Despatch DF 3630 User Manual

INSPIRED INNOVATION

u DF In-line Diffusion System

Diffusion for highly uniform emitters

e Despatch In-line Diusion Furnace incorporates advanced infrared
thermal technology that provides the tight temperature uniformity
needed for increased cell eciencies. Air is passively preheated as it
enters the chamber and lamps on top and bottom along with edge
heaters eectively transfer heat to the wafers. Automated drop-down
access to the chamber reduces maintenance time and the insulation
in the rst zones of the furnace is easily removed if it becomes
contaminated. e furnace provides advanced prole capability
and a fully comprehensive soware system.

In-line processing oers reduced wafer handling and greater throughput
than batch processing. With less handling you will have less breakage
and increased yield. e Despatch Diusion Furnace combined with
USI’s Deposition tool consistently produces highly uniform emitters
using aqueous-based doping. is repeatability enables
higher sheet resistances, excellent yields and optimum
cell eciency.

FEATURES AT A GLANCE

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High volume production

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Exceptional thermal uniformity

± 1°C in the dwell region

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Closed loop temperature controls

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Advanced graphical user interface

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Safe, simple chamber accessibility

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High production up-time

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Ease of maintenance

High ohm emmiter capability

Industry best emitter uniformity

Best-in-class uptime and yield

Minneapolis • shanghai • Berlin • singapore • hsinchu • ToKYo

DF 3630 PRODUCTION SCALE

PRODUCT CONFIGURATION

System size
(length x width x height)

Standard entrance table

Heated length 10,516 mm (414 inch)

Cooling length 1,829 mm (72 inch)

Standard exit table 914 mm (36 inch)

Conveyor type Lightweight balance spiral weave, Nichrome V material

Conveyor height above floor 97.8 cm +/-3.6 cm (38.4 in +/-1.5 in)

Product clearance 6.4 mm (0.25 inch)

Number of Lanes (156 x 156 mm) 5

Conveyor width 914 mm (36 inch)

PROCESS CAPABILITIES

Maximum temperature 1000 °C (1832 °F)

Approx. throughput (156 x 156 mm)

Conveyor speed range

Conveyor speed accuracy ± 0.5%

Conveyor speed control Closed loop feedback

Wafer size 100x100, 125 x125, 156 x 156 mm (4, 5, 6 inch)

Sheet resistance 40 to >120 ohm/sq configurable

15,329 × 1,870 × 1,750 mm (603.5 x 74 x 69 inches)

914 mm (36 inch)

1200-1400 wafers/hr

10–100 cm/min (4-40 ipm)

Option for 210 x 210 mm (8 inch) support

IN-LINE DIFFUSION FURNACE

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Tight temperature control for maximum

process window

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Maximum up-time for higher yields

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Process profiles for high efficiency solar cells

OPTIONS

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Water-cooled heat exchanger

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Failed element monitor

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Master production control interface

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Profiling systems

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Ultrasonic belt cleaner/dryer

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Uninterruptible power supply

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Extended process profiles

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Conveyor table extensions

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CE Compliance

A plasma system is
available for chemical­free conditioning of the
wafer surface.

The Despatch Diffusion Furnace combined with USI’s Deposition

tool is a reliable system for highly uniform emitters.

GLOBAL OFFICES

Germany: [phone] / [e-mail]
China: [phone] / [e-mail]
Taiwan:

[phone] / [e-mail]

Japan: [phone] / [e-mail]

INTEGRATED PROCESS

conTrol sYsTeM

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Doper/Furnace recipe creation

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Process window monitoring with

audible and visual alarming

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Real-time process window display

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Data logging

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Process repeatability

USA HEADQUARTERS

Phone: [phone]
toll free usa: 1-888-337-7282
fax: [phone]

[e-mail]
[e-mail]

www.despatch.com

8860 207th Street West
Minneapolis, MN 55044 USA

© 2011 Despatch Industries. All rights reserved. Despatch is a registered trademark of Despatch Industries in the U.S. and other countries. DF-6-11