Datasheet TLE4208G Datasheet (Siemens)

Page 1
1-A Quad-HBD (Quad-Half-Bridge Driver) TLE 4208
Overview
Features
• Driver for up to 3 motors
• Delivers up to 0.8 A continuous
• Optimized for DC motor management applications
• Low saturation voltage
• Output protected against short circuit
• Error flag diagnosis
• Overvoltage lockout and diagnosis
• Undervoltage lockout
• CMOS/TTL compatible inputs with hysteresis
• No crossover current
• Internal clamp diodes
• Overtemperature protection with hysteresis and diagnosis
• Enhanced power P-DSO-Package
; typ.1.2 V total @ 25 °C; 0.4 A
P-DSO-28-6
Type Ordering Code Package
TLE 4208 G Q67007-A9335 P-DSO-28-6
Description
The TLE 4208 is a fully protected Quad-Half-Bridge-Driver designed specially for automotive and industrial motion control applications.
The part is built using the Siemens bipolar high voltage power technology DOPL. In a cascade configuration up to three actuators (DC motors) can be connected between
the four half-bridges. These four half-bridges are configured as 2 dual-half-bridges, which are supplied and controlled separately. Operation modes forward (cw), reverse (ccw), brake and high impedance are invoked from a standard interface.
The standard enhanced power P-DSO-28 package meets the application requirements and saves PCB-board space and costs.
Furthermore the built-in features like diagnosis, over- and undervoltage-lockout, short­circuit protection, over-temperature protection and the very low quiescent current in stand-by mode will open a wide range of automotive and industrial applications.
Semiconductor Group 1 1998-06-03
Page 2
TLE 4208
GND
EF
IN1
N.C.
OUT1
GND GND GND GND
OUT3
N.C.
IN3
INH
GND
128 2
12
3 4 5 6 7
TLE 4208 G
8 9 10 11 12 13
34
14
Figure 1 Pin Configuration (top view)
27 26 25 24 23 22
21 20 19 18 17 16 15
N.C. INH
12
IN2
V
S12
OUT2 GND GND GND GND OUT4
V
S34
IN4 EF
34
N.C.
AEP02349
Semiconductor Group 2 1998-06-03
Page 3
Pin Definitions and Functions Pin No. Symbol Function
TLE 4208
1, 6, 7, 8, 9, 14, 20, 21,
GND Ground;
negative reference potential for blocking capacitor
22, 23 2EF
12
Error Flag output of half-bridges 1and 2;
open collector; low = error
3 IN1 Input channel of half-bridge 1;
controls OUT1 4, 11, 15, 28 N.C. Not connected 5 OUT1 Power output of half-bridge 1;
full short circuit protected; with integrated clamp diodes 10 OUT3 Power output of half-bridge 3;
full short-circuit protected; with integrated clamp diodes 12 IN3 Input channel of half-bridge 3;
controls OUT3 13 INH
34
Inhibit input of half-bridges 3 and 4;
low = half-bridges 3 and 4 in stand-by 16 EF
34
Error Flag output of half-bridges 3 and 4;
open collector; low = error 17 IN4 Input channel of half-bridge 4;
controls OUT4 18
V
S34
Power supply voltage of half-bridges 3 and 4;
positive reference potential for blocking capacitor 19 OUT4 Power output of half-bridge 4;
full short circuit protected; with integrated clamp diodes 24 OUT2 Power-output of half-bridge 2;
full short circuit protected; with integrated clamp diodes 25
V
S12
Power supply voltage of half-bridges 1 and 2;
positive reference potential for blocking capacitor 26 IN2 Input channel of half-bridge 2;
controls OUT2 27 INH
12
Inhibit input of half-bridges 1and 2;
