Datasheet TLE6220GP Specification

Page 1
Data Sheet TLE 6220 GP
FAULT
RESET
Smart Quad Low-Side Switch
Short Circuit Protection
Overtemperature Protection
Overvoltage Protection
8 bit Serial Data Input and Diag-
nostic Output (SPI protocol)
Direct Parallel Control of Four Channels for PWM Applications
Cascadable with Other Quad Switches
Low Quiescent Current
µC Compatible Input
Electostatic Discharge (ESD) Protection
Green Product (RoHS compliant)
AEC qualified
Application
µC Compatible Power Switch for 12 V and 24 V Applications
Switch for Automotive and Industrial System
Solenoids, Relays and Resistive Loads
Injectors
Robotic controls
General Description
Quad Low-Side Switch in Smart Power Technology (SPT) with a Serial Peripheral Interface (SPI) and four open drain DMOS output stages. The TLE 6220 GP is protected by embedded protection func­tions and designed for automotive and industrial applications. The output stages can be controlled direct in parallel for PWM applications (injector coils), or through serial control via the SPI. Therefore the TLE 6220 GP is particularly suitable for engine management and powertrain systems.
Block Diagram
Supply voltage VS 4.5 – 5.5 V Drain source voltage V
DS(AZ) max
60 V On resistance RON 0.32 Output current (all outp. ON equal) I
D(NOM)
1 A
(individually) 3 A
PG-DSO-20
PRG
VS
GND
IN1
IN2
IN3
IN4
SCLK SI
CS
SO
as Ch. 1
as Ch. 1
as Ch. 1
8
Serial Interface
SPI
V2.2 Page 2009-11-18
VS
LOGIC
1
8 4
Output Control
Buffer
4
GND
normal function
SCB / overload
open load
short to ground
Output Stage
1
V
BB
OUT1
OUT4
Page 2
Data Sheet TLE 6220 GP
RESET
CS
FAULT
RESET
CS
FAULT
Pin Description Pin Configuration (Top view)
Pin Symbol Function
1 GND Ground 2 IN2 Input Channel 2 3 OUT1 Power Output Channel 1 4 VS Supply Voltage 5
6 7 PRG Program (inputs high or low active)
8 OUT2 Power Output Channel 2
9 IN1 Input Channel 1 10 GND Ground 11 GND Ground 12 IN4 Input Channel 4 13 OUT3 Power Output Channel 3 14
15 SO Serial Data Output 16 SCLK Serial Clock 17 SI Serial Data Input 18 OUT4 Power Output Channel 4 19 IN3 Input Channel 3 20 GND Ground
General Fault Flag
Reset
Chip Select
GND 1• 20 GND
IN2 2 19 IN3
OUT1 3 18 OUT4
VS
PRG 7 14
OUT2 8 13 OUT3
IN1 9 12 IN4
GND 10 11 GND
Power SO-20
4 17 5 16 SCLK 6 15 SO
SI
Heat slug internally connected to ground pins
V2.2 Page 2009-11-18
2
Page 3
Data Sheet TLE 6220 GP
Maximum Ratings for Tj = – 40°C to 150°C
Parameter Symbol Values Unit
Supply Voltage VS -0.3 ... +7 V Continuous Drain Source Voltage (OUT1...OUT4) VDS 45 V Input Voltage, All Inputs and Data Lines VIN - 0.3 ... + 7 V
2
Load Dump Protection V
Load Dump
= UP+US; UP=13.5 V
V
Load Dump
With Automotive Injector Valve RL = 14
1
)
R
=2 Ω; td=400ms; IN = low or high
I
With RL= 6.8 (ID = 2A) RI=2 Ω; td=400ms; IN = low or high Operating Temperature Range Storage Temperature Range Output Current per Channel (see el. characteristics) I Output Current per Channel @ TA = 25°C
