Datasheet TDF8712T, TDF8712, TDA8712T, TDA8712 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8712; TDF8712

8-bit digital-to-analog converters

Product specification
Supersedes data of April 1993
File under Integrated Circuits, IC02

Philips Semiconductors

June 1994

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

FEATURES

• 8-bit resolution

• Conversion rate up to 50 MHz

• TTL input levels

• Internal reference voltage generator

• Two complementary analog voltage outputs

• No deglitching circuit required

• Internal input register

• Low power dissipation

• Internal 75 Ω output load (connected to the analog

supply)

• Very few external components required

• Temperature range

– TDA8712: 0 to 70 °C
– TDF8712: −40 to +85 °C.

ORDERING INFORMATION

TYPE NUMBER

PINS PIN POSITION MATERIAL CODE

TDA8712 16 DIP plastic SOT38-1

TDF8712 16 DIP plastic SOT38-1
TDA8712T 16 SO16L plastic SOT162-1
TDF8712T 16 SO16L plastic SOT162-1

APPLICATIONS

• High-speed digital-to-analog conversion

• Digital TV including:

– field progressive scan
– line progressive scan

• Subscriber TV decoders

• Satellite TV decoders

• Digital VCRs

• Industrial and automotive.

GENERAL DESCRIPTION

The TDA8712 and TDF8712 are 8-bit digital-to-analog
converters (DACs) for video and other applications. They
convert the digital input signal into an analog voltage
output at a maximum conversion rate of 50 MHz. No
external reference voltage is required and all digital inputs
are TTL compatible.

PACKAGE

June 1994 2

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CCA

V

CCD

I

CCA

I

CCD

∆V

OUT(p-p)

ILE DC integral linear error −±0.3 ±0.5 LSB
DLE DC differential linearity error −±0.3 ±0.5 LSB
f

clk(max)

B −3 dB analog bandwidth f
P

tot

analog supply voltage

TDA8712 4.5 5.0 5.5 V
TDF8712 4.75 5.0 5.25 V

digital supply voltage

TDA8712 4.5 5.0 5.5 V

TDF8712 4.75 5.0 5.25 V
analog supply current note 1 20 26 32 mA
digital supply current note 1 16 23 30 mA
full-scale analog output voltage

differences between V
V

(peak-to-peak value)

OUT

OUT

and

ZL = 10 kΩ; note 2 −1.45 −1.60 −1.75 V

= 75 Ω; note 2 −0.72 0.80 −0.88 V

Z

L

maximum conversion rate 50 −−MHz

= 50 MHz; note 3 − 150 − MHz

clk

total power dissipation

TDA8712 160 250 340 mW

TDF8712 170 250 325 mW

Notes

1. D0 to D7 are connected to V

2. The analog output voltages (V
between V

and each of these outputs is typically 75 Ω.

CCA

and CLK is connected to DGND.

CCD

OUT

and V

) are negative with respect to V

OUT

(see Table 1). The output resistance

CCA

3. The −3 dB analog output bandwidth is determined by real time analysis of the output transient at a maximum input
code transition (code 0 to 255).

June 1994 3

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

BLOCK DIAGRAM

handbook, full pagewidth

REF

100 nF

DGND
AGND

(LSB) D0

(MSB) D7

CLK

D1
D2
D3
D4
D5
D6

1

BAND-GAP

REFERENCE

6
2

5

CLOCK INPUT

INTERFACE

TDA8712
TDF8712

12
11
3
4
10
9
8
7

CURRENT

REFERENCE

LOOP

CURRENT

GENERATORS

CURRENT

SWITCHES

REGISTERS

DATA

INPUT

INTERFACE

16

V

CCA

75

75

Ω

Ω

15

V
V

V

OUT
OUT

CCD

14

Fig.1 Block diagram.

