The uP6204 is a compact three-pha se synchronous-rectified
Buck controller specifically designed to deliver high quality
output voltage for high power applications. This part is
ca pable of delivering up to 90A output current thanks to its
embedded bootstrapped drivers that support 12V + 12V
driving capa bility . The built-in bootstra p diode simplifies the
circuit design and reduces external part count and PCB
space.
The output voltage is precisely regulated to the reference
inputs R1/R2/R3/R4 that are selected by VID inputs VID1
and VID0. The reference voltage can also be progra mmed
by I2C interface.
The uP6204 adopts DCR current sensing technique for over
current protection and droop tuning. Current balance is
achieved by sen sing the phase current through R
lower MOSFET when it turns on.
This part features comprehensive protection functions
including over current protection, input/output under voltage
protection, over voltage protection and over te mperature
protection.
DS(ON)
of
Features
Operate with 10.8V ~13.2V Supply Voltage
12V Bootstrapped Drivers with Internal
Bootstrap Diode
Flexible Reference Voltage for Power Play
External Reference Input R1/R2/R3/R4
Selected by VID1 and VID0
Internal Reference Voltage Programmed by
I2C
Simple Single-Loop Voltage-Mode Control
DCR Current Sensing for Over Current
Protection and Droop Tuning
R
Adjustable Operation Frequency form 50kHz to
External Compensation
Adjustable Soft Start
VQFN6x6-40L Package
RoHS Compliant and 100% Lead (Pb)-Free
Current Sensing for Current Balance
DS(ON)
1MHz Per Phase
Other features include adjustable soft start, adjustable
operation frequency, and quick response to step load
transient. With af orementioned functions, this part provides
customers a compact, high ef ficiency , well-prote cted a nd
cost-effective solutions. This part comes to VQF N6x6-40L
package.
pplications
Middle-High End GPU Core Power
High End Desktop PC Memory Core Power
Low Output V oltage, High Power Density DC-DC
Converters
Voltage Regulator Modules
Ordering Informatio n
rebmuNredrOepyTegakcaPkrameR
JAQA4026PuL04-6x6NFQV
Note: uPI products are compatible with the current IPC/
JEDEC J-ST D-020 and RoHS requirements. They are 100%
matte tin (Sn) plating and suitable f or use in SnPb or Pbfree soldering processes.
The uP6204 is a compact three-pha se synchronous-rectified
Buck controller specifically designed to deliver high quality
output voltage for high power applications. This part is
cap able of delivering up to 90A output current thanks to its
embedded bootstrapped drivers that support 12V + 12V
driving capa bility . The built-in bootstra p diode simplifies the
circuit design and reduces external part count and PCB
space.
The output voltage is precisely regulated to the reference
inputs R1/R2/R3/R4 that are selected by VID inputs VID1
and VID0. The reference voltage can also be progra mmed
by I2C interface.
The uP6204 adopts DCR current sensing technique for over
current protection and droop tuning. Current balance is
achieved by sensing the phase current through R
lower MOSFET when it turns on.
This part features comprehensive protection functions
including over current protection, input/output under voltage
protection, over voltage protection and over te mperature
protection.
Other features include adjustable soft start, adjustable
operation frequency, and quick response to step load
transient. With af orementioned functions, this part provides
customers a compact, high ef ficiency , well-prote cted and
cost-effective solutions. This part comes to VQF N6x6-40L
package.
DS(ON)
of
uP6204
Functional Description
V
IN1
V
OUT
LGATE1
PHASE1
UGATE1
BOOT1
PWM Controller
BOOT1
LGATE2
Figure 1. Simplified T wo-Pha se Buck Converter .
The uP6204 selects pha se number of operation according
to the MODE pin and VCC2 status. The MODE pin is a tristate input. When the MODE pin is pulled low , the uP6204
operates in three phases. When the MODE pin is left
floating, only pha se 1 is activated. When the MODE pin is
pulled high, only phase 1 & 2 are activated. The uP6204
does not support real-time phase number of operation
change. If a ny change of MODE state ha s been detected,
the uP6204 will shut down the output voltage and re-softstart again.