low = half-bridges 1 and 2 in stand-by
Semiconductor Group 3 1998-06-03
Page 4
TLE 4208
INH
EF
INH
EF
12
12
IN1
IN2
34
34
IN3
IN4
27
2
3
26
13
16
12
17
INH
0 1 1 1
INH
0 1 1 1 1
Inhibit 1,2
Fault-Detection 1,2
IN1 IN2
12
0 0 1 1
Inhibit 3,4
Fault-Detection 3,4
34
IN3
IN4
X
0 0 1 1
0 1 0 11
X 0 1 0 1
TLE 4208 G
OUT1 OUT2
ZXZX L L H H
OUT3
Z L
L
H
L
H
OUT4
Z
L LH H H
L
H
DRV1
DRV2
DRV3
DRV4
25
5
24
1,6,7,8,
9,14,
20,21,
22,23
10
19
18
V
S12
OUT1
OUT2
GND
OUT3
OUT4
V
S34
AEB02350
Figure 2 Block Diagram
Semiconductor Group 4 1998-06-03
Page 5
Input Logic
Functional Truth Table of Halfbridge 1 and 2
TLE 4208
INH
12
IN1 IN2 OUT1 OUT2 Mode
0 X X Z Z Stand-By 1
1 1 1
0 0 1 1
0 1 0 1
L L H H
L H L H
Brake LL CW CCW Brake HH
Note: Half-Bridge 1 and 2 connected to a full-bridge
Functional Truth Table of Half-Bridge 3 and 4 INH
34
IN3 IN4 OUT3 OUT4 Mode
0 X X Z Z Stand-By 1
1 1 1
0 0 1 1
0 1 0 1
L L H H
L H L H
Brake LL CW CCW Brake HH
IN: 0 = Logic LOW OUT: Z = Output in tristate condition
1 = Logic HIGH L = Output in sink condition X = don’t care H = Output in source condition
Note: Half-Bridge 3 and 4 connected to a full-bridge
Diagnosis EF
1 0 0 1 1 0 0
12
EF
1 1 1 0 0 0 0
34
Error
no error over temperature of half-bridge 1 and 2 or over voltage of half-bridge 1 and 2 over temperature of half-bridge 3 and 4 or over voltage of half-bridge 3 and 4 over temperature of all half-bridges or over voltage of all half-bridges
Semiconductor Group 5 1998-06-03
Page 6
Electrical Characteristics
Absolute Maximum Ratings Parameter Symbol Limit Values Unit Remarks
min. max.
Voltages
V
Supply voltage
V
S12 S34
,
– 0.3 45 V
TLE 4208
Supply voltage
Logic input voltages (IN1; IN2; INH IN3; IN4; INH
34
12
;
)
Logic output voltage
; EF34)
(EF
12
Currents
Output current (cont.) Output current (peak) Output current (diode) Output current (EF)
Temperatures
Junction temperature
V
S12
V
S34
V
I
V
EF12
V
EF34
I
OUT1-4
I
OUT1-4
I
OUT1-4
I
EF12-34
T
j
,
– 1 V t < 0.5 s;
– 5 20 V 0V < V
,
– 0.3 20 V 0 V < V
I
S12
, I
S34
S12
S12
> – 2 A
, V
S34
, V
S34
< 45 V
< 45 V
A internally limited – A internally limited –1 1 A – –2 5 mA
– 40 150 °C–
Storage temperature
T
stg
– 50 150 °C–
Thermal Resistances
Junction pin Junction ambient
R R
thj-pin thjA
25 K/W measured to pin 7 – 65 K/W
Note: Maximum ratings are absolute ratings; exceeding any one of these values may
cause irreversible damage to the integrated circuit.
Semiconductor Group 6 1998-06-03
Page 7
Operating Range Parameter Symbol Limit Values Unit Remarks
min. max.
TLE 4208
Supply voltage
Supply voltage increasing V
Supply voltage decreasing
Logic input voltages (IN1; IN2; INH IN3; IN4; INH
34
12
;
)
Junction temperature
V V
V V
V V
T
S12 S34
S12 S34
S12 S34
I
j
,
,
,
V
UV OFF
18 V After V
– 0.3 V
– 0.3 V
UV ON
UV OFF
rising
above
S12,VS34
V
UV ON
V Outputs in tristate
V Outputs in tristate
– 2 18 V
– 40 150 °C–
Note: In the operating range the functions given in the circuit description are fulfilled.
Semiconductor Group 7 1998-06-03
Page 8
TLE 4208
Electrical Characteristics
V
8 V <
S12
= V
unless otherwise specified
Parameter Symbol Limit Values Unit Test Condition
Current Consumption
INH
= INH34 = LOW
12
< 18 V; INH12 = INH34 = HIGH; I
S34
min. typ. max.
