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TDA7040T
Datasheet (Philips)
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Datasheet TDA7040T Datasheet (Philips)

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Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA7040T
Low voltage PLL stereo decoder
Product specification File under Integrated Circuits, IC01
September 1986
Page 2
Low voltage PLL stereo decoder TDA7040T

GENERAL DESCRIPTION

The TDA7040T is a monolithic integrated circuit for low cost FM stereo radios with an absolute minimum of peripheral components and a simple lay-out.

Features

• Built-in four pole low pass filter with a 70 kHz corner frequency suppressing unwanted out-of-band input signals
• Fully integrated 228 kHz oscillator
• Pilot presence detector and soft mono/stereo blend
• Built-in interference suppression
• External stereo lamp driver applicable
• Adjustable gain.

QUICK REFERENCE DATA

PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Supply voltage (pin 4) V Supply current V
= 3 V I
P
P
P
Total harmonic distortion THD − 0,3 − % Signal to noise ratio S/(S + N) − 70 − dB Channel separation α−40 − dB
1,8 − 6V
− 3 − mA

PACKAGE OUTLINE

8-lead mini-pack; plastic (S08; SOT96A); SOT96-1; 1996 July 24.
September 1986 2
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Low voltage PLL stereo decoder TDA7040T
Fig.1 Block diagram.

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Supply voltage range V Operating ambient temperature T Storage temperature range T
P amb stg
September 1986 3
−−7V
−10 −+ 70 °C
−55 −+ 150 °C
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Low voltage PLL stereo decoder TDA7040T

CHARACTERISTICS

V
= 3 V; T
P
Supply voltage (pin 4) V Supply current I Output voltage (r.m.s. value)
V
i(rms)
f = 1 kHz V
Channel balance
V
i(rms)
f = 1 kHz ∆G Output resistance R Total harmonic distortion
V
i(rms)
f = 1 kHz THD − 0,1 − % Total harmonic distortion
V
i(rms)
f = 1 kHz; V Signal-to-noise ratio
V
i(rms)
Signal-to-noise ratio
V
i(rms)
V
p(rms)
Channel separation
V
i(rms)
f = 1 kHz; V
Capture range
V
p(rms)
centre frequency ∆f −± 3 − % Carrier leak
V
i(rms)
V
p(rms)
f = 19 kHz − 30 − dB
f = 38 kHz − 50 − dB SCA (Subsidiary Communications Authorization) rejection
V
i(rms)
V
p(rms)
V
SCA(RMS)
= 25 °C; test circuit Fig.2; unless otherwise specified
amb
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
P
P
1,8 3,0 6,0 V
− 34mA
L and R 120 mV;
5, 6-1
− 240 − mV
L and R 40mV;
v
O
− 01dB
− 5 − kΩ
L and R 40 mV;
L and R 40 mV;
= 12 mV THD − 0,3 − %
p(rms)
= 120 mV; f = 1 kHz S/(S + N) − 70 − dB
= 120 mV; f = 1 kHz
= 12 mV S/(S + N) − 70 − dB
L and R 40 mV;
= 12 mV α−40 − dB
p(rms)
= 12 mV; deviation from
L and R 120 mV;
= 12 mV; f = 1 kHz;
L and R 120 mV;
= 12 mV; f = 1 kHz;
= 12 mV; f = 67 kHz α
67
− 70 − dB
September 1986 4
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Low voltage PLL stereo decoder TDA7040T
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
ACI (Adjacent channel interference)
V
L and R 120 mV;
i(rms)
V
V
V Traffic radio (V.W.F.) suppression α
α
57 VWF()
measured with: 91% stereo signal; fm = 1 kHz; 9% pilot signal; 5% traffic subcarrier (f = 57 kHz, f
= 12 mV; f = 1 kHz;
p(rms) ACI(RMS) ACI(RMS)
= 1,3 mV; f = 114 kHz α = 1,3 mV; f = 190 kHz α
=
------------------------------------------------------------------------------------­V
o spurious()
= 23 Hz AM, m = 60%)
m
V
o signal()
at1kHz( 23 Hz )±
at1kHz()
114 119 57(VWF)
− 90 − dB
− 85 − dB
− 75 − dB
Fig.2 Test circuit.
September 1986 5
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Low voltage PLL stereo decoder TDA7040T
Fig.3 Application diagram in combination with TDA7021T and TDA7050T.
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Low voltage PLL stereo decoder TDA7040T
CHARACTERISTICS Of the combination TDA7021T, TDA7040T and TDA7050T (Fig.3).
Conditions unless otherwise specified: V
= 1 mV; fhf = 97 MHz; f
vhf(rms)
measured unweighted in a range from 400 Hz to 15 kHz.
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Total harmonic distortion (pilot on)
= (L + R) signal; f
V
i
V
= L signal; f
i
mod
= 1 kHz THD − 0,5 − %
mod
= 1 kHz THD − 1,0 − %
Signal to noise ratio
V
= (L + R) signal; f
i
mod
= 1 kHz pilot off S/(S + N) − 56 − dB pilot on S/(S + N) − 50 − dB
Channel separation
V
= L-signal, f
i
f
= 97 MHz α
RF
V
= L-signal, f
i
= 87,5 MHz and 108 MHz α−14 − dB
f
RF
= 1 kHz; pilot on; − 26 − dB
mod
= 1 kHz; pilot on;
mod
Output voltage (pilot off)
Vi = (L + R) signal, f
= 1 kHz V
mod
o(rms)
= 22,5 kHz; f
dev
= 6,75 kHz; noise
dev pilot
− 80 − mV
a = measured in test circuit (Fig.2) b = measured in application diagram (Fig.3)
Fig.4 Channel separation as a function of audio frequency.
September 1986 7
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Low voltage PLL stereo decoder TDA7040T
Fig.5 Signal/noise and channel separation behaviour in Fig.3. at R1 = 270 kΩ and R2 = 13 kΩ;
without diode BAW62.
Fig.6 Signal/noise and channel separation behaviour in Fig.3.
at R1 = 200 kΩ, R2 = 30 kΩ; with diode BAW62.
September 1986 8
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Low voltage PLL stereo decoder TDA7040T

