Dual Dolby* B-type noise reduction
circuit for playback applications
Preliminary specification
Supersedes data of July 1993
File under Integrated Circuits, IC01
1996 Jun 07
Page 2
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
for playback applications
FEATURES
• Dual noise reduction (NR) channels
• Head pre-amplifiers
• Reverse head switching
• Automatic Music Search (AMS)
• Music scan
• Equalization with electronically switched time constants
• Dolby reference level = 387.5 mV
• 24 pins
• Improved EMC behaviour.
GENERAL DESCRIPTION
The TEA0675 is a bipolar integrated circuit that provides
two channels of Dolby B noise reduction for playback
applications in car radios. It includes head and
equalization amplifiers with electronically switchable time
constants. Furthermore it includes electronically
switchable inputs for tape drivers with reverse heads.
This device also detects pauses of music in the Automatic
Music Search (AMS) scan mode, for applications with an
intelligent controlled tape driver, or AMS-latch mode, for
applications with a simple controlled tape driver. For both
modes, the delay time can be fixed externally by a resistor.
The device operates with power supplies in the range of
7.6 to 12 V, output overload level increasing with increase
in supply voltage.
Current drain varies with the following variables:
Because of this current drain variation it is advisable to use
a regulated power supply or a supply with a long time
constant.
TEA0675
supply voltage
noise reduction on/off
AMS on/off.
QUICK REFERENCE DATA
SYMBOLPARAMETERMIN.TYP.MAX.UNIT
V
CC
I
CC
SN+
-------------N
ORDERING INFORMATION
TYPE
NUMBER
TEA0675SDIP24
TEA0675TSO24plastic small outline package; 24 leads; body width 7.5 mmSOT137-1
Remark Dolby*: Available only to licensees of Dolby Laboratories Licensing Corporation, San Francisco, CA94111,
USA, from whom licensing and application information must be obtained. Dolby is a registered trade-mark of Dolby
Laboratories Licensing Corporation.
supply voltage7.6−12V
supply current−2631mA
signal plus noise-to-noise ratio7884−dB
Dual Dolby* B-type noise reduction circuit
for playback applications
BLOCK DIAGRAM
pF
470
10
µF
27
kΩ
21
input
headswitch
10 µF
180 Ω
pF
470
PRE
1 kΩ
TEA0675
AMP.
POWER
TEA0675
MED621
pF
470
µF
100
pF
470
PRE
AMP.
SUPPL Y
CC
V
10 µF
180 Ω
1 kΩ
handbook, full pagewidth
AMS
330
output
kΩ
EQ
NR
4.7
15
100
330
70
120
10
nF
nF
nF
nF
nF
kΩ
8.2
µs
18
kΩ
µs
24
kΩ
kΩ
1.5
OFFON
kΩ
180
270 kΩ
EQ
AMP.
LOGIC
AMS
PROCESSOR
TIME
DELA Y
DOLBY B
242322212019181716151413
RISE TIME
LATCH AND
LEVEL
DETECTOR
EQ
AMP.
DOLBY B
7891011 12
270 kΩ
123456
kΩ
8.2
t
R
24
kΩ
kΩ
1.5
kΩ
180
100
330
10
nF
kΩ
330
nF
4.7
(1)
OFFON
AMS
15
nF
nF
nF
Fig.1 Block and application diagram.
for AMS-scan mode.
CC
10 µF
output B
1996 Jun 073
10 µF
output A
(1) Switched to V
Page 4
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
for playback applications
PINNING
SYMBOLPINDESCRIPTION
OUTA1output channel A
INTA2integrating filter channel A
CONTRA3control voltage channel A
HPA4high-pass filter channel A
SCA5side chain channel A
TD6delay time constant
EQA7equalizing output channel A
EQFA8equalizing input channel A
V
CC
INA110input channel A1 (forward or reverse)
V
ref
INA212input channel A2 (reverse or forward)
INB213input channel B2 (reverse or forward)
HS14head switch input
INB115input channel B1 (forward or reverse)
GND16ground
EQFB17equalizing input channel B
EQB18equalizing output channel B
AMSEQ19AMS output and EQ switch input
SCB20side chain channel B
HPB21high-pass filter channel B
CONTRB22control voltage channel B
INTB23integrating filter channel B
OUTB24output channel B
9supply voltage
11reference voltage
handbook, halfpage
OUTA
1
INTA
2
CONTRA
HPA
SCA
TD
EQA
EQFA
V
CC
INA1
V
ref
INA2
3
4
5
6
7
8
9
10
11
12
TEA0675
Fig.2 Pin configuration.
