Datasheet TEA 1623P, TEA1623PH Datasheet (Philips)

Page 1

DatasheetArchive.com

Request For Quotation

Order the parts you need from our real-time inventory database. Simply complete a request for quotation form with your part information and a sales representative will respond to you with price and availability.

Request For Quotation

Your free datasheet starts on the next page.

More datasheets and data books are available from our homepage: http://www.datasheetarchive.com

This datasheet has been downloaded from http://www.datasheetarchive.com.

Page 2

TEA1623P; TEA1623PH

STARplug

Rev. 01 — 17 March 2004 Product data sheet

1. General description

The TEA1623P; TEA1623PH is a Switched Mode Power Supply (SMPS) controller IC that operates directly from the rectiﬁed universal mains. It is implemented in the high voltage EZ-HV™ SOI process, combined with a low voltage BICMOS process.

The device includes a high voltage power switch and a circuit for start-up directly from the rectiﬁed mains voltage. A dedicated circuit for valley switching is built in, which makes a very efﬁcient slim-line electronic power-plug concept possible.

In its most basic version of application, the TEA1623P; TEA1623PH acts as a voltage source. Here, no additional secondary electronics are required. A combined voltage and current source can be realized with minimum costs for external components. Implementation of the TEA1623P; TEA1623PH renders an efﬁcient and low cost power supply system.

2. Features

■ Designed for general purpose supplies

■ Integrated power switch: 6.5 Ω and 650 V

■ Operates from universal AC mains supplies: 80 V to 276 V

■ Adjustable frequency for ﬂexible design

■ RC oscillator for load insensitive regulation loop constant

■ Valley switching for minimum switch-on loss

■ Frequency reduction at low power output for low standby power: <100 mW

■ Adjustable overcurrent protection

■ Undervoltage protection

■ Temperature protection

■ Short winding protection

■ Safe restart mode for system fault conditions

■ Simple application with both primary and secondary (opto) feedback

■ Available in 8-pin and 16-pin DIP package.

3. Applications

■ Adapters ■ VCD

■ Set-Top Box (STB) ■ CD(R)

■ DVD ■ PC Silverbox standby SMPS.

Page 3

Philips Semiconductors

4. Quick reference data

Table 1: Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

CC(max)

DRAIN(max)

DRAIN

DSon

osc

amb

5. Ordering information

TEA1623P; TEA1623PH

STARplug

maximum supply voltage - - 40 V maximum voltage at pin

DRAIN supply current drawn from

pin DRAIN drain-source on-state

resistance

oscillator frequency range 10 - 200 kHz ambient temperature −20 - +85 °C

Tj>0°C - - 650 V

no auxiliary supply - 0.5 - mA

SOURCE

= −0.5 A

=25°C - 6.5 7.5 Ω

= 100 °C - 9.0 10.0 Ω

Table 2: Ordering information

Type number Package

Name Description Version

TEA1623P DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 TEA1623PH DIP16 plastic dual in-line package; 16 leads (300 mil);

SOT38-1

long body

Product data sheet Rev. 01 — 17 March 2004 2 of 18

Page 4

Philips Semiconductors

6. Block diagram

TEA1623P; TEA1623PH

STARplug

GND

REG

stop

OSCILLATOR

low frequency

2.5 V

1.8 U

10x

TEA1623P

PWM

THERMAL

SHUTDOWN

POWER-UP

RESET

SUPPLY

LOGIC

PROTECTION

LOGIC

overcurrent

short winding

VALLEY

blank

100 mV

0.5 V

DRAIN

n.c.

SOURCE

AUX

0.75 V

col011

Fig 1. Block diagram of TEA1623P.

Product data sheet Rev. 01 — 17 March 2004 3 of 18

Page 5

Philips Semiconductors

TEA1623P; TEA1623PH

STARplug

GND

REG

SGND

stop

OSCILLATOR

low frequency

2.5 V

1.8 U

10x

TEA1623PH

PWM

THERMAL

SHUTDOWN

POWER-UP

RESET

SUPPLY

LOGIC

PROTECTION

LOGIC

overcurrent

short winding

VALLEY

blank

0.75 V

100 mV

0.5 V

1, 2, 7, 9,

10, 13,

15, 16

DRAIN

n.c.

SOURCE

AUX

col013

Fig 2. Block diagram of TEA1623PH.

7. Pinning information

7.1 Pinning

n.c. n.c.

