Datasheet UPC3210TB-E3, UPC3210TB Datasheet (NEC)

DATA SHEET

BIPOLAR ANALOG INTEGRATED CI RCUIT

µµµµ

PC3210TB

5 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER

DESCRIPTION

The µPC3210TB is a silicon monolithic integrated circuits designed as wideband amplifier. The µPC3210TB is

suitable to systems required wideband operation from HF to L band.

This IC is manufactured using NEC’s 20 GHz fT NESAT™III silicon bipolar process. This process uses silicon
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.

FEATURES

• High-density surface mounting: 6-pin super minimold package

• Supply voltage : VCC = 4.5 to 5.5 V

• Wideband response : fu = 2.3 GHz TYP. @3 dB bandwidth

• Power gain : GP = 20 dB TYP. @f = 1.5 GHz

• Noise figure : NF = 3.4 dB TYP. @f = 1.5 GHz

APPLICATION

• Systems required wideband operation from HF to 2.0 GHz

ORDERING INFORMATION

Part Number Package Marking Supplying Form

µ

PC3210TB-E3 6-pin super minimold C2X Embossed tape 8 mm wide.

1, 2, 3 pins face to perforat i on side of the tape.
Qty 3 kp/reel.

Remark

To order evaluation samples, please contact your local NEC sales office. (Part number for sample
order:

PC3210TB)

µ

Caution Electro-static sensitive devices

The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.

Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.

Document No. P13593EJ2V0DS00 (2nd edition)
Date Published May 1999 N CP(K)
Printed in Japan

The mark shows major revised points.

©

1998, 1999

PIN CONNECTIONS

µµµµ

PC3210TB

3

2

1

(Top View)

4

5

6

C2X

(Bottom View)

4

5

6

3

2

1

PRODUCT LINE-UP OF 5V-BIAS SILICON MMIC WIDEBAND AMPLIFIERS

A

= +25 °C, VCC = 5.0 V, ZL = ZS = 50

(T

u

Part No.

PC2711T 6-pin minimold

µ

PC2711TB

µ

PC2712T 6-pin minimold

µ

PC2712TB

µ

PC2713T 1.2 +7.0 29 3.2

µ

PC2791TB 1.9 +4.0 12 5.5

µ

PC2792TB 1.2 +5.0 20 3.5

µ

PC3210TB 2.3 +3.5 20 3.4

µ

f

(GHz)

2.9 +1.0 13 5.0

2.6 +3.0 20 4.5

O (sat)

P

(dBm)

ΩΩΩΩ

G

(dB)

)

P

NF

(dB)

@f = 1 GHz

@f = 1 GHz

@f = 0.5 GHz

@f = 0.5 GHz

@f = 0.5 GHz

@f = 1.5 GHz

CC

I

(mA)

12

6-pin super minimold

12

6-pin super minimold

12 6-pin minimold C1J

17 6-pin super minimold C2S

19 6-pin super minimold C2T

15 6-pin super minimold C2X

Package Marking

Pin No. Pin Name

1 INPUT
2GND
3GND
4OUTPUT
5GND
6V

CC

C1G

C1H

Remark

Notice

2

Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.

The package size distinguishes between minimold and super minimold.

Data Sheet P13593EJ2V0DS00

PIN EXPLANATION

µµµµ

PC3210TB

Pin

Pin Name

No.

1 INPUT

4OUTPUT

Applied
Voltage
V





6VCC4.5 to 5.5

2

GND 0
3
5

Pin
Voltage

Note

V

Function and Applications Internal Equivalent Circ ui t

0.82 Signal input pin. A internal m atching circuit,
configured with resistors, enables 50

Ω

connection over a wide band. A mul ti­feedback circuit is designed to cancel the

FE

deviations of h

and resistance. This pin
must be coupled to signal source with
capacitor for DC cut.

4.0 Signal output pin. A internal matching
circuit, configured wi th resistors, enables 50

connection over a wide band. This pi n

Ω

must be coupled to next s tage with
capacitor for DC cut.

Power supply pin. This pin s houl d be



externally equipped with bypas s capacitor to
minimize ground impedance.