3
(All 4 Channels ON; Mounted on PCB )
)
Output Clamping Energy
Tj T
stg
D(lim)
ID 1 A
EAS 50 mJ ID = 1A Power Dissipation (DC, mounted on PCB) @ TA = 25°C P
Electrostatic Discharge Voltage (human body model)
3 W
tot
V
ESD
according to MIL STD 883D, method 3015.7 and EOS/ESD assn. standard S5.1 - 1993
DIN Humidity Category, DIN 40 040 E IEC Climatic Category, DIN IEC 68-1 40/150/56 Thermal resistance junction – case (die soldered on the frame) junction - ambient @ min. footprint
R
thJC
R
thJA
junction - ambient @ 6 cm2 cooling area
)
62
52
I
- 40 ... + 150
- 55 ... + 150
D(lim) min
A
°C
2000 V
2 50
K/W
38
V
Minimum footprint
PCB with heat pipes, backside 6 cm2 cooling area
1
)
RI=internal resistance of the load dump test pulse generator LD200
2
)
V
LoadDump
3
)
Output current rating so long as maximum junction temperature is not exceeded. At TA = 125 °C the output
current has to be calculated using R
V2.2 Page 2009-11-18
is setup without DUT connected to the generator per ISO 7637-1 and DIN 40 839.
according mounting conditions.
thJA
3
Page 4
Data Sheet TLE 6220 GP
µs
RESET
FAULT
FAULT
K
Electrical Characteristics
Parameter and Conditions Symbol Values Unit
VS = 4.5 to 5.5 V ; Tj = - 40 °C to + 150 °C ; Reset = H
(unless otherwise specified)
1. Power Supply, Reset
min typ max
Supply Voltage4 Supply Current 5 IS Minimum Reset Duration
VS
t
Reset,min
4.5 -- 5.5
--
1 2 mA
10
(After a reset all parallel inputs are ORed with the SPI data bits)
2. Power Outputs
ON Resistance VS = 5 V; ID = 1 A TJ = 25°C TJ = 150°C
Output Clamping Voltage output OFF V Current Limit I Output Leakage Current V
RESET
= L Turn-On Time ID = 1 A, resistive load tON -­Turn-Off Time ID = 1 A, resistive load t
R
D(lim)
I
D(lkg)
OFF
DS(ON)
DS(AZ)
-- --
--
--
-­45
0.32
-­53
3 4.5 6 A
5 10 µs 5 10 µs
3. Digital Inputs
Input Low Voltage V Input High Voltage V Input Voltage Hysteresis V Input Pull Down/Up Current (IN1 ... IN4) I PRG,
Pull Up Current I Input Pull Down Current (SI, SCLK) I Input Pull Up Current (CS) I
- 0.3
INL
2.0
INH
50 100
INHys
20 50 100 µA
IN(1..4) IN(PRG,Res) IN(SI,SCLK) IN(CS)
20 50 100 µA
10 20 50 µA
10 20 50 µA
--
--
0.4
0.7 60 V
10 µA
1.0 V
VS+0.3
200
mV
V
V
4. Digital Outputs (SO,
SO High State Output Voltage I SO Low State Output Voltage I Output Tri-state Leakage Current CS= H, 0 VSO VS I
Output Low Voltage I Current Limitation; Overload Threshold Current I Overtemperature Shutdown Threshold
Hysteresis6
)
= 2 mA V
SOH
= 2.5 mA V
SOL
= 1.6 mA V
FAULT
VS - 0.4 -- -- V
SOH
-- -- 0.4 V
SOL
-10 0 10 µA
SOlkg
FAULTL
D(lim) 1...4
T
th(sd)
T
hys
-- --
3 4.5 6 A
170
--
-­10
0.4 V
200
--
°C
4
For VS < 4.5V the power stages are switched according the input signals and data bits or are definitely switched
off. This undervoltage reset gets active at VS = 3V (typ. value) and is guaranteed by design.
