Datasheet TDA6108AJF Datasheet

Page 1

TDA6108AJF

Triple video output ampliﬁer

Rev. 03 — 20 April 2005 Product data sheet

1. General description

The TDA6108AJF contains three video output ampliﬁers which are intended to drive the three cathodes of a color CRT. The device is contained in a plastic DIL-bent-SIL 9-pin medium power (DBS9MPF) package, and uses high-voltage DMOS technology.

To obtain maximum performance, the ampliﬁer should be used with black-current control.

2. Features

■ Typical bandwidth of 9.0 MHz for an output signal of 60 V (p-p)

■ High slew rate of 1310 V/µs

■ No external components required

■ Very simple application

■ Single supply voltage of 200 V

■ Internal reference voltage of 2.5 V

■ Fixed gain of 81

■ Black-Current Stabilization (BCS) circuit with voltage window from 1.5 V to 6 V and

current window from +100 µA to −10 mA

■ Thermal protection

3. Ordering information

Table 1: Ordering information

Type number Package

Name Description Version

TDA6108AJF DBS9MPF plastic DIL-bent-SIL medium power package with ﬁn; 9 leads SOT111-1

Page 2

Philips Semiconductors

4. Block diagram

TDA6108AJF

Triple video output ampliﬁer

CURRENT

SOURCE

i(1),

1, 2, 3

i(2),

i(3)

Fig 1. Block diagram

MIRROR 1

THERMAL

PROTECTION

CIRCUIT

3×

TDA6108AJF

VIP

REFERENCE

MIRROR 3

MIRROR 4

DIFFERENTIAL

MIRROR 2

STAGE

MIRROR 5

CASCODE 1

3×

mce462

oc(1), oc(2),

oc(3)

1×

CASCODE 2

9, 8, 7

Product data sheet Rev. 03 — 20 April 2005 2 of 16

Page 3

Philips Semiconductors

5. Pinning information

5.1 Pinning

GND

i(1)

i(2)

i(3)

oc(3)

oc(2)

oc(1)

TDA6108AJF

Triple video output ampliﬁer

001aac594

Fig 2. Pin conﬁguration

5.2 Pin description

Table 2: Pin description

Symbol Pin Description

i(1)

i(2)

i(3)

GND 4 ground I

oc(3)

oc(2)

oc(1)

1 inverting input 1 2 inverting input 2 3 inverting input 3

5 black-current measurement output 6 supply voltage 7 cathode output 3 8 cathode output 2 9 cathode output 1

Product data sheet Rev. 03 — 20 April 2005 3 of 16

Page 4

Philips Semiconductors

6. Internal circuitry

GND

TDA6108AJF

Triple video output ampliﬁer

TDA6108AJF

from

input

circuit

from input

circuit

1, 2, 3

esd

to black-current

measurement circuit

6.8 Vesd

to black-current

measurement circuit

to cascode

stage

from control circuit

from blackcurrent measurement circuit

from control circuit

(1) All pins have an energy protection for positive or negative overstress situations.

Fig 3. Internal pin conﬁguration

7. Limiting values

esd

to black-current

measurement circuit

(1)

flash

esd

bias

esd

to black-current

measurement circuit

7, 8, 9

mce465

Table 3: Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages measured with respect to ground; currents as speciﬁed in

Figure 9; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Max Unit

om(mean)

stg

esd

supply voltage 0 250 V input voltage at pins V

i(1)

, V

i(2)

and V

i(3)

012V

measurement output voltage 0 6 V

| absolute value of mean current of

measurement output (for three channels) cathode output voltage 0 V

Voc=0VtoVDD; V

= 1.5 V to 6 V

- 5.6 mA

storage temperature −55 +150 °C junction temperature −20 +150 °C electrostatic discharge voltage Human Body Model (HBM) - ±3000 V

Machine Model (MM) - ±300 V

Product data sheet Rev. 03 — 20 April 2005 4 of 16

Page 5

Philips Semiconductors

8. Thermal characteristics

Table 4: Thermal characteristics

Symbol Parameter Conditions Typ Unit

th(j-a)

th(j-ﬁn)

thermal resistance from junction to ambient

thermal resistance from junction to ﬁn

TDA6108AJF

Triple video output ampliﬁer

in free air 56 K/W

[1]

11 K/W

[1] An external heatsink is necessary; see

tot

(W)

−40 0 40 80 160120

(1) Inﬁnite heatsink. (2) No heatsink.

