Datasheet TDA6120Q-N1 Datasheet (Philips)

DATA SH EET

Preliminary specification
Supersedes data of 1997 Jul 17
File under Integrated Circuits, IC02

1997 Aug 27

INTEGRATED CIRCUITS

TDA6120Q

Video output amplifier

1997 Aug 27 2

Philips Semiconductors Preliminary specification

Video output amplifier TDA6120Q

FEATURES

• High large signal bandwidth of 32 MHz (typ.) at
125 V (p-p)

• High small signal bandwidth of 47 MHz (typ.) at
60 V (p-p)

• Rise/fall time of 12.5 ns for 125 V (p-p)

• High slew rate of 10 V/ns

• Low static power dissipation of 2.5 W at 200 V supply

voltage

• High maximum output voltage

• Bandwidth independent of voltage gain

• Maximum overall voltage gain over 46 dB

• High Power Supply Rejection Ratio (PSRR)

• Fast cathode current measurement output for dark

current control loop

• Differential voltage input.

GENERAL DESCRIPTION

The TDA6120Q is a single 30 MHz, 125 V (p-p) video
output amplifier contained in a plastic DIL-bent-SIL power
package.The device uses high-voltage DMOS technology
and is intended to drive the cathodes of a CRT in High
Definition TVs (HDTVs) or monitors.

ORDERING INFORMATION

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA6120Q DBS13P plastic DIL-bent-SIL power package; 13 leads (lead length 7.7 mm) SOT141-8

1997 Aug 27 3

Philips Semiconductors Preliminary specification

Video output amplifier TDA6120Q

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

MGK440

1×

1×

CURRENT

INPUT

out 1×

in

out 4×

MIRROR

1×

in out

CASCODE

MIRROR

4×

in out

CASCODE

+

J

5 mA

0.7 pF

TDA6120Q

9, 11

6

2

n.c.

V

CC

VIN−

1

3

4

RC−

RC+

VIN+

8

GND

12

13

7

OUTC

OUT

OUTM

IIN

V

DD

10

5

Fig.2 Top view.

handbook, full pagewidth

MGK441

442 Ω

68 pF

C1

RC−

RC+

1

35791113

2

4 6 8 10 12

22 Ω

VIN− VIN+

C

r

10 nF

C

CC
10
µF

C

DD

3.3
µF

C

C
22
nF

C

D
22
nF

TDA6120Q

22 kΩ

R

f

IIN OUTM n.c. n.c.

OUT

CRTVIN

147 Ω

R

flash

V

CC

V

DD

D

flash

OUTCGND

+12 V

+200 V

V

ref

R

ia

R

i

1997 Aug 27 4

Philips Semiconductors Preliminary specification

Video output amplifier TDA6120Q

PINNING

SYMBOL PIN DESCRIPTION

RC− 1 inverting input pre-emphasis

network
VIN− 2 inverting voltage input
RC+ 3 non-inverting input pre-emphasis

network
VIN+ 4 non-inverting voltage input
IIN 5 feedback current input
V

CC

6 low supply voltage (12 V)

OUTM 7 cathode current measurement

output
GND 8 power ground and heatsink
n.c. 9 not connected
V

DD

10 high supply voltage (200 V)
n.c. 11 not connected
OUTC 12 cathode output
OUT 13 feedback output

Fig.3 Pin configuration.

handbook, halfpage

RC−

VIN−

RC+

VIN+

IIN

V

CC

OUTM

GND

n.c.

V

DD

n.c.

OUTC

OUT

1
2
3
4
5
6
7
8

9
10
11
12
13

TDA6120Q

MGK438

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

Note

1. 1250 V for IIN (pin 5).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

DD

high supply voltage 0 280 V

V

CC

low supply voltage 0 20 V

V

i

input voltage (pins 2 and 4) 0 V

CC

V

V

i(dif)

differential mode input voltage (pins 2 and 4) −V

CC

V

CC

V

V

i(pe)

pre-emphasis input voltage (pins 1 and 3) 0 V

CC

V

V

i(dif)(pe)

differential mode pre-emphasis input voltage
(pins 1 and 3)