Ground pin. This pin should be connect ed



to system ground with minimum inductance.
Ground pattern on the board should be
formed as wide as possible. All the ground
pins must be connected t ogether with wide
ground pattern to decrease impedance
difference.

1

IN

2

GND GND

V

CC

6

4

OUT

5

3

Pin voltage is measured at V

Note

CC

= 5.0 V

Data Sheet P13593EJ2V0DS00

3

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Conditions Ratings Unit

µµµµ

PC3210TB

Supply Voltage V
Circuit Current I
Total Power Dissipat i on P

Operating Ambient Temperature
Storage Temperature T
Input Power Level P

CC

CC

D

A

T

stg

in

TA = +25 °C 6.0 V
TA = +25 °C 30 mA
Mounted on double sided copper clad

50 × 50 × 1.6 mm epoxy glass P WB (T

A

= +85 °C)

200 mW

–40 to +85 °C

–55 to +150 °C

TA = +25 °C +10 dBm

RECOMMENDED OPERATING CONDITIONS

Parameter Symbol MIN. TYP. MAX. Unit

T

CC

f

O (sat)

G

∆

CC

A

4.5 5.0 5.5 V

–40 +25 +85 °C

)

ΩΩΩΩ

No signals 11.5 15.0 19.5 mA

P

u

f = 1.5 GHz 18 20 – dB

3 dB down below from gain at

2.05 2.3 – GHz

f = 0.1 GHz

in

f = 1.5 GHz 10 14.5 – dB

out

f = 1.5 GHz 7 11 – dB
f = 1.5 GHz, Pin = 0 dBm +0.5 +3.5 – dBm

P

f = 0.1 GHz to 2.05 GHz –

1.0 – dB

±

Supply Voltage V
Operating Ambient Temperature

ELECTRICAL OPERATING CONDITIONS (TA = +25°C, VCC = 5.0 V, ZS = ZL = 50

Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
Circuit Current I
Power Gain G
Noise Figure NF f = 1.5 GHz – 3.4 4.4 dB
Upper Limit Operating

Frequency
Isolation ISL f = 1.5 GHz 29 34 – dB
Input Return Loss RL
Output Return Loss RL
Maximum Output Level P
Gain Flatness

4

Data Sheet P13593EJ2V0DS00

TEST CIRCUIT

V

CC

1 000 pF 1 000 pF

C

4

C

3

C

6

C

5

1 000 pF 1 000 pF

6

µµµµ

PC3210TB

50 Ω

1

C

IN

1 000 pF

EXAMPLE OF APPLICATION CIRCUIT

V

CC

1 000 pF

C

4

IN

C

3

6

50 Ω

1

C

1

1 000 pF 1 000 pF

2, 3, 5

1

4

1 000 pF

C

1 000 pF

2

C

4

50 Ω

OUT

1 000 pF

2, 3, 5

1 000 pF

C

1 000 pF

5

C

6

6

7

8

C

1

C

4

50 Ω

2

OUT

1 000 pF

R

1

50 to 200 Ω



To stabilize operation,



please connect R






1

, C

2, 3, 5

8



The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.

Capacitors for VCC, input and output pins

CC

1 000 pF capacitors are recommendable as bypass capacitor for V

pin and coupling capacitors for input/output

pins.

Bypass capacitor for VCC pin is intended to minimize VCC pin’s ground impedance. Therefore, stable bias can be

supplied against VCC fluctuation.

Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC.

To get flat gain from 100 MHz up, 1 000 pF capacitors are assembled on the test circuit. [Actually, 1 000 pF

capacitors give flat gain at least 10 MHz. In the case of under 10 MHz operation, increase the value of coupling
capacitor such as 2 200 pF. Because the coupling capacitors are determined by the equation of C = 1/(2 π fZs).]

Data Sheet P13593EJ2V0DS00

5

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD

Top View

OUT

C2X

Mounting Direction

IN

C1

C3

C4

C5

C2

C6

µµµµ

PC3210TB

COMPONENT LIST

C1 to C6 1 000 pF

Value

Notes

1. 42 × 35 × 0.4 mm double sided copper clad polyimide board.