Fig 4. Power derating curve

Application Note AN10227-01

mbh989

(1)

(2)

amb

(°C)

8.1 Thermal protection

The internal thermal protection circuit gives a decrease of the slew rate at high temperatures: 10 % decrease at 130 °C and 30 % decrease at 145 °C (typical values on the spot of the thermal protection circuit).

outputs

5 K/W

thermal protection circuit

6 K/W

fin

Fig 5. Equivalent thermal resistance network

Product data sheet Rev. 03 — 20 April 2005 5 of 16

mgk279

Page 6

Philips Semiconductors

TDA6108AJF

Triple video output ampliﬁer

9. Characteristics

Table 5: Characteristics

Operating range: Tj=−20°C to +150°C; VDD= 180 V to 210 V; test conditions: T V

oc(1)=Voc(2)=Voc(3)

in test circuit of

= 0.5VDD; CL= 10 pF (CL consists of parasitic and cathode capacitance); R

Figure 9; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

ref(int)

quiescent supply current 7.9 9.4 10.8 mA internal reference voltage (input

stage)

input resistance - 2.1 - kΩ G gain of ampliﬁer 73 81 89 ∆G gain difference −4.2 0 +4.2 PSRR power supply rejection ratio f < 50 kHz

ct(DC)

Measurement output pin I

om(clamp)

DC crosstalk between channels - −50 - dB

; Voc=V

oc(min)

to V

oc(max)

clamping voltage of

measurement output I

om(offset)

/∆I

∆I

Output pins V

oc(DC)

∆V

oc(DC)(offset)

offset current of measurement

output (for three channels)

linearity of current transfer

(for three channels)

, V

oc(2)

, V

oc(3)

oc(1)

DC output voltage Ii=0µA 768797V

differential DC output offset

Ioc=0µA; V

=1.5Vto6V

Ioc= −100 µA to +100 µA; V

= 1.5 V to 6 V

= −100 µA to +10 mA;

= 1.5 V to 4 V

Ii=0µA −5 0 +5 V

voltage between two output pins ∆V

oc(T)

∆V

oc(T)(offset)

output voltage temperature drift - 10 - mV/K

differential output offset voltage

temperature drift between two

output pins I

oc(max)

oc(min)

oc(max)

oc(p)

∆t

oc(p)

maximum peak output current Voc=50VtoVDD− 50 V - 28 - mA

minimum output voltage Vi = 4.5 V; at Ioc = 0 mA

maximum output voltage Vi= 0.5 V; at Ioc=0mA

small signal bandwidth Voc= 60 V (p-p) - 9.0 - MHz

large signal bandwidth Voc= 100 V (p-p) - 8.0 - MHz

cathodeoutputpropagationtime

50 % input to 50 % output

difference in cathode output

propagation time 50 % input to

Voc= 100 V (p-p) square wave

= 100 V (p-p) square

wave 50 % output (between two output pins)

oc(r)

oc(f)

cathode output rise time 10 % output to 90 % output

cathode output fall time 90 % output to 10 % output

Voc= 50 V to 150 V square

wave

Voc= 150 V to 50 V square

wave

=25°C; VDD= 200 V;

amb

= 18 K/W; measured

th(h-a)

- 2.5 - V

[1]

-65-dB

6 - 10 V

−50 - +50 µA

−0.9 −1.0 −1.1

- 0 - mV/K

[2]

--10V

[2]

VDD− 15 - - V

[3]

-32-ns

[3]

−10 0 +10 ns

[3]

35 50 70 ns

[3]

35 50 65 ns

Product data sheet Rev. 03 — 20 April 2005 6 of 16

Page 7

Philips Semiconductors

TDA6108AJF

Triple video output ampliﬁer

Table 5: Characteristics

Operating range: Tj=−20°C to +150°C; VDD= 180 V to 210 V; test conditions: T V

oc(1)=Voc(2)=Voc(3)

in test circuit of

Figure 9; unless otherwise speciﬁed.