OUT1-4
= 0 A; – 40 °C < Tj < 150 °C;
Quiescent current Quiescent current I
INH
= HIGH and INH34 = LOW or INH12 = LOW and INH34 = HIGH
12
Supply current Supply current
Supply current
I
I I
I
S S
S12 S12
S12
, I , I
, I
Over- and Under Voltage Lockout
UV Switch ON voltage
UV Switch OFF voltage
V
UV ON
V
UV OFF
100 µA IS = I –2040µA IS = I
–1020mA
S34
30 mA I
S34
50 mA I
S34
6.5 7.5 V V
56–VV
+ I
S12
+ I
S12
V
= V
S12
T
= 25 °C
j
OUT1/3
I
OUT2/4 OUT1/3
I
OUT2/4
S12
S34
= 0.4 A = – 0.4 A
= 0.8 A = – 0.8 A
, V
S34
increasing
S12,VS34
decreasing
S34
;
S34
= 13.2 V;
UV ON/OFF hysteresis OV Switch OFF voltage V
V
UV HY OV OFF
0.5 V V –2024VV
V
UV ON S12,VS34
UV OFF
increasing
OV Switch ON voltage
V
OV ON
18 19.5 – V V
S12,VS34
decreasing
OV ON/OFF hysteresis
Semiconductor Group 8 1998-06-03
V
OV HY
0.5 V V
OV OFF
V
OV ON
Page 9
TLE 4208
Electrical Characteristics (cont’d)
V
8 V <
S12
= V
unless otherwise specified
Parameter Symbol Limit Values Unit Test Condition
Outputs OUT1; OUT2; OUT 3; OUT 4 Saturation Voltages
< 18 V; INH12 = INH34 = HIGH; I
S34
min. typ. max.
= 0 A; – 40 °C < Tj < 150 °C;
OUT1-4
Source (upper)
I
OUT12
, I
OUT34
= – 0.2 A
Source (upper)
I
OUT12
, I
OUT34
= – 0.4 A
Sink (upper)
I
OUT12
, I
OUT34
= – 0.8 A
Sink (lower)
I
OUT12
, I
OUT34
= 0.2 A
Sink (lower)
I
OUT12
, I
OUT34
= 0.4 A
Sink (lower)
I
OUT12
, I
OUT34
= 0.8 A
Total Drop
I
OUT12
, I
OUT34
= 0.2 A
Total Drop
I
OUT12
, I
OUT34
= 0.4 A
Total Drop
I
OUT12
, I
OUT34
= 0.8 A
V
V
V
V
V
V
V
V
V
SAT U
SAT U
SAT U
SAT L
SAT L
SAT L
SAT
SAT
SAT
0.85 1.15 V Tj = 25 °C
0.90 1.20 V Tj = 25 °C
1.10 1.50 V Tj = 25 °C
0.15 0.23 V Tj = 25 °C
0.25 0.40 V Tj = 25 °C
0.45 0.75 V Tj = 25 °C
V
V
V
SAT
SAT
SAT
= V
= V
= V
SAT U
SAT U
SAT U
1 1.4 V
1.2 1.7 V
1.6 2.5 V
+ V
+ V
+ V
SAT L
SAT L
SAT L
Clamp Diodes
Forward voltage; upper Upper leakage current Forward voltage; lower V
Notes see page 11.
Semiconductor Group 9 1998-06-03
V I
FU
LKU
FL
1 1.5 V IF = 0.4 A ––5mAIF = 0.4 A – 0.9 1.4 V IF = 0.4 A
1)
Page 10
Electrical Characteristics (cont’d)
TLE 4208
8 V <
V
S12
= V
< 18 V; INH12 = INH34 = HIGH; I
S34
OUT1-4
= 0 A; – 40 °C < Tj < 150 °C;
unless otherwise specified
Parameter Symbol Limit Values Unit Test Condition
min. typ. max.
Input Interface Logic Inputs IN1; IN2; IN3; IN4
H-input voltage L-input voltage Hysteresis of input voltage H-input current L-input current
Logic Inputs INH12; INH
V V V I I
34
H-input voltage V
IH IL
IHY IH IL
IH
2.0 3.0 V
1.0 1.5 V – – 0.5 V – –2 10 µA VI = 5 V – 100 – 20 – 5 µA VI = 0 V
2.7 3.5 V – L-input voltage Hysteresis of input voltage H-input current L-input current
Error-Flags EF12; EF
34
V V I I
L-output voltage level V Leakage current
I
IL
IHY IH IL
EFL EFLK
1.0 2.0 V – – 0.7 V – – 100 250 µA V –10 10 µA V
INH INH
= 5 V = 0 V
0.2 0.4 V IEF = 2 mA – –10µA 0 V < VEF < 7 V
Semiconductor Group 10 1998-06-03
Page 11
TLE 4208
Electrical Characteristics (cont’d)
V
8 V <
S12
= V
unless otherwise specified
Parameter Symbol Limit Values Unit Test Condition
Thermal Shutdown
< 18 V; INH12 = INH34 = HIGH; I
S34
min. typ. max.