GND n.c.

2 3 4

TEA1623P

001aaa310

RC SOURCE

REG AUX

8 7 6 5

DRAIN

GND n.c.

RC SOURCE

REG AUX

n.c. n.c.

SGND n.c.

TEA1623PH

5 6 7 8

001aaa312

a. DIP8 package. b. DIP16 package.

Fig 3. Pin conﬁguration.

Product data sheet Rev. 01 — 17 March 2004 4 of 18

16 15 14 13 12 11 10

DRAIN

Page 6

Philips Semiconductors

7.2 Pin description

Table 3: Pin description

Symbol Pin Description

GND 2 4 ground RC 3 5 frequency setting REG 4 6 regulation input SGND - 8 signal ground; must preferably be connected to pin GND AUX 5 11 input for voltage from auxiliary winding for timing

SOURCE 6 12 source of internal MOS switch n.c. 7 1,2, 7, 9, 10,

DRAIN 8 14 drain of internal MOS switch; input for start-up current

TEA1623P; TEA1623PH

TEA1623P TEA1623PH

1 3 supply voltage

(demagnetization)

not connected

13, 15, 16

and valley sensing

STARplug

8. Functional description

The TEA1623P; TEA1623PH is the heart of a compact ﬂyback converter, with the IC placed at the primary side. The auxiliary winding of the transformer can be used for indirect feedbackto control the isolated output. This additional winding also powers the IC. A more accurate control of the output voltage and/or current can be implemented with an additional secondary sensing circuit and optocoupler feedback.

The TEA1623P; TEA1623PH uses voltage mode control. The frequency is determined by the maximum transformer demagnetizing time and the time of the oscillator. In the ﬁrst case, the converter operates in the Self Oscillating Power Supply (SOPS) mode. In the latter case, it operates at a constant frequency, which can be adjusted with external components RRC and CRC. This mode is called Pulse Width Modulation (PWM). Furthermore, a primary stroke is started only in a valley of the secondary ringing. This valley switching principle minimizes capacitive switch-on losses.

8.1 Start-up and undervoltage lock-out

Initially, the IC is self supplying from the rectiﬁed mains voltage. The IC starts switching as soon as the voltage on pin VCCpasses the V auxiliary winding of the transformer as soon as VCC is high enough and the supply from the line is stopped for high efﬁciency operation.

As soon as the voltage on pin VCC drops below the V and restarts from the rectiﬁed mains voltage.

CC(start)

level. The supply is taken over by the

level, the IC stops switching

CC(stop)

8.2 Oscillator

The frequency of the oscillator is set by the external resistor and capacitor on pin RC. The external capacitor is charged rapidly to the V stroke, it discharges to the V

level. Because the discharge is exponential, the

RC(min)

RC(max)

relative sensitivity of the duty factor to the regulation voltage at low duty factor is almost

Product data sheet Rev. 01 — 17 March 2004 5 of 18

leveland, starting from a new primary

Page 7

Philips Semiconductors

equal to the sensitivity at high duty factors. This results in a more constant gain over the duty factor range compared to PWM systems with a linear sawtooth oscillator. Stable operation at low duty factors is easily realized. For high efﬁciency, the frequency is reduced as soon as the duty factor drops below a certain value. This is accomplished by increasing the oscillator charge time.

To ensure that the capacitor can be charged within the charge time, the value of the oscillator capacitor should be limited to approximately 1 nF.

8.3 Duty factor control

The duty factor is controlled by the internal regulation voltage and the oscillator signal on pin RC. The internal regulation voltage is equal to the external regulation voltage (minus

2.5 V) multiplied by the gain of the error ampliﬁer (typical 20 dB or 10 ×). The minimum duty factor of the switched mode power supply is 0 %. The maximum duty

factor is set to 75 % (typical value at 100 kHz oscillation frequency).

8.4 Valley switching

TEA1623P; TEA1623PH

STARplug

A new cycle is started at the primary stroke when the switch is switched on (see Figure 4). After a certain time (determined by the RC oscillator voltage and the internal regulation level), the switch is turned off and the secondary stroke starts. The internal regulation level is determined by the voltage on pin REG. After the secondary stroke, the drain voltage shows an oscillation with a frequency of approximately

Where:

Lp is the primary self inductance on the drain node Cp is the parasitic capacitance on the drain node.