…continued

=25°C; VDD= 200 V;

amb

= 0.5VDD; CL= 10 pF (CL consists of parasitic and cathode capacitance); R

= 18 K/W; measured

th(h-a)

Symbol Parameter Conditions Min Typ Max Unit

SR slew rate between 50 V to

[1] The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage. [2] See Figure 6 for the typical DC-to-DC transfer of Vito Voc. [3] f < 1 MHz; tr=tf= 40 ns [pins V

200

(V)

160

120

settling time input (50 %) to output (99 % to 101 %)

− 50 V

cathode output voltage overshoot

and V

i(1),Vi(2)

Voc= 100 V (p-p) square

wave

= 2.5 V (p-p) square

wave

Voc= 100 V (p-p) square

wave

] see Figure 7 and Figure 8.

i(3)

[3]

- - 350 ns

[3]

- 1310 - V/µs

[3]

-10-%

mce455

0 4321

Fig 6. Typical DC-to-DC transfer of Vi to V

Vi (V)

Product data sheet Rev. 03 — 20 April 2005 7 of 16

Page 8

Philips Semiconductors

(V)

TDA6108AJF

Triple video output ampliﬁer

2.96

2.34

1.73

150 140

(V)

100

60 50

Fig 7. Output voltage [pins V

input signal

oc(1)

, V

co(p)

oc(2)

Ov (in %)

oc(r)

and V

151

149

mce477

] rising edges as a function of the AC

oc(3)

Product data sheet Rev. 03 — 20 April 2005 8 of 16

Page 9

Philips Semiconductors

(V)

TDA6108AJF

Triple video output ampliﬁer

2.96

2.34

1.73

150 140

(V)

100

60 50

Fig 8. Output voltage [pins V

input signal

oc(1)

, V

co(p)

oc(2)

oc(f)

and V

Ov (in %)

] falling edges as a function of the AC

oc(3)

mce476

10. Application information

10.1 Flashover protection

For sufﬁcient ﬂashover protection it is necessary to apply an external diode and 100 Ω resistor for each channel; see

To limit the diode current an external 1 kΩ carbon high-voltage resistor in series with the cathode output and a 2 kV spark gap are needed (for this resistor value, the CRT has to be connected to the main PCB).

VDD must be decoupled to GND:

1. With a capacitor > 20 nF with good HF behavior (e.g. foil); this capacitor must be placed as close as possible to pins VDDand GND and must be within 5 mm

2. With a capacitor > 3.3 µF on the picture tube base print, depending on the CRT size.

Product data sheet Rev. 03 — 20 April 2005 9 of 16

Application Note AN10227-01

Page 10

Philips Semiconductors

10.2 Switch-off behavior

The switch-off behavior of the TDA6108AJF is controllable. This is because the output pins of the TDA6108AJF are still under control of the input pins for low power supply voltages (approximately 30 V and higher).

10.3 Bandwidth

The addition of the ﬂash resistor produces a decreased bandwidth and increases the rise and fall times.

10.4 Dissipation

A distinction must ﬁrst be made between static dissipation (independent of frequency) and dynamic dissipation (proportional to frequency).

The static dissipation of the TDA6108AJF is due to voltage supply currents and load currents in the feedback network and CRT.

TDA6108AJF

Triple video output ampliﬁer

The static dissipation P

equals: P

stat

stat=VDD

× IDD+3× Voc× I

Where:

VDD= supply voltage IDD= supply current Voc= DC value of cathode output voltage Ioc= DC value of cathode output current.

