@ : Nopop Component
1@ : Populate for G72MV
2@ : Populate for G86MV
45144731L01 pop for G86MV
45144XXXXX pop for G72MV
44
MB PCB
Part NumberDescription
DAA00000K0L
A
PCB ZGX LA-3302P
REV0 M/B DIS
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Index and Config.
LA-3302P
366Monday, February 26, 2007
1
0.4
of
5
4
3
2
1
RUN_ON
ADAPTER
DD
+PWR_SRC
FDS4435
(Q24)
ISL6236
(PU25)
M_ON
GFX_CORE_ON
+INV_PWR_SRC
+1.25V_M
+GPU_CORE
RUN_ON
MAX1510E
(PU26)
MAX1510E
(PU26)
+1.25V_RUN
+1.05V_M
BATTERY
RUN_ON
SI4810DY
(Q58)
+15V_ALW
+5V_RUNSI4810DY
(Q52)
M_ON
SI4800BDY
(Q67)
CHARGER
ISL6260
CC
SUS_ON
+5V_SUS
+3.3V_SUS
(PU11)(PU6)
RUNPWROK
+VCC_CORE
ISlL88550_AVDD
+1.8V_SUS+0.9V_DDR_VTT
ISL88550A
DDR_ON
ISL6236
(PU21)
1.05V_RUN_ON
1.5V_RUN_ON
ISL6236
(PU20)
+1.05V_VCCP+1.5V_RUN
ALWON
ALWON
+5V_ALW
+3.3V_ALW
ENAB_3VLAN
SI3456BDV
RUN_ON
(Q44)
RUN_ON
BB
MAX9789A
AUDIO_AVDD_ON
SI3456BDV
(Q54)
HDDC_EN#
SI3456SI3456BDV
(Q48)(Q56)(U37)
MODC_EN#
+3.3V_LAN
CTRL_18
+3.3V_RUN
CTRL_10
+3.3V_M
BCP69BCP69
+5V_HDD
+5V_MOD
(Q45)
+VDDA
(Q46)
+1.8VRUN
AA
+1.8V_LAN+1.0V_LAN
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Power Rail
LA-3302P
466Monday, February 26, 2007
1
0.4
of
5
hexainf@hotmail.com
GRATIS - FOR FREE
AJ26
ICH_SMBCLK
ICH_SMBDATA
ICH8-M
DD
AD19
2.2K
2.2K
4
+3.3V_SUS
WWAN
SMBUS Address [TBD]
3
3032
C8C7
Intel LAN
SMBUS Address [TBD]
3230
2N7002
2N7002
2N7002
2N7002
WLAN_SMBCLK
WLAN_SMBDATA
2.2K
2.2K
2
MEM_SCLK
MEM_SDATA
+3.3V_WLAN
WLAN
2.2K
2.2K
@ 0
+3.3V_RUN
197
195
DIMMA
197
195
DIMMB
CLK_SCLK@ 0
CLK_SDATA
1
SMBUS Address [TBD]
SMBUS Address [TBD]
SMBUS Address [TBD]
8.2K
8.2K
8
LCD_SMBCLK
7
CC
LCD_SMDATA
4.7K
4.7K
100
THRM_SMBCLK
99
THRM_SMBDAT
+3.3V_ALW
+3.3V_ALW
6
5
10
9
12
11
INVERTER
(JLVDS)
Charger
EMC4001
SMBUS Address [TBD]
SMBUS Address [TBD]
SMBUS Address [TBD]
2.2K
SBAT_SMBCLK
10
SBAT_SMBDAT
SIO
9
2.2K
2.2K
111
PBAT_SMBCLK
PBAT_SMBDAT
112
BB
2.2K
+3.3V_ALW
100 ohm
100 ohm
+3.3V_ALW
100 ohm
100 ohm
3
4
3
4
9
10
2'nd
BATTERY
BATTERY
CONN
CHARGER
SMBUS Address [TBD]
SMBUS Address [TBD]
SMBUS Address [TBD]
8.2K
+5V_ALW
6
5
DOCKING
SMBUS Address [TBD]
MEC 5025
6
5
8.2K
DOCK_SMB_CLK
DOCK_SMB_DAT
2.2K
2.2K
CKG_SMBDAT
12
CKG_SMBCLK
13
2N7002
2N7002
+3.3V_RUN
CLK_SDATA
CLK_SCLK
17
16
CLK GEN
SMBUS Address [TBD]
AA
Compal Electronics, Inc.
SMBUS TOPOLOGY
LA-3302P
566Monday, February 26, 2007
1
0.4
of
5
Title
Size Document NumberRev
4
3
2
Date:Sheet
5
+3.3V_RUN
R435
@
12
0_0402_5%~D
CKG_SMBDAT39
DD
+3.3V_RUN
CKG_SMBCLK39
FSCFSBFSA CPU
CLKSEL2CLKSEL0CLKSEL1
13
13
12
R440
@
0_0402_5%~D
000
1
00
1
0
*
0
1
CC
1
1
11
0
11
00
1
0
1
0
1
R265
D
S
Q34
2N7002W-7-F_SOT323-3~D
G
2
2
G
Q35
2N7002W-7-F_SOT323-3~D
D
S
SRC
MHz
MHz
100
266
100
133
100
200
100
166
100
333
100
100
100
400
20010033.3
Table : ICS954305AK
CPU_BSELCPU_BSEL2(FSC) CPU_BSEL1(FSB)
133
166
+3.3V_RUN
R290
BB
10K_0402_5%~D
12
PCI_PCM
+3.3V_RUN
12
R304
10K_0402_5%~D
PCI_ICH
0
0
CLK_NV_27M52
84.5_0402_1%~D
Populate R697,R833 for G72MV
Populate R286 for G86MV.
