Datasheet uPC337HF Datasheet (NEC)

DATA SHEET

123

1 : ADJ
2 : INPUT
3 : OUTPUT

BIPOLAR ANALOG INTEGRATED CIRCUIT

µ

PC337

3-TERMINAL NEGATIVE ADJUSTABLE REGULATOR

The µPC337 is an adjustable 3-terminal negative voltage regulator, which has 1.5 A capable for the output

current. The output voltage can be set any value between –1.3 V and –30 V by two external resistors.

FEATURES

• Output current excess of 1.5 A

• On-chip some protection circuit (over current protec­tion, SOA protection and thermal shut down).

ORDERING INFORMATION

Part Number Package

µ

PC337HF 3-pin plastic SIP (MP-45G) (isolated TO-220)

EQUIVALENT CIRCUIT

R

41

Q

1

R

1

Q

3

Q

8

D

Q

13

Q

12

R

Q

14

R

13

4

22

R

D

23

5

D

1

R

24

R

9

D

2

PIN CONFIGURATION (Marking Side)

R

3

R

2

Q

2

R

5

R

42

R

Q

4

C

1

C

2

R

6

Q

6

4

Q

5

R

8

C

3

R

7

Q

7

D

7

R

Q

36

28

Q

29

ADJ

OUTPUT

R

14

R

Q

15

R

15

Document No. G13783EJ2V0DS00 (2nd edition)
(Previous No. IN-1878)
Date Published October 1998 N CP(K)
Printed in Japan

17

R

16

Q

19

Q

Q

17

Q

16

R

18

Q

18

Q

20

R

19

R

20

The information in this document is subject to change without notice.

Q

R

28

R

Q

22

21

R

21

R

25

D

3

D

6

Q

Q

9

Q

11

10

Q

R

11

R

10

R

33

26

Q

24

C

Q

23

26

4

R

27

R

35

Q

R

C

R

29

R

31

27

R

34

30

37

5

Q

Q

31

R

30

R

25

R

32

39

R

38

R

40

INPUT

The mark shows major revised points.

©

1986

ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified.)

Parameter Symbol Rating Unit
Input-Output Voltage Differential VIN – VO –40 V
Total Power Dissipation PT 15
Operating Ambient Temperature TA –20 to +85 °C
Operating Junction Temperature TJ –20 to +150 °C
Storage Temperature Tstg –65 to +150 °C
Thermal Resistance (junction to case) Rth(J-C) 7 °C/W
Thermal Resistance (junction to ambient) Rth(J-A) 65 °C/W

Note Internally limited.

When operating junction temperature rise up to 150 °C (≤200 °C), the internal circuit shutdown output
voltage.

Caution Exposure to Absolute Maximum Ratings for extended periods may affect device reliability;

exceeding the ratings could cause permanent damage. The parameters apply independently.
The device should be operated within the limits specified under DC and AC Characteristics.

Note

V

µ

PC337

RECOMMENDED OPERATING CONDITIONS

Parameter Symbol MIN. TYP. MAX. Unit
Input-Output Voltage Differential VIN – VO –3 –5 –38.7 V
Input Voltage VIN –4.3 –40 V
Output Voltage VO –1.3 –30 V
Output Current IO 0.01 1.5 A
Operating Junction Temperature TJ –20 +125 °C

2

TYPICAL CONNECTION

µ

PC337

D

2

IN

V

INPUT

µ

PC337

ADJ

C

IN

µ

1 F

ADJ

C

µ

10 F

R

2

+

Remark R1, R2 : Resistor to set the output voltage.

R

O = (1 + ) • VREF + IADJ • R2 = (1 + ) • VREF

V

2

R1

•

•

VO (V) R2 (Ω : TYP.)

–1.25 0

–2.5 120
–5.0 360

–12 1032
–24 2184
–30 2760

R2
R1

OUTPUT

1

R
120 Ω

O

V

D

1

O

C

µ

4.7 F

+

CIN : Need to stop the oscillation for the long input wiring length.

O : Need to stop the oscillation for the long output wiring length.

C

Improve the transient stability of the output voltage when the lord current is suddently changed.

CADJ : Improve the ripple rejection and the oscillate rejection.

1 : Protect against CADJ from output short.

D
D2 : Need for VIN > VO.

3

µ

PC337

ELECTRICAL CHARACTERISTICS (VIN – VO = –5 V, IO = 0.5 A, 0 °C ≤ TJ ≤ +125 °C, unless otherwise
specified.)

Parameter Symbol Conditions MIN. TYP. MAX. Unit
Line Regulation REGIN TJ = 25 °C, 3 V ≤ | VIN – VO | ≤ 40 V

0 °C ≤ TJ ≤ 125 °C, 3 V ≤ | VIN – VO | ≤ 40 V

Load Regulation REGL TJ = 25 °C, | VO | ≤ 5 V 30 50 mV

10 mA ≤ IO ≤ 1.5 A
0 °C ≤ TJ ≤ 125 °C, | VO | ≤ 5 V 45 70 mV
10 mA ≤ IO ≤ 1.5 A

Thermal Regulation REGTH TJ = 25 °C, | VIN – VO | = 40 V, VO = –10 V, 0.005 0.04 %/W

0 A ≤ IO ≤ 0.25 A, t = 10 ms
ADJ pin Output Current IADJ 60 100
IADJ Change ∆IADJ TJ = 25 °C, 3 V ≤ | VIN – VO | ≤ 40 V, 2 5

