Datasheet TEA0676T Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TEA0676T

Dual pre-amplifier and equalizer for
reverse tape decks

Product specification
Supersedes data of 1996 Jun 20
File under Integrated Circuits, IC01

1997 Oct 07

Philips Semiconductors Product specification

Dual pre-amplifier and equalizer for

TEA0676T

reverse tape decks

FEATURES

• Dual head pre-amplifiers

• Reverse head switching

• Equalization with electronically switched time constants

• Output level like Dolby level of 387.5 mV = 0 dB

• Improved EMC behaviour.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CC

I

CC

SN+

-------------­N

V

o (rms)

supply voltage 7.6 10 12 V
supply current VCC=10V − 10 13 mA
signal plus noise-to-noise ratio unweighted RMS value 67 73 − dB

output voltage (0 dB) (RMS value) gain internal = 40 dB; linear − 387.5 − mV

GENERAL DESCRIPTION

The TEA0676T is a monolithic bipolar integrated circuit
intended for applications in car radios. It includes head and
equalization amplifiers with electronically switchable time
constants. Furthermore it includes electronically
switchable inputs for tape drivers with reverse heads.

The device will operate with power supplies in a range of

7.6 to 12.0 V. The output overload level increases with the
increase in supply voltage, so it is advisable to use a
regulated power supply or a supply with a long time
constant.

ORDERING INFORMATION

TYPE

NUMBER

TEA0676T SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

NAME DESCRIPTION VERSION

PACKAGE

1997 Oct 07 2

Philips Semiconductors Product specification

Dual pre-amplifier and equalizer for
reverse tape decks

BLOCK DIAGRAM

handbook, full pagewidth

equalizer

switch

70 µs

10 µF

OUTB
16

120 µs

18 kΩ

EQSW

15

330 kΩ

10 nF

EQOUTB
14

8.2 kΩ

180 Ω

1 kΩ

EQINB
13

GND
12

10 µF

INB1
11

470

pF

head

switch

IN1

IN2

27 kΩ

HSW INB2
10

10
µF

TEA0676T

470

pF

9

TEA0676T

1

OUT A

10 µF

2
n.c.

LOGIC

3
EQOUT A

10 nF

330 kΩ

EQ
AMPLIFIER

EQ
AMPLIFIER

8.2 kΩ

4
EQINA

1 kΩ

180 Ω

5

V

CC

10 V

10 µF

INA1

PRE­AMPLIFIER

POWER
SUPPLY

PRE­AMPLIFIER

470

pF

µF

8
INA2

470

pF

MGE862

76
V

ref

100

Fig.1 Block and application diagram.

1997 Oct 07 3

Philips Semiconductors Product specification

Dual pre-amplifier and equalizer for
reverse tape decks

PINNING

SYMBOL PIN DESCRIPTION

OUTA 1 output channel A
n.c. 2 not connected
EQOUTA 3 output equalizer channel A
EQINA 4 input equalizer channel A
V

CC

INA1 6 input channel A1

V

ref

INA2 8 input channel A2

INB2 9 input channel B2

HSW 10 input head switch
INB1 11 input channel B1

GND 12 ground
EQINB 13 input equalizer channel B
EQOUTB 14 output equalizer channel B
EQSW 15 input equalizer switch
OUTB 16 output channel B

5 supply voltage

(forward or reverse)

7 reference voltage

(reverse or forward)

(reverse or forward)

(forward or reverse)

handbook, halfpage

EQOUTA

OUTA

1

n.c.

2
3

V

CC

INA1

V

ref

INA2

4

TEA0676T

5
6
7
8

MGE861

EQINA

Fig.2 Pin configuration.

TEA0676T

16

OUTB

15

EQSW

14

EQOUTB

13

EQINB

12

GND

11

INB1

10

HSW

9

INB2

FUNCTIONAL DESCRIPTION

Gain of pre-amplifier = 30 dB; minimum gain of
EQ-amplifier = 24.5 dB at f = 1 kHz with 70 µs cut-off
frequency.

Head switching is achieved when pin 10 (HSW) is
connected to ground via a 27 kΩ resistor (inputs INA2,

INB2 are active) or connected to HIGH level (0.8V

CC

)

(inputs INA1, INB1 are active).
Equalization time constant switching (70 µs/120 µs) is

achieved when pin 15 (EQSW) is connected to ground via
an 18 kΩ resistor (120 µs) or left open-circuit (70 µs).