June 1994 4

MBC915 - 1

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

PINNING

SYMBOL PIN DESCRIPTION

REF 1 voltage reference (decoupling)
AGND 2 analog ground
D2 3 data input; bit 2
D3 4 data input; bit 3
CLK 5 clock input
DGND 6 digital ground
D7 7 data input; bit 7 (MSB)
D6 8 data input; bit 6
D5 9 data input; bit 5
D4 10 data input; bit 4
D1 11 data input; bit 1
D0 12 data input; bit 0 (LSB)
V
V
V
V

CCD
OUT
OUT
CCA

13 digital supply voltage (+5 V)
14 analog output voltage
15 complimentary analog output voltage
16 analog supply voltage (+5 V)

handbook, halfpage

1

REF

2

AGND

D2

3

D3

4
5
6
7
8

TDA8712
TDF8712

MBC901 - 1

CLK

DGND

D7

D6

Fig.2 Pin configuration.

V

16

CCA

V

15

OUT

V

14

OUT

V

13

CCD

D0

12

D1

11

D4

10

D5

9

June 1994 5

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC134).

SYMBOL PARAMETER MIN. MAX. UNIT

V
V

∆V
∆V

V
I

tot

T
T

T

CCA
CCD

CC
GND

I

stg
amb

j

analog supply voltage −0.3 +7.0 V
digital supply voltage −0.3 +7.0 V
supply voltage differences between V
ground voltage differences between V
input voltage (pins 3 to 5 and 7 to 12) −0.3 V
total output current (I

OUT

+ I

; pins 14 and 15) −5 +26 mA

OUT

CCA

AGND

and V

and V

CCD

−0.5 +0.5 V

−0.1 +0.1 V

DGND

CCD

V

storage temperature −55 +150 °C
operating ambient temperature

TDA8712 0 +70 °C
TDF8712 −40 +85 °C

junction temperature − +150 °C

HANDLING

Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air

SOT38-1 70 K/W
SOT162-1 90 K/W

June 1994 6

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

CHARACTERISTICS

V

= V16 to V2 = 4.5 to 5.5 V (TDA8712) = 4.75 to 5.25 V (TDF8712); V

CCA

4.75 to 5.25 V (TDF8712); V

AGND via a 100 nF capacitor; T
V

CCA=VCCD

= 5 V and T

to V

CCA

amb

= 25 °C; unless otherwise specified.

amb

= −0.5 to +0.5 V (TDA8712) = −0.25 to +0.25 V (TDF8712); REF decoupled to

CCD

= −40 to +85 °C; AGND and DGND shorted together; typical readings taken at

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

CCA

analog supply voltage

TDA8712 4.5 5.0 5.5 V
TDF8712 4.75 5.0 5.25 V

V

CCD

digital supply voltage

TDA8712 4.5 5.0 5.5 V
TDF8712 4.75 5.0 5.25 V

I

CCA

I

CCD

∆V

GND

analog supply current note 1 20 26 32 mA
digital supply current note 1 16 23 30 mA
ground voltage differences

between V

AGND

and V

DGND

Inputs

= V13to V6 = 4.5 to 5.5 V (TDA8712) =

CCD

−0.1 − +0.1 V

IGITAL INPUTS (D7 TO D0) AND CLOCK INPUT CLK

D
V

IL

V

IH

I

IL

I

IH

f

clk(max)

Outputs (referenced to V

∆V

OUT(p-p)

V

os

TC

VOUT

LOW level input voltage 0 − 0.8 V
HIGH level input voltage 2.0 − V

CCD

V
LOW level input current VI= 0.4 V −−0.3 −0.4 mA
HIGH level input current VI= 2.7 V − 0.01 20 µA
maximum clock frequency 50 −−MHz

)

CCA

full-scale analog output voltage
differences between V
V

(peak-to-peak value)