The dynamic dissipation P

equals: P

dyn

=3× VDD× (CL+C

dyn

) × fi× V

int

oc(p-p)

×δ

Where:

CL= load capacitance C

= internal load capacitance (≈4 pF)

int

fi= input frequency V

= cathode output voltage (peak-to-peak value)

oc(p-p)

δ = non-blanking duty factor.

The TDA6108AJF must be mounted on the picture tube base print to minimize the load capacitance.

Product data sheet Rev. 03 — 20 April 2005 10 of 16

Page 11

Philips Semiconductors

11. Test information

22 µF

22 nF

22 µF

22 nF

22 µF

22 nF

TDA6108AJF

Triple video output ampliﬁer

VIP

REFERENCE

i(1)

i(2)

i(3)

oc(1)

3.2 pF

oc(2)

C12

3.2 pF

oc(3)

C15

3.2 pF

TDA6108AJF

GND

20 nFC710 µF

C10

6.8 pF

C11 136 pF

C13

6.8 pF

C14 136 pF

C16

6.8 pF

C17 136 pF

4 V

R1 2 MΩ

probe 1

R2 100 kΩ

R3 2 MΩ

probe 2

R4 100 kΩ

R5 2 MΩ

probe 3

R6 100 kΩ

mce464

Current sources J1, J2andJ3must be adjusted so that the DC outputvoltage of pins V

oc(1),Voc(2)

and V

is set to 100 V.

oc(3)

Fig 9. Test circuit

11.1 Quality information

The

General Quality Speciﬁcation for Integrated Circuits, SNW-FQ-611

Product data sheet Rev. 03 — 20 April 2005 11 of 16

is applicable.

Page 12

Philips Semiconductors

12. Package outline

TDA6108AJF

Triple video output ampliﬁer

DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads

pin 1 index

SOT111-1

seating plane

DIMENSIONS (mm are the original dimensions)

UNIT A A

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE VERSION

SOT111-1

max. max.

18.5

3.7

17.8

8.7

15.5

8.0

1.40

15.1

1.14

IEC JEDEC JEITA

0.67

0.50

1.40

0.48

1.14

0.38

REFERENCES

bcD

0 5 10 mm

scale

(1)

21.8

21.4

(1)

21.4

6.48

20.7

6.20

w M

3.4

3.2

1.75

1.55

eLPP1q1q

3.9

2.54

3.4

2.75

2.50

15.1

4.4

14.9

4.2

EUROPEAN

PROJECTION

5.9

5.7

(1)

0.25

ISSUE DATE

95-03-11 03-03-12

Fig 10. Package outline SOT111-1 (DBS9MPF)

Product data sheet Rev. 03 — 20 April 2005 12 of 16

Page 13

Philips Semiconductors

13. Handling information

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe, it is desirable to take normal precautions appropriate to handling integrated circuits.

14. Soldering

14.1 Introduction to soldering through-hole mount packages

This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our (document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board.

14.2 Soldering by dipping or by solder wave

TDA6108AJF

Triple video output ampliﬁer

Data Handbook IC26; Integrated Circuit Packages

Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic

body must not exceed the speciﬁed maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

14.3 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 °C and 400 °C, contact may be up to 5 seconds.

14.4 Package related soldering information

Table 6: Suitability of through-hole mount IC packages for dipping and wave soldering

methods

Package Soldering method

Dipping Wave

CPGA, HCPGA − suitable DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable

[2]

PMFP

− not suitable

stg(max)

[1]

). If the

[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit

board.

[2] For PMFP packages hot bar soldering or manual soldering is suitable.

