The D packages are available taped and reeled. Add the suffix R to
the device type when ordering. (i.e.,RC4559DR)
OPERATING
TEMPERATURE
RANGE
VIO max
at 25°C
D OR P PACKAGE
(TOP VIEW)
OUT
1
AMP # 1
V
IN−
IN+
CC−
2
3
4
ymbol (each amplifier)
IN+
IN−
+
−
V
8
CC+
OUT
7
IN−
6
IN+
5
AMP # 2
OUT
description
The RC4559 is a dual high-performance operational amplifier. The high common-mode input voltage and the
absence of latch-up make this amplifier ideal for low-noise signal applications such as audio preamplifiers and
signal conditioners. This amplifier features a guaranteed dynamic performance and output drive capability that
far exceeds that of the general-purpose type amplifiers.
The RC4559 is characterized for operation from 0°C to 70°C.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
The marketing status values are defined asfollows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the devicewill be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but isnot in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production ofthe device.
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAUN / A for Pkg Type
CU NIPDAUN / A for Pkg Type
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information andadditional product content details.
TBD: The Pb-Free/Green conversion plan has notbeen defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products aresuitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
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