Datasheet TDA5341 Datasheet (Philips)

Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA5341
Brushless DC motor and VCM drive circuit with speed control
Product specification File under Integrated Circuits, IC11
1997 Jul 10
Page 2
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit with speed control
FEATURES
Full-wave commutation (using push-pull output stages) without position sensors
Built-in start-up circuitry
Three push-pull MOS outputs:
– 1 A output current – Low voltage drop – Built-in current limiter
Thermal protection
General purpose operational amplifier
Reset generator
Motor brake facility
Actuator driver (H-bridge current-controlled)
Power-down detector
Automatic park and brake procedure
Adjustable park voltage
Sleep mode
Speed control with Frequency-Locked Loop (FLL)
Serial port
Friction reduction prior to spin-up.
APPLICATIONS
Hard Disk Drive (HDD).
GENERAL DESCRIPTION
The TDA5341 is a BiCMOS integrated circuit used to drive brushless DC motors in full-wave mode. The device senses the rotor position using an EMF sensing technique and is ideally suited as a drive circuit for a hard disk drive motor.
The TDA5341 also includes a Voice Coil Motor driver (VCM), reset and park facilities and an accurate speed regulator. In addition, a serial port facilitates the control of the device.
TDA5341
QUICK REFERENCE DATA
Measured over full voltage and temperature range.
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
V
DD
I
oMOT
R
DS(MOT)
I
oACT
R
DS(ACT)
ORDERING INFORMATION
TYPE
NUMBER
TDA5341G LQFP64
general supply voltage for logic and power 4.5 5.0 5.25 V motor output current 1.3 1.6 1.9 A motor output resistance 1.1 1.56 actuator output current 0.7 1.1 1.4 A actuator output resistance 2.0 2.5
PACKAGE
NAME DESCRIPTION VERSION
plastic low profile quad flat package; 64 leads; body 10 × 10 × 1.4 mm
SOT314-2
Page 3
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit with speed control
BLOCK DIAGRAM
handbook, full pagewidth
CAPCP
FREDENA
TESTIN
CAPCDM
CAPCDS
CAPTI
CAPST
BRAKE
FG
FMOT
CLOCK
DATA
ENABLE
RESET
ROSC
DPULSE
RETRACT
V
CMIN1
V
CMIN2
V
ref
GAINSEL
CAPXA
27
9
12
18 19
2
1
11
10 58
39 38 42 57
48
35
30
33 34 36
15
CAPXB
UPPER VOLTAGE
THERMAL
SWITCH
ADAPTIVE
COMMUTATION
DELAY
TIMING
OSCILLATOR
START
OSCILLATOR
BRAKE
CONTROLLER
POLES
DIVIDER
SERIAL
PORT
PROGRAMMING
FREQUENCY
DIVIDER
VCM
PREAMPLIFIER
50 14 55 31 49 17
CAPYA
CONVERTER
CAPYB
COMMUTATION
AND OUTPUT DRIVING
LOGIC
brake
BAND GAP 1
sleep
fill
DIGITAL
FREQUENCY
COMPARATOR
park
CNTRL
CAPCPC
222463625961
CONTROL
AMPLIFIER
POWER 1
POWER 2
POWER 3
COMPARATORS
BAND GAP 2
UNDER-VOLTAGE
DETECTOR
BRAKE
AFTER PARK
CHARGE
PUMP
SENSE
AMPLIFIER
VCM
H-BRIDGE
CURRENT
LIMIT
CONTROL
TDA5341
25 64 40 16 41
ILIM
TDA5341
23
20
PRESET
60
MOT1
8
MOT2
21
MOT3
7
MOT0
3
CLAMP1
26
CLAMP2
43
RESETOUT
44
UVDIN1
54
UVDIN2
46
BRAKEDELAY
4
AMPOUT
5
AMPIN
6
AMPIN+
32
FILTER
53
SENSEOUT
52
SENSEIN+
51
SENSEIN
37
VCM+
45
VCM
28
FB1
29
FB2
V
EEDVEE1VEE2VEE3VEE4VEEVDD1VDD2VDD3VDDVDDD
Fig.1 Block diagram.