R833,R286 place overlap
PGMODE
ITP_EN
+3.3V_RUN+3.3V_RUN
12
R318
10K_0402_5%~D
AA
PCI_LOM
12
R319
@
10K_0402_5%~D
12
R329
@
10K_0402_5%~D
FSA
12
R391
@
10K_0402_5%~D
*
TME
*
FCTSEL1 PIN43PIN44PIN47PIN48
0=UMA
*
0=UMA
1=DIS
12
12
R266
2.2K_0402_5%~D
2.2K_0402_5%~D
CLK_SDATA
CLK_SCLK
PCI
MHz
33.3
33.3
33.3
33.3
33.3
33.3
Place crystal within
33.3
500 mils of CK410
CLK_ICH_48M23
CLK_SMC_48M31
CPU_MCH_BSEL08,10
CPU_MCH_BSEL18,10
CPU_MCH_BSEL28,10
CLK_PCI_TPM28
0
1
R697
1@
0
1
0
1
Normal Operation
0
Trusted Mode Enabled
1
CLK_PCI_DOCK36
CLK_PCI_PCM30
CLK_PCI_502539
CLK_PCI_501838
CLK_ICH_14M23
CLK_SIO_14M38
CLK_NVSS_27M52
12
CLK_PCI_ICH21
CLK_PWRGD23
PIN 9
VTT_PWRGD#/PD
CKPWRGD/PD#
PIN 37
Pin 5/6 as SRC_10
Pin 5/6 as CPU_ITP
PIN 32
DOT96T DOT96C96/100M_T 96/100M_C
27M_out 27M SSout SRCT0SRC C0
1=Disc. GRFX down
5
+CK_VDD_48
1
C99
2
4.7U_0603_6.3V4Z~D
1
C708
2
3.3P_0402_50V8C~D
C483
27P_0402_50V8J~D
C484
33P_0402_50V8J~D
CLK_NVSS_27M
4
1
C471
2
0.1U_0402_16V4Z~D
1
C799
2
0.047U_0402_16V4Z~D
CLK_SMC_48MCLK_ICH_48M
1
2
X1
14.31818MHz_20P_1BX14318CC1A~D
12
12
12
CLK_ICH_48M
CLK_SMC_48M
CLK_PCI_TPM
CLK_PCI_DOCK
CLK_PCI_PCM
CLK_PCI_5025
CLK_PCI_5018
CLK_ICH_14M
CLK_SIO_14M
CLK_NV_27M
CLK_PCI_ICH
CLK_PWRGD
+3.3V_RUN
4
12
L28
BLM21PG600SN1D_0805~D
L87
0.047U_0402_16V4Z~D
0_0402_5%~D
12
R298
CLK_SCLK34
CLK_SDATA34
R271
12
12
12
12
12
12
+CK_VDD_MAIN2
12
BLM21PG600SN1D_0805~D
+CK_VDD_REF
1
C189
2
C774
3.3P_0402_50V8C~D
R27315_0402_5%~D
R27515_0402_5%~D
12
R3092.2K_0402_5%~D
12
R3148.2K_0402_5%~D
12
R27733_0402_5%~D
R59633_0402_5%~D
R28033_0402_5%~D
R28215_0402_5%~D
R33315_0402_5%~D
12
R28415_0402_5%~D
12
R28515_0402_5%~D
12
R28633_0402_5%~D 2@
12
R833147_0402_1%~D1@
12
R28733_0402_5%~D
12
R29133_0402_5%~D
R295
@
10K_0402_5%~D
12
@
12
10K_0402_5%~D
R760
12
12
R7582.2_0603_5%~D
+CK_VDD_MAIN+3.3V_RUN
1_0603_5%~D
CLK_XTAL_IN
CLK_XTAL_OUT
FSA
FSC
PCI_LOM
PCI_DOCK
PCI_PCM
PCI_SIO
CLKREF
DOT96
CLK_NVSS
PCI_ICH
PGMODE
CLK_SCLK
CLK_SDATA
3
+CK_VDD_MAIN
1
1
1
C474
C473
C472
2
10U_0805_10V4Z~D
1
C480
2
10U_0805_10V4Z~D
R759
12
2.2_0603_5%~D
U28
1
49
54
65
30
36
+CK_VDD_REF
+CK_VDD_48
12
18
40
20
19
41
45
23
34
33
32
27
22
43
44
37
39
9
16
17
4
15
21
31
35
42
68
73
74
75
76
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
For the purpose of testability, route these signals
through a ground referenced Z0 = 55ohm trace that
ends in a via that is near a GND via and is
accessible through an oscilloscope connection.