PACKAGE OUTLINE

SO8: plastic small outline package; 8 leads; body width 3.9 mm
D
c
y
Z
8
pin 1 index
1
e
5
A
2
A
4
w M
b
p

SOT96-1

E
H
E
1
L
detail X
A
X
v M
A
Q
(A )
L
p
A
3
θ
0 2.5 5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
mm
inches
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
A
max.
1.75
0.069
OUTLINE VERSION
SOT96-1
A
1
0.25
0.10
0.010
0.004
A2A
1.45
1.25
0.057
0.049
IEC JEDEC EIAJ
076E03S MS-012AA
0.25
0.01
b
3
p
0.49
0.25
0.36
0.19
0.019
0.0100
0.014
0.0075
(1)E(2)
cD
5.0
4.8
0.20
0.19
REFERENCES
4.0
3.8
0.16
0.15
0.050
September 1986 9
eHELLpQZywv θ
1.27
6.2
5.8
0.244
0.228
1.05
1.0
0.4
0.039
0.016
0.7
0.6
0.028
0.024
0.25 0.10.25
0.010.010.041 0.004
EUROPEAN
PROJECTION
(1)
0.7
0.3
0.028
0.012
ISSUE DATE
95-02-04 97-05-22
o
8
o
0
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Low voltage PLL stereo decoder TDA7040T
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
Reflow soldering
Reflow soldering techniques are suitable for all SO packages.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
(order code 9398 652 90011).
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
Wave soldering
Wave soldering techniques can be used for all SO packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.
• The longitudinal axis of the package footprint must be parallel to the solder flow.
• The package footprint must incorporate solder thieves at the downstream end.
September 1986 10
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Low voltage PLL stereo decoder TDA7040T

DEFINITIONS

Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
September 1986 11
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