Datasheet UPC358C Specification

DATA SHEET

BIPOLAR ANALOG INTEGRATED CIRCUIT

µ

LOW POWER DUAL OPERATIONAL AMPLIFIERS

PC358

DESCRIPTION

The µPC358 is a dual operational amplifier which is
designed to operate from a single power supply over a
wide range of voltages. Operation from split power
supplies is also possible and the power supply current
drain is very low. Further advantage, the input common­mode voltage range includes ground in the linear mode.

EQUIVALENT CIRCUIT (1/2 Circuit)

+

100 A

6 Aµ6 A

Q

Q

I

I

I

N

2

Q

1

Q

Q

8

µ

3

9

C

Q

C

4

Q

Q

10

µ

Q

5

Q

7

11

Q

12

50 A

µ

V

Q

6

R

SC

OUT

Q

13

–

V

FEATURES

• Internally frequency compensation

• Wide output voltage swing V– to V+ –1.5 V

• Common mode input voltage range includes V

• Wide supply voltage range
3 V to 30 V (Single)
±1.5 V to ±15 V (Split)

• Output short circuit protection

PIN CONFIGURATION (Marking Side)

PC358C, 358G2

µ

OUT

I

V

I

I1

N1

1

–

1

2

3

4

µ

1

+–

PC358HA

+

8

V

7

OUT

2

–+

2

6

I

I2

5

I

N2

–

ORDERING INFORMATION

Part Number Package

µ

PC358C 8-pin plastic DIP (300 mil)

µ

PC358G2 8-pin plastic SOP (225 mil)

µ

PC358HA 9-pin slim SIP

The information in this document is subject to change without notice.

Document No. G11765EJ4V0DS00 (4th edition)
(Previous No. IC-1284)
Date Published May 1997 N
Printed in Japan

The mark shows major revised points.

1

123456789

1

+

I1

I

V

OUT

2

+–

+–

–

N1

V

I

2

+

I2

N2

I

I

V

OUT

©

1997

ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)

Parameter Symbol Ratings Unit
Voltage between V+ and V
Differential Input Voltage VID ±32 V
Input Voltage Note 2 VI V––0.3 to V–+32 V
Output Voltage Note 3 VO V––0.3 to V++0.3 V
Power Dissipation C Package Note 4 PT 350 mW

Output Short Circuit Duration Note 6 Indefinite s
Operating Ambient Temperature TA –20 to +80 ° C
Storage Temperature Tstg –55 to +125 ° C

–

G2 Package Note 5 440 mW
HA Package Note 4 350 mW

Note 1 V+ – V

Notes 1. Reverse connection of supply voltage can cause destruction.

2. The input voltage should be allowed to input without damage or destruction independent of the magnitude

+

of V

. Either input signal should not be allowed to go negative by more than 0.3 V. The normal operation
will establish when the both inputs are within the Common Mode Input Voltage Range of electrical
characteristics.

3. This specification is the voltage which should be allowed to supply to the output terminal from external
without damage or destructive. Even during the transition period of supply voltage, power on/off etc., this
specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of
electrical characteristics.

4. Thermal derating factor is –5.0 mW/°C when operating ambient temperature is higher than 55 °C.

5. Thermal derating factor is –4.4 mW/°C when operating ambient temperature is higher than 25 °C.

6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and

Note 5.

–

–0.3 to +32 V

µ

PC358

RECOMMENDED OPERATING CONDITIONS

Parameter Symbol MIN. TYP. MAX. Unit
Supply Voltage (Split) V
Supply Voltage (V– = GND) V

±

+

±1.5 ±15 V

+3 +30 V

ELECTRICAL CHARACTERISTICS (TA = 25 °C, V+ = +5 V, V– = GND)

Parameter Symbol Conditions MIN. TYP. MAX. Unit
Input Offset Voltage VIO RS = 0 Ω±2±7mV
Input Offset Current IIO ±5 ± 50 nA
Input Bias Current Note 7 IB 45 250 nA
Large Signal Voltage Gain AV RL ≥ 2 kΩ 25 100 V/mA
Supply Current ICC RL = ∞, IO = 0 A, Both Amplifiers 0.7 1.2 mA
Common Mode Rejection Ratio CMR 65 70 dB
Supply Voltage Rejection Ratio SVR 65 100 dB
Output Voltage Swing VO RL = 2 kΩ (Connect to GND) 0 V+ –1.5 V
Common Mode Input Voltage Range VICM 0V
Output Current (SOURCE) IO SOURCE VIN+ = +1 V, VIN– = 0 V 20 40 mA
Output Current (SINK) IO SINK VIN– = +1 V, VIN+ = 0 V 10 20 mA

VIN– = +1 V, VIN+ = 0 V, 12 50
VO = 200 mV

Channel Separation f = 1 kHz to 20 kHz 120 dB

Note 7. Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input

stage.