= 0 A; – 40 °C < Tj < 150 °C;
OUT1-4
Thermal shutdown junction
T
jSD
150 175 200 °C–
temperature Thermal switch-on junction
T
jSO
120 170 °C–
temperature Temperature hysteresis
1)
Guaranteed by design.
T –30–K–
Note: The listed characteristics are ensured over the operating range of the integrated
circuit. Typical characteristics specify mean values expected over the production spread. If not otherwise specified, typical characteristics apply at
T
= 25°C and
A
the given supply voltage.
Semiconductor Group 11 1998-06-03
Page 12
Watchdog In
Watchdog Out
Reset Out
Q
8 1 14
9
TLE 4278 G
3,4,5,10,11,12 76
Input
13
Watchdog Adjust
2
TLE 4208
= 12 V
V
S
D1 1N4001
R
GNDD
QA
R
10 k
10 k
V
RWDIWDO
CC
INH12
QB
C
Q
22 F
µ
4
C
D
100 nF
Inhibit 1,2
Reset Adjust
TLE 4208 G
R
WA
100 k
C
Ι
100 nF
V
28
C
S
22 F
µ
S12
DRV1
EF12
25
24
IN1
5
IN2
µ
C
INH34
18
Fault-Detection 1,2
INH12
IN1 IN2
0
0L0
1
0
1 1
1 0
1 1H11
Inhibit 3,4
OUT1 OUT2
ZXZX L H
L
L
H
H
DRV2
DRV3
27
1
6,7,8,9,
20,21,
22,23
OUT1
M1
OUT2
GND
EF34
IN3
IN4
11
10
19
Fault-Detection 3,4
INH34
IN3
IN4
0
1 1 1 1
X
X
0
0 0
1 0
1
1
1
OUT4
OUT3
Z
Z
L
L LH H
L H
H
DRV4
13
15
14
OUT3
M2
OUT4
V
S34
AES02351
Figure 3 Application Circuit 1 (Device is used as Dual-Full-Bridge-Driver)
Semiconductor Group 12 1998-06-03
Page 13
Diagrams
TLE 4208
Quiescent current over Temperature
50
µ
A
Ι
S
40
30
20
10
0
-50 0
V
S
V
S
V
S
I
S
= 18 V
= 13.2 V
= 8 V
AED02352
100
T
j
Saturation Voltage of Source V
SAT U
over Temperature
1500
V
SAT U
1250
V
S
= 14 V
Ι
OUT
= 800 mA
mV
1000
750
Ι
Ι
OUT
OUT
= 400 mA
= 200 mA
500
250
0
15050
C
-50
0 50 100 150
AED02308
˚C
T
j
Saturation Voltage of Sink over Temperature
1000
V
SAT L
750
500
250
mV
0
-50
= 14 V
V
S
= 800 mA
Ι
OUT
= 400 mA
Ι
OUT
= 200 mA
Ι
OUT
0 50 100 150
V
SAT L
AED02309
˚C
T
Total Drop at outputs
V
SAT
over Temperature
2000
V
SAT
= 14 V
V
S
mV
= 800 mA
Ι
OUT
1500
= 400 mA
Ι
OUT
= 200 mA
Ι
1000
OUT
500
0
-50
j
0 50 100 150
AED02310
˚C
T
j
Semiconductor Group 13 1998-06-03
Page 14
Package Outlines
P-DSO-28-6
(Plastic Dual Small Outline Package)
1.27
+0.15
0.35
2)
0.2 28x
1528
-0.1
0.2
-0.2
2.45
0.1
2.65 max
0.35 x 45˚
7.6
-0.2
0.4
10.3
1)
+0.8
±0.3
+0.09
0.23
TLE 4208
8˚ max
114
18.1
-0.4
1)
Index Marking
1) Does not include plastic or metal protrusions of 0.15 max rer side
2) Does not include dambar protrusion of 0.05 max per side
GPS05123
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our Data Book “Package Information”.
SMD = Surface Mounted Device
Dimensions in mm
Semiconductor Group 14 1998-06-03
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