−V

CC

V

CC

V

V

IIN

input voltage (pin 5) 0 2V

BE

V

V

OUTM

measurement output voltage 0 20 V

V

o

output voltage (pins 12 and 13) 0 V

DD

V

T

stg

storage temperature −55 +150 °C

T

j

junction temperature −20 +150 °C

V

ESD

voltage peak human body model note 1 − 2000 V
voltage peak machine model − 300 V

1997 Aug 27 5

Philips Semiconductors Preliminary specification

Video output amplifier TDA6120Q

QUALITY SPECIFICATION

Quality specification in accordance with

“SNW-FQ-611 part E”

.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-c

thermal resistance from junction to case 3.0 K/W

Fig.4 Power derating curve.

(1) Infinite heatsink.
(2) No heatsink.

handbook, halfpage

−20 160

20

0

(1)

(2)

4

MGK442

8

12

16

04020 80 120

T

amb

(°C)

P

tot

(W)

1997 Aug 27 6

Philips Semiconductors Preliminary specification

Video output amplifier TDA6120Q

CHARACTERISTICS

Operating range: T

j

= −20 to +150 °C; VDD= 180 to 210 V; VCC= 10.8 to 13.2 V; V

OUTM

= 4 to 20 V; V

VIN−

= 1.5 to 5 V;

V

VIN+

= 1.5 to 5 V.

Test conditions: T

amb

=25°C; VDD= 200 V; VCC= 12 V; V

VIN+

=3V; V

OUTM

=6V; CL= 10 pF (CL consists of parasitic

and cathode capacitance); R

th h

= 4 K/W; test circuit of Fig.5; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

DD(q)

quiescent high voltage supply
current

V

OUTC

= 100 V 8 10 12 mA

I

CC(q)

quiescent low voltage supply
current

V

VIN−=VVIN+

25 31 39 mA

I

bias

input bias current
(pins 2 and 4)

V

OUTC

= 100 V − 30 −µA

V

OUTC

DC output voltage
(pins 12 and 13)

V

VIN−=VVIN+

70 100 130 V

∆V

OUTC(T)

DC output voltage
temperature drift
(pins 12 and 13)

V

VIN−=VVIN+

−−5V

I

(offset)OUTM

offset current of measurement
output

note 1 −40 +20 +120 µA

∆I

OUTM

/∆I

OUTC

linearity of current transfer −50 µA<I

OUTC

< +50 µA;

note 1

− 1.0 −

C

i

input capacitance
(pins 2 and 4)

V

OUTC=VOUTC(max)

− 3 − pF

I

OUTC(max)

maximum dynamic peak
output current (pin 12)

20V<V

OUTC<VDD

− 20 V − 100 − mA

V

OUTC(min)

minimum output voltage
(pin 12)

− 410V

V

OUTC(max)

maximum output voltage
(pin 12)

VDD− 10 VDD− 6 − V

G

int

internal gain 1.68 1.87 2.08

B

s

small signal bandwidth
(pin 12)

V

OUTC(AC)

= 60 V (p-p);

V

OUTC(DC)

= 100 V

40 47 − MHz

B

l

large signal bandwidth
(pin 12)

V

OUTC(AC)

= 125 V (p-p);

V

OUTC(DC)

= 100 V

28 32 − MHz

t

pd

cathode output propagation
time 50% input to 50% output
(pin 12)

V

OUTC(AC)

= 125 V (p-p);

V

OUTC(DC)

= 100 V;
square wave; f < 1 MHz;
t

f(VIN−)

= 10 ns;

t

r(VIN−)

= 10 ns;

see Figs 6 and 7

10 − 15 ns

t

o(r)

cathode output rise time
10% output to 90% output
(pin 12)

V

OUTC(AC)

= 125 V (p-p);
V

OUTC(DC)

= 100 V;
square wave; f < 1 MHz;
t

f(VIN−)

= 10 ns;

t

r(VIN−)

= 10 ns;

see Fig.6

10 14 18 ns

1997 Aug 27 7

Philips Semiconductors Preliminary specification

Video output amplifier TDA6120Q

Notes

1. The operating range of the measurement output OUTM is 4 to 20 V. Below 4 V, OUTM acts as a voltage source with
an output resistance such that the maximum current input from OUTM is 2 mA.

a) The linearity of the current transfer is guaranteed until a junction temperature of 125 °C.