2. Back side: GND pattern

3. Solder plated on pattern

4.

: Through holes

6

Data Sheet P13593EJ2V0DS00

µµµµ

PC3210TB

TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25

CIRCUIT CURRENT vs. SUPPLY VOLTAGE

25

No input signal

20

(mA)

CC

15

10

Circuit Current I

5

0

0123456

CC

Supply Voltage V

(V)

NOISE FIGURE AND INSERTION POWER GAIN vs. FREQUENCY NOISE FIGURE AND INSERTION POWER GAIN vs. FREQUENCY

25

7

VCC = 5.0 V

20

6

(dB)

P

G

P

15

5

VCC = 4.5 V

VCC = 5.5 V

CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE

25

No input signal

20

VCC = 5.0 V

(mA)

CC

15

10

Circuit Current I

5

0

−60 −40 −20 0 +20 +40 +60 +80 +
Operating Ambient Temperature T

25

7

TA = −40 °C

20

6

(dB)

P

15

5

C)

°°°°

G

P

VCC = 5.5 V

TA = +25 °C

TA = +85 °C

VCC = 4.5 V

A

(°C)

VCC = 5.0 V

100

10

4

Noise Figure NF (dB)

5

3

Insertion Power Gain G

0

2

0.1 0.3 1.0 3.0

0

−10

−20

VCC = 5.5 V VCC = 5.0 V

−30

Isolation ISL (dB)

−40

−50

0.1 0.3 1.0 3.0

VCC = 5.5 V

NF

VCC = 5.0 V

VCC = 4.5 V

Frequency f (GHz)

ISOLATION vs. FREQUENCY

VCC = 4.5 V

Frequency f (GHz)

10

4

Noise Figure NF (dB)

3

2

5

Insertion Power Gain G

0

0.1 0.3 1.0 3.0

0

−10

−20
TA = +85 °C

−30

Isolation ISL (dB)

−40

−50

0.1 0.3 1.0 3.0

TA = +85 °C

TA = +25 °C

NF

TA = −40 °C

Frequency f (GHz)

ISOLATION vs. FREQUENCY

VCC = 5.0 V

TA = +25 °C

TA = −40 °C

Frequency f (GHz)

Data Sheet P13593EJ2V0DS00

7

µµµµ

PC3210TB

INPUT RETURN LOSS vs. FREQUENCY

0

VCC = 5.5 V

VCC = 5.0 V

VCC = 4.5 V

Input Return Loss RLin (dB)

0.1 0.3 1.0
Frequency f (GHz)

OUTPUT RETURN LOSS vs. FREQUENCY OUTPUT RETURN LOSS vs. FREQUENCY

0

VCC = 5.5 V

VCC = 5.0 V

3.0

−10

−15

−20

Input Return Loss RLin (dB)

−25

−10

−5

−5

INPUT RETURN LOSS vs. FREQUENCY

0

−5

−10
TA = −40 °C

−15

−20

−25

0.1 0.3 1.0

0

−5
TA = +25 °C TA = −40 °C

−10

TA = +85 °C

Frequency f (GHz)

VCC = 5.0 V

TA = +25 °C

3.0

VCC = 5.0 V

−15

−20

Output Return Loss RLout (dB)

−25

0.1 0.3 1.0 3.0

OUTPUT POWER vs. INPUT POWER

+10

f = 1.0 GHz

+5

0

−5

−10

−15

−20

Output Power Pout (dBm)

−25

−30

−

40−35−30−25−20−15−10−5

VCC = 4.5 V

Frequency f (GHz)

VCC = 5.5 V

VCC = 4.5 V

Input Power P

in (dBm)

VCC = 5.0 V

+5+

−15
TA = +85 °C

−20

Output Return Loss RLout (dB)

−25

0.1 0.3 1.0 3.0
Frequency f (GHz)

OUTPUT POWER vs. INPUT POWER

+10

f = 1.0 GHz

CC = 5.0 V

V

+5

0

−5

−10

−15

−20

Output Power Pout (dBm)