OUT

OUT

ZL = 10 kΩ; note 2 −1.45 −1.60 −1.75 V

and

= 75 Ω; note 2 −0.72 0.80 −0.88 V

Z

L

analog offset output voltage code = 0 −−3−25 mV
full-scale analog output voltage

−−200 µV/K

temperature coefficient

TC

Vos

analog offset output voltage

−−20 µV/K

temperature coefficient

B −3 dB analog bandwidth f
G

diff

ϕ

diff

Z

o

Transfer function (f

differential gain − 0.6 − %
differential phase − 1 − deg
output impedance − 75 −Ω

= 50 MHz)

clk

= 50 MHz; note 3 − 150 − MHz

clk

ILE DC integral linear error −±0.3 ±0.5 LSB
DLE DC differential linearity error −±0.3 ±0.5 LSB

June 1994 7

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Switching characteristics (f

t

SU;DAT

t

HD;DAT

t

PD

t

S1

data set-up time −0.3 −−ns
data hold time 2.0 −−ns
propagation delay time −−1.0 ns
settling time 1 10% to 90% full-scale

= 50 MHz; notes 4 and 5; see Figs 3, 4 and 5)

clk

− 1.1 1.5 ns

change to ±1 LSB

t

S2

settling time 2 10% to 90% full-scale

− 6.5 8.0 ns

change to ±1 LSB

t

d

Output transients (glitches; f

E

g

input to 50% output delay time − 3.0 5.0 ns

= 50 MHz; note 6; see Fig.6)

clk

glitch energy from code transition 127 to 128 −−30 LSB⋅ns

Notes

1. D0 to D7 are connected to V

2. The analog output voltages (V
between V

and each of these outputs is typically 75 Ω.

CCA

and CLK is connected to DGND.

CCD

OUT

and V

) are negative with respect to V

OUT

(see Table 1). The output resistance

CCA

3. The −3 dB analog output bandwidth is determined by real time analysis of the output transient at a maximum input
code transition (code 0 to 255).

4. The worst case characteristics are obtained at the transition from input code 0 to 255 and if an external load
impedance greater than 75 Ω is connected between V
measured with an active probe between V

and AGND. No further load impedance between V

OUT

OUT

or V

OUT

and V

. The specified values have been

CCA

and AGND has

OUT

been applied. All input data is latched at the rising edge of the clock. The output voltage remains stable (independent
of input data variations) during the HIGH level of the clock (CLK = HIGH). During a LOW-to-HIGH transition of the
clock (CLK = LOW), the DAC operates in the transparent mode (input data will be directly transferred to their
corresponding analog output voltages; see Fig.5.

5. The data set-up time (t

) is the minimum period preceding the rising edge of the clock that the input data must

SU;DAT

be stable in order to be correctly registered. A negative set-up time indicates that the data may be initiated after the
rising edge of the clock and still be recognized. The data hold time (t

) is the minimum period following the rising

HD;DAT

edge of the clock that the input data must be stable in order to be correctly registered. A negative hold time indicates
that the data may be released prior to the rising edge of the clock and still be recognized.

6. The definition of glitch energy and the measurement set-up are shown in Fig.6. The glitch energy is measured at the
input transition between code 127 and 128 and on the falling edge of the clock.

June 1994 8

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

Table 1 Input coding and output voltages (typical values; referenced to V

CODE INPUT DATA (D7 to D0)

Z

= 10 kΩ ZL = 75 Ω

L

V

OUT

0 000 00 00 0 −1.6 0 −0.8
1 000 000 01 −0.006 −1.594 −0.003 −0.797

. . ....

128 100 000 00 −0.8 −0.8 −0.4 −0.4

. . ....

254 111 111 10 −1.594 −0.006 −0.797 −0.003
255 111 111 11 −1.6 0 −0.8 0

ndbook, full pagewidth

input data

t

SU; DAT

stable

t

HD; DAT

, regardless of the offset voltage).