MED622
TEA0675
OUTB
24
INTB
23
CONTRB
22
HPB
21
SCB
20
19
AMSEQ
EQB
18
17
EQFB
GND
16
INB1
15
HS
14
INB2
13
1996 Jun 074
Page 5
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
for playback applications
FUNCTIONAL DESCRIPTION
Noise Reduction (NR) is enabled when pin HPB is
open-circuit and disabled when connected to GND via an
1.5 kΩ resistor.
Dolby B noise reduction only operates correctly if 0 dB
Dolby level is adjusted at 387.5 mV.
Automatic Music Search (AMS) scan mode is enabled
when pin HPA is connected to VCC via an 1.5 kΩ resistor
and disabled when pin HPA is open-circuit. Switching AMS
on, internally NR is switched OFF simultaneously
(see Figs 5 and 6 for principle timing in AMS-scan mode).
AMS-latch mode is enabled when pin HPA is connected
to GND via an 1.5 kΩ resistor and disabled when pin HPA
is open-circuit. Switching AMS on, NR is switched off
internally. In this mode the device detects a pause level
signal, when a music level signal has appeared first
(see Figs 7 and 8 for principle timing). Furthermore a
longer rise time constant is supplied for suppressing the
detection of plops on tape. The output signal at pin
AMSEQ in this mode may be applied to drive a tape driver
logic circuit.
TEA0675
Equalization time constant switching (70 µs or 120 µs)
is achieved when pin AMSEQ is connected to GND via an
18 kΩ resistor (120 µs), or left open-circuit (70 µs).
This does not affect the AMS output signal during AMS
mode (see Fig.1).
Head switching is achieved when pin HS is connected
(input IN2 active) to GND via a 27 kΩ resistor, or left
open-circuit (input IN1 active). The 10 µF capacitor at pin
HS sets the time constants for smooth switching.
In AMS mode the signals of both channels are rectified and
then added. This means, even if one channel signal
appears inverted to the other channel, the normal AMS
function is ensured. Pins HPB and HPA perform the
function of a logic input for AMS, respectively NR mode
switching in both channels and provide the frequency
dependent feedback of the control chain amplifier in the
corresponding channel. Thus it is important that no voltage
is applied to pins HPB and HPA during NR on/AMS off
mode, otherwise this will cause irregular NR
characteristics.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
CC
V
i
t
short
T
stg
T
amb
V
es
supply voltage014V
input voltage (except pin 11)−0.3+V
pin 11 (V
) to VCC short-circuiting duration−5s
ref
CC
V
storage temperature−55+150°C
operating ambient temperature−40+85°C
electrostatic handling voltage for all pinsnote 1−2+2kV
note 2−500+500V
Notes
1. Human body model (1.5 kΩ, 100 pF).
2. Machine model (0 Ω, 200 pF).
1996 Jun 075
Page 6
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
TEA0675
for playback applications
CHARACTERISTICS
VCC= 10 V; f = 20 Hz to 20 kHz; T
pin OUTA or OUTB; see Fig.1; NR on/AMS off; EQ switch in the 70 µs position; unless otherwise specified.
