dimming methods: external
PWM signal or DC voltage input. Applying a PWM
signal to DIM pin to adjust the LED current, that
means, the LED current of all enabled channels can be
adjusted at the same time and the LED brightness can
be adjusted from 1%*I

During the high level period of PWM signal, the LED
is turned on and 100% of the current flows through
LED, while during the low level period of the PWM
signal, the LED is turned off and almost no current
flows through the LED, thus changing the average
current through LED and finally adjusting LED
brightness. The external PWM signal frequency
applied to PWM pin is allowed to be 80Hz or higher.

3.Over Voltage Protection

between ISET pin and GND to

ISET

. The LED current is

SET

⋅

Vk

ISET

Ω

CHX_MAX

=

)(

to 100%*I

194.10156

×

Ω

kRkR

ISETISET

)(

CHX_MAX

The AP3616 integrates an OVP circuit. The OVP pin
is connected to the center tap of voltage-divider (R

and R
and GND (Figure 19). If the voltage on OVP pin

exceeds 1.194V, which may results from open loop or
excessive output voltage, the AP3616 will start LED
open protection.

4. LED Short-circuit Protection

The AP3616 integrates an LED short-circuit
protection circuit. During normal operation, any short­circuited LED will cause the corresponding LED pin
voltage to rise. If any LED pin voltage exceeds 8
times of the voltage at SCP pin, the corresponding
LED current sink will be latched off, while the
remaining string(s) keep normal operation. Toggle the
VIN and/or EN to reset the latch. An internal current

.

source was connected to this pin, a resistor connected
here is used to set the shorting LED trigger voltage.

5. LED Open-circuit Protection

The AP3616 integrates an LED Open-Circuit Protec­tion circuit. When any LED string is open, V

boost up until the voltage at OVP pin reaches an
approximate 1.194V threshold. The IC will automati­cally ignore the open string(s) whose CHX pin voltage
is less than 100mV.

) that placed between high voltage output

OV4

×

V

OVP

=

R

OV4OV3

OV4

V194.1)R(R

OUT

OV3

will

BCD Semiconductor Manufacturing LimitedJul. 2012 Rev. 1. 2

12

Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Typical Application

R2

C1

(Optional)

(Optional)

+24V

C

µ

22 F/50V

IN1

+24V (VCC)

L

µ

C

C

IN2

IN3

UVLO_1

20k

R

1

UVLO

OVP1

2

R1

EN

Ω

51

2.7k

UVLO_2

R

OV

3

EN

4

VIN

5

VCC

6

OUT

V

78

C

µ

GND

0.47 F/25V

47 H/4A

C

ss

100k

22nF/16V

C

C

R

C

3.9k

10nF/16V

R10

R

T

(Optional)

C4

R

G

Ω

2

14

SS

13

COMP

12

FB

11

SHDN

10

GND

AP3039A

9

CS

RT

U1

Single Chip Application (12S16P)

R3

(Optional)

MBRD360

60V/3A

FQD13N06L

60V/11A

D

10 F/100V

V

OUT

R

R

OV1

200k 150k

OVP1 OVP2

OV2

OV3

R

OV4

4.3k

C

C

OUT1

µ

OUT2

µ

10 F/100V

R

4.3k

LED Arrays

12x16

R10

PWM

SYN

CH1

R6
30k

CH2

AP3616

FB

VIN

ISET

GND

SCP

C3

R7

6.8nF

130k

µ

R

R

(Optional)

300m

CS2

CS1

300m

Ω

Ω

R4
100k

R5 62k

V

=24V

CC

C2

µ

0.1 F/50V

CH16

DIM

FBX

OVP

EN

FLAG

SYNF

R8

Ω

51

R9

1k

OVP2

EN

+5V

PWM / Linear

Dimming

Ω

51

µ

1 F

(Optional)

+24V

C

µ

22 F/50V

IN1

+24V (VCC)

R2

C1

(Optional)

(Optional)

R11_1

(Optional)

C4

(Optional)

R3

MBRD360

60V/3A

FQD13N06L

60V/11A

R

R

CS2

CS1

(Optional)