Product data sheet Rev. 03 — 20 April 2005 13 of 16

Page 14

Philips Semiconductors

TDA6108AJF

Triple video output ampliﬁer

15. Revision history

Table 7: Revision history

Document ID Release date Data sheet status Change notice Doc. number Supersedes

TDA6108AJF_3 20050420 Product data sheet - 9397 750 14729 TDA6108AJF_2 Modiﬁcations:

TDA6108AJF_2 040630 Preliminary

Modiﬁcations:

TDA6108AJF_1 030919 Preliminary

• The format of this data sheet has been redesigned to comply with the new presentation and

information standard of Philips Semiconductors

- 9397 750 13498 TDA6108AJF_1

speciﬁcation

• In Features: change of slew rate

• In Limiting values; change to ESD

• In Characteristics; change of value for output measurement pin

• In Characteristics; change of value for slew rate and cathode output rise time

- 9397 750 11633 -

speciﬁcation

Product data sheet Rev. 03 — 20 April 2005 14 of 16

Page 15

Philips Semiconductors

16. Data sheet status

TDA6108AJF

Triple video output ampliﬁer

Level Data sheet status

I Objective data Development This data sheet contains data from the objective speciﬁcation for product development. Philips

II Preliminary data Qualiﬁcation Thisdata sheet contains data from the preliminary speciﬁcation. Supplementary data will be published

III Product data Production This data sheet contains data from the product speciﬁcation. Philips Semiconductors reserves the

[1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.

[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

[1]

Product status

17. Deﬁnitions

Short-form speciﬁcation — The data in a short-form speciﬁcation is

extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values deﬁnition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representationor warranty that such applications will be suitable for the speciﬁed use without further testing or modiﬁcation.

[2] [3]

Deﬁnition

Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in order to improve the design and supply the best possible product.

right to make changes at any time in order to improve the design, manufacturing and supply.Relevant changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

18. Disclaimers

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speciﬁed.

19. Contact information

For additional information, please visit: http://www.semiconductors.philips.com For sales ofﬁce addresses, send an email to: sales.addresses@www.semiconductors.philips.com

Product data sheet Rev. 03 — 20 April 2005 15 of 16

Page 16

Philips Semiconductors

20. Contents

1 General description . . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1

4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 4

7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5

8.1 Thermal protection . . . . . . . . . . . . . . . . . . . . . . 5

9 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6

10 Application information. . . . . . . . . . . . . . . . . . . 9

10.1 Flashover protection. . . . . . . . . . . . . . . . . . . . . 9

10.2 Switch-off behavior. . . . . . . . . . . . . . . . . . . . . 10

10.3 Bandwidth. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

10.4 Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

11 Test information. . . . . . . . . . . . . . . . . . . . . . . . 11

11.1 Quality information . . . . . . . . . . . . . . . . . . . . . 11

12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12

13 Handling information. . . . . . . . . . . . . . . . . . . . 13

14 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

14.1 Introduction to soldering through-hole

mount packages . . . . . . . . . . . . . . . . . . . . . . . 13

14.2 Soldering by dipping or by solder wave . . . . . 13

14.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13

14.4 Package related soldering information . . . . . . 13

15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14

16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15

17 Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

18 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

19 Contact information . . . . . . . . . . . . . . . . . . . . 15

TDA6108AJF

Triple video output ampliﬁer

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Published in The Netherlands

Date of release: 20 April 2005

Document number: 9397 750 14729

Page 17

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Datasheets for electronics components.

Datasheet TDA6108AJF Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual

1. General description

2. Features

3. Ordering information

4. Block diagram

5. Pinning information

5.1 Pinning

5.2 Pin description

6. Internal circuitry

7. Limiting values

8. Thermal characteristics

8.1 Thermal protection

9. Characteristics

10. Application information

10.1 Flashover protection

10.2 Switch-off behavior

10.3 Bandwidth

10.4 Dissipation

11. Test information

11.1 Quality information

12. Package outline

13. Handling information

14. Soldering

14.1 Introduction to soldering through-hole mount packages

14.2 Soldering by dipping or by solder wave

14.3 Manual soldering

14.4 Package related soldering information

15. Revision history

16. Data sheet status

18. Disclaimers

19. Contact information

20. Contents