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
CC
I
CC
α
m
supply voltage7.61012V
supply current−2631mA
channel matchingf = 1 kHz; Vo= 0 dB; NR off −0.5−+0.5dB
THDtotal harmonic distortion
(2nd and 3rd harmonic)
H
R
SN+
-------------N
headroom at outputVCC= 7.6 V; THD = 1%;
signal plus noise-to-noise
ratio
PSRRpower supply ripple
rejection
f
o
frequency response;
referenced to TP
α
cs
α
cc
channel separationVo= 10 dB; f = 1 kHz;
crosstalk between active
and inactive input
R
L
G
v
load resistance at outputAC-coupled; f = 1 kHz;
voltage gain of
pre-amplifier
V
I(offset)(DC)
I
i(bias)
R
EQ
R
i
DC input offset voltage−2−mV
input bias current−0.10.4µA
equalization resistor4.75.86.9kΩ
input resistance head
inputs
A
v
open-loop amplificationpin INA1 or
=25°C; all levels are referenced to 387.5 mV (RMS) (0 dB) at test point (TP)
amb
f = 1 kHz; V
f = 10 kHz; V
=0dB−0.080.15%
o
=10dB−0.150.3%
o
12−−dB
f = 1 kHz
internal gain 40 dB, linear;
7884−dB
CCIR/ARM weighted;
decode mode; see Fig.25
= 0.25 V; f = 1 kHz;
V
i(rms)
5257−dB
see Fig.22
encode mode; see Fig.25
= −25 dB; f = 0.2 kHz−22.9−24.4−25.9dB
V
o
= 0 dB; f = 1 kHz−1.50+1.5dB
V
o
= −25 dB; f=1kHz−17.8−19.3−20.8dB
V
o
= −25 dB; f=5kHz−18.1−19.6−21.1dB
V
o
= −35 dB; f = 10 kHz−24.4−25.9−27.4dB
V
o
5763−dB
see Fig.23
f = 1 kHz; Vo= 10 dB;
7077−dB
NR off; see Fig.23
10−−kΩ
Vo= 12 dB; THD = 1%
from pin INA1 or INA2 to
293031dB
pin EQFA and from
pin INB1 or
INB2 to pin EQFB;
f = 1 kHz
60100−kΩ
INA2 to pin EQA and
pin INB1 or INB2 to
pin EQB
f = 10 kHz8086−dB
f = 400 Hz104110−dB
1996 Jun 076
Page 7
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
TEA0675
for playback applications
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
− V
ref
I
O
Z
o
V
no(rms)
V
TD
EMCDC offset voltage at
Switching thresholds
V
NROFF
I
NROFF
I
NRON
V
HPB(max)
HPA (PIN 4)
V
AMSlON
I
AMSlON
V
AMSsON
I
AMSsON
I
AMSOFF
V
HPA(max)
AMSEQ (PIN 19)
DC output offset voltage
OUT
at pins OUTA and OUTB
NR off; pins INA1, INA2,
INB1 and INB2 connected
to V
AMS-scan mode2610ms
AMS-latch mode130150170ms
AMS mode; f = 10 kHz;
note 2; see Fig.24
music to pause
1996 Jun 077
−25−22−19dB
Page 8
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
TEA0675
for playback applications
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
A
P/M
EQ switch input (not AMS mode)
I
EQ70
I
EQ120
I
EQth
HEAD SWITCHING
V
HSW
I
HSW
V
HSW(HIGH)
V
HSW(LOW)
Notes
1. In AMS off mode, pin AMSEQ is HIGH level, the equalization time constant will be switched by pulling approximately
200 µA out of pin AMSEQ. This means for the device connected to pin AMSEQ, a restriction of input current at HIGH
level less than 200 µA during AMS off; otherwise the selection of the equalization time constant is disabled and fixed
at 120 µs. If the connected devices consume more than 200 µA, this input has to be disconnected in AMS off mode.
(To ensure switching, the currents for the different switched modes are specified with a tolerance of ±50 µA in
Chapter “Characteristics”.) For an application with a fixed EQ time constant of 120 µs the equalizing network may be
applied completely external. Change 8.2 kΩ resistor to 14 kΩ the internal resistor REQ= 5.8 kΩ is short-circuited by
fixing the EQ switch input at the 70 µs position (I
2. The high speed of the tape (FF, REW) at the tape head during AMS mode causes a transformation of level and
frequency of the originally recorded signal. It means a boost of signal level of approximately 10 dB and more for
recorded frequencies from 500 Hz up to 4 kHz. So the threshold level of −22 dB corresponds to signal levels in Play
Back (PB) mode of approximately −32 dB. The AMS inputs for each channel are pin SCA and pin SCB. As the
frequency spectrum is transformed by a factor of approximately 10 to 30 due to the higher tape speed in FF, REW,
the high-pass filter (4.7 nF/24 kΩ) removes the effect of offset voltages but does not affect the music search function.
In the application circuit (Fig.1) the frequency response of the system between tape heads input, e.g. pins INA2 and
INB2, to the AMS input pins SCA and SCB is constant over the whole frequency range (see Fig.3).