CCA

DAC OUTPUT VOLTAGES (V)

V

OUT

V

OUT

3.0 V

1.3 V
0 V

V

OUT

3.0 V

CLK

MBC912

The shaded areas indicate when the input data may change and be correctly registered. Data input update must be completed within 0.3 ns after the first
rising edge of the clock (t

is negative; −0.3 ns). Data must be held at least 2 ns after the rising edge (t

SU;DAT

HD;DAT

= +2 ns).

1.3 V
0 V

Fig.3 Data set-up and hold times.

June 1994 9

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

ndbook, full pagewidth

input data
(example of a
full-scale input
transition)

CLK

code 0

1.3 V

1 LSB

V

CCA

(code 0)

t

d

V

OUT

t

S1

t

PD

t

S2

Fig.4 Switching characteristics.

1.3 V

code 255

1 LSB

MBC913

10 %

50 %

90 %

V

1.6 V

CCA

(code 255)

andbook, full pagewidth

During the transparent mode (CLK = LOW), any change of input data will be seen at the output. During the latched mode (CLK = HIGH), the analog output
remains stable regardless of any change at the input. A change of input data during the latched mode will be seen on the falling edge of the clock
(beginning of the transparent mode).

CLK

input
codes

analog
output
voltage

MBC914 - 1

V

OUT

transparent

mode

transparent

mode

latched

mode

latched mode

(stable output)

1.3 V

beginning of

transparent

mode

Fig.5 Latched and transparent mode.

June 1994 10

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

handbook, full pagewidth

HP8082A

HP8082A

PULSE

GENERATOR

(SLAVE)

PULSE

GENERATOR

(SLAVE)

DIVIDER

( 10)

V

OUT

1/10 f

1/10 f

f

code 128

clk

clk

clk

D7 MSB
D6
D5

D4
D3

TDA8712
TDF8712

D2
D1
D0 (LSB)

PULSE

GENERATOR

(MASTER)

MODEL EH107

code 127

f

clk

time

V
V

OUT
OUT

1 LSB

TEK P6201 TEK7104 and TEK7A26

DYNAMIC

PROBE

R = 100 kΩ
C = 3 pF

clock

3

1

2

timing diagram

OSCILLO-

SCOPE

bandwidth = 20 MHz

MBC916

The value of the glitch energy is the sum of the shaded area measured in LSB⋅ns.

Fig.6 Glitch energy measurement.

June 1994 11

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

INTERNAL PIN CONFIGURATIONS

handbook, full pagewidth

V

CCA

REF

AGND

V

REF

regulation loop

MBC911 - 1

Fig.7 Reference voltage generator decoupling.

output current
generators

handbook, halfpage

DGND

AGND

substrate

MBC908

Fig.8 AGND and DGND.

June 1994 12

handbook, halfpage

V

CCA

D0 to D7,
CLK

AGND

Fig.9 D7 to D0 and CLK.

MBC910

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

handbook, halfpage

V

CCA

75 Ω75 Ω

V

handbook, halfpage

V

CCD

V

OUT

OUT

handbook, halfpage

DGND

MBC907

Fig.10 Digital supply.

V

CCA

AGND

MBC909 - 1

bit

n

switches and

current generators

Fig.11 Analog outputs.

bit
n

AGND

MBC906

Fig.12 Analog supply.

June 1994 13

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

APPLICATION INFORMATION

Additional application information can be supplied on request (please quote

handbook, halfpage

AGND

(1) This is a recommended value for decoupling pin 1.
VO = −V

; see Table 1; ZL = 10 kΩ.

OUT

100 nF

(1)

V

REF

CCA

V

OUT

V

OUT

TDA8712

TDF8712

MBC905 - 1

Fig.13 Analog output voltage without external load.

“FTV/8901”).

V

O

100 nF

(1)

REF

TDA8712
TDF8712

handbook, halfpage

AGND

(1) This is a recommended value for decoupling pin 1.
External load ZL = 75 Ω to ∞.

Fig.14 Analog output voltage with external load.

