Termin als K1, K2 and A correspond to the alternative
line designators of T, R and G or A, B and C. The
negative protection voltage is controlled by the
voltage, V
applied to the G terminal.
GG,
G1,G2
SD6XAP
description
PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
The TISP61089AS is a dual forward-conducting buffered p-gate overvoltage protector. It is designed to
protect ringing SLICs (Subscr iber L ine Interface Circu its) agains t overvoltages on the tel ephone line cause d
by lightning, a.c. power contact and induction. The TISP61089AS limits voltages that exceed the SLIC supply
rail voltage. The TISP61089AS parameters ar e specified to allow equipm ent compliance with Bel lcore GR1089-CORE, Issue 1.
The SLIC line driver section is typically powered from 0 V (ground) and a negative voltage in the region of
-10 V to -100 V. The protector gate is connected to this negative supply. This references the protection
(clipping) voltage to the nega tive supply voltage. As the prote ction voltage will then track the negative supply
voltage the overvoltage stress on the SLIC is minimised.
Positive over voltages are clipp ed to ground by diode forward conduction. Ne gative overvoltages are initially
clipped close to the SLIC negative supply rail value. If sufficient current is available from the overvoltage, then
the protector will c rowbar in to a l ow voltage on-state cond ition. As the overvoltage sub side s the hi gh hol ding
current of the crowbar prevents d.c. latchup.
The TISP61089AS is inten ded to be used with a series combinati on of a 25Ω or higher re sistance and a
suitable overcurrent protector. Power fault compliance requires the serie s overcurrent element to open- cir cuit
or become high impedance (see Applications Information). For equipment compliant to ITU-T
recommendations K20 or K21 only, the series resistor value is set by the power cross requirements. For K20
and K21, a minimum series resistor value of 10Ω is recommended.
These monolithic prote ction devices are fabricated in ion-implanted planar vertic al power structures for high
reliability and in nor mal system operation they are virtually transparent. The TISP61089AS buffered gate
design reduces the loading on the SLIC supply during overvoltages caused by power cross and induction.
The TISP61089AS is the TISP61089AD with a different pinout. The feed-through Ring (leads 4 — 5) and Tip
(leads 1 — 8) connection s have been replaced by single Ring (lead 4) and Tip (lead 1) connections. This
increases package creepage distance of the biased to ground co nnec ti ons fr om abou t 0.7 mm to over 3 mm.
This increased spacing eases the design task of compliance with various safety standards, such as UL 1950.
absolute maximum ratings
RATINGSYMBOLVALUEUNIT
≤
Repetitive peak off-state voltage, I
Repetitive peak gate-cathode voltage, V
Non-repetitive peak on-state pulse current (see Notes 1 and 2)
1.2/50 µs (Bellcore GR-1089-COR E, Issue 1, November 1994, Section 4, Alternative)100
2/10 µs (Bellcore GR-1089-CORE, Issue 1, November 1994, Section 4)120
Non-repetitive peak on-state current, V
100 ms11
1s
5s
300 s
900 s
Non-repetitive peak gate current, 1/2 µs pulse, cathodes commoned (see Notes 1 and 2)I
Operating free-air temperature rangeT
Junction temperatureT
Storage temperature rangeT
= 0, -40°C≤T
G
= 0, -40°C≤T
KA
= -80 V, 50Hz to 60 Hz (see Notes 1 and 2)
GG
85°CV
J
≤
85°CV
J
DRM
GKRM
I
TSP
I
TSM
GSM
A
J
stg
-120V
-120V
30
40
4.8
2.7
0.95
0.92
40A
-40 to +85°C
-40 to +150°C
-65 to +150°C
A
A
NOTES: 1. Initially the protector must be in thermal equilibrium with -40 °C≤T
its initial conditions.
2. The rated current values may be applied either to the Ring to Ground or to the Tip to Ground terminal pa irs. Additionally, both
terminal pairs may have their rated current values applied simultaneously (in this case the Ground terminal current will be twice the
rated current value of an individual terminal pair). Above 25 °C ambient temperature, derate linearly at -0.6 %/°C. Current values
for other times and gate voltages are shown in Figure 2.