1997 Oct 07 4

Philips Semiconductors Product specification

Dual pre-amplifier and equalizer for

TEA0676T

reverse tape decks

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

∆V

(12-x)

T

stg

T

amb

V

es

Notes

1. Human body model: C = 100 pF; R = 1.5 kΩ.

2. Machine model: C = 200 pF; R = 0 Ω.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

supply voltage 0 14 V
voltage at pins 1 to 11, 13 to 16 with respect to pin 12 0 V

CC

V
storage temperature −55 +150 °C
operating ambient temperature −40 +85 °C
electrostatic handling voltage note 1 −2000 +2000 V

note 2 −500 +500 V

thermal resistance from junction to ambient in free air 70 K/W

1997 Oct 07 5

Philips Semiconductors Product specification

Dual pre-amplifier and equalizer for

TEA0676T

reverse tape decks

CHARACTERISTICS

V

= 10 V; RL=10kΩ; CL= 2.5 nF; T

CC

387.5 mV with 0 dB as standard; EQ switch in 70 µs position; unless otherwise specified; see notes 1 and 2.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

CC

I

CC

supply voltage (pin 5) 7.6 10.0 12.0 V
supply current − 10 13 mA

THD total harmonic distortion f = 1 kHz; V

H

R

headroom at output VCC= 7.6 V; THD = 1%;

PSRR power supply ripple

rejection

α

cs

α

m

α

ct

channel separation selective measurement;

channel matching selective measurement;

crosstalk between active
and inactive input

SN+

-------------­N

V

no(rms)

signal plus noise-to-noise
ratio (RMS value)

equivalent input noise
voltage (RMS value)

G

v

voltage gain of
pre-amplifier

A

v

R

EQ

Z

I

open-loop amplification pin INA1 to pin OUTA and

equalization resistor 4.7 5.8 6.9 kΩ
input impedance

pre-amplifier

Z

O

output impedance
EQ-amplifier

R

L

C

L

V

offset(DC)

I

O(GND)

I

O(VCC)

output load resistance 10 −− kΩ
output load capacitance 0 − 10 nF
input offset voltage pins INA1, INA2, INB1 and

DC current capability output to ground −2 −− mA
DC current capability output to V

EMC DC offset voltage at

pins 1 and 16

=25°C; Vo= 0 dB means 387.5 mV at output; all levels are referenced to

amb

=0dB − 0.08 0.15 %

o

f = 10 kHz; V

=6dB − 0.15 0.3 %

o

12 −− dB

f=1kHz
V

< 0.25 V; f = 1 kHz − 50 − dB

R(rms)

57 63 − dB

f = 1 kHz; Vo=10dB

−0.5 − +0.5 dB

f = 1 kHz; Vo=0dB
selective measurement;

70 77 − dB

f = 1 kHz; Vo=10dB
unweighted;

f = 20 Hz to 20 kHz; R

=0Ω;

s

67 73 − dB

internal gain 40 dB; linear;
see Fig.13

unweighted;

− 0.8 −µV

f = 20 Hz to 20 kHz; Rs=0Ω
from pin INA1 or INA2 to

29 30 31 dB
pin EQINA and from pin INB1
or INB2 to pin EQINB

pin INB1 to pin OUTB

f = 10 kHz 80 86 − dB
f = 400 Hz 104 110 − dB

60 100 − kΩ

− 80 100 Ω

− 2 − mV

INB2 connected to V

CC

f = 900 MHz; V

ref

= 6 V (RMS);

i

300 −− µA

− 50 − mV

see Figs 12, 14 and 15

1997 Oct 07 6

Philips Semiconductors Product specification

Dual pre-amplifier and equalizer for

TEA0676T

reverse tape decks

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Switching thresholds

E

QUALIZATION TIME CONSTANT SWITCHING

V

EQSW

I

EQSW

V

EQSW(HIGH)

V

EQSW(LOW)

HEAD SWITCHING
V

HSW

I

HSW

V

HSW(HIGH)

V

HSW(LOW)

Notes

1. For an application with a fixed equalization time constant of 120 µs the equalizing network may be applied completely
external. In this application the 8.2 kΩ resistor has to be changed to 14 kΩ and the internal resistor REQ= 5.8 kΩ
must be short-circuited by fixing the equalization switch input at 70 µs (pin 15 left open-circuit). To activate the inputs
INA1 and INB1, pin 10 (HSW) might be left open-circuit. In this event the DC level at pin 10 (HSW) is 0.8V

