Datasheet TK65855STL, TK65845STL, TK65850STL, TK65840STL, TK65835STL Datasheet (TOKO)

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Page 1
February 1999 TOKO, Inc. Page 1
ADVANCED INFORMATION
FEATURES
Low Dropout Voltage
Very Low Quiescent Current (50 µA maximum)
Internal Bandgap Reference
Regulates down to 1.8 V
Short Circuit Protection
Miniature Package (SOT-23-5)
BLOCK DIAGRAM
TKxxxxx
GND
V
IN
NC
V
OUT
CONTROL
TK6xxxx S
ORDERING INFORMATION
TAPE/REEL CODE
TL: Tape Left
PACKAGE CODE
S: SOT-23-5
Tape/Reel Code Package Code
VOLTAGE CODE
18 = 1.8 V 33 = 3.3 V 55 = 5.5 V 20 = 2.0 V 35 = 3.5 V 60 = 6.0 V 25 = 2.5 V 40 = 4.0 V 28 = 2.8 V 45 = 4.5 V 30 = 3.0 V 50 = 5.0 V
Voltage Code
DESCRIPTION
The device is a low dropout linear regulation housed in a small SOT-23-5 package, rated at 500 mW.
An internal P Channel pass transistor is used in order to achieve low dropout voltage. The device has extremely low quiescent current (max 50 µA). The device offers high precision output voltage of 2% at over temperature. The low quiescent current and dropout voltage make this part ideal for battery powered applications. In the standby mode when the device is disabled, the linear regulator only draws 1 µA (max).
APPLICATIONS
Battery Powered Systems
Cellular Telephones
Pagers
Toys
Radio Control Systems
Low Voltage Systems
Personal Communications Systems
Portable Instrumentation
Portable Consumer Equipment
CMOS LDO REGULATOR WITH HIGH ACTIVE CONTROL
ADVANCED
INFORMATION
CONTROL
GND
V
IN V
OUT
+
-
BANDGAP
REFERENCE
CONTROL
CIRCUIT
+
-
CURRENT
LIMIT
Page 2
Page 2 February 1999 TOKO, Inc.
ADVANCED INFORMATION
ABSOLUTE MAXIMUM RATINGS
All pins except GND ................................................... 9 V
Power Dissipation (Note 1) ................................ 500 mW
Storage Temperature Range ................... -55 to +150 °C
Operating Temp. Range..............................-30 to +80 °C
Junction Temperature ........................................... 150 °C
ELECTRICAL CHARACTERISTICS
Test conditions: VIN = V
OUT(TYP)
+ 1 V, TA = 25 °C, unless otherwise specified.
Note 1: Power dissapation is 500 mW when mounted as recommended (150 mW in Free Air). Derate at 1.8 mW/°C for operation above 25 °C. Note 2: V
OUT
= 1.8 V to 6 V, 0.1 V step.
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Page 3
February 1999 TOKO, Inc. Page 3
ADVANCED INFORMATION
DEFINITION AND EXPLANATION OF TECHNICAL TERMS
OUTPUT VOLTAGE (V
OUT
)
The output voltage is specified with VIN = (V
OUT(TYP)
+ 1 V)
and I
OUT
= 1 mA.
DROPOUT VOLTAGE (V
DROP
)
The dropout voltage is the difference between the input voltage and the output voltage at which point the regulator starts to fall out of regulation. Below this value, the output voltage will fall as the input voltage is reduced. It is dependent upon the load current and the junction temperature.
OUTPUT CURRENT (I
OUT
)
Normal operating output current. This is limited by package power dissipation.
LINE REGULATION (Line Reg)
Line regulation is the ability of the regulator to maintain a constant output voltage as the input voltage changes. The line regulation is specified as the input voltage is changed from VIN = V
OUT
+ 0.5 V to VIN = 8 V.
LOAD REGULATION (Load Reg)
Load regulation is the ability of the regulator to maintain a constant output voltage as the load current changes. It is a pulsed measurement to minimize temperature effects with the input voltage set to VIN = V
OUT
+1 V. The load regulation is specified under output current step conditions of 1 mA to 50 mA.
QUIESCENT CURRENT (IQ)
The quiescent current is the current which flows through the ground terminal under no load conditions (I
OUT
= 0 mA).
STANDBY CURRENT (I
STBY
)
Standby current is the current which flows into the regulator when the output is turned off by the control function (V
CONT
= 0 V). It is measured with VIN = 8 V.
SENSOR CIRCUITS
Overcurrent Sensor
The overcurrent sensor protects the device if the output is shorted to ground.