5
If Reset = L the supply current is reduced to typ. 20µA
6
This parameter will not be tested but guaranteed by design
V2.2 Page 2009-11-18
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Page 5
Data Sheet TLE 6220 GP
V
V
V
V
Electrical Characteristics cont.
Parameter and Conditions Symbol Values Unit
VS = 4.5 to 5.5 V ; Tj = - 40 °C to + 150 °C ; Reset = H
min typ max
(unless otherwise specified)
5. Diagnostic Functions
Open Load Detection Voltage V Output Pull Down Current I Fault Delay Time t Short to Ground Detection Voltage V Short to Ground Detection Current I
V
DS(OL)
50 90 150 µA
PD(OL)
50 110 200 µs
d(fault)
VS –3.3 VS -2.9
DS(SHG)
-50 -100 -150 µA
SHG
-2.5 VS -2
S
S
S
6. SPI-Timing
Serial Clock Frequency (depending on SO load) f Serial Clock Period (1/fclk) t Serial Clock High Time t Serial Clock Low Time t Enable Lead Time (falling edge of CS to rising edge of
CLK)
Enable Lag Time (falling edge of CLK to rising edge ofCS) t
DC -- 5 MHz
SCK
200 -- -- ns
p(SCK)
50 -- -- ns
SCKH
50 -- -- ns
SCKL
t
250 -- -- ns
lead
250 --- -- ns
lag
Data Setup Time (required time SI to falling of CLK) tSU 20 -- -- ns Data Hold Time (falling edge of CLK to SI) tH 20 -- -- ns Disable Time @ CL = 50 pF8 t Transfer Delay Time7
-- -- 150 ns
DIS
tdt 200 -- -- ns (CS high time between two accesses) Data Valid Time CL = 50 pF CL = 100 pF8 CL = 220 pF8
t
--
valid
--
--
--
--
--
110 120 150
-1.3
-2.5
ns
7
This time is necessary between two write accesses. To get the correct diagnostic information, the transfer delay
time has to be extended to the maximum fault delay time t
8
This parameter will not be tested but guaranteed by design
d(fault)max
V2.2 Page 2009-11-18
= 200µs.
5
Page 6
Data Sheet TLE 6220 GP
CS
CS
CS
CS
Functional Description
The TLE 6220 GP is an quad-low-side power switch which provides a serial peripheral inter­face (SPI) to control the 4 power DMOS switches, as well as diagnostic feedback. The power transistors are protected against short to VBB, overload, overtemperature and against over­voltage by an active zener clamp. The diagnostic logic recognises a fault condition which can be read out via the serial diagnos­tic output (SO).
Circuit Description
Power Transistor Protection Functions9)
Each of the four output stages has its own zener clamp, which causes a voltage limitation at the power transistor when solenoid loads are switched off. The outputs are provided with a current limitation set to a minimum of 3 A. The continuous current for each channel is 1A (all channels ON; depending on cooling). Each output is protected by embedded protection functions. In the event of an overload or short to supply, the current is internally limited and the corresponding bit combination is set (early warning). If this operation leads to an overtemperature condition, a second protection level (about 170 °C) will change the output into a low duty cycle PWM (selective thermal shut­down with restart) to prevent critical chip temperatures.
SPI Signal Description
- Chip Select. The system microcontroller selects the TLE 6220 GP by means of the pin. Whenever the pin is in a logic low state, data can be transferred from the µC and vice versa.
High to Low transition: - Diagnostic status information is transferred from the power
outputs into the shift register.
state corresponding to the SO bits.
To avoid any false clocking the serial clock input pin SCLK should be logic low state during high to low transition of CS. When CS is in a logic high state, any signals at the SCLK and SI
pins are ignored and SO is forced into a high impedance state.
- Serial input data can be clocked in from then on.
- SO changes from high impedance state to logic high or low
Low to High transition: - Transfer of SI bits from shift register into output buffers
- Reset of diagnosis register.
9 )
The integrated protection functions prevent an IC destruction under fault conditions and may not be used in normal operation or permanently .