300m

300m

Ω

R4

100k

D

C

µ

10 F/100V

Ω

V

CC

OUT1

R5 62k

=24V

C2

µ

0.1 F/50V

V

OUT

C

OUT2

µ

10 F/100V

R

OV2

4.3k

R

OV1

200k
OVP1 OVP2

SYN

FB

U2

VIN

R6_1
30k

R
150k

ISET

OV3

R

OV4

4.3k

CH1

AP3616

GND

R7_1
130k

SCP

6.8nF

C3_1

CH2

SYNF

R8_1

Ω

51

EN

L

µ

C

C

IN2

IN3

UVLO_1

20k

R

1

UVLO

OVP1

2

R1

EN

Ω

51

OV

3

EN

4

VIN

5

VCC

2.7k

6

OUT

V

78

UVLO_2

C

µ

GND

R

0.47 F/25V

47 H/4A

C

ss

22nF/16V

14

SS

C

C

R

C

13

COMP

3.9k
10nF/16V

12

FB

11

SHDN

10

GND

AP3039A

9

CS

R

T

RT

100k

U1

R

G

2Ω

EN

R9_1

LED Arrays

12x32

PWM

SYN

CH1

CH16

DIM

FBX

VCC=24V

OVP

FLAG

C2

µ

0.1 F/50V

OVP2

1k

+5V

CH2

AP3616

FB

U3

VIN

ISET

GND

SCP

SYNF

C3

R7

R6

6.8nF

130k

30k

R10

OVP2

PWM / Linear

Dimming

Ω

51

µ

1 F
(Optional)

CH16

DIM

FBX

OVP

EN

FLAG

R8

R9

Ω

51

1k

+5V

Multi Chips Application (12S32P)

Figure 19. Typical Applications of AP3616

Jul. 2012 Rev. 1. 2

BCD Semiconductor Manufacturing Limited

13

Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Mechanical Dimensions

SOIC-28

17.700(0.697)

18.100(0.713)

10.210(0.402)

10.610(0.418)

1.270(0.050)
BSC

7.400(0.291)

0.400(0.016)

1.270(0.050)

Unit: mm(inch)

0.204(0.008)

0.330(0.013)

°

0

°

8

7.700(0.303)

0.330(0.013)

0.510(0.020)

2.290(0.090)

2.500(0.098)

Note: Eject hole, oriented hole and mold mark is optional.

0.100(0.004)

0.300(0.012)

2.350(0.093)

2.650(0.104)

BCD Semiconductor Manufacturing LimitedJul. 2012 Rev. 1. 2

14

Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Mechanical Dimensions (Continued)

10.000(0.394)

10.650(0.419)

7.400(0.291)

7.600(0.300)

0.230(0.009)

0.470(0.019)

HSOP-28

17.890(0.704)

18.190(0.716)

5.050(0.199)

5.250(0.207)

0.800(0.031)

0.100(0.004)

0.300(0.012)

0.400(0.016)

1.270(0.050)

TYP

Unit: mm(inch)

0.204(0.008)

0.360(0.014)

o

o

8

0

～

2.180(0.086)

2.330(0.092)

Note: Eject hole, oriented hole and mold mark is optional.

2.280(0.090)

2.630(0.104)

BCD Semiconductor Manufacturing LimitedJul. 2012 Rev. 1. 2

15

BCD Semiconductor Manufacturing Limited

IMPORTANT NOTICE

IMPORTANT NOTICE

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-

cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any

cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any

particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use

particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use

of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or

of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or

other rights nor the rights of others.

other rights nor the rights of others.

http://www.bcdsemi.com

MAIN SITE

MAIN SITE

- Headquarters

BCD Semiconductor Manufacturing Limited

BCD Semiconductor Manufactur ing Limited

- Wafer Fab

No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China

Shanghai SIM-BCD Semiconductor Manufacturing Limited

Tel: [phone], Fax: [phone]

800, Yi Shan Road, Shanghai 200233, China
Tel: [phone], Fax: [phone]

REGIONAL SALES OFFICE

Shenzhen Office

REGIONAL SALES OFFICE

Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office

Shenzhen Office

Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen,

Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office

China

Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office

Tel: [phone]

Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China

Fax: [phone]

Tel: [phone]
Fax: [phone]

- Wafer Fab

BCD Semiconductor Manufacturing Limited

Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

- IC Design Group

800 Yi Shan Road, Shanghai 200233, China

Advanced Analog Circuits (Shanghai) Corporation

Tel: [phone], Fax: [phone]

8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China
Tel: [phone], Fax: [phone]

Taiwan Office
BCD Semiconductor (Taiwan) Company Limited

Taiwan Office

4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei,

BCD Semiconductor (Taiwan) Company Limited

Tai wan

4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei,

Tel: [phone]

Taiwan

Fax: [phone]

Tel: [phone]
Fax: [phone]

USA Office
BCD Semiconductor Corp.

USA Office

30920 Huntwood Ave. Hayward,

BCD Semiconductor Corporation

CA 94544, USA

30920 Huntwood Ave. Hayward,

Tel : [phone]

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