2. It is recommended to switch off VCC with a gradient of 400 V/s at maximum to avoid plops on the tape in the event
of contact between tape and tape head while switching off.

pin voltage load current +100 to −100 µA − 0.8VCC− V
input current V
pin voltage time constant 70 µs active
pin voltage time constant 120 µs active 0 −

EQSW

= 0 to V

CC

−180 − +180 µA

1

⁄2VCC+ 0.5 − V

CC

1

⁄2VCC− 0.5 V

pin voltage load current +90 to −90 µA − 0.8VCC− V
input current V
HIGH-level pin voltage inputs INA1 and INB1 active
LOW-level pin voltage inputs INA2 and INB2 active 0 −

HSW

= 0 to V

CC

−170 − +170 µA

1

⁄2VCC+ 0.5 − V

CC

1

⁄2VCC− 0.5 V

CC

V

V

1997 Oct 07 7

Philips Semiconductors Product specification

Dual pre-amplifier and equalizer for
reverse tape decks

INTERNAL PIN CONFIGURATIONS

handbook, halfpage

+

100

Ω

1

5 V

80 Ω

MGE863

handbook, halfpage

TEA0676T

5.8
kΩ

3

5 V

MGE864

+

80 Ω

100

Ω

Fig.3 Pins 1 and 16: output channel.

handbook, halfpage

Fig.4 Pins 3 and 14: equalizer outputs.

MGE865

4

10 kΩ

1 pF

handbook, halfpage

5

MGE866

+

Fig.5 Pins 4 and 13: equalizer inputs.

1997 Oct 07 8

Fig.6 Pin 5: supply voltage.

Philips Semiconductors Product specification

Dual pre-amplifier and equalizer for
reverse tape decks

handbook, halfpage

6

5 V

100 kΩ

5 V

220 Ω

12
pF

+

MGE867

handbook, halfpage

TEA0676T

+

2.5 kΩ

5 V

7

2.5 kΩ

MGE868

Fig.7 Pins 6, 8, 9, 11: input channel.

handbook, halfpage

Fig.8 Pin 7: reference voltage.

10

8 V

+

MGE869

handbook, halfpage

15

8 V

+

MGE870

Fig.9 Pin 10: input head switch.

1997 Oct 07 9

Fig.10 Pin 15: input equalizer switch.

Philips Semiconductors Product specification

Dual pre-amplifier and equalizer for
reverse tape decks

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

10 kΩ

equalizer

switch
70 µs

10 µF

OUTB
16

120 µs

18 kΩ

EQSW
15

330 kΩ

10 nF

EQOUTB
14

8.2 kΩ

180 Ω

1 kΩ

EQINB
13

GND
12

10 µF

200 Ω

INB1
11

10
µF

470

head

pF

switch

IN1

IN2

27 kΩ

HSW INB2
10

10
µF

TEA0676T

470

pF

10

200 Ω

µF

9

10 kΩ

TEA0676T

1

OUT A

10 µF

2
n.c.

LOGIC

3
EQOUT A

10 nF

330 kΩ

EQ
AMPLIFIER

EQ
AMPLIFIER

8.2 kΩ

4
EQINA

1 kΩ

180 Ω

5

V

CC

10 V

200 Ω

10 µF

INA1

PRE­AMPLIFIER

POWER
SUPPLY

PRE­AMPLIFIER

10

µF

470

pF

µF

8
INA2

10
µF

200 Ω

470

pF

MGE871

76
V

ref

100

Fig.11 Test circuit.

1997 Oct 07 10

Philips Semiconductors Product specification

Dual pre-amplifier and equalizer for
reverse tape decks

handbook, full pagewidth

20 kΩ

10 µF

OUTB
16

EQSW
15

EQOUTB
14

EQ
AMPLIFIER

EQINB
13

10 kΩ

GND
12

200 Ω

INB1
11

470

pF

PRE­AMPLIFIER

head

switch

IN1

IN2

27 kΩ

HSW INB2
10

200 Ω

10
µF

TEA0676T

470

pF

9

TEA0676T

1

OUT A

10 µF

2
n.c.