As soon as the oscillator voltage is high again and the secondary stroke has ended, the circuit waits for a low drain voltage before starting a new primary stroke.

The primary stroke starts some time before the actual valley at low ringing frequencies, and some time after the actual valley at high ringing frequencies. Figure 5 shows a typical curve for a reﬂected voltage N × Vo of 80 V. This voltage is the output voltage Vo (see

Figure 6) transferred to the primary side of the transformer with the factor N (determined

by the turns ratio of the transformer). Figure 5 shows that the system switches exactly at minimum drain voltage for ringing frequencies of 480 kHz, thus reducing the switch-on losses to a minimum. At 200 kHz, the next primary stroke is started at 33° before the valley. The switch-on losses are still reduced signiﬁcantly.

------------------------------

2π LpC

Product data sheet Rev. 01 — 17 March 2004 6 of 18

Page 8

Philips Semiconductors

TEA1623P; TEA1623PH

STARplug

primary

stroke

drain

valley

secondary

stroke

oscillator

regulation level

A: Start of new cycle with valley switching. B: Start of new cycle in a classical PWM system.

Fig 4. Signals for valley switching.

secondary

stroke

secondary

ringing

col007

phase

(°)

−20

−40

0 800600200 400

Reﬂected voltage at N × Vo=80V.

Fig 5. Typical phase of drain ringing at switch-on.

001aaa311

f (kHz)

Product data sheet Rev. 01 — 17 March 2004 7 of 18

Page 9

Philips Semiconductors

8.5 Demagnetization

The system operates in discontinuous conduction mode all the time. As long as the secondary stroke has not ended, the oscillator will not start a new primary stroke. During the suppression time t may be necessary in applications where the transformer has a large leakage inductance and at low output voltages.

8.6 Protections

8.6.1 Overcurrent protection

The cycle-by-cycle peak drain current limit circuit uses the external source resistor RI(see

Figure 6) to measure the current. The circuit is activated after the leading edge blanking

time t

leb

primary peak current.

8.6.2 Short winding protection

The short winding protection circuit is also activated after the leading edge blanking time. If the source voltage exceeds the short winding protection voltage V TEA1623PH stops switching. Only a power-on reset will restart normal operation. The short winding protection also protects in case of a secondary diode short circuit.

TEA1623P; TEA1623PH

, demagnetization recognition is suppressed. This suppression

suppr

. The protection circuit limits the source voltage to V

source(max)

STARplug

, and thus limits the

, the TEA1623P;

swp

8.6.3 Overtemperature protection

An accurate temperature protection is provided in the TEA1623P; TEA1623PH. When the junction temperature exceeds the thermal shutdown temperature, the IC stops switching. During thermal protection, the IC current is lowered to the start-up current. The IC continues normal operation as soon as the overtemperature situation has disappeared.

8.6.4 Overvoltage protection

Overvoltage protection can be achieved in the application by pulling pin REG above its normal operation level, or by keeping the level of pin AUX above V primary stroke is terminated immediately, and no new primary stroke is started until the voltage on pin REG drops to its normal operation level. Pin REG has an internal clamp. The current feed into pin REG must be limited.

8.7 Characteristics of the complete power-plug

8.7.1 Input

The input voltage range comprises the universal AC mains from 80 V to 276 V.

8.7.2 Accuracy

The accuracy of the complete converter, functioning as a voltage source with primary sensing, is approximately 8 % (mainly dependent on the transformer coupling). The accuracy with secondary sensing is deﬁned by the accuracy of the external components. For safety requirements in case of optocoupler feedback loss, the primary sensing remains active when an overvoltage circuit is connected.

. The current

demag

Product data sheet Rev. 01 — 17 March 2004 8 of 18

Page 10

Philips Semiconductors

8.7.3 Efﬁciency

An efﬁciency of 75 % at maximum output power can be achievedfor a complete converter designed for universal mains.

8.7.4 Ripple

A minimum ripple is obtained in a system designed for a maximum duty factor of 50 % under normal operating conditions, and a minimized dead time. The magnitude of the ripple in the output voltage is determined by the frequency and duty factor of the converter, the output current level, and the value and ESR of the output capacitor.

