Datasheet TDA6108JF Specification

INTEGRATED CIRCUITS

DATA SH EET

TDA6108JF

Triple video output amplifier

Product specification
Supersedes data of 1998 Jun 22
File under Integrated Circuits, IC02

1999 Oct 29

Philips Semiconductors Product specification

Triple video output amplifier TDA6108JF

FEATURES

• Typical bandwidth of 9.0 MHz for an output signal of

• Black-Current Stabilization (BCS) circuit

• Thermal protection.

60 V (p-p)

• High slew rate of 1850 V/µs

• No external components required

• Very simple application

• Single supply voltage of 200 V

• Internal reference voltage of 2.5 V

• Fixed gain of 51

GENERAL DESCRIPTION

The TDA6108JF includes three video output amplifiers in
oneplasticDIL-bent-SIL9-pinmediumpower(DBS9MPF)
package (SOT111-1), using high-voltage DMOS
technology, and is intended to drive the three cathodes of
a colour CRT directly. To obtain maximum performance,
the amplifier should be used with black-current control.

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA6108JF DBS9MPF plastic DIL-bent-SIL medium power package with fin; 9 leads SOT111-1

BLOCK DIAGRAM

handbook, full pagewidth

V

DD

6

f

3×

MIRROR 5

CASCODE 1

CASCODE 2

V

1×

9, 8, 7

4

MGL318

oc(3),

V

oc(2),

V

oc(1)

5

I

o(m)

MIRROR 1

TDA6108JF

MIRROR 4

CURRENT

SOURCE

1×

THERMAL

PROTECTION

CIRCUIT

V

,

i(1)

1, 2, 3

V

,

i(2)

V

i(3)

R

i
R

a

VIP

REFERENCE

MIRROR 3

DIFFERENTIAL

STAGE

R

3×

MIRROR 2

Fig.1 Block diagram (one amplifier shown).

1999 Oct 29 2

Philips Semiconductors Product specification

Triple video output amplifier TDA6108JF

PINNING

SYMBOL PIN DESCRIPTION

V

i(1)

V

i(2)

V

i(3)

GND 4 ground (fin)
I

om

V

DD

V

oc(3)

V

oc(2)

V

oc(1)

1 inverting input 1
2 inverting input 2
3 inverting input 3

5 black current measurement output
6 supply voltage
7 cathode output 3
8 cathode output 2
9 cathode output 1

handbook, halfpage

V
V
V

V

i(1)

V

i(2)

V

i(3)

GND

I

om

V

DD
oc(3)
oc(2)
oc(1)

1
2
3
4
5

TDA6108JF

6
7
8
9

MGL319

Fig.2 Pin configuration.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); voltages measured with respect to pin 4 (ground);
currents as specified in Fig.1; unless otherwise specified.

SYMBOL PARAMETER MIN. MAX. UNIT

V

DD

V

i

V

om

V

oc

T

stg

T

j

V

es

supply voltage 0 250 V
input voltage 0 12 V
measurement output voltage 0 6V
cathode output voltage 0 V

DD

V
storage temperature −55 +150 °C
junction temperature −20 +150 °C
electrostatic handling

human body model (HBM) − 2000 V
machine model (MM) − 300 V

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices (see

“Handling MOS Devices”

).

QUALITY SPECIFICATION

Quality specification

“SNW-FQ-611 part D”

is applicable.

1999 Oct 29 3

Philips Semiconductors Product specification

Triple video output amplifier TDA6108JF

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

R

th(j-fin)

R

th(h-a)

Note

1. An external heatsink is necessary.

thermal resistance from junction to ambient 56 K/W
thermal resistance from junction to fin note 1 11 K/W
thermal resistance from heatsink to ambient 10 K/W

Thermal protection

handbook, halfpage

8

P

tot

(W)

6

4

2

0

−20 20

(1) Infinite heatsink.
(2) No heatsink.

(1)

(2)

60 100 140

T

Fig.3 Power derating curves.

MGL322

amb

180

(°C)

The internal thermal protection circuit gives a decrease of
the slew rate at high temperatures: 10% decrease at
130 °C and 30% decrease at 145 °C (typical values on the
spot of the thermal protection circuit).

handbook, halfpage

outputs

5 K/W

thermal protection circuit

6 K/W

fin

MGK279

Fig.4 Equivalent thermal resistance network.