T a ble 1. Phase Number of Operation T able.
EDOMROP2CCVnoitarepOforebmuNesahP
hgiHX2/1esahP
V
IN2
PHASE2
UGATE2
Selecting Phase Number of Operation
The uP6204 supports single/two/three-phase operation that
is important f or PCIE interfaced gra phic cards where neither
bus power nor external power is ca pable of delivering full
load current. Take a two-pha se buck converter a s shown in
Figure 1 for exa mple. T wo-phase operation will make the
phase 2 converter a ct like a boost converter if the external
power is not available, boosting the output voltage V
the input voltage V
. The relationship between input voltage
IN2
OUT
to
and output voltage is governed by conventional boost
converter equation. Offset of the current balance function
may make the duty cycle of phase 2 converter smaller
than that of pha se 1 converter. This results in input voltage
V
higher than 15V that may damage the in put ca pacitors
IN2
and other devices. Therefore, pha se 2 must be turned of f
when input voltage VIN2 is not present to eliminate the
possibility of over voltage on input capacitors and other
devices of the pha se 2 converter.
gnitaolFX1esahP
woLSEY3/2/1esahP
woLONnwodtuhS
VCC1 powers the gate drives for phase 1/2 while VCC2
powers the gate drivers for phase 1. When MODE pin is
pulled low, the uP6204 che cks the VCC2 POR status before
soft start to ensure both bus and extern al power inputs are
ready for providing current to output voltage. The VCC2 pin
should be connected to V
(external power input). Figure
IN2
2 shows an imple mentation example where pha se 1/2 are
powered by PECI bus and phase 3 is power by external
cable.
Note that when operated in single/dual-phase, the
rated current is reduced to fractions of normal level.
Continuous demanding high current may da mage the
converter.
Rev. P01, File Name: uP6204-DS-P0100
6uPI Semiconductor Corp., http://www.upi-semi.com
Page 7
PCIE +12V
Phase 1/2
Converter
Phase 3
Converter
VCC1
VCC2EXT +12V
Preliminary
uP6204
Operation
Phase
Selection
uP6204
Functional Description
VID Table as shown in Table 3.
R1/R2/R3/R4 define four voltage levels through voltage
dividers for power on default setting.
LOW
VV
5CC]4:1[R
where V
is the 5.0V reference output voltage at 5VCC
CC5
pin. Note that the VR2 is the default reference voltage
level for soft start.
R
×=
LOWHIGH
RR
+
External Power Detection
Ext. Pwr Plugged = 0
Ext. Pwr Not Plugged = 1
MODE
Figure 2. Single/Three Pha se Operation
Dynamic Voltage Management
The uP6204 provides a comprehensive dynamic voltage
management scheme as shown in Figure 3. V
reference voltage used for voltage control loop. V
default connected V
V
REFS
The V
The V
or V
REFS
REFP
by PMBUS, see the related section for details.
REFP
is a reference voltage progra mmed by PMBUS.
is a reference voltage programmed by the VID0
and ca n be progra mmed to either
REF/P
REF
is the
is
REF
and VID1 inputs. One of the voltage levels Level[1:4] is
selected as V
are defined a s V
as illustrated in ta ble 2. Initially , Level[1:4]
REFP
defined by R[1:4] pins. Level[1:4] ca n
R[1:4]
also be overwritten by PMBUS according the AMD GPU
T a ble 2. Parallel VID Selection.