Resistor placed within 0.5" of
CPU pin.Trace should be at least
25 mils away from any other
toggling signal. COMP0, COMP2
trace should be 27.4 ohm.
COMP1, COMP3 should be 55
ohm.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Place these inside
socket cavity on L8
(North side
Secondary)
DD
Place these inside
socket cavity on L8
(Sorth side
Secondary)
Place these inside
socket cavity on L8
(North side
Primary)
Place these inside
socket cavity on L8
(Sorth side
Primary)
CC
1
2
+VCC_CORE
1
2
+VCC_CORE
1
2
+VCC_CORE
1
2
C329
10U_0805_4VAM~D
C222
10U_0805_4VAM~D
C363
10U_0805_4VAM~D
C364
10U_0805_4VAM~D
1
C330
10U_0805_4VAM~D
2
1
C223
10U_0805_4VAM~D
2
1
C64
10U_0805_4VAM~D
2
1
C50
10U_0805_4VAM~D
2
1
C331
10U_0805_4VAM~D
2
1
C224
10U_0805_4VAM~D
2
1
C65
10U_0805_4VAM~D
2
1
C51
10U_0805_4VAM~D
2
1
C332
10U_0805_4VAM~D
2
1
C225
10U_0805_4VAM~D
2
1
C66
10U_0805_4VAM~D
2
1
C52
10U_0805_4VAM~D
2
4
1
2
1
2
1
2
1
2
C333
10U_0805_4VAM~D
C227
10U_0805_4VAM~D
C67
10U_0805_4VAM~D
C53
10U_0805_4VAM~D
1
C334
10U_0805_4VAM~D
2
1
C226
10U_0805_4VAM~D
2
1
C68
10U_0805_4VAM~D
2
1
C54
10U_0805_4VAM~D
2
1
C335
10U_0805_4VAM~D
2
1
C228
10U_0805_4VAM~D
2
10uF 0805 X6S -> 85 degree C
3
1
C336
10U_0805_4VAM~D
2
1
C229
10U_0805_4VAM~D
2
1
C55
10U_0805_4VAM~D
2
1
C69
10U_0805_4VAM~D
2
1
C190
10U_0805_4VAM~D
2
1
C185
10U_0805_4VAM~D
2
2
1
High Frequence Decoupling
Near VCORE regulator.
+VCC_CORE+VCC_CORE
South Side Secondary
C177
BB
220U_X_2VM_R7M~D
1
1
+
+
C179
C178
2
2
@
220U_X_2VM_R7M~D
220U_X_2VM_R7M~D
1
1
+
+
C338
C366
2
2
@
220U_X_2VM_R7M~D
220U_X_2VM_R7M~D
1
+
2
North Side Secondary
1
+
C365
2
220U_X_2VM_R7M~D
ESR <= 1.5m ohm
Capacitor > 1980uF
1
C870
0.1U_0402_10V7K~D
2
@
1
C871
0.1U_0402_10V7K~D
2
@
1
C872
0.1U_0402_10V7K~D
2
@
1
C873
0.1U_0402_10V7K~D
2
@
BITs WI97837
+1.05V_VCCP
1
C312
0.1U_0402_10V7K~D
2
AA
1
C256
0.1U_0402_10V7K~D
2
1
C293
0.1U_0402_10V7K~D
2
1
C250
0.1U_0402_10V7K~D
2
1
C310
0.1U_0402_10V7K~D
2
1
C264
0.1U_0402_10V7K~D
2
Place these inside
socket cavity on L8
(North side
Secondary)
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
CPU Bypass
LA-3302P
966Monday, February 26, 2007
1
0.4
of
5
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PEG_MTX_GRX_P[0..15] 52
PEG_MTX_GRX_N[0..15] 52
3
C5000.1U_0402_10V7K~D
12
C5010.1U_0402_10V7K~D
C5020.1U_0402_10V7K~D
12
C5040.1U_0402_10V7K~D
12
C5060.1U_0402_10V7K~D
12
C5080.1U_0402_10V7K~D
12
C5100.1U_0402_10V7K~D
12
C5120.1U_0402_10V7K~D
12
C5140.1U_0402_10V7K~D
12
C5160.1U_0402_10V7K~D
12
C5180.1U_0402_10V7K~D
12
C5200.1U_0402_10V7K~D
12
C5220.1U_0402_10V7K~D
12
C5240.1U_0402_10V7K~D
12
C5260.1U_0402_10V7K~D
12
C5280.1U_0402_10V7K~D
12
C5300.1U_0402_10V7K~D
12
12
C5030.1U_0402_10V7K~D
12
C5050.1U_0402_10V7K~D
12
C5070.1U_0402_10V7K~D
12
C5090.1U_0402_10V7K~D
12
C5110.1U_0402_10V7K~D
12