LOGIC

3
EQOUT A

EQ
AMPLIFIER

20 kΩ

10 kΩ

4
EQINA

5

V

CC

10 V

200 Ω

INA1

POWER
SUPPLY

PRE­AMPLIFIER

470

pF

10 Ω

µF

200 Ω

8
INA2

470

pF

f = 900 MHz

Vi = 6 V (RMS)

MGE872

76
V

ref

100

40 Ω

Fig.12 EMC test diagram.

1997 Oct 07 11

Philips Semiconductors Product specification

Dual pre-amplifier and equalizer for
reverse tape decks

handbook, full pagewidth

equalizer

switch

70 µs

10 µF

OUTB
16

120 µs

18 kΩ

EQSW
15

EQOUTB
14

10 kΩ

20 kΩ

EQINB
13

EQ
AMPLIFIER

GND
12

INB1
11

head

switch

IN1

IN2

27 kΩ

HSW INB2
10

PRE­AMPLIFIER

10
µF

TEA0676T

9

TEA0676T

1

OUT A

10 µF

2
n.c.

LOGIC

3
EQOUT A

EQ
AMPLIFIER

20 kΩ

10 kΩ

4
EQINA

POWER
SUPPLY

PRE­AMPLIFIER

5

V

CC

INA1

10 V

76
V

ref

100

8
INA2

µF

MGE873

Fig.13 Noise test diagram.

1997 Oct 07 12

Philips Semiconductors Product specification

Dual pre-amplifier and equalizer for
reverse tape decks

LAYOUT OF PRINTED CIRCUIT BOARD FOR EMC TEST CIRCUIT

handbook, full pagewidth

50

54

TEA0676T

27 kΩ 200 Ω

200 Ω

470 pF

0 Ω 0 Ω

100 nF

40 Ω

10 Ω

470 pF

200 Ω

TEA0676T

0 Ω

Fig.14 Top side with components.

1997 Oct 07 13

0 Ω

470 pF
10 kΩ

20 kΩ

20 kΩ

10 kΩ
470 pF
200 Ω

100 nF

MBH457

Philips Semiconductors Product specification

Dual pre-amplifier and equalizer for
reverse tape decks

handbook, full pagewidth

50

TEA0676T

54

X3

10 µF

S1

MP

100 µF 100 µF

MP

HFDR.

MP

10 µF

10 µF

X2

X1

Fig.15 Bottom side with components.

X4

MBH458

1997 Oct 07 14

Philips Semiconductors Product specification

Dual pre-amplifier and equalizer for
reverse tape decks

PACKAGE OUTLINE

SO16: plastic small outline package; 16 leads; body width 7.5 mm

D

c

y

Z

16

9

TEA0676T

SOT162-1

E

H

E

A

X

v M

A

pin 1 index

1

e

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

2.65

0.10

A

1

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

8

w M

b

p

0 5 10 mm

scale

(1)E(1) (1)

cD

10.5

10.1

0.41

0.40

eHELLpQ

7.6

1.27

7.4

0.30

0.050

0.29

A

2

10.65

10.00

0.419

0.394

A

1

1.4

0.055

1.1

0.4

0.043

0.016

detail X

0.043

0.039

1.1

1.0

Q

3

0.25 0.1

0.01

A

θ

ywv θ

0.004

Z

0.9

0.4

0.035

0.016

o

8

o

0

(A )

L

p

L

0.25

0.01

OUTLINE
VERSION

SOT162-1

IEC JEDEC EIAJ

075E03 MS-013AA

REFERENCES

1997 Oct 07 15

EUROPEAN

PROJECTION

ISSUE DATE

95-01-24
97-05-22

Philips Semiconductors Product specification

Dual pre-amplifier and equalizer for
reverse tape decks

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Reflow soldering

Reflow soldering techniques are suitable for all SO
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

(order code 9398 652 90011).

TEA0676T

Wave soldering

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1997 Oct 07 16

Philips Semiconductors Product specification

Dual pre-amplifier and equalizer for

TEA0676T

reverse tape decks

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1997 Oct 07 17

Philips Semiconductors Product specification

Dual pre-amplifier and equalizer for
reverse tape decks

TEA0676T

NOTES

1997 Oct 07 18

Philips Semiconductors Product specification

Dual pre-amplifier and equalizer for
reverse tape decks

TEA0676T

NOTES

1997 Oct 07 19

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Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1997 SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 547027/1200/02/pp20 Date of release: 1997 Oct 07 Document order number: 9397 750 02743