V2.2 Page 2009-11-18
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Data Sheet TLE 6220 GP
CS
CS
RESET
SCLK - Serial Clock. The system clock pin clocks the internal shift register of the TLE
6220 GP. The serial input (SI) accepts data into the input shift register on the falling edge of SCLK while the serial output (SO) shifts diagnostic information out of the shift register on the rising edge of serial clock. It is essential that the SCLK pin is in a logic low state whenever
chip select SI - Serial Input. Serial data bits are shifted in at this pin, the most significant bit first. SI infor-
mation is read in on the falling edge of SCLK. Input data is latched in the shift register and then transferred to the control buffer of the output stages. The input data consists of one byte, made up of four control bits and four data bits. The con­trol word is used to program the device, to operate it in a certain mode as well as providing diagnostic information (see page 11). The four data bits contain the input information for the four channels, and are high active.
SO - Serial Output. Diagnostic data bits are shifted out serially at this pin, the most significant
makes any transition.
bit first. SO is in a high impedance state until the nostic data will appear at the SO pin following the rising edge of SCLK.
- Reset pin. If the reset pin is in a logic low state, it clears the SPI shift register and switches all outputs OFF. An internal pull-up structure is provided on chip. As long as the re­set pin is low the device is in low quiescent current mode and the supply current is reduced to typ. 20µA.
pin goes to a logic low state. New diag-
Output Stage Control
The four outputs of the TLE 6220 GP can either be controlled in parallel (IN1...IN4), or via the Serial Peripheral Interface (SPI).
Parallel Control
A Boolean operation (either AND or OR) is performed on each of the parallel inputs and re­spective SPI data bits, in order to determine the states of the respective outputs. The type of Boolean operation performed is programmed via the serial interface. The parallel inputs are high or low active depending on the PRG pin. If the parallel input pins are not connected (independent of high or low activity) it is guaranteed that the outputs 1 to 4 are switched OFF. PRG pin itself is internally pulled up when it is not connected.
PRG - Program pin. PRG = High (VS): Parallel inputs Channel 1 to 4 are high active PRG = Low (GND): Parallel inputs Channel 1 to 4 are low active.
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Data Sheet TLE 6220 GP
IN1...4 and serial data bits 'AND'ed. 'Full Diagnosis' performed.
Serial Control of the Outputs: SPI protocol
Each output is independently controlled by an output latch and a common reset line, which disables all four outputs. The Serial Input (SI) is read on the falling edge of the serial clock. A logic high input 'data bit' turns the respective output channel ON, a logic low 'data bit' turns it
OFF. CS must be low whilst shifting all the serial data into the device. A low-to-high transition of CS transfers the serial data input bits to the output control buffer.
As mentioned above, the serial input byte consists of a 4 bit control word and a 4 bit data word. Via the control word, the specific mode of the device is programmable.
MSB LSB
Five specific control words are recognised, having the following functions:
No. Serial Input Byte Function
1 2 3 4 5
Note: 'X' means 'don't care', because this bit will be ignored 'D' represents the data bit, either being H (=ON) or L (=OFF)
1. LLLL XXXX - Diagnosis only By clocking in this control byte, it is possible to get pure diagnostic information (two bits per channel) in accordance with Figure 1 (page 11). The data bits are ignored, so that the state of the outputs are not influenced. This command is only active once unless the next control com­mand is again "Diagnosis only".
2. HHLL XXXX - Reading back of input, and ‘1-bit Diagnosis’ If the TLE 6220 GP is used as bare die in a hybrid application, it is necessary to know if proper connections exist between the µC-port and parallel inputs. By entering ‘HHLL’ as the control word, the first four bits of the SO give the state of the parallel inputs, depending on the µC signals. By comparing the four IN-bits with the corresponding µC-port signal, the neces­sary connection between the µC and the TLE 6220 can be verified - i.e. ‘read back of the in­puts’. The second 4-bit word fed out at the serial output contains ‘1-bit’ fault information of the out­puts ( H = no fault, L = fault ). In the expression given below for the output byte, ‘FX’ is the fault bit for channel X.
