Datasheet TEA1081T, TEA1081 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TEA1081

Supply circuit with power-down for
telephone set peripherals

Product specification
Supersedes data of February 1988
File under Integrated Circuits, IC03

Philips Semiconductors

September 1994

Philips Semiconductors Product specification

Supply circuit with power-down for

TEA1081

telephone set peripherals

FEATURES

• High input impedance for audio signals

• Low DC series resistance

• High output current

• Large audio signal handling capability

• Low distortion

• Two modes of operation:

– output voltage that follows the DC line voltage
– regulated output voltage

• Power-down input

• Low number of external components.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

LN

V

O

∆V

LN-O

R

S

I

O

operating DC line voltage 2.5 − 12.0 V
DC output voltage 2.0 − 10.0 V
voltage drop from line to output IO=0mA − 0.5 − V
internal series resistance − 20 −Ω
output current (pin 7) VLN=4V

TEA1081 −−30 mA
TEA1081T −−20 mA

V

LN(rms)

I

INT

T

amb

AC line voltage (RMS value) VLN=4V; IO=15mA;

internal supply current VLN=4V; IO= 0 mA;

operating ambient temperature −25 − +70 °C

GENERAL DESCRIPTION

The TEA1081 is an integrated circuit for use in
line-powered telephone sets to supply peripheral circuits
for extended dialling and/or loudspeaker facilities.

The IC uses a part of the surplus line current normally
drawn by the voltage regulator of the speech/transmission
circuit. A power-down function isolates the IC from its load
and reduces the input current.

− 1.5 − V

THD=2%

− 0.8 1.4 mA

PD = LOW; VSP= V

O

ORDERING INFORMATION

PACKAGE

TYPE NUMBER

NAME DESCRIPTION VERSION

TEA1081 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

TEA1081T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

September 1994 2

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

BLOCK DIAGRAM

handbook, full pagewidth

LN

IF

AD

VN

R

S

1

0.5 V

5

3

2

A1

A3

1/2 V

TR1

A2

O

TEA1081

TR2

POWER-

DOWN

REFERENCE

CURRENT

TEA1081

7

QS

8

SP

4

PD

6

VA

Fig.1 Block diagram.

PINNING

SYMBOL PIN DESCRIPTION

LN 1 positive line terminal
VN 2 negative line terminal
AD 3 amplifier decoupling
PD 4 power-down input
IF 5 low-pass filter input
VA 6 output voltage adjustment
QS 7 power supply output
SP 8 supply input; power-down circuit

MLC166

age

LN
VN
AD
PD

1
2
3
4

TEA1081

Fig.2 Pin configuration.

MLC167

8

SP

7

QS

6

VA

5

IF

September 1994 3

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

FUNCTIONAL DESCRIPTION

The TEA1081 is a supply interface between telephone line
and peripheral devices in the telephone set. The high input
impedance of the circuit allows direct connection to the
telephone line (via a diode bridge). An inductor function is
obtained by amplifier A1, resistor RS (see Fig.1) and an
external low-pass RC filter.

Under the control of amplifier A2, transistor TR1 supplies
peripheral devices and transistor TR2 minimizes line
signal distortion by momentarily diverting input current to
ground whenever the instantaneous value of the line
voltage drops below the output voltage.

Internal circuits are biased by a temperature and line
voltage compensated reference current source.

The power-down circuit isolates the supply circuit from
external circuitry.

Line terminals: LN and VN (pins 1 and 2)

The input terminals LN and VN can be connected directly
to the line. The minimum DC line voltage required at the
input is expressed by formula (1); see also Table 1.

V

LNI1RS

× V

LNminVLN P()

V()++=

Table 1 Explanation of formula (1).

SYMBOL DESCRIPTION

I

1

R
V

LNmin

S

input current
internal series resistance
minimum instantaneous line voltage

(1.4 V at IO = 5 mA)

V

LN(P)

The internal current (I

required peak level of AC line voltage

) at IO = 0 mA is typically 0.8 mA

INT

at VLN = 4 V and reaches a maximum of 1.4 mA at
VLN=12V.