3. To activate the inputs IN1, pin HS might be left open-circuit. In this event the DC level at pin HS is 0.775VCC.
signal level at output for
AMS mode; f = 10 kHz;−24−21−18dB
AMS switching
pause to music
with a gradient of 400 V/s at maximum to avoid plops on tape in the event of contact
CC
between tape and tape head while switching off.
DELAY TIME t
TYP. (ms)
TEA0675
d
TOLERANCE
(%)
−20
handbook, full pagewidth
(dB)
−30
−40
−50
−60
2
10
(1) AMS threshold level for application circuit (Fig.1).
(2) AMS threshold level for test circuit (Fig.24).
(1)
(2)
3
10
Fig.3 AMS threshold level.
MED623
4
10
(Hz)
5
10
1996 Jun 079
Page 10
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
for playback applications
Short description ‘music search’
A system for ‘music search’ mainly consists of a level and
a time detection (see Fig.4). For adapting and decoupling
the input signal will be amplified (A), then rectified (B) and
smoothed with a time constant (C). So the voltage at (C)
corresponds to the signal level and will be compared to the
predefined pause level at the first comparator (D), the level
detector. If the signal level becomes smaller than the
pause level, the level detector changes its output signal.
Due to the output level of the level detector the capacitor
of the second time constant (E) will be charged,
handbook, full pagewidth
INPUT
(A)
(B)
(C)
COMPARATOR 1COMPARATOR 2
V
I
t
1
TEA0675
respectively discharged. If the pause level of the input
signal remains for a certain time, the voltage at the
capacitor reaches a certain value, which corresponds to
an equivalent time value. The voltage at the capacitor will
be compared to a predefined time-equivalent voltage by
the second comparator (F), the time detector. If the pause
level of the input signal remains for this predefined time,
the time detector changes its output level for ‘pause found’
status.
(D)
(E)(F)
V
t
t
2
OUTPUT
AMPLIFIERRECTIFIER
LEVEL DETECTORTIME DETECTOR
MED624
Fig.4 Integrated ‘music search’ function.
1996 Jun 0710
Page 11
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
TEA0675
for playback applications
Description of the principle timing diagram for AMS-scan mode without initial input signal (see Fig.5)
tr: rise time
handbook, full pagewidth
td: delay time
tb: burst time
tp: pause time
tf: fall time
level threshold
upper threshold
(hysteresis)
time threshold
V
V
REF
V
V
in
l
t
AMS on
t
r
t
d
t
f
tb<t
r
tp<t
d
Vl: voltage at
level detector
input
pin 3 (CONTRA)
Vt: voltage at
time detector
input
pin 22 (CONTRB)
t
t
V
AMSEQ
4.5 V
output signal
to microprocessor
t
0
t3t
4t5t6
Fig.5 AMS-scan mode without initial input signal.
By activating AMS-scan mode, the AMS output level
directly indicates whether the input level corresponds to a
pause level (V
= LOW) or not (V
AMSEQ
AMSEQ
= HIGH).
At t0 the AMS-scan mode is activated. Without a signal at
Vin, the following initial procedure runs until the AMS
output changes to LOW level: due to no signal at Vin the
voltage at the level detector input VI (pin 3, CONTRA)
remains below the level threshold and the second time
constant will be discharged (time detector input Vt).
When Vt passes the time threshold level, the time detector
output changes to LOW level. Now the initial procedure is
completed.
If a signal burst appears at t3, the level detector input
voltage rises immediately and causes its output to charge
the second time constant, which supplies the input voltage
Vt for the time detector. When Vt passes the upper
t
t
t
t8t9t
7
10
t11t12t13t
14t15
MED625
threshold level after the rise time tr (at t4), the AMS output
changes to HIGH. If the signal burst ends at t5 the level
detector input VI falls to its LOW level. When passing the
level threshold at t6, the discharging of the second time
constant begins. Now the circuit measures the delay time
td, which is externally fixed by a resistor and defines the
length of a pause to be detected. If no signal appears at V
within the time interval td, the time detector output switches
the AMS output to LOW level at t7.
If a plop noise pulse appears at Vin (t8) with a pulse width
less than the rise time tr>tb, the plop noise will not be
detected as music. The AMS output remains LOW.