9. Limiting values

Table 4: Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Voltages

SOURCE

DRAIN

Currents

REG

AUX

SOURCE

DRAIN

General

tot

stg

amb

esd

TEA1623P; TEA1623PH

STARplug

supply voltage continuous oscillator input voltage DMOS power transistor source

voltage DMOS power transistor drain

voltage

regulation input current auxiliary winding input current oscillator capacitor charge

current source current −2+2A drain current −2+2A

total power dissipation

TEA1623P T TEA1623PH T

<45°C - 1.0 W

amb

<50°C - 1.7 W

amb

storage temperature −55 +150 °C ambient temperature −20 +85 °C junction temperature −20 +145 °C electrostatic discharge voltage human body model

pin DRAIN −1500 +1500 V all other pins −2000 +2000 V

machine model

all pins −200 +200 V

[1]

−0.4 +40 V

[1]

−0.4 +3 V

−0.4 +5 V

−0.4 +650 V

[2]

-6mA

[2]

−10 +5 mA

−3- mA

[3]

[4]

[1] Pins VCC and RC are not allowed to be current driven. [2] Pins REG and AUX are not allowed to be voltage driven. [3] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.

Product data sheet Rev. 01 — 17 March 2004 9 of 18

Page 11

Philips Semiconductors

[4] Machine model: equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 Ω series

resistor.

10. Thermal characteristics

Table 5: Thermal characteristics

Symbol Parameter Conditions Typ Unit

th(j-a)

thermal resistance from junction to ambient

TEA1623P 100 K/W TEA1623PH 55 K/W

TEA1623P; TEA1623PH

in free air

STARplug

[1]

[1] Thermal resistance R

printed-circuit board. See the TEA152x application notes for details.

can be lower when pin GND is connected to sufﬁcient copper area on the

th(j-a)

11. Characteristics

Table 6: Characteristics

=25°C; no overtemperature; all voltages are measured with respect to ground; currents are positive when ﬂowing into

amb

the IC; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Supplies

Supply on pin V

CC(start)

CC(stop)

CC(operate)

CC(startup)

CC(ch)

Supply on pin DRAIN

DRAIN

Pulse width modulator mode

min

max

Self oscillating power supply mode

demag

suppr

Oscillator: pin RC

RC(min)

RC(max)

start voltage 9 9.5 10 V stop voltage undervoltage lock-out 7.0 7.5 8.0 V operating supply current normal operation - 1.3 1.9 mA start-up supply current start-up - 180 400 µA charging current V

>60V

DRAIN

=0V −650 −520 −390 µA

= 8.5 V −375 −275 −175 µA

supply current drawn from pin DRAIN no auxiliary supply - 0.5 - mA

with auxiliary supply;

>60V

DRAIN

- 30 125 µA

minimum duty factor - 0 - % maximum duty factor f

demagnetization recognition voltage

= 100 kHz - 75 - %

osc

50 100 150 mV

level time of suppression of transformer

1.0 1.5 2.0 µs

ringing at start of secondary stroke

minimum voltage of RC oscillator

60 75 90 mV

setting maximum voltage of RC oscillator

2.4 2.5 2.6 V

setting

Product data sheet Rev. 01 — 17 March 2004 10 of 18

Page 12

Philips Semiconductors

TEA1623P; TEA1623PH

STARplug

Table 6: Characteristics

=25°C; no overtemperature; all voltages are measured with respect to ground; currents are positive when ﬂowing into

amb

…continued

the IC; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

RC(ch)

osc

RC charging time - 1 - µs oscillator frequency range 10 - 200 kHz

Duty factor regulator: pin REG

REG

V(erroramp)

REG(clamp)

input voltage on pin REG 2.4 2.5 2.6 V voltage gain of error ampliﬁer - 20 - dB clamping voltage on pin REG I

= 6 mA - - 7.5 V

REG

Valley switching recognition

dV/dt

valley

d(valley-on)

valley recognition −102 - +102 V/µs ringing frequency for valley switching N × Vo= 100 V 200 550 800 kHz delay from valley recognition to

- 150 - ns

switch-on

Output stage (FET)

L(drain)

BR(drain)

DSon

drain(f)

drain leakage current V drain breakdown voltage Tj>0°C 650 - - V drain-source on-state resistance I

drain fall time V

= 650 V - - 125 µA

DRAIN

SOURCE

= −0.5 A

=25°C - 6.5 7.5 Ω

= 100 °C - 9.0 10.0 Ω

DRAIN(switch_on)

= 300 V;

-75-ns no external capacitor at pin DRAIN

Temperature protection

prot(max)

prot(hys)

maximum threshold temperature 150 160 170 °C threshold temperature hysteresis - 2 - °C