PACKAGE POWER DISSIPATION (PD)
This is the power dissipation level at which the thermal sensor is activated. The IC contains an internal thermal sensor which monitors the junction temperature. When the junction temperature exceeds the monitor threshold of 150 °C, the IC is shut down. The junction temperature rises as the difference between the input power (VIN x IIN) and the output power (V
OUT
x I
OUT
) increases. The rate of temperature rise is greatly affected by the mounting pad configuration on the PCB, the board material, and the ambient temperature. When the IC mounting has good thermal conductivity, the junction temperature will be low even if the power dissipation is great. When mounted on the recommended mounting pad, the power dissipation of the SOT-23-5 is increased to 500 mW. For operation at ambient temperatures over 25 °C, the power dissipation of the SOT-23-5 device should be derated at 4.0 mW/ °C. To determine the power dissipation for shutdown when mounted, attach the device on the actual PCB and deliberately increase the output current (or raise the input voltage) until the thermal protection circuit is activated. Calculate the power dissipation of the device by subtracting the output power from the input power. These measurements should allow for the ambient temperature of the PCB. The value obtained from PD /(150 °C - TA) is the derating factor. The PCB mounting pad should provide maximum thermal conductivity in order to maintain low device temperatures. As a general rule, the lower the temperature, the better the reliability of the device. The thermal resistance when mounted is expressed as follows:
Tj = 0jA x PD + T
A
For Toko ICs, the internal limit for junction temperature is 150 °C. If the ambient temperature (TA) is 25 °C, then:
150 °C = 0jA x PD + 25 °C 0jA = 125 °C / P
D
Page 4
Page 4 February 1999 TOKO, Inc.
ADVANCED INFORMATION
DEFINITION AND EXPLANATION OF TECHNICAL TERMS (CONT.)
PD is the value when the thermal protection circuit is activated. A simple way to determine PD is to calculate V
IN
x IIN when the output side is shorted. Input current gradually falls as temperature rises. You should use the value when thermal equilibrium is reached.
The range of usable currents can also be found from the graph below.
Procedure:
1) Find P
D
2) PD1 is taken to be PD x (~0.8 - 0.9)
3) Plot PD1 against 25 °C
4) Connect P
D1
to the point corresponding to the 150 °C
with a straight line.
5) In design, take a vertical line from the maximum operating temperature (e.g., 75 °C) to the derating curve.
6) Read off the value of PD against the point at which the vertical line intersects the derating curve. This is taken as the maximum power dissipation, DPD.
The maximum operating current is:
I
OUT
= (D
PD
/ (V
IN(MAX) - VOUT
)
SOT-23-5 POWER DISSIPATION CURVE
P
D
D
PD
25 50 75 150
(mW)
TA (°C)
3
6
5
4
0 50 100 150
TA (°C)
P
D
(
m
W)
0
100
500
MOUNTED AS
SHOWN
FREE AIR
200
300
400
Page 5
February 1999 TOKO, Inc. Page 5
ADVANCED INFORMATION
APPLICATION INFORMATION
+
CONTROL
V
IN
V
OUT
+
GND
BOARD LAYOUT
SOT-23-5 BOARD LAYOUTBAOR-5
Page 6
Page 6 February 1999 TOKO, Inc.
ADVANCED INFORMATION
0.95
0.95
0.950.95
e
M
0.1
2.9
1.6
1.1
0.15
0.4
2.8
1.90
2.4
e'
Recommended Mount Pad
1
23
45
1.0
0.7
(0.8)
0 - 0.1
(0.6)
(0.6)
1.4 max
e
e e
0.1
e1
0 - 15 max
Marking
± 0.3
+0.15
- 0.05
Dimensions are shown in millimeters Tolerance: x.x = ± 0.2 mm (unless otherwise specified)
+0.15
-0.05
Marking Information
Part Number Marking
SOT-23-5
PACKAGE OUTLINE
Printed in the USA
© 1999 Toko, Inc. All Rights Reserved
TOKO AMERICA REGIONAL OFFICES
Toko America, Inc. Headquarters 1250 Feehanville Drive, Mount Prospect, Illinois 60056 Tel: (847) 297-0070 Fax: (847) 699-7864
IC-216-TKxxxxx
0798O0.0K
Visit our Internet site at http://www.tokoam.com
The information furnished by TOKO, Inc. is believed to be accurate and reliable. However, TOKO reserves the right to make changes or improvements in the design, specification or manufacture of its products without further notice. TOKO does not assume any liability arising from the application or use of any product or circuit described herein, nor for any infringements of patents or other rights of third parties which may result from the use of its products. No license is granted by implication or otherwise under any patent or patent rights of TOKO, Inc.
Western Regional Office Toko America, Inc. 2480 North First Street , Suite 260 San Jose, CA 95131 Tel: (408) 432-8281 Fax: (408) 943-9790
Midwest Regional Office Toko America, Inc. 1250 Feehanville Drive Mount Prospect, IL 60056 Tel: (847) 297-0070 Fax: (847) 699-7864
Eastern Regional Office Toko America, Inc. 107 Mill Plain Road Danbury, CT 06811 Tel: (203) 748-6871 Fax: (203) 797-1223
Semiconductor Technical Support Toko Design Center 4755 Forge Road Colorado Springs, CO 80907 Tel: (719) 528-2200 Fax: (719) 528-2375
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