V
]0:1[DIV
PFER
egatloV
4/3R/2R/1RybteSsuBMPybteS
00V
10V
01V
11V
1R
2R
3R
4R
1leveL
2leveL
3leveL
4leveL
Voltage Control Loop and Power On Sequence
Figure 4 and Figure 5 show the voltage control loop and
typical power on sequence of uP6204 respectively. The
power on reset is acknowledged and the controller is
enabled at T0. A buffer with 160uA maximum current
capability starts to charge the soft start capacitor
SCL
SDA
PMBUS Select
(SVID)
5VCC
R1
R2
R3
R4
Rev. P01, File Name: uP6204-DS-P01000
AMD GPU Table
6-Bit/64-Level
Range: 0.8V ~ 1.2V
Step: ~12.5mV
PMBUS Programmable
PWR
ON
Default
Setting
Level 1
Level 2
Level 3
Level 4
Power Play
Table
VID0
Figure 4. Dyn a mic V oltage Ma nagement
2-Bit PVID
Select
VID1
PMBUS enable SVID mode
(Default PVID mode)
V
V
REF/S
REF/P
V
REF
7uPI Semiconductor Corp., http://www.upi-semi.com
Page 8
Preliminary
uP6204
Functional Description
T a ble 3. AMD GPU VID T a bleT a ble 3. AMD GPU VID T a ble
connected to SS pin after a 800us delay time T
The non-inverting input of the error a mplifier V
to VSS and ramp up linearly to V
drop caused by droop setting resistor R
. (Neglect the voltage
REF
, see the related
DRP
DLY
is equal
EAP
at T1.
section for details.) Consequently, the FB voltage VFB is
regulated to V
VR2 is default selected as V
and ra mp up linearly to V
EAP
during soft start cycle
REF
REF
.
regardless of the status of VID0 and VID1. The output
voltage reache s power on default output voltage defined by
R2 pin at T2 and stays there f or a time interval T
Error
Amplifier
V
REF
R
EAP
SS
DRP
FB
Maximum
Current =
160uA
I
SEN
DFT
.
T a ble 4. T ypical Power On Periods with CSS = 4.7nF
retemaraPlobmyS
emiTyaleDtratST
emiTtratStfoST
tuptuOotelbanE
noitalugeRni
tluafeDNORWP
doirePegatloV
YLD
SS
=
T
PMAR
T
T+
YLD
SS
T
TFD
lanimoN
eulaV
su002AN
sm3sm4~1
sm2.3sm2.4~2.1
sm002AN
elbatsujdA
egnaR
Operation Frequency Programming
A resistor RRT connected to RT pin progra ms the oscillation
frequency as:
=
10000
RT
)k(R
Ω
(kHz)
f
OSC
Figure 6 shows the relationship between oscillation
frequency and RRT.
COMP
uP6204
Figure 4. V oltage Control Loop
The uP6204 enters PVID mode (parallel VID mode) and
moves the output voltage to its final level selected by
VID[1:0] and voltages at R1/R2/R3/R4 after T3. The output
voltage transition slew rate is identical to the slew rate
during TSS. Table 4 shows typical time period of soft start
cycle of uP6204.
Controller Enable and
Power On Rest
T
RAMP
PWR ON Default
Output Volt age = V
T0T1T2T3
T
DLY
T
SS
T
R2
DFT
SS
V
OUT
Output Voltage
Selected by VID[0:1]
Time
PVID Mode
Figure 5. Power On Sequence
1000
100
Switching Frequency (kHz)
10
101001000
RRT (kohm)
Figure 6. Switching Frequency vs. RRT.
Channel Current Sensing and Current Balance
The uP6204 senses the pha se currents for current balance
by sensing the voltage across the lower switches when
they turn on as shown in Figure 7. The sampled-and-held
current is calculated as:
SEN
−
=
]3:1[I
PHASE
SEN
]3:1[VmV10
]3:1[R
Rev. P01, File Name: uP6204-DS-P01000
9uPI Semiconductor Corp., http://www.upi-semi.com
Page 10
Preliminary
uP6204
Functional Description
5VCC
S/H
PHASE[1:3]
R
SEN
ISEN[1:3]
uP6204
10mV
Figure 7. Pha se Current Sensing.
The uP6204 fine tunes the duty cycle of ea ch channel for
current balance according to the sensed inductor current
signals. If the current of channel 1 is smaller tha n the current
of channel 2 a nd 3, the uP6204 increa ses the duty cycle of
the corresponding phase to increase its phase current
accordingly , vice versa. The user can adjust R
to adjust
SEN
current ratio between phase s.