C5130.1U_0402_10V7K~D
12
C5150.1U_0402_10V7K~D
12
C5170.1U_0402_10V7K~D
12
C5190.1U_0402_10V7K~D
12
C5210.1U_0402_10V7K~D
12
C5230.1U_0402_10V7K~D
12
C5250.1U_0402_10V7K~D
12
C5270.1U_0402_10V7K~D
12
C5290.1U_0402_10V7K~D
12
C5310.1U_0402_10V7K~D
12
Strap Pin Table
PCI Express
Graphic Lane
FSB Dynamic
ODT
DMI Lane
Reversal
SDVO/PCIE
Concurrent
Operation
PEG_MTX_GRX_P0
PEG_MTX_GRX_N0
PEG_MTX_GRX_P1
PEG_MTX_GRX_N1
PEG_MTX_GRX_P2
PEG_MTX_GRX_N2PEG_MTX_GRX_C_N2
PEG_MTX_GRX_P3
PEG_MTX_GRX_N3
PEG_MTX_GRX_N4
PEG_MTX_GRX_P5
PEG_MTX_GRX_N5
PEG_MTX_GRX_P6
PEG_MTX_GRX_N6
PEG_MTX_GRX_P7
PEG_MTX_GRX_N7
PEG_MTX_GRX_P8
PEG_MTX_GRX_N8
PEG_MTX_GRX_P9
PEG_MTX_GRX_N9
PEG_MTX_GRX_P10
PEG_MTX_GRX_N10
PEG_MTX_GRX_P11
PEG_MTX_GRX_N11
PEG_MTX_GRX_P12
PEG_MTX_GRX_N12
PEG_MTX_GRX_P13
PEG_MTX_GRX_N13
PEG_MTX_GRX_P14
PEG_MTX_GRX_N14
PEG_MTX_GRX_P15
PEG_MTX_GRX_N15
Low = DMI x 2
High = DMI x 4 (Default)
Low = Reverse LaneCFG9
High = Normal O p e r a t i o n ( Default)
Low=Dynamic O D T Disable
High=Dynamic ODT Enable(default)
Low=Normal (default)
High=Lane Reversed
Low=Only SDVO or PCIEx1 is
operational (defaults)
High=SDVO and P C I E x 1 a r e o p e rating
simultaneously via PEG port
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Layout Note:
Place one cap close to every 2 pullup
resistors terminated to +0.9V_DDR_VTT
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
1
2
2
C138
C137
14
23
14
23
14
23
14
23
14
23
R223
56_0402_5%~D
23
14
5
1
2
1
2
RN4
RN3
RN9
RN2
RN1
RN7
C132
0.1U_0402_16V4Z~D
C139
C437
1
2
0.1U_0402_16V4Z~D
C131
1
2
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
2
C140
+0.9V_DDR_VTT
12
C116
1
2
C118
0.1U_0402_16V4Z~D
1
2
C105
DDR_A_MA9
DDR_A_MA12
DDR_A_MA7
DDR_A_MA6
DDR_A_MA5
DDR_A_MA8
DDR_A_MA4
DDR_A_MA2
DDR_A_MA0
DDR_A_BS1
M_ODT0
DDR_A_MA13
DDR_A_MA14
DDR_A_MA11
0.1U_0402_16V4Z~D
Layout Note:
Place near JDIM1
0.1U_0402_16V4Z~D
1
1
2
2
C106
C107
4
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
1
2
2
C109
C108
Layout Note:
Place these resistor
closely DIMM0,all
trace length<750 mil
Layout Note:
Place these resistor
closely DIMM0,all
trace length
Max=1.3"
4
3
+1.8V_SUS+1.8V_SUS
ON TOP SIDE
JDIM2
1
VREF
3
2.2U_0603_6.3V6K~D
C115
VSS
5
DQ0
7
DQ1
9
VSS
11
DQS0#
13
DQS0
15
VSS
17
DQ2
19
DQ3
21
VSS
23
DQ8
25
DQ9
27
VSS
29
DQS1#
31
DQS1
33
VSS
35
DQ10
37
DQ11
39
VSS
41
VSS
43
DQ16
45
DQ17
47
VSS
49
DQS2#
51
DQS2
53
VSS
55
DQ18
57
DQ19
59
VSS
61
DQ24
63
DQ25
65
VSS
67
DM3
69
NC
71
VSS
73
DQ26
75
DQ27
77
VSS
79
CKE0
81
VDD
83
NC
85
BA2
87
VDD
89
A12
91
A9
93
A8
95
VDD
97
A5
99
A3
101
A1
103
VDD
105
A10/AP
107
BA0
109
WE#
111
VDD
113
CAS#
115
NC/S1#
117
VDD
119
NC/ODT1
121
VSS
123
DQ32
125
DQ33
127
VSS
129
DQS4#
131
DQS4
133
VSS
135
DQ34
137
DQ35
139
VSS
141
DQ40
143
DQ41
145
VSS
147
DM5
149
VSS
151
DQ42
153
DQ43
155
VSS
157
DQ48
159
DQ49
161
VSS
163