MSB LSB IN4 IN3 IN2 IN1 F4 F3 F2 F1 : Serial Output byte
DDDDCCCC : Serial input byte
321321
Bits DataBits Control
LLLL XXXX Only 'Full Diagnosis' performed. No change to output states. HHLL XXXX State of four parallel inputs and '1-bit Diagnosis' outputted. HLHL XXXX Echo-function of SPI; SI direct connected to SO LLHH DDDD IN1...4 and serial data bits 'OR'ed. 'Full Diagnosis' performed. HHHH DDDD
V2.2 Page 2009-11-18
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Page 9
Data Sheet TLE 6220 GP
CS
CS
IN 1...4
data bits 0...3
CS
SI H H L L X X X X SO H H H H H H H H
SI command
output state; reading back of inputs and 1bit diagnosis
SO diagnosis
function
: No change of the
: No fault, normal
CS
SI H H H H L H H L
IN4 IN3 IN2 IN1 F4 F3 F2 F1
SO
SI command: AND-Operation; Ch1 and 4 OFF, Ch2 and 3 ON.
SO diagnosis
inputs and 1 bit diagnosis performed
: State of four parallel
CS
SI H H H H L L L L SO H H H H H H H H
SI command: AND-Operation and all channels OFF. SO diagnosis: No fault, normal function
3. HLHL XXXX - Echo-function of SPI To check the proper function of the serial interface the TLE 6220 GP provides a "SPI Echo
Function". By entering HLHL as control word, SI and SO are connected during the next period. By comparing the bits clocked in with the serial output bits, the proper function of the
SPI interface can be verified. This internal loop is only closed once (for one
period).
CS
SI H L H L X X X X
SI word
SI SO
SO H H H H L H H H
SI command: No change of the output states; Echo function of SPI SO diagnosis: Open load condition at channel 2, other channels ok.
Echo-function of SPI
directly connected to SO. SI information
during this cycle
outputs set accordingly after chip select rising edge
, i.e. SI
will be accepted
and the
4. LLHH DDDD - OR operation, and ‘full diagnosis’ With LLHH as the control word, each of the input signals IN1...IN4 are 'OR'ed with the corre­sponding data bits (DDDD).
Output
Driver
Serial Input,
1
This OR operation enables the serial interface to switch the channel ON, even though the cor­responding parallel input might be in the off state.
SPI Priority for ON-State
Also parallel control of the outputs is possible without an SPI input.
V2.2 Page 2009-11-18
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Data Sheet TLE 6220 GP
IN 1...4
The OR-function is the default Boolean operation if the device restarts after a Reset, or when the supply voltage is switched on for the first time. If the OR operation is programmed it is latched until it is overwritten by the AND operation.
5. HHHH DDDD - AND operation, and ‘full diagnosis’ With HHHH as the control word, each of the input signals IN1...IN4 are 'AND'ed with the cor­responding data bits (DDDD).
&
Serial Input, data bits 0...3
The AND operation implies that the output can be switched off by the SPI data bit input, even if the corresponding parallel input is in the ON state.
This also implies that the serial input data bit can only switch the output channel ON if the cor­responding parallel input is in the ON state. If the AND operation is programmed it is latched until it is overwritten by the OR operation.
Control words beside No. 1- 5
All control words except those for Diag Only, Read Back of Inputs, SPI echo, will be accepted as an OR or an AND command with valid data bits depending on the boolean operation which was programmed before.
Example 1:
LLHH HLLH: OR operation between parallel inputs and data bits, i.e channel 1 and 4 will be switched on. The next command is now: LHHH HHLH LHHH as command word has no special meaning but it will be accepted as an OR operation and the data bits will be ORed with the inputs and the outputs 1,3 and 4 will be switched on. See above: 'If the OR operation is programmed it is latched until it is overwritten by the AND operation.'