Overcurrent and short winding protection: pin SOURCE

source(max)

swp

d(propagation)

overcurrent protection voltage dV/dt = 0.1 V/µs 0.47 0.50 0.53 V short winding protection voltage dV/dt = 0.5 V/µs 0.7 0.75 0.8 V delay from detecting V

source(max)

dV/dt = 0.5 V/µs - 160 185 ns

switch-off

leb

leading edge blanking time both overcurrent and short

250 350 450 ns

winding protection

Product data sheet Rev. 01 — 17 March 2004 11 of 18

Page 13

Philips Semiconductors

12. Application information

TEA1623P; TEA1623PH

STARplug

CF1

mains

CF2

VCC

GND

REG

Further application information can be found in the TEA152x application notes.

Fig 6. Application with primary sensing for TEA1623P.

13. Test information

TEA1623P

DRAIN

n.c.

SOURCE

AUX

Z1 D1

C6 - Ycap

AUX

col012

13.1 Quality information

The

General Quality Speciﬁcation for Integrated Circuits, SNW-FQ-611

Product data sheet Rev. 01 — 17 March 2004 12 of 18

is applicable.

Page 14

Philips Semiconductors

14. Package outline

TEA1623P; TEA1623PH

STARplug

DIP8: plastic dual in-line package; 8 leads (300 mil)

seating plane

pin 1 index

w M

SOT97-1

(e )

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

min.

max.

050G01 MO-001 SC-504-8

1.73

1.14

0.068

0.021

0.045

0.015

IEC JEDEC JEITA

OUTLINE VERSION

SOT97-1

max.

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

0.53

0.38

0 5 10 mm

scale

1.07

0.89

0.042

0.035

0.36

0.23

0.014

0.009

REFERENCES

(1) (1)

cD E e M

9.8

9.2

0.39

0.36

6.48

6.20

0.26

0.24

3.60

3.05

0.14

0.12

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

10.0

0.39

0.33

8.3

max.

0.2542.54 7.62

1.154.2 0.51 3.2

0.010.1 0.3

0.0450.17 0.02 0.13

ISSUE DATE

99-12-27 03-02-13

(1)

Fig 7. Package outline DIP8.

Product data sheet Rev. 01 — 17 March 2004 13 of 18

Page 15

Philips Semiconductors

TEA1623P; TEA1623PH

STARplug

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

seating plane

pin 1 index

w M

SOT38-1

(e )

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

OUTLINE VERSION

SOT38-1

max.

4.7 0.51 3.7

1 2

min.

max.

1.40

1.14

0.055

0.15

0.045

IEC JEDEC JEITA

050G09 MO-001 SC-503-16

0.53

0.38

0.021

0.015

cEe M

0.32

0.23

0.013

0.009

REFERENCES

21.8

21.4

0.86

0.84

scale

(1) (1)

6.48

6.20

0.26

0.24

0.3

3.9

3.4

EUROPEAN

PROJECTION

8.25

7.80

0.32

0.31

9.5

8.3

0.37

0.33

0.15

0.13

max.

0.2542.54 7.62

0.087

0.010.10.020.19

ISSUE DATE

99-12-27 03-02-13

2.2

(1)

Fig 8. Package outline DIP16.

Product data sheet Rev. 01 — 17 March 2004 14 of 18

Page 16

Philips Semiconductors

15. Soldering

15.1 Introduction to soldering through-hole mount packages

This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our (document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board.

15.2 Soldering by dipping or by solder wave

Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

The total contact time of successive solder waves must not exceed 5 seconds.

TEA1623P; TEA1623PH

STARplug

Data Handbook IC26; Integrated Circuit Packages

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the speciﬁed maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

15.3 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm aboveit. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

15.4 Package related soldering information

Table 7: Suitability of through-hole mount IC packages for dipping and wave soldering

methods

Package Soldering method

Dipping Wave

DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable

[2]

PMFP

[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit

board.

[2] For PMFP packages hot bar soldering or manual soldering is suitable.