The sampled-and-held current I
phase over current prote ction. If any one of I
[1:3] are monitored for
SEN
[1:3] is higher
SEN
than 20uA, phase over current protection is activated and
shuts down the uP6204.
T otal Current Sen sing
The uP6204 extracts output current by para sitic DCR of the
inductors for over current protection. A RC network is
paralleled to the inductor for current sensing as shown in
Figure 8 where DCR is the parasitic resistance. The V
across the capacitor equals to V
= IL x DCR across the
DCR
DCR of the inductor if the time consta nts match:
R1CS = R2CS = R3CS = 3xL/DCR
L
R1
DCR
C
S
V
OUT
R
CSN
CSN
V
C
CSP
PHASE1
PHASE2
PHASE3
R2
R3
Figure 8. DCR Current Sensing Sche me
The sourcing ca pa bility of the GM amplifier is 100uA. It is
recommended to scale I
= 40uA at rated inductor current.
CSN
Take a 90A converter for example. Assume DCR = 2mΩ,
select the sense resistor a ccording to
=k5.1
R
CSN
m2A90
×
uA403
Ω=
Ω×
Output V oltage Droop Tuning
The uP6204 dynamically adjusts the output voltage
according to the output current the droop tuning resistor
RDRP as shown in Figure 4. The sensed current signal
IA VG is mirrored and in jected to EAP pin, producing a voltage
drop between SS pin and EAP pin.
REFDRPAVGSSEAP
DRP
OUT
−=××−=
/ 3 / R
R
CSN
).
CSN
VRI3VV×
Since the FB voltage is regulated to track VEAP, it shows
C
a load line with slope = (DCR x R
Short the R
to disable the droop function.
DRP
DCRI
×
Over Current Protection
I
AVG
R
DRP
The GM a mplifier will source a current source I
= VC/R
AVG
to virtually short its two inputs. Consequently I
calculated as:
I
CSN
R
V
C
CSN
DCRI
×
L
==
R
=
CSN
Rev. P01, File Name: uP6204-DS-P0100
OUT
DCRI
×
R3
×
CSN
CSN
The sensed current signal I
CSN
is
IMAX pin for over current protection. If the IMAX pin voltage
is mirrored and injected to
AVG
is higher than 3.0V, over current protection is activated a nd
shuts down the uP6204 as shown in Figure 9. A resistor
connected to IMAX set the over current protection level a s:
RV33
××
I
=
MAX
IMAX
For example, if DCR = 2mΩ, R
CSN
DCRR
×
= 1.5kΩ, and R
CSN
47kΩ, the over current protection level is calculated a s 144A.
is over the over temperature warning level.
A PTC network is used to monitor the converter temperature.
The uP6204 asserts over demarcature warning a nd turn s
on the internal MOSFET if
R
PTC
PTC
28.0
>
1RR
+
V
IMAX
(2V/Div)
UGATE1
(20V/Div)
Time: (10ms/Div)
Figure 8. Over Current Protection.
Dyna mic Pha se Reduction
The uP6204 dynamically reduces the phase number of
operation to reduce the switching and conduction loss at
light load condition. This yield high ef ficiency over wide range
of output current.
The 20uA current source out of PSI pin produces a voltage
cross the resistor R
RIV×=
PSIPSIPSI
The uP6204 operates with single phase if V
than V
PSI
. (V
< 0.2V) disables the dyna mic pha se reduction
PSI
connected to this pin.
PSI
is smaller
IMAX
function.
The VRHOT/EN is cla mped to 0.45V by internal diode a nd
is OK to keep the uP6204 enabled. It is highly suggest to
use 10k
ΩΩ
Ω pull high resistance so that the VRHOT/EN
ΩΩ
can be properly clamped.
The uP6204 asserts thermal shutdown a nd turns off upper/
lower MOSFET s if
R
PTC
PTC
+
33.0
>
1RR
An NTC network is also OK f or temperature monitoring.