+

–1.5 V

µ

A

2

TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25 °C, TYP.)

µ

PC358

POWER DISSIPATION

600

500

PC358G2

µ

400

µ

PC358C, 358HA

300

200

100

- Total Power Dissipation - mW

T

P

0

20 40 60 80 100

TA - Operating Ambient Temperature - °C

INPUT OFFSET VOLTAGE

3

2

1

- Input Offset Voltage - mV

IO

V

0

0

10 20 30 40

+

- Supply Voltage - V (V– = GND)

V

TA = 25 ˚C

4

3

V

A

+

I

CC

–
+

2

SUPPLY CURRENT

1

- Supply Current - mA

CC

I

TA = 0 to 70 °C

TA = –20 °C

0 10203040

+

V

- Supply Voltage - V (V

–

= GND)

INPUT OFFSET VOLTAGE

5
4

+

V

= 5 V

3
2
1

0
–1
–2

- Input Offset Voltage - mV

IO

–3

V

–4

–50

T

A

- Operating Ambient Temperature - ˚C

0 50 100

INPUT BIAS CURRENT

100

75

50

TA= 25 °C

25

- Input Bias Current - nA

B

I

040

V+ - Supply Voltage - V (V

302010

–

= GND)

- Input Bias Current - nA

B

I

INPUT BIAS CURRENT

100

+

= +15 V

V

–

= GND

80

V

60

40

20

0
–50 100

500

TA - Operating Ambient Temperature - ˚C

3

µ

y

µ

PC358

OUTPUT SHORT CIRCUIT CURRENT

70

60

–
+

50

40

- Output Short Circuit Current - mA

O SHORT

I

30

–20

0 20 60 80 10 100 k 10 M

A

- Ambient Temperature - ˚C

T

40 10 k100 1 k 1 M

OPEN LOOP VOLTAGE GAIN

160

RL = 20 kΩ

120

RL = 2 kΩ

80

I

O SHORT

OPEN LOOP FREQUENCY RESPONSE

140

120

100

80

V

IN

0.1 F

µ

V+/2

10 M

60

V+ = 30 V

40

V+ = 10 to 15 V

20

Aυ - Open Loop Voltage Gain - dB

0

1

f - Frequency - Hz

LARGE SIGNAL
FREQUENCY RESPONSE

20

p-p

15

1 kΩ

V

IN

+7 V

10

Ω

–
+

100 kΩ

+15 V
–
+

+

V

V

O

V

O

2 k

Ω

40

- Open Loop Voltage Gain - dB

V

A

0

10 20 30 40

+

V

- Supply Voltage - V (V

–

= GND)

COMMON MODE REJECTION RATIO

120

100

80

60

40

20

0

100

CMR - Common Mode Rejection Ratio - dB

1 k 10 k 100 k 1 M

f - Frequenc

- Hz

5

- Output Voltage Swing -V

O

V

0
1 k

3 5 10 k

30 50 100 k 300 500

f - Frequency - Hz

VOLTAGE FOLLOWER
PULSE RESPONSE

4
3
2

-

1

O

0
3

2

-V

IN

V

1

Input Voltage - V Output Voltage - V

0 20406080

t - Time - s

RL ≥ 2 kΩ

+

= 15 V

V

1 M

4

SLEW RATE

0.3

µ

0.2

0.1

SR - Slew Rate - V/ s

V± = ±15 V

O

= ±10 V

V

0

–50

T

A

- Operating Ambient Temperature - ˚C

0 50 100

OUTPUT SINK CURRENT LIMIT

100

50
30

20
10

5
3

2
1

0.5

- Output Voltage - V

O

0.3

V

0.2

0.1

0.05

0.03

0.02

0.01

0.01 0.030.05 0.1 0.3 0.5 1 2 5 10 1005030203

SR

SR

–

+

V+/2

–
+

+

V

V+ = +15 V

I

O SINK

V

O

µ

PC358

5

+

V

= +15 V

4

+

- V

+

/2

V

3

2

- Output Voltage to V

O

∆V

1

0

0.01

0.03 0.05 0.1 0.5 1 2 5 10 20 10050300.3 3

O SINK

- Output Sink Current - mA

I

OUTPUT SOURCE CURRENT LIMIT

+

V

∆V

+
–

O

I

O SOURCE

I

O SOURSE

- Output Source Current - mA

5

PACKAGE DRAWINGS

8 PIN PLASTIC DIP (300 mil)

85

14

µ

PC358

A

I

P

J

H

G

C

B

F

DN

NOTES

1) Each lead centerline is located within 0.25 mm (0.01 inch) of
its true position (T.P.) at maximum material condition.

2) ltem "K" to center of leads when formed parallel.

M

K

L

M

ITEM MILLIMETERS INCHES

A 10.16 MAX. 0.400 MAX.
B 1.27 MAX. 0.050 MAX.
C 2.54 (T.P.) 0.100 (T.P.)