NC,TEST
165
VSS
167
DQS6#
169
DQS6
171
VSS
173
DQ50
175
DQ51
177
VSS
179
DQ56
181
DQ57
183
VSS
185
DM7
187
VSS
189
DQ58
191
DQ59
193
VSS
195
SDA
197
SCL
199
VDDSPD
201
GND
TYCO_1470815-2~D
RESERVE
DDR_A_D0
DDR_A_D5
DDR_A_DQS#0
DDR_A_DQS0
DDR_A_D3
DDR_A_D7
DDR_A_D13
DDR_A_D12
DDR_A_DQS#1
DDR_A_DQS1
DDR_A_D10
DDR_A_D17
DDR_A_D21
DDR_A_DQS#2
DDR_A_DQS2
DDR_A_D22
DDR_A_D23
DDR_A_D29
DDR_A_DM3
DDR_A_D27
DDR_A_D30
DDR_CKE0_DIMMA10
DDR_A_BS211
DDR_A_BS011
DDR_A_WE#11
DDR_A_CAS#11
DDR_CS1_DIMMA#10
M_ODT110
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
1
2
2
C110
C707
MEM_SDATA17,23
MEM_SCLK17,23
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Layout Note:
Place one cap close to every 2 pullup
resistors terminated to +0.9V_DDR_VTT
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
1
2
2
C454
C453
+0.9V_DDR_VTT
RN23
RN24
RN17
RN18
RN25
12
RN26
5
2.2U_0603_6.3V6K~D
C438
1
2
0.1U_0402_16V4Z~D
C414
1
2
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
2
C450
Layout Note:
Place near JDIM2
C411
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
1
2
2
C410
C409
4
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
1
1
2
2
2
C408
Layout Note:
Place these resistor
closely DIMM0,all
trace length<750 mil
Layout Note:
Place these resistor
closely DIMM0,all
trace length
Max=1.3"
C406
C407
4
3
ON BOTTOM SIDE
DDR_B_D0
DDR_B_DQS#0
DDR_B_DQS0
DDR_B_D6
DDR_B_D7
DDR_B_D8
DDR_B_D9
DDR_B_DQS#1
DDR_B_DQS1
DDR_B_D14
DDR_B_D15
DDR_B_D16
DDR_B_D21
DDR_B_DQS#2
DDR_B_DQS2
DDR_B_D19
DDR_B_D18
DDR_B_D24DDR_B_D28
DDR_B_D25
DDR_B_DM3
DDR_B_D26
DDR_B_D27
DDR_CKE2_DIMMB10
DDR_B_BS211
DDR_B_BS011
DDR_B_WE#11
DDR_B_CAS#11
DDR_CS3_DIMMB#10
1
2
C405
M_ODT310
MEM_SDATA16,23
MEM_SCLK16,23
DDR_CKE2_DIMMB
DDR_B_BS2
DDR_B_MA12
DDR_B_MA9
DDR_B_MA8
DDR_B_MA5
DDR_B_MA3
DDR_B_MA1
DDR_B_MA10
DDR_B_BS0
DDR_B_WE#
DDR_B_CAS#
DDR_CS3_DIMMB#
M_ODT3
DDR_B_D36
DDR_B_DQS#4
DDR_B_DQS4
DDR_B_D34
DDR_B_D40
DDR_B_D41
DDR_B_DM5
DDR_B_D42
DDR_B_D53
DDR_B_D49DDR_B_D48
DDR_B_DQS#6
DDR_B_DQS6
DDR_B_D55
DDR_B_D50
DDR_B_D56
DDR_B_D60
DDR_B_DM7
DDR_B_D58
DDR_B_D59
MEM_SDATA
MEM_SCLK
+3.3V_RUN
0.1U_0402_16V4Z~D
2.2U_0603_6.3V6K~D
C431
1
1
2
2
C429
JDIM1
1
VREF
3
VSS
5
DQ0
7
DQ1
9
VSS
11
DQS0#
13
DQS0
15
VSS
17
DQ2
19
DQ3
21
VSS
23
DQ8
25
DQ9
27
VSS
29
DQS1#
31
DQS1
33
VSS
35
DQ10
37
DQ11
39
VSS
41
VSS
43
DQ16
45
DQ17
47
VSS
49
DQS2#
51
DQS2
53
VSS
55
DQ18
57
DQ19
59
VSS
61
DQ24
63
DQ25
65
VSS
67
DM3
69
NC
71
VSS
73
DQ26
75
DQ27
77
VSS
79
CKE0
81
VDD
83
NC
85
BA2
87
VDD
89
A12
91
A9
93
A8
95
VDD
97
A5
99
A3
101
A1
103
VDD
105
A10/AP
107
BA0
109
WE#
111
VDD
113
CAS#
115
NC/S1#
117
VDD
119
NC/ODT1
121
VSS
123
DQ32
125
DQ33
127
VSS
129
DQS4#
131
DQS4
133
VSS
135
DQ34
137
DQ35
139
VSS
141
DQ40
143
DQ41
145
VSS
147
DM5
149
VSS
151
DQ42
153
DQ43
155
VSS
157
DQ48
159
DQ49
161
VSS
163
NC,TEST
165
VSS
167