1999 Oct 29 4

Philips Semiconductors Product specification

Triple video output amplifier TDA6108JF

CHARACTERISTICS

Operating range: Tj= −20 to +150 °C; VDD= 180 to 210 V. Test conditions: T
V

o(c1)=Vo(c2)=Vo(c3)

=1⁄2VDD; CL= 10 pF (CL consists of parasitic and cathode capacitance); R

(measured in test circuit of Fig.8); unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

q

V

ref(int)

quiescent supply current 8.8 10.3 11.7 mA
internal reference voltage

(input stage)

R

i

input resistance − 3.2 − kΩ
G gain of amplifier 47.5 51.0 55.0
∆G gain difference −2.5 0 +2.5
V

O(c)

nominal output voltage at

Ii=0µA 116 129 142 V

pins 7, 8 and 9 (DC value)
∆V

O(c)(offset)

differential nominal output

Ii=0µA − 05V
offset voltage between
pins 7 and 8, 8 and 9 and
9 and 7 (DC value)

∆V

o(c)(T)

output voltage temperature
drift at pins 7, 8 and 9

∆V

o(c)(T)(offset)

differential output offset
voltage temperature drift
between pins 7 and 8,
8 and 9 and 7 and 9

I

o(m)(offset)

∆I

/∆I

o(m)

offsetcurrentofmeasurement
output (for 3 channels)

linearity of current transfer −100µA<I

o(c)

I

=0µA;

o(c)

1.5 V < Vi< 5.5 V;

3V<V

o(m)

<6V

< 100 µA;

o(c)

1.5 V < Vi< 5.5 V;

I

o(c)(max)

maximum peak output current

3V<V

50V<V

<6V

o(m)

o(c)<VDD

− 50 V − 28 − mA

(pins 7, 8 and 9)

V

o(c)(min)

minimum output voltage

Vi= 7.0 V; note 1 −−10 V
(pins 7, 8 and 9)

V

o(c)(max)

maximum output voltage

Vi= 1.0 V; note 1 VDD− 15 −−V
(pins 7, 8 and 9)

B

S

small signal bandwidth

V

= 60 V (p-p) − 9.0 − MHz

o(c)

(pins 7, 8 and 9)

B

L

large signal bandwidth

V

= 100 V (p-p) − 8.0 − MHz

o(c)

(pins 7, 8 and 9)

t

Pco

cathode output propagation
time 50% input to 50% output
(pins 7, 8 and 9)

V

= 100 V (p-p)

o(c)

square wave; f <1 MHz;

tr=tf=40ns

(pins 1, 2 and 3);

see Figs 6 and 7

=25°C; VDD= 200 V;

amb

= 18 K/W

th(h-a)

− 2.5 − V

−−10 − mV/K

− 0 − mV/K

−50 − +50 µA

0.9 1.0 1.1

− 32 − ns

1999 Oct 29 5

Philips Semiconductors Product specification

Triple video output amplifier TDA6108JF

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

∆t

Pco

t

o(r)

t

o(f)

t

st

SR slew rate between

O

v

PSRR power supply rejection ratio f < 50 kHz; note 2 − 65 − dB

α

ct(DC)

difference in cathode output
propagationtime50% inputto
50% output (pins 7 and 8,
7 and 9 and 8 and 9)

cathode output rise time
10% output to 90% output
(pins 7, 8 and 9)

cathode output fall time
90% output to 10% output
(pins 7, 8 and 9)

settling time 50% input to
99% < output < 101%
(pins 7, 8 and 9)

50Vto(VDD− 50 V)
(pins 7, 8 and 9)

cathode output voltage
overshoot (pins 7, 8 and 9)

DC crosstalk between
channels

V

= 100 V (p-p)

o(c)

square wave; f < 1 MHz;

tr=tf=40ns

(pins 1, 2 and 3)