D 0.50±0.10 0.020
F 1.4 MIN. 0.055 MIN.

G 3.2±0.3 0.126±0.012
H 0.51 MIN. 0.020 MIN.

I 4.31 MAX. 0.170 MAX.

J 5.08 MAX. 0.200 MAX.

K 7.62 (T.P.) 0.300 (T.P.)

L 6.4 0.252

M 0.25 0.010
N 0.25

P 0.9 MIN.
R 0~15° 0~15°

+0.10
–0.05

R

+0.004
–0.005

+0.004
–0.003

0.01

0.035 MIN.

P8C-100-300B,C-1

6

8 PIN PLASTIC SOP (225 mil)

85

detail of lead end

P

µ

PC358

1

4

A

G

F

K

E

B

C

D

NOTE

Each lead centerline is located within 0.12 mm (0.005 inch) of
its true position (T.P.) at maximum material condition.

M

M

H

I

L

ITEM MILLIMETERS INCHES

A
B
C

D 0.40
E

F
G
H

I

J
K 0.15

L 0.6±0.2 0.024

M
N

P3° 3°

5.37 MAX.

0.78 MAX.

1.27 (T.P.)
+0.10

–0.05

0.1±0.1

1.8 MAX.

1.49

6.5±0.3

4.4

1.1
+0.10

–0.05

0.12

0.10

+7°
–3°

J

N

0.212 MAX.

0.031 MAX.

0.050 (T.P.)
+0.004

0.016

–0.003

0.004±0.004

0.071 MAX.

0.059

0.256±0.012

0.173

0.043
+0.004

0.006

–0.002
+0.008

–0.009

0.005

0.004

+7°
–3°

S8GM-50-225B-4

7

9 PIN PLASTIC SLIM SIP

µ

PC358

A

M

19

C

F G

M

J

Q

K

Y

H

N

Z

NOTE

Each lead centerline is located within 0.25 mm (0.01 inch) of
its true position (T.P.) at maximum material condition.

ITEM MILLIMETERS INCHES

22.86 MAX.

A

1.1 MIN.

C

0.5±0.1

F
G

0.25

H

2.54

J

1.27 MAX.

K

0.51 MIN.

M

5.08 MAX.

N

2.8±0.2

Q

5.75 MAX.

U

1.5 MAX.

V

0.25

3.2±0.5

Y

1.1 MIN.Z 0.043 MIN.

V

U

+0.10
–0.05

0.900 MAX.

0.043 MIN.
+0.004

0.02

–0.005

0.010

0.100

0.050 MAX.

0.020 MIN.

0.200 MAX.
+0.009

0.11

–0.008

0.227 MAX.

0.059 MAX.
+0.004

0.01

–0.003

0.126±0.02

P9HA-254B-1

8

µ

PC358

RECOMMENDED SOLDERING CONDITIONS

When soldering these products, it is highly recommended to observe the conditions as shown below. If other
soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult
with our sales offices.

For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”

(C10535E).

Type of Surface Mount Device

µ

PC358G2: 8-pin plastic SOP (225 mil)

Process Conditions Symbol

Infrared ray reflow Peak temperature: 230 °C or below (Package surface temperature), IR30-00-1

Reflow time: 30 seconds or less (at 210 °C or higher),
Maximum number of reflow processes: 1 time.

Vapor phase soldering Peak temperature: 215 °C or below (Package surface temperature), VP15-00-1

Reflow time: 40 seconds or less (at 200 °C or higher),
Maximum number of reflow processes: 1 time.

Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less, WS60-00-1

Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 °C or below (Package surface temperature).

Partial heating method Pin temperature: 300 °C or below, –

Heat time: 3 seconds or less (Per each side of the device).

Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the

device will be damaged by heat stress.

Types of Through-hole Device

µ

PC358C: 8-pin plastic DIP (300 mil)

µ

PC358HA: 9-pin slim SIP

Process Conditions

Wave soldering Solder temperature: 260 °C or below,
(only to leads) Flow time: 10 seconds or less.

Partial heating method Pin temperature: 300 °C or below,

Heat time: 3 seconds or less (per each lead).

Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure

that the package body does not get jet soldered.

9

REFERENCE DOCUMENTS

QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES C11531E
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL C10535E
IC PACKAGE MANUAL C10943X
GUIDE TO QUALITY ASSUARANCE FOR SEMICONDUCTOR DEVICES MEI-1202
SEMICONDUCTORS SELECTION GUIDE X10679E
NEC SEMICONDUCTOR DEVICE RELIABILITY/ IEI-1212
QUALITY CONTROL SYSTEM - STANDARD LINEAR IC

µ

PC358

10

[MEMO]

µ

PC358

11

µ

[MEMO]

No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.

Standard: Computers, office equipment, communications equipment, test and measurement equipment,

audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots

Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)

Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.

PC358

M4 96.5

2