(1)

TEA1081

The output voltage follows the line voltage and is
expressed by formula (2); see also Table 2.

V

V

O

LNI1RS

Table 2 Explanation of formula (2).

SYMBOL DESCRIPTION

V

LN

I

1

R

S

EGULATED OUTPUT VOLTAGE (SEE FIG.4)

R

line voltage
input current
internal series resistance

The circuit operates in this mode when an external resistor
(RV) is connected between QS and VA (see Fig.6).

The output voltage is held constant at VO = 2 × I6× RV (V)
as soon as the line voltage
VLN>(2×I6×RV+I1×RS+ 0.5) (V)

The control current I6 is typically 20 µA.

10

handbook, halfpage

V

O

(V)

8

6

4

2

0

010

2468

(2)

(1)

0.5+×()– V()=

MLC168

(3)

V (V)

LN

(2)

Supply terminals: QS and VA (pins 7 and 6)

Peripheral devices are supplied from QS (pin 7). Two
modes of output voltage regulation are available.

OUTPUT VOLTAGE FOLLOWS LINE VOLTAGE (SEE FIG.3)
The TEA1081 operates in this mode when there is no

external resistor (RV) between QS and VA (see Fig.6).

September 1994 4

Application without RV.
(1) I1 = 5 mA.
(2) I1 = 20 mA.
(3) I1 = 30 mA; not valid for TEA1081T.

Fig.3 Output voltage as a function of line voltage.

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

75 kΩ

50 kΩ

V (V)

MLC169

LN

handbook, halfpage

6

V

O

(V)

4

2

0

0

RV connected between QS and VA.
(1) I1 = 5 mA.
(2) I1 = 20 mA.
(3) I1 = 30 mA; not valid for TEA1081T.

(1)

(2)

(3)

210

468

R = 100 kΩ

V

Fig.4 Output voltage as a function of line voltage.

TEA1081

Input current at V
approximates to:

I1 = I

+2×IO (mA)

INT

The maximum supply current (within the specified output
current limits) available for peripheral devices is shown by:

I

Omax

-----------------------------------------------------------

I

LINEminILNmin

=

Where:

I

is the minimum line current of the telephone set;

LINEmin

I

is the specified minimum input current of the

LNmin

speech/transmission circuit.

Input low-pass filter: IF (pin 5)

The input impedance between LN and VN at audio
frequencies is determined by the filter elements C
(between pins 1 and 5), RL (between pins 5 and 7) and the
internal resistor RS(typical value 20 Ω).

At audio frequencies the TEA1081 behaves as an inductor
of the value LI= CL× RL× RS (H). The typical value of LI at
CL = 2.2 µF and RL = 100 kΩ is 4.4 H.

= 1 V and without R

LN(rms)

– I

–

INT

2

V

L

Input and output currents I1 and IO (pins 1 and 7)

The maximum available current into pin 1 (I

1

) is

determined by:

• The minimum line current (I

) that is available for

LINEmin

the telephone set

• The specified minimum input current (I

LNmin

) for the

speech/transmission circuit.
That is I
At V

LN(rms)

I1=I

INT

1max

= I

LINEmin

− I

LNmin

.

< 150 mV, the input current I1is approximately:

+k×IO (mA)

Where:

I

= internal supply current (0.8 mA at VLN= 4 V);

INT

k = correction factor (k < 1.1 for the specified output

current range).
With large line signals the instantaneous line voltage may

drop below VO+ 0.4 V. Normally (when VLN>VO+ 0.4 V),
instantaneous current flows from LN to QS (pin 1 to pin 7)
to the output load.

When VLN<VO+ 0.4 V, the instantaneous current is
diverted to pin 2 to prevent distortion of the line signal.

Amplifier decoupling: AD (pin 3)

To ensure stability, a 68 pF decoupling capacitor is
required between AD (pin 3) and LN (pin 1).