−25

−30

100

−

TA = +85 °C

40−35−30−25−20−15−10−5

TA = −40 °C

TA = +25 °C

Input Power P

in (dBm)

+5+

100

8

Data Sheet P13593EJ2V0DS00

µµµµ

PC3210TB

OUTPUT POWER vs. INPUT POWER

+10

f = 1.5 GHz

+5

0

(dBm)

−5

out

−10

VCC = 4.5 V

−15

−20

Output Power P

−25

−30

−

40−35−30−25−20−15−10−5

Input Power P

OUTPUT POWER vs. INPUT POWER

+10

f = 2.0 GHz

+5

VCC = 5.5 V

0

(dBm)

−5

out

−10

VCC = 4.5 V

−15

−20

Output Power P

−25

−30

−

40−35−30−25−20−15−10−5

Input Power P

VCC = 5.5 V

VCC = 5.0 V

in

(dBm)

VCC = 5.0 V

in

(dBm)

+5+

+5+

OUTPUT POWER vs. INPUT POWER

+10

f = 1.5 GHz

CC

= 5.0 V

V

+5

0

(dBm)

−5

out

TA = −40 °C

TA = +25 °C

−10

−15

−20

Output Power P

TA = +85 °C

−25

−30

100

−

40−35−30−25−20−15−10−5

in

Input Power P

(dBm)

+5+

100

OUTPUT POWER vs. INPUT POWER

+10

f = 2.0 GHz

CC

= 5.0 V

V

+5

0

TA = −40 °C

(dBm)

−5

out

TA = +25 °C

−10

−15

−20

Output Power P

TA = +85 °C

−25

−30

−

100

40−35−30−25−20−15−10−5

in

Input Power P

(dBm)

+5+

100

SATURATED OUTPUT POWER vs. FREQUENCY

+10

VCC = 5.5 V

Pin = 0 dBm

(dBm)

+5

O (sat)

VCC = 4.5 V

VCC = 5.0 V

0

−5

Saturated Output Power P

−10

0.1 0.3 1.0 3.0
Frequency f (GHz)

SATURATED OUTPUT POWER vs. FREQUENCY

+10

TA = +85 °C

VCC = 5.0 V

in

P

(dBm)

+5

O (sat)

TA = −40 °C

TA = +25 °C

0

−5

Saturated Output Power P

−10

0.1 0.3 1.0 3.0
Frequency f (GHz)

= 0 dBm

Data Sheet P13593EJ2V0DS00

9

µµµµ

PC3210TB

THIRD ORDER INTERMODULATION DISTORTION

AND OUTPUT POWER OF EACH TONE vs.

INPUT POWER OF EACH TONE

f1 = 1 000 MHz
f

2

= 1 002 MHz

P

out (each)

VCC = 4.5 V

IM

3

VCC = 5.5 V

VCC = 5.0 V

VCC = 5.5 V

VCC = 5.0 V

VCC = 4.5 V

(dBm)

3

(dBm)

out (each)

+10

0

−10

−20

−30

−40

−50

−60

Output Power of Each Tone P

−40 −35 −30 −25 −20 −15 −10 −5

3rd Order Intermodulation Distortion IM

Input Power of Each Tone P

in (each)

THIRD ORDER INTERMODULATION DISTORTION

AND OUTPUT POWER OF EACH TONE vs.

INPUT POWER OF EACH TONE

f1 = 1 500 MHz

2

= 1 502 MHz

f

P

out (each)

VCC = 4.5 V

VCC = 5.5 V

VCC = 5.0 V

VCC = 5.5 V

VCC = 5.0 V

(dBm)

3

(dBm)

out (each)

+10

0

−10

−20

−30

VCC = 4.5 V

IM

−40

3

−50

−60

Output Power of Each Tone P

3rd Order Intermodulation Distortion IM

Input Power of Each Tone P

in (each)

THIRD ORDER INTERMODULATION DISTORTION

AND OUTPUT POWER OF EACH TONE vs.