PRODUCT INFORMATION
2
≤
85 °C. The surge may be repeated af ter the device returns to
J
Page 3
DUAL FORWARD-CONDUCTING P-GATE THYRISTORS
PROGRAMMABLE OVERVOLTAGE PROTECTORS
recommended operating conditions
Gate decoupling capacitor100220nF
C
G
TISP61089AS series resistor for first-level and second-level surge survival
R
S
TISP61089AS series resistor for first-level surge survival
Figure 2. NON-REPETITIVE PEAK ON-STATE CURRENT AGAINST DURATION
APPLICATIONS INFORMATION
gated protectors
This section covers three topics. Firstly, it is explained why gated protectors ar e n eed ed. S econd, the voltage
limiting action of the protector is described. Third, an example application circuit is described.
purpose of gated protectors
Fixed voltage thyristor overvoltage protectors have been used since the early 1980s to protect monol ithic
SLICs (Subscriber Line Interface Circuits) against overvoltages on the telephone line caused by lightning, a.c.
power contact and induction. As the SLIC was usually powered from a fixed voltage negative supply rail, the
limiting voltage of the protector could als o be a fixed value. The TISP1072F3 is a typical example of a fixed
voltage SLIC protector.
SLICs have become more sophisticated. To minimise power consumption, some designs automatically adjust
the supply voltage, V
, to a value that is just sufficient to drive the requir ed line curre nt. For shor t lines th e
BAT
supply voltage would be set low, but for long lines, a higher supply voltage would be generated to drive
sufficient line curre nt. The optimum protection for this type of SLIC would be given by a protection voltage
which tracks the SLIC supply voltage. This can be achieved by connecting the protection thyristor ga te to th e
SLIC supply, Figure 3. This gated (programmable) protection arrangement mi nimises the voltage stress on
the SLIC, no matter what value of supply voltage.
In the mid-1990s ring ing SLICs were intr oduced. These inte grated the ringing fuction by using the SLIC li ne
driver stage as a differential power amplifie r. Operatin g on negative supply voltages down to -75 V, these
ringing SLICs produced ring voltage levels sufficient for short loop applications (e.g. ISDN terminal adaptors).
With an -85 V rating, the TISP61089 was used to protect these SLICs. The need for higher ringing voltage
levels has led to the introduction of ringing SLICs with supply voltages approaching -100 V (e.g. the
Am79R241). To protect this new class of ringing SLIC, the -120 V rated TISP61089A has been developed.
operation of gated protectors
Figures 4. and 5. show how the TISP61089AS limits negative and positive overvoltages. Positive o vervoltages
(Figure 5) are cli pped by the antiparall el diodes in the TISP61089 AS and the resulting cu rrent is diver ted to
ground. Negative overvoltages (Figure 4.) are initially c lipped close to the SLIC negative supply rail value
(V
). If sufficient current i s available from the overvoltage, then the protector (Th5) wil l crowbar into a low
BAT
voltage on-state conditio n. As the overvoltage subsi des th e high holding curren t of the crowbar prevents d.c.
latchup. The protection voltage will be th e sum of the gate s upply (V
(V
). The protection voltage wi ll be increased if the re i s a l ong c on nec tio n bet ween th e gate d ec oup li ng
GK(BO)
capacitor, C1, and the gate terminal. During the in iti al rise of a fast impulse, the gate cur rent ( I
as the cathode current (I
). Rates of 70 A/µs can cause inductive voltages of 0.7 V in 2.5 cm of printed wiring
K
) and the peak gate-cathode voltage
BAT
) is the same
G
track. To minimise this inductive voltage increase of protection voltage, the length of the capacit or to gate
terminal tracking should be minimised. Inductive voltages in the protector cathode wiring will also increase the
protection voltage. These voltages can be minimised by routing the line to SLIC connection via the protector.