Similarly the system handles ‘no music pulses’ tp: when
music appears at t11 with a small interruption at t13, this
interruption will not affect the AMS output for tp<td.
in
1996 Jun 0711
Page 12
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
TEA0675
for playback applications
Description of the principle timing diagram for AMS-scan mode with initial input signal (see Fig.6)
tr: rise time
handbook, full pagewidth
td: delay time
tb: burst time
tp: pause time
tf: fall time
level threshold
upper threshold
(hysteresis)
time threshold
V
V
REF
V
V
in
l
t
AMS on
t
d
t
f
tb<t
r
tp<t
r
Vl: voltage at
level detector
input
pin 3 (CONTRA)
Vt: voltage at
time detector
input
pin 22 (CONTRB)
t
t
V
AMSEQ
4.5 V
output signal
to microprocessor
t0t
t5t
1
t
6
7
t8t9t
10
Fig.6 AMS-scan mode with initial input signal.
At t0 the AMS-scan mode is activated. With an input signal
at Vin, the following initial procedure runs until the circuit
gets a steady state status.
Due to the signal at Vin the voltage at the level detector
input VI (pin 3, CONTRA) slides to a value which is defined
by a limiter. This voltage causes the level detector output
charging the second time constant (time detector input Vt)
t
t
t11t12t13t
t
15
14
MED626
to its maximum voltage level at t1. Now the initial
procedure is completed.
The following behaviour does not differ from the
description in Section “Description of the principle timing
diagram for AMS-scan mode without initial input signal
(see Fig.5)”.
1996 Jun 0712
Page 13
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
TEA0675
for playback applications
Description of the principle timing diagram for AMS-latch mode without initial input signal (see Fig.7)
tr: rise time
handbook, full pagewidth
td: delay time
tb: burst time
tp: pause time
tf: fall time
level threshold
upper threshold
(hysteresis)
time threshold
V
V
REF
in
V
V
l
t
AMS on
t
r
t
d
t
f
tb<t
r
tp<t
d
Vl: voltage at
level detector
input
pin 3 (CONTRA)
Vt: voltage at
time detector
input
pin 22 (CONTRB)
t
t
H
internal
latch status
output signal
to power FET
V
AMSEQ
4.5 V
L
t
0
t3t
4t5t6
t
Fig.7 AMS-latch mode without initial input signal.
This is similar to the description of the principle timing
diagram from AMS-scan mode. It only differs in its initial
behaviour and its rise time tr. (Please notice that the
different tr does not occur in the principle timing diagrams
for latch and scan mode).
Running in AMS-latch mode, the circuit may be simply
applied to drive a stop solenoid via a power FET. So the
AMS output signal has not to be processed by a controller.
Because there is no processor to make a decision whether
there is a plop noise or not, for this mode the rise time tr is
extended to approximately 150 ms.
By activating AMS-latch mode the AMS output will not
change to LOW level at t2 if there is no initial signal at Vin.
t
t
t
t8t9t
7
10
t11t12t13t
14t15
MED627
A latch forces the AMS output to be HIGH until a signal
appears at Vin (t4). After t4 the latch will not affect the
output any more until AMS-latch mode is started again.
The existence of the latch appears necessary if the AMS
output for example drives a stop solenoid via a power FET.
The LOW output level will cause a drive of the stop
solenoid. This would happen after a maximum time of t
occurred without any input signal. If there is no music on
tape for a long time (e.g. at tape end), the AMS mode
would be activated repeatedly as long as there is no signal
at Vin. Thus the circuit waits until first music appears before
detecting the pauses.
d
1996 Jun 0713
Page 14
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
TEA0675
for playback applications
Description of the principle timing diagram for AMS-latch mode with initial input signal (see Fig.8)
tr: rise time
handbook, full pagewidth
td: delay time
tb: burst time
tp: pause time
tf: fall time
level threshold
upper threshold
(hysteresis)
V
V
REF
V
V
in
l
t
AMS on
t
d
t
f
tb<t
r
tp<t
d
Vl: voltage at
level detector
input
pin 3 (CONTRA)
Vt: voltage at
time detector
input
pin 22 (CONTRB)
t
t
time threshold
H
internal
latch status
output signal
to power FET
V
AMSEQ
4.5 V
L
t0t
t5t
1
t
6
7
t8t9t
10
Fig.8 AMS-latch mode with initial input signal.