DQS6#
169
DQS6
171
VSS
173
DQ50
175
DQ51
177
VSS
179
DQ56
181
DQ57
183
VSS
185
DM7
187
VSS
189
DQ58
191
DQ59
193
VSS
195
SDA
197
SCL
199
VDDSPD
201
GND
TYCO_1565917-4~D
DIMMB
STANDARD
DQ4
DQ5
DM0
DQ6
DQ7
DQ12
DQ13
DM1
CK0#
DQ14
DQ15
DQ20
DQ21
DM2
DQ22
DQ23
DQ28
DQ29
DQS3#
DQS3
DQ30
DQ31
NC/CKE1
VDD
NC/A15
NC/A14
VDD
VDD
VDD
RAS#
VDD
ODT0
NC/A13
VDD
DQ36
DQ37
DM4
DQ38
DQ39
DQ44
DQ45
DQS5#
DQS5
DQ46
DQ47
DQ52
DQ53
CK1#
DM6
DQ54
DQ55
DQ60
DQ61
DQS7#
DQS7
DQ62
DQ63
SAO
GND
VSS
VSS
VSS
VSS
VSS
VSS
CK0
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
BA1
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
CK1
VSS
VSS
VSS
VSS
VSS
VSS
SA1
NC
A11
A7
A6
A4
A2
A0
S0#
NC
2
+1.8V_SUS+1.8V_SUSV_DDR_MCH_REF
2
DDR_B_D5
4
DDR_B_D4DDR_B_D1
6
8
DDR_B_DM0
10
12
DDR_B_D2
14
DDR_B_D3
16
18
DDR_B_D13
20
DDR_B_D12
22
24
DDR_B_DM1
26
28
M_CLK_DDR2
30
M_CLK_DDR#2
32
34
DDR_B_D10
36
DDR_B_D11
38
40
42
DDR_B_D20
44
DDR_B_D17
46
48
PM_EXTTS#1
50
DDR_B_DM2
52
54
DDR_B_D22
56
DDR_B_D23
58
60
62
DDR_B_D29
64
66
DDR_B_DQS#3
68
DDR_B_DQS3
70
72
DDR_B_D30
74
DDR_B_D31
76
78
DDR_CKE3_DIMMB
80
82
84
DDR_B_MA14
86
88
DDR_B_MA11
90
DDR_B_MA7
92
DDR_B_MA6
94
96
DDR_B_MA4
98
DDR_B_MA2
100
DDR_B_MA0
102
104
DDR_B_BS1
106
DDR_B_RAS#
108
DDR_CS2_DIMMB#
110
112
M_ODT2
114
DDR_B_MA13
116
118
120
122
DDR_B_D33DDR_B_D32
124
DDR_B_D37
126
128
DDR_B_DM4
130
132
DDR_B_D38
134
DDR_B_D39DDR_B_D35
136
138
DDR_B_D44
140
DDR_B_D45
142
144
DDR_B_DQS#5
146
DDR_B_DQS5
148
150
DDR_B_D43DDR_B_D46
152
DDR_B_D47
154
156
DDR_B_D52
158
160
162
M_CLK_DDR3
164
M_CLK_DDR#3
166
168
DDR_B_DM6
170
172
DDR_B_D54
174
DDR_B_D51
176
178
DDR_B_D57
180
DDR_B_D61
182
184
DDR_B_DQS#7
186
DDR_B_DQS7
188
190
DDR_B_D62
192
DDR_B_D63
194
196
198
200
202
10K_0402_5%~D
12
M_CLK_DDR2 10
M_CLK_DDR#2 10
PM_EXTTS#1 10
DDR_CKE3_DIMMB 10
DDR_B_BS1 11
DDR_B_RAS# 11
DDR_CS2_DIMMB# 10
M_ODT210
M_CLK_DDR3 10
M_CLK_DDR#3 10
R243
10K_0402_5%~D
R241
V_DDR_MCH_REF
2.2U_0603_6.3V6K~D
1
C447
2
+3.3V_RUN
12
1
0.1U_0402_16V4Z~D
1
C436
2
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
DDRII-SODIMM SLOT2
LA-3302P
1766Thursday, March 01, 2007
1
0.4
of
5
+3.3V_SUS
12
R423
8.2K_0402_5%~D
2
Q38
2
Q39
B
+3.3V_SUS
B
C
E
31
12
C
E
31
THERMATRIP1#
1
C628
0.1U_0402_16V4Z~D
2
R426
8.2K_0402_5%~D
THERMATRIP2#
1
C632
0.1U_0402_16V4Z~D
2
+1.05V_VCCP
R425
DD
H_THERMTRIP#7
THERMTRIP_MCH#10
2.2K_0402_5%~D
12
MMST3904-7-F_SOT323-3~D
+1.05V_VCCP
R427
2.2K_0402_5%~D
12
MMST3904-7-F_SOT323-3~D
Place under CPU
CC
C633
@
2200P_0402_50V7K~D
Place C633 close to the Q40 as possible
Place C636 close to the Guardian pins as possible
H_THERMDA7
470P_0402_50V7K~D
H_THERMDC7
+3.3V_SUS
0.1U_0402_16V4Z~D
12
R186
8.2K_0402_5%~D
+3.3V_SUS
BB
+3.3V_SUS
R196
@
12
10K_0402_5%~D
@
12
10K_0402_5%~D
AA
R194
MDC_RST_DIS#
SIO_GFX_PWR
+3.3V_RUN
THERMTRIP_VGA#52
5
R428
12
49.9_0603_1%~D