In Figure 6, the positive gate charge (Q
used, increased the gate supply by about 1 V (= Q
volt age, V
. This increase does not directly add to the protection voltage as the supply voltage change
BAT
) is about 0.1 µC which, with the 0.1 µF gate decoupling capacitor
GS
/C1). This change is just visible on the -72 V gate
GS
reaches a maximum at 0.4 µs when the gate current reverses polarity ; wher eas the pro tectio n voltage peaks
at 0.3 µs. In Figure 6, the peak cl ampin g voltage (V
) is -77.5 V, an increase o f 5.5 V on the nomin al ga te
(BO)
supply voltage. This 5.5 V increase is the sum of the supply rail increase at that time, (0.5 V), and the
protection circuits cathode diode to supply rail br eakover voltage (5 V). In practice, use of the r ecommend ed
220 nF gate decoupling capacitor would give a supply rail increase of 0.25 V and a V
Figure 7 shows a typic al TISP61 089AS S LIC card p rotectio n circuit. The incom ing lin e conductor s, Ring (R)
and Tip (T), connect to the r elay m atrix via the series overcurrent protection. Fusible resistors, fus es and
positive temperature coeffici ent (PTC) resis tors ca n be used for overcurrent protection. R esistors wi ll reduce
the prospective current fr om the surge generator for both the TISP61089AS a nd the r ing/test p rotector. The
TISP7xxxF3 protector has the sam e pr otection voltage for any ter mina l pair. This protector i s used when t he
ring generator configuration may be ground or battery-backed. For dedicated ground-backed ringing
generators, the TISP3xxxF3 gives better protection as its inter-conductor protection voltage is twice the
conductor to ground value.
TIP
WIRE
RING
WIRE
OVER-
CURRENT
PROTECTION
R1a
R1b
RING/TEST
PROTECTION
Th1
Th3
Th2
TISP7xxxF3/H3
FOR Th1 & Th2
ONLY USE A
TISP3xxxF3/H3
TEST
RELAY
S1a
S1b
TEST
EQUIP-
MENT
RING
RELAY
S2a
S2b
RING
GENERATOR
SLIC
RELAY
S3a
S3b
SLIC
PROTECTOR
Th4
Th5
TISP
61089AS
C1
220 nF
SLIC
V
BAT
AI6XCBA
Figure 7. TYPICAL APPLICATION CIRCUIT
Relay contacts 3a and 3b connect the line conductors to the SLIC via the TISP61089AS protector. The
protector gate reference voltage comes from the SLIC negative supply (V
). A 220 nF gate capacitor
BAT
sources the high gate current pulses caused by fast rising impulses.
LSSGR 1089
GR-1089-CORE, “1089”, covers electromagnetic compatibility and electrical safety generic criteria for US
network telecommunica tion equipment. It is a module in Volume 3 of LSSGR (LATA (Local Ac cess Transport
Area) Switching Sy stems G ener ic Requ irements, FR- NWT-000064 ). In 1 089 s urge and power fault immunity
tests are done at two levels. After first-level testing the equipment shall not be damaged and shall continue to
operate correctly. Under second level testing the equipment shall not become a safety hazard. The equipment
is permitted to fail as a result of second-level testing. When the equipment is to be located on customer
premises, second-level testing incl udes a wiri ng simulator test, whic h requires the equ ipment to reduce t he
power fault current below certain values.
The following clauses reference the 1089 section and calculate the protector stress levels. The TISP61089AS
is specified for use with a 40Ω series resistor. This resis tor value wil l en su re tha t the TISP61089AS survives
second level surge testing. Values down to 25Ω may be used if some second level surge failure is
acceptable. All the tabulated values are for a ser i es r esis tan ce of 40Ω. Peak current values for a 25Ω series
resistor are covered in the clause text.
PRODUCT INFORMATION
8
Page 9
TISP61089AS
DUAL FORWARD-CONDUCTING P-GATE THYRISTORS
PROGRAMMABLE OVERVOLTAGE PROTECTORS
OCTOBER 1999
The values of protector curr ent are calc ulated from t he open circ uit generator voltage div ided by the su m of
the total circuit resistance. The total circuit resistance is the sum of the generator fictive source resistance and
the TISP61089AS ser ies resistor value. Most generators have multiple outputs an d each output connec ts to
an individual line conductor. For those generators that have a single output, each conductor will have an
effective generator fictive source resista nce of n time s the g enerator fi ctive source res istance, wh ere n is the
number of conductors simultaneously tested.
The two most significant test wave shapes in this section are the high energy 10/1000 and the high current
2/10. As shown in table 1, the peak currents for these surges are 2x20 A and 2x56 A respectively. The
protector must sur vive the 2x20 A 10/1000 surge and the TIS P61089AS will do this as its rating is 2x30 A.