This is similar to the description in Section “Description of
the principle timing diagram for AMS-scan mode with initial
input signal (see Fig.6)”. It only differs in its rise time tr and
a release of its internal latch when voltage Vt passes the
upper threshold between t0 and t1. Now the initial
procedure is completed.
t
t
t
t11t12t13t
t
15
14
MED628
The following behaviour does not differ from the
description in Section “Description of the principle timing
diagram for AMS-latch mode without initial input signal
(see Fig.7)”.
1996 Jun 0714
Page 15
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
for playback applications
INTERNAL PIN CONFIGURATIONS
handbook, halfpage
+
65 Ω
1
5 V
65 Ω
MBH506
handbook, halfpage
TEA0675
2
V
±0.23 V
+
ref
Fig.9 Pins 1 and 24: output channel.
handbook, halfpage
MBH507
Fig.10 Pins 2 and 23: integrating filter.
3.4 kΩ1.2 kΩ
3.6 kΩ
3
5 V
+
handbook, halfpage
+
4
5 V
675 Ω
10 kΩ
+
MBH509
+
MBH508
Fig.11 Pins 3 and 22: control voltage.Fig.12 Pins 4 and 21: high-pass filter.
1996 Jun 0715
Page 16
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
for playback applications
handbook, halfpage
+
5
5 V
MBD510
handbook, halfpage
TEA0675
6
+
8 V
1 KΩ
MBH511
handbook, halfpage
Fig.13 Pins 5 and 20: side chain.
5.8 kΩ
7
5 V
MBH512
+
100 Ω
handbook, halfpage
Fig.14 Pin 6: delay time constant.
+
8
5 V
10 kΩ
1 pF
MBH513
Fig.15 Pins 7 and 18: equalizing output.
1996 Jun 0716
Fig.16 Pins 8 and 17: equalizing input.
Page 17
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
for playback applications
handbook, halfpage
9
10 V
MBH514
handbook, halfpage
TEA0675
10
5 V
+
220 Ω
100 kΩ
5 V
12 pF
MBH515
handbook, halfpage
Fig.17 Pin 9: supply voltage.
+
2.5 kΩ
5 V
11
2.5 kΩ
MBH516
Fig.18 Pins 10, 12, 13 and 15: input channel.
handbook, halfpage
14
8 V
+
MBH517
Fig.19 Pin 11: reference voltage.
1996 Jun 0717
Fig.20 Pin 14: head switch input.
Page 18
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
for playback applications
handbook, halfpage
+
19
4.6 V
MBH518
TEA0675
Fig.21 Pin 19: AMS output and EQ switch input.
1996 Jun 0718
Page 19
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
for playback applications
TEST AND APPLICATION INFORMATION
10
µF
27
kΩ
TEA0675
PRE
AMP.
POWER
SUPPL Y
PRE
TEA0675
MED629
µF
100
AMP.
= 10 V
CC
V
1000
µF
10 kΩ
1 kHz
100
nF
0.25 V RMS
dbook, full pagewidth
AMS
output
10
EQ
NR
4.7
15
100
330
10
µF
10
kΩ
EQ
70 µs
nF
nF
nF
nF
OFFON
18
24
1.5
180
AMP.
20 kΩ
kΩ
kΩ
kΩ
kΩ
DOLBY B
270 kΩ
242322212019181716151413
AMS
PROCESSOR
RISE TIME
LATCH AND
LOGIC
DELA Y
LEVEL
TIME
DETECTOR
EQ
AMP.
DOLBY B
7891011 12
56
1234
20 kΩ
R
24
1.5
15
180
270 kΩ
10
t
kΩ
kΩ
nF
kΩ
100
330
kΩ
ONOFF
nF
nF
4.7
(1)
nF
µF
Fig.22 Test circuit for power supply ripple rejection.
for AMS-scan mode.
CC
10 µF
output B
1996 Jun 0719
10 µF
output A
(1) Switched to V
Page 20
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
for playback applications
10
µF
27
kΩ
TEA0675
PRE
AMP.
POWER
SUPPL Y
PRE
TEA0675
MED630
µF
100
Ω
200
10
µF
AMP.