June 1994 14

V

V

CCA

OUT

MBC904 - 1

()

VOZL/

Z

L

75Z

L

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

handbook, halfpage

(1) This is a recommended value for decoupling pin 1.

100 nF

AGND

MBC903 - 1

Fig.15 Analog output voltage with AGND as reference.

(1)

REF

TDA8712
TDF8712

V

OUT

100 µF

75 Ω

V

CCA

AGND

V

O

2

handbook, full pagewidth

TDA8712
TDF8712

V

OUT

(pin 15)

or

V

OUT

(pin 14)

100 µF

390 Ω

39 pF 100 pF 56 pF

Fig.16 Example of anti-aliasing filter (analog output referenced to AGND).

June 1994 15

10 µH 12 µH

27 pF 12 pF

390 Ω

V

MSA656

o

[390/(780+75)]

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

Characteristics of Fig. 17

• Order 5; adapted CHEBYSHEV

handbook, halfpage

0

α

(dB)

20

40

60

80

100

01020 40

30

MSA657

f (MHz)

i

• Ripple ρ≤0.1 dB

• f = 6.7 MHz at −3dB

• f

= 9.7 MHz and 13.3 MHz.

notch

Fig.17 Frequency response for filter shown in

Fig.16.

handbook, full pagewidth

AGND

100 nF

(1)

REF

V

V

TDA8712
TDF8712

OUT

OUT

100 µF

100 µF

R1

R1

R2

R2

AGND

2 X V (R2/R1)

O

MBC902

(1) This is a recommended value for decoupling pin 1.

Fig.18 Differential mode (improved supply voltage ripple rejection).

June 1994 16

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

PACKAGE OUTLINES

handbook, full pagewidth

seating plane

3.9

3.4

2.2

max

22.00

21.35

3.7

4.7

max

max

0.51
min

2.54
(7x)

1.4 max

16

1

0.53
max

0.254 M

9

6.48

6.14

8

0.32 max

8.25

7.80

7.62

9.5

8.3

MSA254

Dimensions in mm.

Fig.19 Plastic dual in-line package; 16 leads (300 mil) SOT38-1.

June 1994 17

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

handbook, full pagewidth

pin 1

index

10.5

10.1

0.49

0.36

0.1 S

9

2.45

2.25

0.25 M

(16x)

S

0.9

(4x)

0.4

16

18

1.27

0.3

0.1

7.6

7.4

10.65

10.00

detail A

1.1

0.5

1.1

1.0

0.32

0.23

0 to 8

MBC233 - 1

A

2.65

2.35

o

Dimensions in mm.

Fig.20 Plastic small outline package; 16 leads; large body (SOT162-1).

June 1994 18

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

SOLDERING
Plastic dual in-line packages

Y DIP OR WAVE

B
The maximum permissible temperature of the solder is

260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.

EPAIRING SOLDERED JOINTS

R
Apply a low voltage soldering iron below the seating plane

(or not more than 2 mm above it). If its temperature is
below 300 °C, it must not be in contact for more than 10 s;
if between 300 and 400 °C, for not more than 5 s.

Plastic small-outline packages

YWAVE

B
During placement and before soldering, the component

must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.

A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.

Y SOLDER PASTE REFLOW

B
Reflow soldering requires the solder paste (a suspension

of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.

EPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING

R

IRON OR PULSE

-HEATED SOLDER TOOL)

Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)

For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.

June 1994 19

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

June 1994 20

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

NOTES

June 1994 21

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

NOTES

June 1994 22

Philips Semiconductors Product specification

8-bit digital-to-analog converters TDA8712; TDF8712

NOTES

June 1994 23

Philips Semiconductors – a worldwide company

Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428)

BUENOS AIRES, Tel. [phone], Fax. [phone]

Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]

Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]

Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands,

Tel. [phone], Fax. [phone]

Brazil: Rua do Rocio 220 - 5

CEP: 04552-903-SÃO PAULO-SP, Brazil.
P.O. Box 7383 (01064-970).
Tel. [phone], Fax. [phone]