− not suitable

stg(max)

[1]

). If the

Product data sheet Rev. 01 — 17 March 2004 15 of 18

Page 17

Philips Semiconductors

TEA1623P; TEA1623PH

STARplug

16. Revision history

Table 8: Revision history

Document ID Release date Data sheet status Change notice Order number Supersedes

TEA1623P_TEA1623PH_1 20040317 Product data - 9397 750 12579 -

Product data sheet Rev. 01 — 17 March 2004 16 of 18

Page 18

Philips Semiconductors

17. Data sheet status

TEA1623P; TEA1623PH

STARplug

Level Data sheet status

I Objective data Development This data sheet contains data from the objective speciﬁcation for product development. Philips

II Preliminary data Qualiﬁcation This data sheet contains data fromthepreliminary speciﬁcation. Supplementary data will be published

III Product data Production This data sheet contains data from the product speciﬁcation. Philips Semiconductors reserves the

[1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.

[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

[1]

Product status

18. Deﬁnitions

Short-form speciﬁcation — The data in a short-form speciﬁcation is

extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values deﬁnition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the speciﬁed use without further testing or modiﬁcation.

[2] [3]

Deﬁnition

Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in order to improve the design and supply the best possible product.

right to make changes at any time in order to improve the design, manufacturing and supply.Relevant changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, andmakes no representations or warrantiesthat these products are free from patent, copyright,ormaskwork right infringement, unless otherwise speciﬁed.

20. Trademarks

19. Disclaimers

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors

STARplug —is a trademark of Koninklijke Philips Electronics N.V. EZ-HV — is a trademark of Koninklijke Philips Electronics N.V.

21. Contact information

For additional information, please visit: http://www.semiconductors.philips.com For sales ofﬁce addresses, send an email to: sales.addresses@www.semiconductors.philips.com

Product data sheet Rev. 01 — 17 March 2004 17 of 18

Page 19

Philips Semiconductors

22. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5

8 Functional description . . . . . . . . . . . . . . . . . . . 5

8.1 Start-up and undervoltage lock-out . . . . . . . . . 5

8.2 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

8.3 Duty factor control. . . . . . . . . . . . . . . . . . . . . . . 6

8.4 Valley switching. . . . . . . . . . . . . . . . . . . . . . . . . 6

8.5 Demagnetization. . . . . . . . . . . . . . . . . . . . . . . . 8

8.6 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

8.6.1 Overcurrent protection . . . . . . . . . . . . . . . . . . . 8

8.6.2 Short winding protection. . . . . . . . . . . . . . . . . . 8

8.6.3 Overtemperature protection . . . . . . . . . . . . . . . 8

8.6.4 Overvoltage protection . . . . . . . . . . . . . . . . . . . 8

8.7 Characteristics of the complete power-plug . . . 8

8.7.1 Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

8.7.2 Accuracy. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

8.7.3 Efﬁciency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

8.7.4 Ripple . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9

10 Thermal characteristics. . . . . . . . . . . . . . . . . . 10

11 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 10

12 Application information. . . . . . . . . . . . . . . . . . 12

13 Test information . . . . . . . . . . . . . . . . . . . . . . . . 12

13.1 Quality information . . . . . . . . . . . . . . . . . . . . . 12

14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13

15 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

15.1 Introduction to soldering through-hole mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

15.2 Soldering by dipping or by solder wave . . . . . 15

15.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 15

15.4 Package related soldering information . . . . . . 15

16 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16

17 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 17

18 Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

19 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

20 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

21 Contact information . . . . . . . . . . . . . . . . . . . . 17

TEA1623P; TEA1623PH

STARplug

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Published in The Netherlands

Date of release: 17 March 2004

Document order number: 9397 750 12579

Datasheet TEA 1623P, TEA1623PH Datasheet (Philips)

Specifications and Main Features

Frequently Asked Questions

User Manual

1. General description

2. Features

3. Applications

4. Quick reference data

5. Ordering information

6. Block diagram

7. Pinning information

7.1 Pinning

7.2 Pin description

8. Functional description

8.1 Start-up and undervoltage lock-out

8.2 Oscillator

8.3 Duty factor control

8.4 Valley switching

8.5 Demagnetization

8.6 Protections

8.7 Characteristics of the complete power-plug

9. Limiting values

10. Thermal characteristics

11. Characteristics

12. Application information

13. Test information

13.1 Quality information

14. Package outline

15. Soldering

15.1 Introduction to soldering through-hole mount packages

15.2 Soldering by dipping or by solder wave

15.3 Manual soldering

15.4 Package related soldering information

16. Revision history

17. Data sheet status

20. Trademarks

19. Disclaimers

21. Contact information

22. Contents