1
C639
2
C100
2200P_0402_50V7K~D
12
2
1
C636
1
C637
0.1U_0402_16V4Z~D
2
2
1
R187
2.2K_0402_5%~D
2@
THERM_B3
C
+3.3V_SUS
2
B
4
RB751S40T1_SOD523-2~D
E
31
+RTC_CELL
E
@
2
B
Q40
MMST3904-7-F_SOT323-3~D
1
2
12
R436
332K_0402_1%~D
12
R438
118K_0402_1%~D
12
R433
8.2K_0402_5%~D
THERMATRIP3#
C
Q76
MMST3904-7-F_SOT323-3~D
2@
31
4
D19
21
+3VSUS_THRM
1
C638
2
0.1U_0402_16V4Z~D
1
C630
2
22U_0805_6.3VAM~D
2200P_0402_50V7K~D
2
C634
1
SUSPWROK42
ICH_PWRGD#42
R437
12
1K_0402_5%~D
MDC_RST_DIS#33
AUDIO_AVDD_ON27
1
C203
0.1U_0402_16V4Z~D
2
2@
3
FAN1 Control and Tachometer
+3.3V_RUN
12
R424
10K_0402_5%~D
12
R414
0_0402_5%~D
+FAN1_VOUT
FAN1_TACH_FB
Place C634 close to the
Guardian pins as possible
THRM_SMBDAT39,49
THRM_SMBCLK39,49
REM_DIODE1_P
REM_DIODE1_N
12
R4291K_0402_5%~D
12
R4321K_0402_5%~D
THERMATRIP1#
THERMATRIP2#
THERMATRIP3#
MDC_RST_DIS#
SIO_GFX_PWR
5V_CAL_SIO#
AUDIO_AVDD_ON
FAN1_TACH 39
JFAN1
1
1
2
2
3
3
MOLEX_53398-0371~D
Discrete
VGA_THERMDP
1
C706
470P_0402_50V7K~D
3
2
U31
11
SMDATA
12
SMBCLK
38
DP1
37
DN1
41
DP2
40
DN2
35
3V_SUS
21
RTC_PWR3V
23
VSUS_PWRGD
16
3V_PWROK#
17
THERMTRIP1#
18
THERMTRIP2#
19
THERMTRIP3#
42
VSET
26
XEN
34
VSS
7
FAN_OUT
8
FAN_OUT
39
FAN_DAC1
10
GPIO1
13
GPIO2
14
GPIO3
15
GPIO4
22
GPIO5
36
GPIO6/FAN_DAC2
49
PAD_GND
VGA_THERMDN
Place Capacitor close to Guardian Chip
+FAN1_VOUT
SMBUS ADDRESS : 2F
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
VGA_THERMDP 53
VGA_THERMDN 53
VCP1
VCP2
ATF_INT#
POWER_SW#
ACAVAIL_CLR
THERMTRIP_SIO
SYS_SHDN#
LDO_SHDN#/ADDR
LDO_POK
LDO_SET
LDO_OUT
LDO_OUT
LDO_IN
LDO_IN
VDD_3V
VDD_5V
VDD_5V
EMC4001_QFN48~D
1
C645
2
10U_0805_10V4Z~D
DP3
DN3
DP4
DN4
DP5
DN5
43
46
45
44
48
47
2
1
20
3
4
25
24
27
33
28
32
31
30
29
9
5
6
1
C646
2
VCP2
VCP2
REM_DIODE3_P
REM_DIODE3_N
REM_DIODE4_P
REM_DIODE4_N
VGA_THERMDP
VGA_THERMDN
7.5K_0402_5%~D
LDO_SET
+3V_LDOIN
+5V_RUN
0.1U_0402_16V4Z~D
2
+5V_SUS
12
R771
2.21K_0603_1%~D
1
C750
2
2200P_0402_50V7K~D
PWR_MON 48
Place C649 close to the
Guardian pins as possible.
1
2
Diode circuit at DP 4/ DN 4 is used for skin temp
sensor (plac e d o p ti m a l l y between CPU, MCH and GPU).
1
2
ATF_INT#
ATF_INT# 38
POWER_SW# 39,40
ACAV_IN 39,49,50
R434
12
+3.3V_SUS
1
1
C640
2
2
1@
10U_0805_10V4Z~D
1
1
C643
2
2
1U_0603_10V4Z~D
1
1
C647
2
2
10U_0805_10V4Z~D
2
VSET=
R436+R438
VSET =
12
R772
10K_0603_1%_TSM1A103F34D3RZ~D
Q102
13
D
2N7002W-7-F_SOT323-3~D
2
G
S
C649
2200P_0402_50V7K~D
Q41 Place near the
bottom SODIMM
C418
2200P_0402_50V7K~D
C648
0.1U_0402_16V4Z~D
R96
10K_0402_5%~D
+2.5V_RUN
C641
0.1U_0402_16V4Z~D
@
R439
12
0_1210_5%~D
C644
0.1U_0402_16V4Z~D
+3.3V_RUN
DELL CONFIDENTIAL/PROPRIETARY
Title
Size Document NumberRev
Date:Sheet
1
R438
Tp-70
x 3.3V
=0.865V
=> Tp = 88.2 C
21
+3.3V_SUS
12
R773
10K_0402_5%~D
5V_CAL_SIO#
This thermistor circuit is located near
Top side DDR connector.
