The TDE1737 is a monolithic amplifier designed
for high current and high voltage applications,
specifically to drive lamps, relays and control of
stepper motors.
This device is essentially blow-out proof.
Current limiting is available to limit the peak output
current to a safe value, the adjustment only
requires one external resistor. In addition, thermal
shut down is provided to keep the I.C. from
overheating. If internal dissipation becomes too
great, the driver will shut down to prevent
excessive heating.
SO14
TDE1737
DIP-8
The output is also protected against short-circuits
with the positive power supply.
The device operates over a wide range of supply
voltages from standard ± 15 V operational
amplifier supplies down to the single + 12 V or +
24 used for industrial electronic systems
1. The offset voltage given is the maximum value of input voltage required to drive the output voltage within 2V of the ground
or the supply voltage.
2. Devices bonded on a 40 cm
Short–circuit Current Limit (R
Output Saturation Voltage (output low) (V
= 300mA, RSC = 0)
I
O
Output Leakage Current (output high) (VO = V
OL
= + 25°C)
T
A
(1)
= +24V, IO = 0)
CC
= 1.5Ω, T
SC
2
glass-epoxy printed circuit 0.15cm thick with 4 cm2 of cooper.
CASE
+
– V
I
= + 25°C)
≤ 50mV
I
= +24V,
CC
–2 50 mV
–
3 5 mA
VCC–2
500 –mA
–
–1 1.5 V
–10 mA
–
V
4/13
Page 5
TDE1737Pin connections and schematic diagrams
3 Pin connections and schematic diagrams
Figure 1.Pin connections (top views)
Figure 2.Schematic diagram
5/13
Page 6
Pin connections and schematic diagramsTDE1737
Figure 3.Simplified schematic
Figure 4.Typical application
6/13
Page 7
TDE1737Typical application
4 Typical application
Figure 5.Available output current vs
limiting resistors
Figure 7.Short-circuit current vs
case temperature
Figure 6.Peak short-circuit vs
limiting resistor
Figure 8.Safe operating area
(non ripetitive overload)
7/13
Page 8
Typical applicationTDE1737
Figure 9.Saturation voltage vs output current
8/13
Page 9
TDE1737Package mechanical data
5 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in compliance
with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are
available at: www.st.com
9/13
Page 10
Package mechanical dataTDE1737
Table 4.SO14 Mechanical data
Dim.
MinTypMaxMinTypMax
A 1.35 1.75 0.053 0.069
A1 0.10 0.30 0.004 0.012
A2 1.10 1.65 0.043 0.065
B 0.33 0.51 0.013 0.020
C 0.19 0.25 0.007 0.01
(1)
D
8.55 8.75 0.337 0.344
E 3.80 4.0 0.150 0.157
e 1.27 0.050
H 5.8 6.20 0.228 0.244
h 0.25 0.50 0.01 0.02
L 0.40 1.27 0.016 0.050
k 0° (min.), 8° (max.)
ddd 0.10 0.004
mm Inch
1. “D” dimension does not include mold flash, protusions or gate burrs. Mold flash, protusions or gate burrs shall not exceed
0.15mm per side.
Figure 10. Package dimensions
10/13
0016019 D
Page 11
TDE1737Package mechanical data
Table 5. DIP-8 Mechanical data
Dim.
MinTypMaxMinTypMax
A 3.32 0.131
a1 0.51 0.020
B 1.15 1.65 0.045 0.065
b 0.356 0.55 0.014 0.022
b1 0.204 0.304 0.008 0.012
D 10.92 0.430
E 7.95 9.75 0.313 0.384
e 2.54 0.100
e3 7.62 0.300
e4 7.62 0.300
F 6.6 0.260
I 5.08 0.200
L 3.18 3.81 0.125 0.150
Z 1.52 0.060
mm Inch
Figure 11. Package dimensions
11/13
Page 12
Revision historyTDE1737
6 Revision history
Table 6.Revision history
DateRevisionChanges
12-Sep-20031Initial release
20-Oct-20032Few changes
30-May-20063New template
12/13
Page 13
TDE1737
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