+10

(dBm)

3

(dBm)

0

out (each)

−10

−20

−30

−40

−50

−60

Output Power of Each Tone P

−40 −35 −30 −25 −20 −15 −10 −50

3rd Order Intermodulation Distortion IM

INPUT POWER OF EACH TONE

f

1

= 2 000 MHz

2

= 2 002 MHz

f

P

out (each)

VCC = 4.5 V

IM

3

VCC = 4.5 V

Input Power of Each Tone P

VCC = 5.5 V

VCC = 5.0 V

VCC = 5.5 V

VCC = 5.0 V

in (each)

(dBm)

(dBm)

(dBm)

THIRD ORDER INTERMODULATION DISTORTION

−50

(dBc)

3

−45

−40

−35

−30

vs. OUTPUT POWER OF EACH TONE

f

1

= 1 000 MHz

f

2

= 1 002 MHz

VCC = 4.5 V

VCC = 5.5 V

VCC = 5.0 V

−25

−20

−15

−10

−5

0

0

−20 −15 −10 −50

3rd Order Intermodulation Distortion IM

Output Power of Each Tone P

out (each)

(dBm)

THIRD ORDER INTERMODULATION DISTORTION

−50

(dBc)

3

−45

−40

−35

−30

−25

vs. OUTPUT POWER OF EACH TONE

f

1

= 1 500 MHz

2

= 1 502 MHz

f

VCC = 5.5 V

VCC = 5.0 V

VCC = 4.5 V

−20

−15

−10

−5

0

0−40 −35 −30 −25 −20 −15 −10 −5

−20 −15 −10 −50

3rd Order Intermodulation Distortion IM

out (each)

Output Power of Each Tone P

(dBm)

THIRD ORDER INTERMODULATION DISTORTION

−50

(dBc)

3

−45

vs. OUTPUT POWER OF EACH TONE

f1 = 2 000 MHz

2

= 2 002 MHz

f

−40

−35

−30

−25

VCC = 5.5 V

−20

−15

−10

−5

0

−20 −15 −10 −50

3rd Order Intermodulation Distortion IM

Output Power of Each Tone P

VCC = 5.0 V

VCC = 4.5 V

out (each)

(dBm)

10

Data Sheet P13593EJ2V0DS00

S-PARAMETER (VCC = 5.0 V)

11

S

FREQUENCY

−−−−

0.1 G

1 G

2.0 G

µµµµ

PC3210TB

22

S

FREQUENCY

−−−−

2.0 G

0.1 G

1.0 G

Data Sheet P13593EJ2V0DS00

11

µµµµ

PC3210TB

TYPICAL S-PARAMETER VALUES (TA = +25

PC3210TB

µ

C)

°°°°

VCC = 5.0 V, ICC = 16 mA

FREQUENCY S

MHz MAG. ANG. MAG. ANG. MAG. ANG. MAG. ANG.