When both conductors are surged simultaneously the return (anode) current will be 40 A, again the
TISP61089AS will su rvive this as its rating for this condition wi ll be 60 A. Similar ly the TISP61089AS will
survive the 2x56 A 2/10 as its rating is 2x120 A.
The highest protectio n voltage will b e for the 56 A 2/10 wave shape. Under this condition the average rate of
current rise will be 56/2 = 28 A/µs. The value of diode and thyristor voltage under this condition is specified in
the electrical characteristics.
Compared to TR-NWT-0010 89, Issue 1, October 1 991, GR- 1089-CORE, Issue 1, November 1994, adds th e
alternative of using the IEEE C62.41 1.2/50-8/20 combination wave generator for the 2/10 test. This generator
usually has a sin gle ou tput and a fic tive resista nce of 2Ω. The 2/10 generator has a fictive output res ista nce
5Ω, (2500/500), and GR-1089-CORE compensates for this by adding an extra 3Ω in the output of the 1.2/508/20 generator. In practice, the extra 3Ω causes the prospective short-circuit current wave shape to be similar
to the 1.2/50 open-circuit voltage wave shape. The TISP61089AS will sur vive the 2x53 A 1.2/50 as its rating
is 2x100 A.
VOLTAGE
V
25003604 + 3472x53
SHORT-CIRCUIT
CURRENT
A
GENERATOR
FICTIVE
SOURCE
RESISTANCE
Ω
TOTAL CIRCUIT
RESISTANCE
Ω
I
T
A
Using a 25Ω series resistor will result in table 1. I
TISP61089AS will survive these peak current values as they are lower than the TISP61089AS ratings.
This is a 2/10 wave shape test. As shown in table 2, the peak current for this surge is 2x100 A. The
TISP61089AS will survive the 2x100 A 2/10 surge as its rating is 2x120 A.
column values of 2x83, 2x78 , 2x 29, 2x 19 a nd 2x 29. Th e
Under this conditio n the average rate of current r ise w ill be 100 /2 = 50 A/µs. The value of diode and thyristor
voltage under this condition is specified in the electrical characteristics.
Compared to TR-NWT-001 089, Issue 1 , Octobe r 1991, GR- 1089-CORE , Issue 1, November 1994, adds t he
alternative of using the IEEE C62.41 1.2/50-8/20 combination wave generator for the 2/10 test. The 2/10
generator has a fictive output resistance 10Ω, (5000/500), and GR-1089-CORE compensates for this by
adding an extra 8Ω in the output of the 1.2/50-8/20 generator. In practice, the extra 8Ω causes the
prospective shor t-cir cuit curr ent wave shape to be similar to the 1.2/ 50 open- circuit voltage wave shape. The
TISP61089AS will survive the 2x96 A 1.2/50 as its rating is 2x100 A.
Using a 25Ω series resistor will result in ta ble 2. I
may fail at these peak current values as they are higher than the TISP61089AS ratings.
These tests use a 2/10 wave shape. As shown in table 3, the peak currents for this test are 2x27 A and 17 A.
The TISP61089AS can survive both these levels as its rating is 2x120 A.
OPEN-CIRCUIT
VOLTAGE
V
50004204 + 8/conductor522x96
SHORT-CIRCUIT
CURRENT
A
column values of 2x143 and 2x 135. The TISP61089AS
T
GENERATOR
FICTIVE
SOURCE
RESISTANCE
Ω
TOT AL
CIRCUIT
RESISTANCE
Ω
I
T
A
table 3. intra-building surge currents
OPEN-CIRCUIT
WAVE SHAPE
2/10150010015552x27
1.2/50, 8/20
(See Text)
Compared to TR-NWT-001089, Issue 1, October 1991, GR-1089-CORE , Issue 1, November 1994, the 2/10
alternative of using a CCITT Recommendation K.22 1.2/50-8/20 combination wave generator has been
changed to an IEEE C 62.41 1.2/50-8/20 gen erator. This generator usually has a singl e output and a fictive
resistance of 2Ω. The 2/10 generator has fictive output resistances of 15Ω and 8Ω. GR-1089-CORE
compensates for this by adding an extra resistances of 12Ω and 6Ω in the output of the 1.2/50-8/20
generator. In practice, this extra resistance causes the pros pective shor t-circuit current wave shape to be
similar to the 1.2/50 open -ci rcui t voltage wave shape. The TISP61089AS will survive the 2x27 A 1.2/50 as its
rating is 2x100 A.