2. The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage.

t

o(f)

cathode output fall time
90% output to 10% output
(pin 12)

V

OUTC(AC)

= 125 V (p-p);

V

OUTC(DC)

= 100 V;
square wave; f < 1 MHz;
t

f(VIN−)

= 10 ns;

t

r(VIN−)

= 10 ns;

see Fig.7

10 12.5 15 ns

t

st

settling time 50% input to
(99% < output < 101%)
(pin 12)

V

OUTC(AC)

= 125 V (p-p);
V

OUTC(DC)

= 100 V;
square wave f < 1 MHz;
t

f(VIN−)

= 10 ns;

t

r(VIN−)

= 10 ns;

see Figs 6 and 7

−−250 ns

SR

r

slew rate rise between
30Vto(VDD− 30 V) (pin 12)

V

VIN−

= 2 V (p-p) square
wave; f < 1 MHz;
t

f(VIN−)

= 10 ns;

t

r(VIN−)

=10ns

− 8 − V/ns

SR

f

slew rate fall between
(VDD− 30 V) to 30 V (pin 12)

V

VIN−

= 2 V (p-p) square
wave; f < 1 MHz;
t

f(VIN−)

= 10 ns;

t

r(VIN−)

= 10 ns;

− 10 − V/ns

O

Vr

cathode output voltage
overshoot rise (pin 12)

V

OUTC(AC)

= 125 V (p-p);

V

OUTC(DC)

= 100 V;
square wave; f < 1 MHz;
t

f(VIN−)

= 10 ns;

t

r(VIN−)

= 10 ns;

see Figs 6 and 7

− 5 − %

O

Vf

cathode output voltage
overshoot fall (pin 12)

V

OUTC(AC)

= 125 V (p-p);
V

OUTC(DC)

= 100 V;
square wave; f < 1 MHz;
t

f(VIN−)

= 10 ns;

t

r(VIN−)

= 10 ns;

see Figs 6 and 7

− 20 − %

PSRRh high voltage power supply

rejection ratio

f < 50 kHz; note 2 − 44 − dB

PSRRl low voltage power supply

rejection ratio

f < 50 kHz; note 2 − 48 − dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1997 Aug 27 8

Philips Semiconductors Preliminary specification

Video output amplifier TDA6120Q

Fig.5 Test circuit with gain of 40 dB.

handbook, full pagewidth

MGK443

442 Ω

22 Ω

R

ia

R

i

47 Ω

R

CC

47 Ω

R

DD

147 Ω

R

flash

68 pF

22 kΩ

R

f

C1

2 MΩ

1 kΩ

R3

100 kΩ

R2

C

CCC

50 Ω

R

a

R

ba

1 kΩ

R

bb

RC−

VIN−

VIN

+12 V

+200 V

V

ref

RC+

VIN+

IIN

V

CC

OUTM

GND

I

m

V

DD

OUTC

OUT

VOUT

1

2

C11 10 µF

C10 22 nF

C13 10 µF

47 µF

C

CC

10 nF

C8

6.8 pF

C7

3.3 pF
C9

136 pF

C

DDD

10 µF

C

DD

10 nF

C12 22 nF

3
4

5

6

7

8

10

12

13

TDA6120Q

Overall gain G

int

R

f

R

i

-----

×=

1997 Aug 27 9

Philips Semiconductors Preliminary specification

Video output amplifier TDA6120Q

162.5
150

100

50

37.5

163.75

161.25

t

st

overshoot (in %)

t

t

0

x

x

t

o(r)

V

oc

V

i

MGK444

t

pd

Fig.6 Output (pins 12 and 13; rising edge) as a function of input signal.

1997 Aug 27 10

Philips Semiconductors Preliminary specification

Video output amplifier TDA6120Q

Fig.7 Output (pins 12 and 13; falling edge) as a function of input signal.