100.0000 0.358 171.9 8.688

200.0000 0.335 166.6 8.807

300.0000 0.321 160.7 8.821

400.0000 0.306 158.3 8.841

500.0000 0.294 154.4 8.908

600.0000 0.283 151.8 8.990

700.0000 0.273 148.6 9.160

800.0000 0.267 146.0 9.342

900.0000 0.260 144.2 9.541

1000.0000 0.252 141.5 9.741

1100.0000 0.246 138.4 10.071

1200.0000 0.239 135.9 10.393

1300.0000 0.229 133.3 10.513

1400.0000 0.224 131.1 10.763

1500.0000 0.215 127.4 10.708

1600.0000 0.203 125.8 10.720

1700.0000 0.191 123.1 10.388

1800.0000 0.179 122.1 9.993

1900.0000 0.163 121.0 9.507

2000.0000 0.155 123.4 8.983

2100.0000 0.140 126.1 8.384

2200.0000 0.133 129.1 7.905

2300.0000 0.130 135.3 7.412

2400.0000 0.133 139.0 6.976

2500.0000 0.137 144.0 6.582 176.1 0.038 73.2 0.157

2600.0000 0.149 148.5 6.202 170.4 0.039 71.4 0.136

2700.0000 0.157 150.2 5.942 164.9 0.043 73.7 0.116

2800.0000 0.170 152.2 5.567 159.7 0.045 72.2 0.102

2900.0000 0.181 150.3 5.360 153.9 0.047 72.5 0.099

3000.0000 0.203 149.0 5.013 149.0 0.048 69.6 0.104

3100.0000 0.209 147.9 4.810 142.9 0.051 71.0 0.117

11

21

S

4.4 0.019

−

10.6 0.019 3.3 0.237

−

17.1 0.019 6.3 0.233

−

23.3 0.019 9.9 0.233

−

29.2 0.019 13.6 0.241

−

35.1 0.019 15.8 0.246

−

41.0 0.019 19.5 0.250

−

47.3 0.018 24.3 0.256

−

53.9 0.018 29.8 0.263

−

60.8 0.019 28.9 0.274

−

68.6 0.019 29.4 0.283

−

76.3 0.018 36.7 0.291

−

85.4 0.019 38.1 0.299

−

94.5 0.019 45.6 0.303

−

104.0 0.021 48.2 0.311

−

114.2 0.021 48.9 0.316

−

124.1 0.023 55.7 0.308

−

133.7 0.023 59.5 0.303

−

142.8 0.025 61.9 0.291

−

151.2 0.024 65.9 0.275

−

158.9 0.027 69.0 0.255

−

166.0 0.029 70.7 0.230

−

172.3 0.032 71.8 0.207

−

178.6 0.034 74.3 0.182

−

12

S

1.4 0.233

−

22

S

6.8 2.63

−

12.0 2.71

−

15.1 2.68

−

20.6 2.68

−

25.6 2.67

−

30.8 2.74

−

35.8 2.67

−

41.2 2.65

−

47.9 2.69

−

53.1 2.46

−

59.0 2.37

−

65.7 2.38

−

71.9 2.25

−

79.7 2.20

−

87.6 2.05

−

94.9 2.07

−

103.4 1.98

−

111.5 2.02

−

119.5 2.01

−

128.4 2.17

−

135.0 2.14

−

140.5 2.12

−

145.9 2.10

−

150.3 2.12

−

151.8 2.06

−

152.1 2.13

−

147.1 2.03

−

137.8 2.04

−

132.3 2.03

−

122.3 2.10

−

114.4 2.08

−

K

12

Data Sheet P13593EJ2V0DS00

PACKAGE DIMENSIONS

6 pin super minimold (unit: mm)

µµµµ

PC3210TB

2.1 ±0.1

1.25 ±0.1

0.2

+0.1
–0

0.65 0.65

1.3

2.0 ±0.2

0.1 MIN.

0.7

0.9 ±0.1

0.15

+0.1
–0

0 to 0.1

Data Sheet P13593EJ2V0DS00

13

µµµµ

PC3210TB

NOTES ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).

All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to VCC line.
(4) The DC cut capacitor must be each attached to input and output pin.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered in the following recommended conditions. Other soldering methods and

conditions than the recommended conditions are to be consulted with our sales representatives.

PC3210TB

µµµµ

Soldering Method Soldering Conditions Recommended Condition Symbol

Infrared Reflow Package peak temperature: 235 ° C or bel ow

Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limi t

VPS Package peak temperature: 215 ° C or bel ow

Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limi t

Wave Soldering Soldering bath temperature: 260 °C or bel ow

Time: 10 seconds or less
Count: 1, Exposure limi t

Partial Heating Pin temperature: 300 °C

Time: 3 seconds or less (per side of device)
Exposure limit

After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.

Note

Note

: None

Note

Note

Note

: None

: None

: None

IR35-00-3

VP15-00-3

WS60-00-1

–

Caution Do not use different soldering methods together (except for partial heating).

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

14

Data Sheet P13593EJ2V0DS00

[MEMO]

µµµµ

PC3210TB

Data Sheet P13593EJ2V0DS00

15

µµµµ

PC3210TB

ATTENTION

OBSERVE PRECAUTIONS

FOR HANDLING

ELECTROSTATIC

SENSITIVE

DEVICES

NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.

• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.

• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.

• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.

• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.

• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.

• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.

M7 98. 8