VOLTAGE
V
80010084817
1500944 + 12/conduc-
8001002 + 64817
SHORT-CIRCUIT
CURRENT
A
GENERATOR
FICTIVE
SOURCE
RESISTANCE
Ω
tor
TOTAL CIRCUIT
RESISTANCE
Ω
562x27
I
T
A
PRODUCT INFORMATION
10
Page 11
TISP61089AS
DUAL FORWARD-CONDUCTING P-GATE THYRISTORS
PROGRAMMABLE OVERVOLTAGE PROTECTORS
OCTOBER 1999
Using a 25Ω series resistor will result in table 3. IT column values of 2x38, 24, 2x37 and 24. The
TISP61089AS will survive these peak current values as they are lower than the TISP61089AS ratings.
GR-1089-CORE section 4.5.12 - first-level power fault testing
The most significant tests are a long duration (900 s) medium current test and a higher current tests of 60 one
second power applications. As shown in table 4, the peak current s for these tests are 2x0. 37 A and 2x1.3 A
respectively. At a g ate voltage of -8 0 V, the TISP61089AS wi ll su rvive both these con di tio ns as it s rat ing s are
2x0.92 A and 2x4.8 A for these time periods
Using a 25Ω series resistor will result in table 4. I
2x0.23. The TISP610 89AS will sur vive these pe ak current values as th ey are lower than the TISP6108 9AS
ratings.
GR-1089-CORE section 4.5.13 - second-level power fault testing
The two most significant tests are a long duration (900 s) medium current test and a higher current 5 s test. .
OPEN-CIRCUIT
RMS VOLTAGE
V
SHORT-CIRCUIT
RMS CURRENT
A
SOURCE
RESISTANCE
Ω
column values of 2x0.45, 2x0.9, 2x1.4, 2x1.4, 2x0.4 and
As shown in table 5, the peak currents for these tests are 2x17 A and 2x7.7 A respectively. For the
TISP61089AS to survive the 2x7.7 A, the series current limiting element must operate within 0.3 s. At
2x17.7 A, the series current limiting element must operate within 0.01 s.
Using a 25Ω series resistor will result in table 5. I
and 2x2.9. The TISP61089AS will probably fail for a peak current level of 2x24 A and the series current
limiting element must operate in under 0.01 s to prevent exceeding the TISP61089AS package limit. For
2x7.7 A, the series current limiting element must operate within 0.3 s for TISP61089AS survival.
GR-1089-CORE section 4.5.15 - second-level power fault testing with wiring simulator
The purpose of this test is to en sure that the telep hone cable does not become a hazard due to excessive
current. A seri es fuse, typ e MDQ 1-6/10A, si mulates the safe current levels of a telepho ne cable. If this fuse
opens the equipment fails the test. For the equipment to pass, the equipment series overcurrent element must
reduce the curren t to below the MDQ 1-6 /10A fusing level to prevent the simulator operating. The a .c. test
voltage can range from zero to 60 0 V, which gives a maximum conducto r curren t of 10 A. Table 6 shows the
simulator fusing times for three current levels.
column values of 2x24, 2x7.7, 2x5.7, 2x11, 2x0.47, 2x1.4
TM
table 6. second-level power fault currents with MDQ 1-6/10A fuse
Using a 25Ω series resis tor will result in table 6. I
operating times will be ∞, 12 s and 0.4 s respectively
For the equipment to pass this test, the TISP61089AS series current limiting element must operate before the
MDQ 1-6/10A fusing times shown in table 7.