< 1.5 mA, a 47 pF capacitor has to be added

If I

Omin

between AD (pin 3) and VA (pin 6).

Power-down inputs: PD and SP (pins 4 and 8)

During pulse dialling or register recall, or if the input current
to pin 1 is insufficient to maintain the output current, the
supply to peripheral devices can be switched off by
activating the PD input at pin 4. With PD = HIGH, the input
current is reduced to 40 µA (typ.) at V

= 4 V and the

LN

internal circuits are isolated from the load at QS (pin 7).
The power-down circuit is supplied via the SP input (pin 8).

SP can be wired to QS in conditions where VO>V
during line interruptions. When VO<V

, SP should be

SPmin

SPmin

wired to an external supply point (e.g. to VCC of the
TEA1060 family circuit).

When power-down is not required, the PD and SP inputs
can be left open-circuit.

September 1994 5

Philips Semiconductors Product specification

Supply circuit with power-down for

TEA1081

telephone set peripherals

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

LN

V

LN(RM)

V

I

I

1

I

I

P

tot

T

amb

T

stg

T

j

positive line voltage continuous − 12 V

during switch-on or line interruptions − 12.5 V

repetitive peak line voltage for a

12 Ω resistor in series with pin 1 − 28 V

1 ms pulse per 5 s
input voltage (all other terminals) VVN− 0.5 VLN+ 0.5 V
DC input current

TEA1081 − 120 mA

TEA1081T − 80 mA
input current (all other terminals) −1+1mA
total power dissipation see Fig.5
operating ambient temperature −25 +70 °C
storage temperature −40 +125 °C
junction temperature − +125 °C

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air

TEA1081 120 K/W

TEA1081T (mounted on a printed-circuit board of 50 × 50 × 1.5 mm) 260 K/W

800

handbook, halfpage

P

tot

(mW)

600

400

200

0

0 40 120

(1)

(2)

8020 10060

MLC170

o

T ( C)

amb

(1) TEA1081.
(2) TEA1081T.

Fig.5 Power derating curves.

September 1994 6

Philips Semiconductors Product specification

Supply circuit with power-down for

TEA1081

telephone set peripherals

CHARACTERISTICS

V

= 4 V; V

LN

unless otherwise specified; see Fig.6.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

LN

V

LNmin

V

LNmax

Characteristics with R

I

1

V

O

∆V

O

I

6

Characteristics without R

I

1

∆V

LN-O

I

O

R

S

I

INT

THD total harmonic distortion V
BRL balance return loss 600 Ω reference 25 −−dB
V

LN(2H)

V

LN(3H)

V

ni(rms)

= 100 mV; IO= 5 mA; f = 300 to 3400 Hz; RL= 100 kΩ; CL= 2.2 µF; RV=75kΩ; T

LN(rms)

amb

=25°C;

operating DC line voltage 2.5 − 12.0 V
minimum instantaneous line voltage −−1.4 V
maximum instantaneous line voltage 12.0 −−V

=75kΩ connected between pins 6 and 7 and CL=10µF

V

input current (pin 1) V

V

=0V − 5.8 − mA

LN(rms)

= 1.5 V; IO=15mA − 30 − mA

LN(rms)

output voltage (pin 7) − 3.0 − V
variation of output voltage over the

ranges of:

line voltage V

temperature T

temperature T

output current I

=4to6V − 100 − mV

LN

= +25 to −25 °C −−100 − mV

amb

= +25 to +75 °C −−100 − mV

amb

=5to20mA −−100 − mV

O

control current (pin 6) − 20 −µA

V

input current (pin 1) V

V

=0V − 6.0 − mA

LN(rms)

= 1.5 V; IO=15mA − 31 − mA

LN(rms)

voltage drop from line to output IO=0mA − 0.5 − V

I

= 15 mA; V

O

= 1.5 V − 1.1 − V

LN(rms)

output current (pin 7)

TEA1081 −−30 mA

TEA1081T −−20 mA
internal series resistance − 20 −Ω
internal supply current IO= 0 mA; PD = LOW; VSP=VO− 0.8 1.4 mA