V

= 50 to 150 V square

o(c)

wave; f < 1 MHz; tf=40ns

(pins 1, 2 and 3); see Fig.6

V

= 150 to 50 V square

o(c)

wave; f < 1 MHz; tr=40ns

(pins 1, 2 and 3); see Fig.7

V

= 100 V (p-p)

o(c)

square wave; f < 1 MHz;

tr=tf=40ns

(pins 1, 2 and 3);

see Figs 6 and 7

Vi= 4 V (p-p) square wave;

f < 1 MHz; tr=tf=40ns

(pins 1, 2 and 3)

V

= 100 V (p-p)

o(c)

square wave; f < 1 MHz;

tr=tf=40ns

(pins 1, 2 and 3);

see Figs 6 and 7

−10 0 +10 ns

35 50 65 ns

35 50 65 ns

−−350 ns

− 1850 − V/µs

− 10 − %

− 50 − dB

Notes

1. See also Fig.5 for the typical DC-to-DC transfer of Vito V

o(c)

.

2. The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage.

1999 Oct 29 6

Philips Semiconductors Product specification

Triple video output amplifier TDA6108JF

200

handbook, halfpage

V

o(c)

(V)

160

129

120

80

40

0

0

2.5

2

46

Fig.5 Typical DC-to-DC transfer of Vito V

Vi (V)

MGL371

o(c)

.

1999 Oct 29 7

Philips Semiconductors Product specification

Triple video output amplifier TDA6108JF

4.18

V

i

(V)

3.09

2.00

t

st

Ov (in %)

150
140

V

o(c)

(V)

100

60
50

t

o(r)

t

Pco

t

151

149

t

MGL369

Fig.6 Output voltage (pins 7, 8 and 9) rising edge as a function of the AC input signal.

1999 Oct 29 8

Philips Semiconductors Product specification

Triple video output amplifier TDA6108JF

4.18

V

i

(V)

3.09

2.00

t

st

150
140

V

o(c)

(V)

100

Ov (in %)

60
50

t

o(f)

t

Pco

t

51

49

t

MGL370

Fig.7 Output voltage (pins 7, 8 and 9) falling edge as a function of the AC input signal.

1999 Oct 29 9

Philips Semiconductors Product specification

Triple video output amplifier TDA6108JF

External flashover protection

For sufficient flashover protection it is necessary to apply
an external diode and 100 Ω resistor for each channel.
See application note

of TDA6107Q/N1”

“Application and Product description

(report number AN96072).

To limit the diode current an external 1 kΩ carbon
high-voltage resistor in series with the external diode and
a 2 kV spark gap are needed (for this resistor value, the
CRT has to be connected to the main PCB).

VDD must be decoupled to GND:

1. With a capacitor >20 nF with good HF behaviour
(e.g. foil); this capacitor must be placed as close as
possible to pins 6 and 4, but definitely within 5 mm.

2. With a capacitor >3.3 µF on the picture tube base
print.

Switch-off behaviour

Theswitch-offbehaviourof the TDA6108JF iscontrollable.
This is due to the fact that the output pins of the
TDA6108JF are still under control of the input pins for low
power supply voltages (approximately 30 V and higher).

Bandwidth

The addition of the flash resistor produces a decreased
bandwidth and increases rise and fall times. For further
information, see Application note of the TDA6108JF.

Dissipation

Regarding dissipation, distinction must first be made
between static dissipation (independent of frequency) and
dynamic dissipation (proportional to frequency).

The static dissipation of the TDA6108JF is due to voltage
supply currents and load currents in the feedback network
and CRT.

The static dissipation P

P

stat

V

DDIDD

stat

3V

O(c)IO(c)

equals:

××+×=

Where:

V

= supply voltage

DD

IDD= supply current
V

= DC value of cathode voltage

O(c)

I

= DC value of cathode current.

O(c)

The dynamic dissipation P

P

3VDDCLC

dyn

equals:

dyn

+()fiV

int

o(c)(p-p)

δ×××××=

Where:

= load capacitance

C

L

C

= internal load capacitance (≈4 pF)

int

fi= input frequency
V

= output voltage (peak-to-peak value)

o(c)(p-p)

δ = non-blanking duty cycle.

The IC must be mounted on the picture tube base print to
minimize the load capacitance CL.