column values of 2x3.1, 2x 9.4 and 2x19. Simulator
TM
table 7. operating times of MDQ 1-6/10A fuse
TIME TO
OPERATE
s
0.217
0.512
19
57
106.8
10002.5
I
RMS
A
PRODUCT INFORMATION
12
Page 13
TISP61089AS
DUAL FORWARD-CONDUCTING P-GATE THYRISTORS
PROGRAMMABLE OVERVOLTAGE PROTECTORS
OCTOBER 1999
overcurrent protection
To meet ‘1089, the overcurrent protection must be coordinated with the requirements of sections 4.5.7, 4.5.8,
4.5.9, 4.5.12, 4.5.13, 4.5.15 and the TISP61089AS. The overcurrent protection must not fail in the first level
tests of sections 4.5.7, 4.5.9 and 4.5.12. Recoverable overcurrent protectors (e.g. Positive Temperature
Coefficient Resistors) may operate during fi rst level testing, but normal equipment working must be resto red
after the test has ended. The test current levels and their duration are shown in Figure 8. First level tests have
a high source resistance and the current levels are not strongly dependent on the TISP61089AS series
resistor value.
Second level tests have a low source resistance and the current levels are dependent on the TISP6108 9AS
series resis tor value. The two stepped lines at the top of Fig ure 8 are for the 25Ω and 40Ω series resistor
cases. If the full current-time duration s occur the equipment will fail the wiring simulator test. The MDQ 1-6/
10A fusing characteri stic is also shown in Figure 8. The TISP61089AS ser ies overcurrent protection must
operate before the MDQ 1-6/10 A fus es, so th is r ep rese nts a noth er bo und ary condi tio n in the s el ect ion o f th e
overcurrent protector.
MAXIMUM RMS CURRENT
vs
30
20
10
TIME
Second Level Tests - 25
7
5
3
2
Second Level Tests - 40
MDQ 1-6/10A Fuse
AI6XAKA
ΩΩΩΩ
ΩΩΩΩ
1
0.7
0.5
Maximum RMS Current - A
0.3
0.2
0.1
0.010.11101001000
Time - s
First Level Tests - 25 & 40
ΩΩΩΩ
Figure 8. ‘1089 MAXIMUM TEST CURRENT LEVEL
Figure 9 summaris es these boundar y condition s. The highest current levels that can flow are influe nced by
the TISP61089AS ser ies r esistance. Af ter one sec ond the maximum cu rrent-tim e boundary becomes set by
the MDQ 1-6/10A fusing characteristic. Fusible overcurrent protectors cannot operate at first level current
levels.
Figure 9 shows two other cur ves. One is the TISP61089AS rated curre nt at gate voltage of -100 V and the
other for a gate voltage of -60 V. The overcurrent protector sh ould not allow current-time durations greater
than this otherwise the TISP61089AS may fail.
The TISP61089AS a.c. ratings are worse case values when the device is mounted on high thermal resistance
EIA/JESD 51 PCB. Typical PCBs would give a 25% increase in the rated currents for periods above 0.1 s.
This small-outline package c onsists of a circuit mounted on a lead frame and encapsulated withi n a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
D008
6,20 (0.244)
5,80 (0.228)
1,75 (0.069)
1,35 (0.053)
4,00 (0.157)
3,81 (0.150)
8
1
7° NOM
3 Places
5,00 (0.197)
4,80 (0.189)
765
432
0,50 (0.020)
0,25 (0.010)
x 45°NOM
Designation per JEDEC Std 30:
PDSO-G8
5,21 (0.205)
4,60 (0.181)
0,203 (0.008)
0,102 (0.004)
0,79 (0.031)
0,28 (0.011)
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
NOTES: A. Leads are within 0,25 (0.010) radius of true position at maximum material condition.
B. Body dimensions do not include mold flash or protrusion.
C. Mold flash or protrusion shall not exceed 0,15 (0.006).
D. Lead tips to be planar within ±0,051 (0.002).
Power Innovations Limited (PI) re se rves the r ig ht t o make chan g es t o it s pr od uc ts o r t o di sc ont inu e any s em ic o nduc t or p r o duct
or service without notice, and advises its customers to verify, before placing orders, that the information being relied on is
current.
PI warrants perfor mance of its semiconductor products to the specifications applicable at the time of sale in accordance with
PI's standard w arr anty. Testing and other quality control tec hn iqu es are utilized to th e extent PI deems necessary to support this
warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government
requirements.
PI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents
or services described herein. Nor is any license, either express or implied, granted under any patent right, copyright, design
right, or other intellectual property right of PI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used.
PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORISED, OR WARRANTED TO BE SUITABLE
FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.