I

= 0 mA; PD = HIGH (note 1);

O

− 40 60 µA

VSP>2V

= 1.5 V −−2%

LN(rms)

second harmonic level of line voltage f = 500 Hz; VLN= 0 dBm;

Z

= 600 Ω

line

third harmonic level of line voltage f = 500 Hz; VLN= 0 dBm;

Z

= 600 Ω

line

noise voltage on input terminal
(RMS value)

V

=0V; RL= 600 Ω;

LN(rms)

P53 curve

−−58 − dBm

−−60 − dBm

−−83 − dBmp

Power-down input (pin 4)

V

IL

V

IH

I

4

LOW level input voltage −−0.3 V
HIGH level input voltage 1.5 − V
input current −−10 µA

September 1994 7

SP

V

Philips Semiconductors Product specification

Supply circuit with power-down for

TEA1081

telephone set peripherals

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Power-down input (pin 8)

V

8

I

8

supply voltage for power-down 2 − V
supply current to power-down circuit V8=3V −−70 µA

Note

1. Power-down circuit supplied via external source.

APPLICATION INFORMATION

handbook, full pagewidth

C =

D

68 pF

TELEPHONE

LINE

SPEECH/

TRANSMISSION

CIRCUIT

V

LN

I

AD
PD
SP

1

C = 2.2 µF

L

3

TEA1081

4
8

IFLN

51

6

7

2

VN

VA

QS

C =

S

47 pF

R

V

I

O

C

O

R = 100 kΩ

L

PERIPHERAL

V

O

CIRCUITS

LN

V

MLC171

Fig.6 Application diagram.

September 1994 8

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

PACKAGE OUTLINES

9.8

handbook, full pagewidth

seating plane

3.60

3.05

1.15
max

9.2

2.54
(3x)

1.73 max

0.53
max

0.51
min

3.2

max

0.254 M

4.2

max

0.38 max

8.25

7.80

7.62

10.0

8.3

TEA1081

MSA252 - 1

Dimensions in mm.

8

5

6.48

6.20

41

Fig.7 Plastic dual in-line package; 8 leads (300 mil); DIP8; SOT97-1.

September 1994 9

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

8

1

1.27

5.0

4.8

0.1 SS

5

4

0.49

0.36

handbook, full pagewidth

0.7

0.3

pin 1

index

0.25 M
(8x)

1.45

1.25

0.25

0.10

4.0

3.8

6.2

5.8

detail A

1.0

0.5

0.7

0.6

A

0.25

0.19

0 to 8

MBC180 - 1

TEA1081

1.75

1.35

o

Dimensions in mm.

Fig.8 Plastic small outline package; 8 leads; body width 3.9 mm (SO8; SOT96-1).

September 1994 10

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

SOLDERING
Plastic dual in-line packages

Y DIP OR WAVE

B
The maximum permissible temperature of the solder is

260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low-voltage soldering iron below the seating plane
(or not more than 2 mm above it). If its temperature is
below 300 °C, it must not be in contact for more than 10 s;
if between 300 and 400 °C, for not more than 5 s.

Plastic small-outline packages

BYWAVE
During placement and before soldering, the component

must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.

TEA1081

Y SOLDER PASTE REFLOW

B
Reflow soldering requires the solder paste (a suspension

of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.

R

EPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING

IRON OR PULSE

Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)

For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.

-HEATED SOLDER TOOL)

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.

A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.

September 1994 11

Philips Semiconductors Product specification

Supply circuit with power-down for

TEA1081

telephone set peripherals

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

September 1994 12

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

TEA1081

NOTES

September 1994 13

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

TEA1081

NOTES

September 1994 14

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

TEA1081

NOTES

September 1994 15

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International Marketing and Sales, Building BE-p,
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Telex 35000 phtcnl, Fax. [phone]

SCD34 © Philips Electronics N.V. 1994

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Philips Semiconductors