Halogen and Antimony Free. “Green” Device (Note 3)
• UL Recognized, File Number E322375
• IEC60950-1 CB Scheme Certified
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Applications
• Consumer electronics – LCD TV & Monitor, Game Machines
EN1 3 3 Switch 1 enable input, active low (AP2142) or active high (AP2152)
EN2 4 4 Switch 2 enable input, active low (AP2142) or active high (AP2152)
FLG2 5 5 Switch 2 over-current and over-temperature fault report; open-drain flag is active low when triggered
OUT2
OUT1
6 6 Switch 2 voltage output pin
7 7 Switch 1 voltage output pin
FLG1 8 8 Switch 1 over-current and over-temperature fault report; open-drain flag is active low when triggered
Exposed Tab — Exposed Tab
Exposed pad. It should be connected to GND and thermal mass for enhanced thermal impedance.
It should not be used as electrical ground conduction path.
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
Input Voltage 6.5 V
Output Voltage
VIN + 0.3
V
Enable Voltage 6.5 V
Maximum Continuous Load Current Internal Limited A
Notes: 5. Test condition for SO-8: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad layout.
6. Test condition for MSOP-8EP: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom
layer ground plane.