Example 2:
HHHH LLHL means: Data bits will be ANDed with the parallel inputs and the outputs switch accordingly. Then HLLH HHLH is clocked in: AND was latched by the command before and is now valid again by using the HLLH command word. So the data bits will be accepted and again ANDed with the parallel input signals. See above: 'If the AND operation is programmed it is latched until it is overwritten by the OR operation.'
Output
Driver
SPI Priority for OFF-state
V2.2 Page 2009-11-18
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Page 11
Data Sheet TLE 6220 GP
FAULT
CS
CS
Ch.4
Ch.3
Ch.2
Ch.1
7 6 5 4 3 2 1 0
Diagnostics
- Fault pin. There is a general fault pin (open drain) which shows a high to low transi-
tion as soon as an error occurs for any one of the four channels. This fault indication can be used to generate a µC interrupt. Therefore a ‘diagnosis’ interrupt routine need only be called after this fault indication. This saves processor time compared to a cyclic reading of the SO information.
As soon as a fault occurs, the fault information is latched into the diagnosis register. A new error will over-write the old error report. Serial data out pin (SO) is in a high impedance state
when The rising edge of CS will reset all error registers.
Full Diagnosis
For full diagnosis there are two diagnostic bits per channel configured as shown in Figure 1.
is high. If
receives a LOW signal, all diagnosis bits can be shifted out serially.
Diagnostic Serial OUT (SO)
HH Normal function HL Overload, Shorted Load or Overtemperature LH Open Load LL Shorted to Ground
Figure 1: Two bits per channel diagnostic feedback
Normal function: The bit combination HH indicates that there is no fault condition, i.e. normal
function. Overload, Short Circuit to Battery (SCB) or Overtemperature: HL is set when the current limitation gets active, i.e. there is a overload, short to supply or overtemperature condition. Open load: An open load condition is detected when the drain voltage decreases below 3 V (typ.). LH bit combination is set. Short Circuit to GND: If a drain to ground short circuit exists and the drain to ground current exceeds 100 µA, short to ground is detected and the LL bit combination is set.
A definite distinction between open load and short to ground is guaranteed by design. The standard way of obtaining diagnostic information is as follows:
Clock in serial information into SI pin and wait approximately 150 µs to allow the outputs to settle. Clock in the identical serial information once again - during this process the data com­ing out at SO contains the bit combinations representing the diagnosis conditions as de­scribed in Figure 1.
V2.2 Page 2009-11-18
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Page 12
Data
Bits
Control
Bits
CS
SCLK
CS
Data Sheet TLE 6220 GP
Timing Diagrams
6 74444 84444
SI
SO
Outputs
7 6 5 4 3 2 1 0
MSB
7 6 5 4 3 2 1 0
Figure 2: Serial Interface
0.2 V
S
t
SCKH
t
lead
SCLK
t
SU
SI
t
SCKL
6 74444 84444
LSB
OLD NEW
t
H
0.7V
S
0.2V
S
0.7VS
t
lag
0.7VS
0.2V
t
dt
S
Figure 3: Input Timing Diagram
0.7 V
SCLK
SO
SO
t
valid
0.2 V
0.7 V
S
0.7 V
0.2 V
S
S
S
S
CS
SO
0.2 V
S
t
Dis
Figure 4: SO Valid Time Waveforms Enable and Disable Time Waveforms
V2.2 Page 2009-11-18
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Data Sheet TLE 6220 GP
MTSR
V
IN
t
t
V
DS
ON
80%
20%
Figure 5: Power Outputs
Application Circuit
t
OFF
t
V
BB
µC