162.5
150

100

50

37.5

38.75

36.25

overshoot (in %)

t

t

0

x

x

MGK445

V

oc

V

i

t

pd

t

st

t

o(r)

FLASHOVER PROTECTION

The TDA6120Q does NOT include protection diodes that
clamp the cathode output pin to the high voltage supply pin
during a CRT flashover discharge. Therefore an external
high voltage reverse biased diode has to be connected
between the OUTC pin and the VDD pin. An external 147 Ω
carbon high-voltage resistor in combination with a 2 kV
spark gap between the cathode and ground will limit the
maximum clamp current (for this resistor value, the CRT
has to be connected to the main printed-circuit board).

This external network causes an increase in the rise and
fall times and a decrease in the overshoot.

Pin 10 must be decoupled to pin 8:

• By a capacitor >22 nF with good HF behaviour (e.g. foil).
This capacitor must be placed as close as possible to
pin 10 and pin 8; definitely within 5 mm.

• By a capacitor >3.3 µF on the picture tube base printed
circuit board (common for three output stages).

1997 Aug 27 11

Philips Semiconductors Preliminary specification

Video output amplifier TDA6120Q

TEST AND APPLICATION INFORMATION
Dissipation

Regarding dissipation, distinction must be made between
static dissipation (independent of frequency) and dynamic
dissipation (proportional to frequency). The static
dissipation of the TDA6120Q is due to supply currents, and
currents in the feedback network and CRT.

The static dissipation is given by the following equation:

Where:

R

f

= feedback resistance

I

OUTC

= DC cathode current.

The dynamic dissipation is given by the following equation:

P

stat

V

CCICCVDDIDDVOUTC

V

OUTC

RfI

OUTC

–

---------------------------

×–×+×=

P

dyn

V

DD

CLC

int

+()f×V

OUTC p p–()

× b××=

Where:

C

L

= load capacitance

C

int

= effective internal load capacitance

(approximately 7 pF)
f = frequency
V

OUTC(p-p)

= output voltage (peak-to-peak value)

b = non-blanking duty cycle (0.8).

The IC must be mounted on the picture tube base
printed-circuit board to minimize the load capacitance CL.

Switch-off

The voltage at output pins OUT and OUTC will be pulled
to ground when the low voltage supply voltage (V

CC

) is

switched off.

1997 Aug 27 12

Philips Semiconductors Preliminary specification

Video output amplifier TDA6120Q

INTERNAL PIN CONFIGURATION

Fig.8 Internal pin diagram.

andbook, full pagewidth

MGK439

ESD

ESD

ESD

ESD

TDA6120Q

7

8

12

10

6

ESD

ESD

13

2

1

ESD

ESD

ESD

4

3

ESD

5

RC+

VIN+

RC−

OUTC

V

DD

V

CC

OUT

OUTM

GND

VIN−

IIN

1997 Aug 27 13

Philips Semiconductors Preliminary specification

Video output amplifier TDA6120Q

PACKAGE OUTLINE

UNIT A e

1

A2bpcD

(1)

E

(1)

Z

(1)

deD

h

LL3m

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

17.0

15.5

4.6

4.2

0.75

0.60

0.48

0.38

24.0

23.6

20.0

19.6

10 3.4

12.2

11.8

1.7

e

2

5.08

2.4

1.6

E

h

6

2.00

1.45

2.1

1.8

3.4

3.1

4.3

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

8.4

7.0

SOT141-8

0 5 10 mm

scale

Qj

0.25

w

0.6

v

0.03

x

D

L

E

A

c

A

2

m

L

3

Q

w M

b

p

1

d

Z

e

2

e

e

113

j

92-11-17
95-03-11

DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 7.7 mm)

SOT141-8

v M

D

x

h

E

h

non-concave

view B: mounting base side

B

1997 Aug 27 14

Philips Semiconductors Preliminary specification

Video output amplifier TDA6120Q

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

1997 Aug 27 15

Philips Semiconductors Preliminary specification

Video output amplifier TDA6120Q

NOTES

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1997 SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

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Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]
Middle East: see Italy

Printed in The Netherlands 547047/1200/02/pp16 Date of release: 1997 Aug 27 Document order number: 9397 750 02701