1999 Oct 29 10

Philips Semiconductors Product specification

Triple video output amplifier TDA6108JF

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

V

i(1)

V

i(2)

V

i(3)

C1

22 µF

C2

22 nF

C3

22 µF

C4

22 nF

C5

22 µF

C6

22 nF

V

DD

20 nFC710 µF

C10

6.8 pF

C11
136 pF

C13

6.8 pF

C14
136 pF

C16

6.8 pF

C17
136 pF

V

o(m)

4 V

I

I

I

of

om

of

om

of

om

V

V

V

oc(1)

oc(2)

oc(3)

6

9

C9

3.2 pF

8

C12

3.2 pF

7

C15

3.2 pF

5

J1

R

i

1

R

a

J2

R

i

2

R

a

J3

R

i

3

R

a

VIP

REFERENCE

R

f

V

1

R

f

V

2

R

f

V

3

TDA6108JF

4

C8

R1
2 MΩ

probe 1

R2
100 kΩ

R3
2 MΩ

probe 2

R4
100 kΩ

R5
2 MΩ

probe 3

R6
100 kΩ

Current sources J1, J2 and J3 are to be tuned so that V

of pins 9, 8 and 7 is set to 100 V.

o(c)

Fig.8 Test circuit.

1999 Oct 29 11

MGL321

Philips Semiconductors Product specification

Triple video output amplifier TDA6108JF

INTERNAL CIRCUITRY

handbook, full pagewidth

to cascode

stage

1, 2, 3

esd

to black current

measurement circuit

5

6.8 Vesd

to black current

measurement circuit

(1) All pins have an energy protection for positive or negative overstress situations.

from

control

circuit

from

control

circuit

GND

46

TDA6108JF

from

input

circuit

from
input

circuit

esd

V

DD

to black current

measurement circuit

(1)

flash

7, 8, 9

MGL320

V

bias

esd

esd

esd

measurement circuit

to black current

Fig.0 Internal pin configuration.

1999 Oct 29 12

Philips Semiconductors Product specification

Triple video output amplifier TDA6108JF

PACKAGE OUTLINE

DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads

D

D

1

q

P

pin 1 index

P

1

q

2

q

1

SOT111-1

A

2

Q

A

3

A

A

4

E

seating plane

19

Z

b

e

2

b

b

1

0 5 10 mm

scale

DIMENSIONS (mm are the original dimensions)

A

UNIT A A

mm

2

max. max.

18.5

3.7

17.8

8.7

8.0

b

0.67

0.50

b

1

2

1.40

1.14

bcD

A

3

4

15.5

1.40

15.1

1.14

0.48

0.38

(1)

21.8

21.4

(1)

D

E

12

21.4

6.48

20.7

6.20

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

IEC JEDEC EIAJ

REFERENCES

SOT111-1

L

c

w M

eLPP1q1q

e

2.54

2.54

3.9

3.4

2.75

2.50

3.4

3.2

Q

1.75

1.55

q

15.1

14.9

4.4

4.2

EUROPEAN

PROJECTION

e

2

θ

2

5.9

5.7

(1)

Z

w

0.25

1.0

ISSUE DATE

92-11-17
95-03-11

θ

o

65

o

55

1999 Oct 29 13

Philips Semiconductors Product specification

Triple video output amplifier TDA6108JF

SOLDERING
Introduction to soldering through-hole mount

packages

This text gives a brief insight to wave, dip and manual
soldering.Amorein-depthaccountofsolderingICscanbe
found in our

Packages”

Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.

Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.

Suitability of through-hole mount IC packages for dipping and wave soldering methods

DBS, DIP, HDIP, SDIP, SIL suitable suitable

Note

1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

“Data Handbook IC26; Integrated Circuit

(document order number 9398 652 90011).

PACKAGE

Thetotalcontacttimeofsuccessive solder waves must not
exceed 5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.

SOLDERING METHOD

DIPPING WAVE

(1)

stg(max)

). If the

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1999 Oct 29 14

Philips Semiconductors Product specification

Triple video output amplifier TDA6108JF

NOTES

1999 Oct 29 15

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1999

Internet: http://www.semiconductors.philips.com

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Printed in The Netherlands 545004/200/03/pp16 Date of release: 1999 Oct 29 Document order number: 9397 750 06486