e.g. C166
MRST
CLK
P xy
VS
10k
PRG
FAULT
RESET
IN1 IN2
IN3
IN4
SI SO
CLK
VS
OUT1
OUT2
OUT4
TLE
6220
GP
GND
V2.2 Page 2009-11-18
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Data Sheet TLE 6220 GP
RDS(ON) [Ohm]
VDS (AZ) [V]
Typical electrical Characteristics Drain-Source on-resistance
R
= f (Tj) ; Vs = 5V
DS(ON)
Typical Drain- Source ON-Resistance
0,58
0,53
0,48
0,43
0,38
0,33
0,28
0,23
-50 -25 0 25 50 75 100 125 150 175
Tj[°C]
Figure 6 : Typical ON Resistance versus Junction-Temperature
Channel 1-4
Channel 1-4
Output Clamping Voltage
V
= f (Tj) ; Vs = 5V
DS(AZ)
Typical Clamping Voltage
55
54
53
52
51
50
49
48
-50 -25 0 25 50 75 100 125 150 175
Channel 1-4
Tj[°C]
Figure 7 : Typical Clamp Voltage versus Junction-Temperature
Channel 1-4
V2.2 Page 2009-11-18
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Data Sheet TLE 6220 GP
Injector 2
Parallel SPI Configuration
Engine Management Application
TLE 6230 GP in combination with TLE 6240 GP (16-fold switch) for relays and general purpose loads and TLE 6220 GP (quad switch) to drive the injector valves. This arrangement covers the numerous loads to be driven in a modern Engine Management/Powertrain system. From 28 channels in sum 16 can be controlled direct in parallel for PWM applications.
µC
C167
P x.1-4
MTSR MRST
CLK
P x.y
P x.1-4
P x.y
P x.1-8
4
4
4 PWM Channels
SI SO CLK
CS
4 PWM Channels
SI SO
CLK
TLE
6220 GP
Quad
TLE
6230 GP
Injector 3
Injector 4
Octal
8
8 PWM Channels
Injector 1
SI SO CLK
P x.y
TLE
6240 GP
16-fold
Daisy Chain Application TLE 6220 GP
V2.2 Page 2009-11-18
µC
MTSR
MRST
Px.1 Px.2
CS
SI
CS
CLK
TLE
6220 GP
Quad
SO
CS
SI
CLK
TLE
6220 GP
Quad
15
SO
CS
SI
CLK
TLE
6220 GP
Quad
SO
Page 16
Data Sheet TLE 6220 GP
Package and Ordering Code
(all dimensions in mm)
PG - DSO - 20
TLE 6220 GP
+/- 0.1
15.74
13.7
-0.2
9 x = 11.431.27
1.27
1120
0.4
+0.1 3
0.25 AM
1 10
1 x 45°
PIN 1 INDEX MAR KING
A
15.9
+/ -0.1 5
2.8
0.1
1.2
-0.3
+/ -0.1
+/ -0 .1
3.2
5.9
1.3
1)
11
14.2
6.3
+/-0.15
+/ -0.3
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Data Sheet TLE 6220 GP
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be com­pliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
V2.2 Page 2009-11-18
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Data Sheet TLE 6220 GP
Revision History Version Date Changes
V2.1 -> V2.2
V2.0 -> V2.1
V1.1 -> V2.0
V1.1 28.08.2007 Initial Version of “grey” product
18.11.2009 Package changed to PG-DSO-20 Ordering code removed
20.04.2007 Ordering Code removed Layout Changes Correct green package name implemented P-DSO-20-12 à PG-DSO­20-26
20.05.2003 Changes to Green Product Version:
- AEC, RoHS Logo and Feature List content added
- Package Name P-DSO -> PGDSO
- Change History added
- Disclaimer re-newed
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Data Sheet TLE 6220 GP
Edition 2007-04-17 Published by
Infineon Technologies AG 81726 Munich, Germany
© 11/19/09 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or characteris­tics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabili­ties of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party.
Information For further information on technology, delivery terms and conditions and prices, please contact the nearest In-
fineon Technologies Office (www.infineon.com). Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other per­sons may be endangered.
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