100
10 V
nF
handbook, full pagewidth
AMS
output
10
nF
nF
nF
µF
kΩ
nF
4.7
Fig.23 Test circuit for channel separation.
10
NR
µF
EQ
4.7
15
100
330
70 µs
nF
nF
nF
nF
ONOFF
10
18
24
1.5
180
kΩ
EQ
AMP.
20 kΩ
kΩ
kΩ
kΩ
kΩ
DOLBY B
270 kΩ
242322212019181716151413
AMS
PROCESSOR
RISE TIME
LATCH AND
LOGIC
DELA Y
LEVEL
TIME
DETECTOR
EQ
AMP.
DOLBY B
7891011 12
123456
20 kΩ
270 kΩ
t
R
24
kΩ
kΩ
180
10
15
100
330
10 µF
output B
1996 Jun 0720
10 µF
output A
Page 21
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
for playback applications
input
voltage
10
µF
27
kΩ
TEA0675
PRE
AMP.
POWER
SUPPL Y
PRE
TEA0675
MED631
µF
100
1112
AMP.
10 V
100
nF
andbook, full pagewidth
AMS
output
10
µF
10
kΩ
270 kΩ
20 kΩ
t
R
24
kΩ
kΩ
1.5
15
kΩ
180
100
330
10
kΩ
10
µF
nF
4.7
Fig.24 Test circuit for AMS threshold level.
(1)
nF
nF
nF
for AMS-scan mode.
CC
EQ
4.7
15
100
330
70 µs
nF
nF
nF
nF
18
24
1.5
180
EQ
AMP.
20 kΩ
kΩ
kΩ
kΩ
kΩ
DOLBY B
270 kΩ
242322212019181716151413
AMS
PROCESSOR
RISE TIME
LATCH AND
LOGIC
DELA Y
LEVEL
TIME
DETECTOR
EQ
AMP.
DOLBY B
78910
12345 6
10 µF
output B
1996 Jun 0721
10 µF
output A
(1) Switched to V
Page 22
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
for playback applications
10
µF
TEA0675
AMP.
POWER
SUPPL Y
V
CC
27
kΩ
i
V
10 µF
25 kΩ
−
25 kΩ
+
151413
PRE
PRE
TEA0675
MED632
µF
100
Ω
10 1112
AMP.
200
pF
470
10
µF
CC
V
i
V
10 V
nF
100
dbook, full pagewidth
AMS
output
EQ
TP
NR
15
100
330
10
70 µs
nF
nF
nF
µF
ON
OFF
10
18
4.7
24
1.5
180
kΩ
EQ
AMP.
20 kΩ
kΩ
nF
kΩ
kΩ
kΩ
DOLBY B
270 kΩ
242322212019181716
AMS
PROCESSOR
RISE TIME
LATCH AND
LOGIC
DELA Y
LEVEL
TIME
DETECTOR
EQ
AMP.
DOLBY B
789
123456
20 kΩ
24
AMS OFF
180
270 kΩ
10
t
R
kΩ
4.7
15
kΩ
100
330
nF
nF
nF
nF
kΩ
10
µF
TP
Fig.25 Test circuit for frequency response (channel B).
10 µF
Encode mode
output B
1996 Jun 0722
10 µF
output A
Decode mode: pre-amplifier 30 dB and EQ amplifier 10dB linear.
Page 23
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
for playback applications
470
pF
Ω
200
10 µF
27
kΩ
input
haed-switch
200
470
pF
Ω
PRE
TEA0675
AMP.
POWER
SUPPL Y
PRE
TEA0675
pF
470
Ω
200
µF
100
Ω
200
pF
= 10 V
CC
V
470
100
nF
AMP.
10 Ω
40 Ω
MBH497
10
10
µF
10
kΩ
EQ
AMP.
20 kΩ
24 kΩ
4.7 nF
15
nF
kΩ
180
100
330
nF
nF
270 kΩ
DOLBY B
242322212019181716151413
AMS
PROCESSOR
RISE TIME
LATCH AND
LOGIC
DELA Y
LEVEL
TIME
DETECTOR
EQ
AMP.