10 mA ≤ IO ≤ 1.5 A, PT ≤ 15 W
Reference Voltage VREF 3 V ≤ | VIN – VO | ≤ 40 V, –1.20 –1.25 –1.30 V

10 mA ≤ IO ≤ 1.5 A, PT ≤ 15 W
Temperature Stability of ∆VREF/∆T0 °C ≤ TJ ≤ 125 °C, IO = 5 mA –0.6 %
VREF
Minimum Load Current IOMIN.| VIN – VO | = 40 V 2.1 10 mA
Peak Output Current IOpeak 3 V ≤ | VIN – VO | ≤ 15 V 1.5 2.3 2.9 A

TJ = 25 °C, | VIN – VO | = 40 V 0.15 0.8 A
Output Noise Voltage Vn TJ = 25 °C, 10 HZ ≤ f ≤ 10 kHz 0.002 %

(RMS)
Ripple Rejection R • R TJ = 25 °C, ∆VIN = 1 Vr.m.s CADJ = 0 60 dB

f = 120 Hz, VO = –10 V CADJ = 10 µF66 75 dB

Note

Note

Note

Note

| VO | ≥ 5 V 0.6 1.0 %

| VO | ≥ 5 V 0.9 1.5 %

0.005 0.04 %/V

0.01 0.07 %/V

µ
µ

A
A

Note Measured at constant junction temperature, using pulse testing with a low duty cycle.

PW = 10 ms, Duty Cycle ≤ 2 %

4

TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified.)

PT vs T

A

25

20

Infinite heatsink

15

10

With 10°C/W heatsink

5

PT - Total Power Dissipation - WIOpeak - Peak Output Current - A

No heatsink

0

25 50 75 100 125

TA - Operating Ambient Temperature -

°C

2.0

%

1.5

1.0

- Load Regulation -

L

0.5

REG

0

–25 0 25 50 75 100 125

TJ - Operating Junction Temperature -

REGL vs

µ

PC337

T

J

V

IN

= –10 V

V

O

= –5 V

°C

I

Opeak

vs

V

DIF

3.0
TJ = –20 °C

+25 °C

2.0

+125 °C

1.0

0

–10

V

DIF

- Input - Output Voltage Differential -

R . R

vs

V

O

90

80

70

C

ADJ

µ

= 10 F

VIN = –15 V
V
I
C
C

60

C

ADJ

= 0

50

40

- Ripple Rejection - dB

30

R

.

R

20

10

10 –10 –20 –30 –40100 1 k 10 k 100 k

- Frequency -

f

Hz V

O

= –10 V

O

= 0.5 A

IN

= 1 F

O

= 4.7 F

V

REF

vs

T

J

–1.27

VIN–VO = –5 V
I

O

= 10 mA

V

–1.26

–1.25

- Reference Voltage -

–1.24

REF

V

–1.23

–25 0 25 50 75 100 125–20 –30 –40

V

TJ - Operating Junction Temperature -

I

OMIN.

vs

V

DIF

°C

4

µ

µ

mA

3

2

TJ = –20 °C

T

J

= +125 °C

1

OMIN. - Minimum Load Current -

I

J

= +25 °C

T

0

DIF

- Input - Output Voltage Differential -

V

5

PACKAGE DRAWING

3PIN PLASTIC SIP (MP-45G)

µ

PC337

A

E

B

I

D

132

H

J

Z

C

FG

NOTE

Each lead centerline is located within 0.25 mm of
its true position (T.P.) at maximum material condition.

M

L

M

K

Y

V

N
P

U

ITEM MILLIMETERS

A 10.0±0.2
B 7.0±0.2
C 1.50±0.2
D 17.0±0.3

φ

E
F 0.75±0.10
G 0.25
H 2.54 (T.P.)

I 5.0±0.3
J
K
L 8.5±0.2
M 8.5±0.2
N
P 2.8±0.2
U 2.4±0.5
V
Y 8.9±0.7
Z 1.30±0.2

3.3±0.2

2.46±0.2

5.0±0.2

4.5±0.2

0.65±0.10

P3HF-254B-4

6

µ

PC337

RECOMMENDED SOLDERING CONDITIONS

When soldering these products, it is highly recommended to observe the conditions as shown below. If other
soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult
with our sales offices.

For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL"

(C10535E).

Type of Through-hole Devices

µ

PC337HF: 3-pin plastic SIP (MP-45G)

Process Conditions
Wave soldering Solder temperature: 260 °C or below,

(only to leads) Flow time: 10 seconds or less.
Partial heating method Pin temperature: 300 °C or below,

Heat time: 3 seconds or less (per each lead).

Caution For through-hole device, the wave soldering process must be applied only to leads, and make

sure that the package body does not get jet soldered.

REFERENCE DOCUMENTS

QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES C11531E

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL C10535E

NEC IC PACKAGE MANUAL (CD-ROM) C13388E

GUIDE TO QUALITY ASSURANCE FOR SEMICONDUCTOR DEVICES MEI-1202

SEMICONDUCTORS SELECTION GUIDE X10679E

NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY CONTROL SYSTEM IEI-1212

–THREE TERMINAL REGULATOR

7

µ

PC337

[MEMO]

No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.

Standard: Computers, office equipment, communications equipment, test and measurement equipment,

audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots

Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)

Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.

M4 96.5

2