5VCC
uP6204
VRHOT/EN
10k ohm
R1
PTC
0.3V
TCS
Thermal
Shutdown
Chip Enable
33% of
5VCC
28% of
5VCC
Over Voltage and Under Voltage Protection
The FB voltage is monitored for under voltage and over
voltage protection. The OVP is triggered a nd turns on the
lower MOSFETs if VFB > V
+ 200mV with 10us dealy.
REF
The OVP function is latch-off type a nd can only be reset by
POR or toggling the VRHOT/EN pin.
The UVP is triggered a nd turns off upper/lower MOSFET s if
VFB < VEAP - 300mV with 10us dealy. The UVP function
is latch-off type and ca n only be re set by POR or toggling
the VRHOT/EN pin.
The OVP and UVP functions are blocked about 20us when
reference voltage is changed either by PVID or SVID.
Temperature Monitoring and Chip Enable
The VRHOT/EN is multifunctional pin: high temperature
warning and chip en able a s shown in Figure 9. Pulling this
pin low shuts down the uP6204. The VRHOT/EN is pulled
high to 5VCC when released. This enables the uP6204.
This pin is cla mped to 0.45V when the sensed temperature
Rev. P01, File Name: uP6204-DS-P01000
Figure 9. T emperature Monitoring a nd Chip Ena ble.
Supply Input Voltage, VCC1/VCC2 (Note 1) -------------------------------------------------------------------------------------- -0.3V to +15V
PHASE to GND
DC ------------------------------------------------------------------------------------------------------------------------------------- -1V to 15V
< 200ns ---------------------------------------------------------------------------------------------------------------------------- -5V to 30V
BOOT to PHASE -------------------------------------------------------------------------------------------------------------------------------------- 15V
BOOT to GND
DC ------------------------------------------------------------------------------------------------------------------------- -0.3V to PHASE +15V
< 200ns -------------------------------------------------------------------------------------------------------------------------- -0.3V to 42V
Input, Output or I/O Voltage ---------------------------------------------------------------------------------------------------------- -0.3V to +6V
Storage T emperature Range ------------------------------------------------------------------------------------------------------------- -65OC to +150OC
Junction T emperature ------------------------------------------------------------------------------------------------------------------------------------ 150OC
Lead T emperature (Soldering, 10 se c) ------------------------------------------------------------------------------------------------------------ 260OC
ESD Rating (Note 2)
HBM (Human Body Mode) --------------------------------------------------------------------------------------------------------------------- 2kV
MM (Machine Mode) ----------------------------------------------------------------------------------------------------------------------------- 200V
Operating Junction T emperature Ra nge (Note 4) ------------------------------------------------------------------------ -40°C to +125°C
Operating Ambient T emperature Range -------------------------------------------------------------------------------------- -40°C to +85°C
Supply Input Voltage, V
------------------------------------------------------------------------------------ 10.8V to 13.2V
CC
Electrical Characteristics
(VCC = 12V, TA = 25OC, unless otherwise specified)
Note 1. Stresses listed a s the above “Absolute Maximum Ratings” may cause permanent damage to the device.
These are for stress ratings. Functional operation of the device at the se or any other conditions beyond those
indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may remain possibility to af fect device relia bility .
Note 2. Devices are ESD sensitive. Handling pre caution recommended.
Note 3. θJA is mea sured in the natural convection at TA = 25°C on a low effective thermal conductivity test board of
JEDEC 51-3 thermal mea surement standard.
Note 4. The device is not guaranteed to function outside its operating conditions.
1.Package Outline U nit Description:
BSC: Basic. Re presents theoretical exa ct di mension or dimen sion target
MIN: Minimum dimension specified.
MAX: Maximum dimension specified.
REF: Reference. Represents dimension f or reference use only . This value is not a device specification.
TYP . Typical. Provided a s a general value. This value is not a device spe cification.
2.Dimensions in Millimeters.
3.Drawing not to scale.
4.These dimensions no not include mold fla sh or protrusion s. Mold fla sh or protrusions shell not exceed 0.15mm.