Populate R155 and de-pop R156
for discrete because it
doesn't support DPST
+15V_ALW
2
G
2
I
2
+15V_ALW
12
R23
100K_0402_5%~D
1
O
G
DDTC124EUA-7-F_SOT323-3~D
3
12
13
D
2
G
S
Q7
+LCDVDD
R24
100K_0402_5%~D
Q8
2N7002W-7-F_SOT323-3~D
SI3456BDV-T1-E3_TSOP6~D
45
1
C30
2
0.1U_0603_50V4Z~D
Q11
D
S
G
3
12
R25
@
100K_0402_5%~D
1
6
2
1
+3.3V_RUN
1
C42
2
0.1U_0402_16V4Z~D
+3.3V_RUN
2
BB
AA
1
2
+INV_PWR_SRC
C180
0.1U_0603_50V4Z~D
LCD_SMBCLK
LCD_SMBDAT
G
13
D
S
Q12
@
2N7002W-7-F_SOT323-3~D
+3.3V_RUN
2
G
13
D
S
Q13
@
2N7002W-7-F_SOT323-3~D
I2CH_SCL
I2CH_SDA
I2CH_SCL 52
I2CH_SDA 52
1
C427
2
1
2
0.1U_0603_50V4Z~D
40mil
1
C463
2
2200P_0402_50V7K~D
+PWR_SRC
12
C173
1000P_0402_50V7K~D
R154
200K_0402_5%~D
Q24
FDS4435BZ_SO8~D
1
2
3
R153
12
100K_0402_5%~D
RUN_ON37,39,41,42,51
4
D
13
2
8
7
6
5
S
G
40mil
Q25
2N7002W-7-F_SOT323-3~D
+INV_PWR_SRC
1
C174
0.1U_0603_50V4Z~D
2
FDS4435: P CHANNAL
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Internal LVDS
LA-3302P
1966Thursday, March 01, 2007
1
0.4
of
5
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
4
3
2
Title
Size Document NumberRev
Date:Sheet
5
DD
4
3
2
1
D8
SDM10U45-7_SOD523-2~D
F3
@
+5V_RUN
21
12
0.12A_48V_NANOSMDC012F~D
12
R792
0_1206_5%~D
RED
DAT_DDC2
GREEN
JVGA_HS
BLUE
JVGA_VS
M_ID2#
CLK_DDC2
CRT_VCC
1
C151
2
0.01U_0402_16V7K~D
JCRT
6
11
1
7
12
2
8
13
14
10
15
SUYIN_070915FR015S201CU~D
16
17
3
9
4
5
D11
DA204U_SOT323~D
1
@
+3.3V_RUN
2
3
L11
CRT_RED36,52
CRT_GRN36,52
CC
CRT_BLU36,52
CRT_RED
CRT_GRN
CRT_BLU
R141
22P_0402_50V8J~D
1
C161
2
@
22P_0402_50V8J~D
1
C165
2
@
12
12
R142
150_0402_1%~D
150_0402_1%~D
12
R143
150_0402_1%~D
1
C162
2
@
Evaluate Package
DAT_DDC236,52
CLK_DDC236,52
SDM10U45-7_SOD523-2~D
+5V_RUN
BB
CRT_HSYNC52
CRT_VSYNC52
21
R60
12
30_0402_1%~D
R59
12
30_0402_1%~D
+5V_RUN_SYNC
D6
5
A2Y
3
SN74AHCT1G125GW_SC70-5~D
5
A2Y
3
R144
1K_0402_5%~D
12
1
U15
P
4
4
12
R146
10_0402_5%~D
12
R138
10_0402_5%~D
OE#
G
1
P
OE#
G
U14
SN74AHCT1G125GW_SC70-5~D
BLM18BB750SN1D_0603~D
12
BLM18BB750SN1D_0603~D
12
BLM18BB750SN1D_0603~D
12
22P_0402_50V8J~D
L1
BLM18AG121SN1D_0603~D
12
HSYNC_R36
VSYNC_R 36
L2
BLM18AG121SN1D_0603~D
12
L10
L9
+5V_RUN_SYNC
12
R3
@
1K_0402_5%~D
1
C5
2
10P_0402_50V8J~D
1
C149
10P_0402_50V8J~D
2
@
12
@
R5
1K_0402_5%~D
1
C4
2
10P_0402_50V8J~D
R137
12
1
C719
2
@
10P_0402_50V8J~D
R2
2.2K_0402_5%~D
12
2.2K_0402_5%~D
1
C712
2
@
10P_0402_50V8J~D
0.1U_0402_16V4Z~D
2
1
C148
10P_0402_50V8J~D
2
@
T5 PAD~D
D10
DA204U_SOT323~D
1
@
3
1
C160
2
1
2
D9
DA204U_SOT323~D
1
@
2
3
C147
10P_0402_50V8J~D
@
AA
DA204U
K1
A2
DELL CONFIDENTIAL/PROPRIETARY
A1K2
5
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
CRT
LA-3302P
2066Thursday, March 01, 2007
1
0.4
of
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