Canada: INTEGRATED CIRCUITS:

Tel. [phone], Fax. [phone]
DISCRETE SEMICONDUCTORS: 601 Milner Ave,
SCARBOROUGH, ONTARIO, M1B 1M8,
Tel. [phone] ext. 2336, Fax. [phone]

Chile: Av. Santa Maria 0760, SANTIAGO,

Tel. [phone], Fax. [phone]

Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17,

77621 BOGOTA, Tel. [phone],
Fax. [phone]

Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]

France: 4 Rue du Port-aux-Vins, BP317,

92156 SURESNES Cedex,
Tel. [phone], Fax. [phone]

Germany: PHILIPS COMPONENTS UB der Philips G.m.b.H.,

P.O. Box 10 63 23, 20043 HAMBURG,
Tel. [phone], Fax. [phone].

Greece: No. 15, 25th March Street, GR 17778 TAVROS,

Tel. [phone] 911, Fax. [phone]

Hong Kong: PHILIPS HONG KONG Ltd., Components Div.,

6/F Philips Ind. Bldg., 24-28 Kung Yip St., KWAI CHUNG, N.T.,
Tel. [phone], Fax. [phone]

India: Philips INDIA Ltd, Components Dept,

Shivsagar Estate, A Block ,
Dr. Annie Besant Rd. Worli, Bombay 400 018
Tel. [phone], Fax. [phone]

Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4,

P.O. Box 4252, JAKARTA 12950,
Tel. [phone], Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]

Italy: PHILIPS COMPONENTS S.r.l.,

Viale F. Testi, 327, 20162 MILANO,
Tel. [phone], Fax. [phone].

Japan: Philips Bldg13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]

Korea: (Republic of) Philips House, 260-199 Itaewon-dong,

Yongsan-ku, SEOUL, Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,

SELANGOR, Tel. [phone], Fax. [phone]

Mexico: Philips Components, 5900 Gateway East, Suite 200,

EL PASO, TX 79905, Tel. [phone], Fax. [phone]

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB

Tel. [phone], Fax. [phone]

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]

th

floor, Suite 51,

Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: Philips Electrical Industries of Pakistan Ltd.,

Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton,
KARACHI 75600, Tel. [phone],
Fax. [phone].

Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Portugal: PHILIPS PORTUGUESA, S.A.,

Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores,
Apartado 300, 2795 LINDA-A-VELHA,
Tel. [phone], Fax. [phone].

Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

South Africa: S.A. PHILIPS Pty Ltd., Components Division,

195-215 Main Road Martindale, 2092 JOHANNESBURG,
P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone].

Spain: Balmes 22, 08007 BARCELONA,

Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,

Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. [phone], Fax. [phone]

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West

Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978,
TAIPEI 100, Tel. [phone], Fax. [phone].

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong,
Bangkok 10260, THAILAND,
Tel. [phone], Fax. [phone].

Turkey:Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,

Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Limited, P.O. Box 65,

Philips House, Torrington Place, LONDON, WC1E 7HD,
Tel. [phone], Fax. [phone]

United States:INTEGRATED CIRCUITS:

811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]
DISCRETE SEMICONDUCTORS: 2001 West Blue Heron Blvd.,

P.O. Box 10330, RIVIERA BEACH, FLORIDA 33404,
Tel. [phone] and [phone], Fax. [phone]

Uruguay: Coronel Mora 433, MONTEVIDEO,

Tel. [phone], Fax. [phone]

For all other countries apply to: Philips Semiconductors,
International Marketing and Sales, Building BAF-1,
P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. [phone]

SCD31 © Philips Electronics N.V. 1994

All rights are reserved. Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation
or contract, is believed to be accurate and reliable and may be changed without
notice. No liability will be accepted by the publisher for any consequence of its
use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.

Printed in The Netherlands

533061/1500/03/pp24 Date of release: June 1994
Document order number: 9397 734 70011

Philips Semiconductors