DOLBY B
7891011 12
123456
20 kΩ
t
R
270 kΩ
15
180
100
330
10
nF
kΩ
nF
nF
kΩ
4.7 nF
µF
handbook, full pagewidth
24 kΩ
Fig.26 EMC test circuit.
10 µF
output B
1996 Jun 0723
10 µF
output A
Decode mode: pre-amplifier 30 dB and EQ amplifier 10dB linear.
Page 24
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
for playback applications
LAYOUT OF PRINTED-CIRCUIT BOARD FOR EMC TEST CIRCUIT (FOR TEA0675T)
handbook, full pagewidth
52
63
TEA0675
Dimensions in mm.
10 kΩ
R
t
20 kΩ
10 kΩ
20 kΩ
24 kΩ
15 nF
100 nF
180 kΩ
270 kΩ
4.7 nF
4.7 nF
270 kΩ
180 kΩ
100 nF
15 nF
24 kΩ
40 Ω
470 pF
200 Ω
200 Ω
470 pF
0 Ω
0 Ω
10 Ω
0 Ω
0 Ω
470 pF
200 Ω
200 Ω
470 pF
27 kΩ
100 nF
TEA0675T
Fig.27 Top side with components.
100 nF
MBH460
1996 Jun 0724
Page 25
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
for playback applications
k, full pagewidth
63
52
TEA0675
Dimensions in mm.
10 µF
X3
MP
S1
100 µF
HFDR.
10 µF
330 nF
330 nF
10 µF
10 µF
100 µF
10 µF
Fig.28 Bottom side with components.
MP
MP
X4
X1
X2
MBH459
1996 Jun 0725
Page 26
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
for playback applications
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
mm
OUTLINE
VERSION
SOT234-1
max.
4.70.513.8
12
min.
max.
IEC JEDEC EIAJ
1.3
0.8
b
1
0.53
0.40
REFERENCES
0.32
0.23
cEeM
(1)(1)
D
22.3
21.4
9.1
8.7
E
12
(1)
L
3.2
2.8
EUROPEAN
PROJECTION
M
10.7
10.2
E
12.2
10.5
e
1
w
H
0.181.77810.16
ISSUE DATE
92-11-17
95-02-04
Z
max.
1.6
1996 Jun 0726
Page 27
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
for playback applications
SO24: plastic small outline package; 24 leads; body width 7.5 mm
D
c
y
Z
24
13
TEA0675
SOT137-1
E
H
E
A
X
v M
A
pin 1 index
1
e
0510 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
A
max.
2.65
0.10
A
1
0.30
0.10
0.012
0.004
A2A
2.45
2.25
0.096
0.089
0.25
0.01
b
3
p
0.49
0.32
0.36
0.23
0.019
0.013
0.014
0.009
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
(1)E(1)(1)
cD
15.6
15.2
0.61
0.60
12
w M
b
p
scale
eHELLpQ
7.6
1.27
7.4
0.30
0.050
0.29
10.65
10.00
0.42
0.39
A
1.4
0.055
Q
2
A
1
detail X
1.1
1.1
0.4
0.043
0.016
1.0
0.043
0.039
0.25
0.01
L
p
L
(A )
0.250.1
0.01
A
3
θ
ywvθ
Z
0.9
0.4
0.035
0.004
0.016
o
8
o
0
OUTLINE
VERSION
SOT137-1
IEC JEDEC EIAJ
075E05 MS-013AD
REFERENCES
1996 Jun 0727
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-24
Page 28
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
for playback applications
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
SDIP
OLDERING BY DIPPING OR BY WA VE
S
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
(order code 9398 652 90011).
). If the
stg max
TEA0675
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
AVE SOLDERING
W
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
EPAIRING SOLDERED JOINTS
R
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1996 Jun 0728
Page 29
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
TEA0675
for playback applications
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Jun 0729
Page 30
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
for playback applications
NOTES
TEA0675
1996 Jun 0730
Page 31
Philips SemiconductorsPreliminary specification
Dual Dolby* B-type noise reduction circuit
for playback applications
NOTES
TEA0675
1996 Jun 0731
Page 32
Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 708 296 8556
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 825 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands517021/50/04/pp32 Date of release: 1996 Jun 07Document order number: 9397 750 00898
Internet: http://www.semiconductors.philips.com/ps/
(1)ADDRESS CONTENT SOURCE August 6, 1996
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