MGE817
Page 4
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit
TDA5341
with speed control
PINNING
SYMBOL PIN DESCRIPTION
CAPST 1 external capacitor for starting oscillator CAPTI 2 external capacitor for timer circuit CLAMP1 3 external capacitor used to park the heads; must be externally connected to CLAMP2 AMPOUT 4 uncommitted operational amplifier output AMPIN 5 uncommitted operational amplifier invert input AMPIN+ 6 uncommitted operational amplifier direct input MOT0 7 motor centre tap input MOT2 8 motor driver output 2 FREDENA 9 friction reduction mode enable input (active HIGH) FG 10 frequency generator (tacho) output BRAKE 11 brake input command (active LOW) TESTIN 12 test input for power output switch-off (active HIGH) TP1 13 test purpose 1 (should be left open-circuit) V
EE1
GAINSEL 15 VCM gain adjustment input (switch ON when GAINSEL is LOW) V
DD
V
EE
CAPCDM 18 external capacitor for adaptive commutation delay (master) CAPCDS 19 external capacitor for adaptive commutation delay (slave) PRESET 20 set the motor drivers into a fixed state: MOT1 = F (floating), MOT2 = L, MOT3 = H MOT3 21 motor driver output 3 CAPCPC 22 frequency compensation of the current control ILIM 23 current limit control input CNTRL 24 motor control V
DD1
CLAMP2 26 external capacitor used to park the heads; must be externally connected to CLAMP1 CAPCP 27 external capacitor for the charge pump output FB1 28 output of the VCM preamplifiers FB2 29 switchable output of the VCM preamplifier RETRACT 30 park input command (active LOW) V
EE3
FILTER 32 charge pump output to be connected to an external filter V
CMIN1
V
CMIN2
DPULSE 35 data pulse input of the frequency comparator of the speed control V
ref
VCM+ 37 positive output of the VCM amplifier DATA 38 input data of the serial port (active HIGH) CLOCK 39 clock input signal to shift DATA into SERIALIN register (active HIGH) V
DD3
14 ground for the spindle motor drivers
16 general power supply 17 general ground
25 power supply 1 for the spindle motor drivers
31 ground 3 for the actuator driver
33 VCM voltage control input 34 switchable VCM voltage control input
36 voltage reference input
40 power supply 3 for the actuator driver
Page 5
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit
TDA5341
with speed control
SYMBOL PIN DESCRIPTION
V
DDD
ENABLE 42 enable input; enables the serial port, i.e. allows DATA to be shifted in (active LOW) RESETOUT 43 under-voltage detector output flag (active LOW) UVDIN1 44 external capacitor for the VCM 45 negative output of the VCM amplifier BRAKEDELAY 46 delay control input for brake after park TP2 47 test purpose 2 (should be left open-circuit) ROSC 48 reference oscillator input for motor speed control V
EE4
V
EED
SENSEIN 51 inverting input of the VCM sense amplifier SENSEN+ 52 non-inverting input of the VCM sense amplifier SENSEOUT 53 output of the VCM sense amplifier UVDIN2 54 external voltage reference for the under-voltage detector V
EE2
TP3 56 test purpose 3 (should be left open-circuit) RESET 57 reset input; forces all bits of the SERIALIN register to 0 (active HIGH) FMOT 58 tachometer output (one pulse per mechanical revolution) CAPXB 59 external capacitor for the charge pump output MOT1 60 motor driver output 1 CAPXA 61 external capacitor for the charge pump output CAPYA 62 external capacitor for the charge pump output CAPYB 63 external capacitor for the charge pump output V
DD2
41 digital power supply
RESETOUT duration
49 ground 4 for the actuator driver 50 digital ground
55 ground 2 for the spindle motor drivers
64 power supply for the spindle motor drivers
Page 6
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit with speed control
handbook, full pagewidth
DD2
CAPYB
CAPST
CAPTI
CLAMP1
AMPOUT
AMPIN AMPIN+
MOT0 MOT2
FREDENA
FG
BRAKE
TESTIN
TP1
V
EE1
GAINSEL
V
DD
V
64 1 2 3 4 5 6 7 8 9
10 11 12 13 14 15 16
17
EE
V
CAPYA
63
62
18
19
CAPCDS
CAPCDM
CAPXA
MOT1
61
60
20
21
MOT3
PRESET
FMOT
CAPXB 59
58
TDA5341
22
23
ILIM
CAPCPC
RESET 57
24
CNTRL
TP3 56
25
DD1
V
EE2
V
UVDIN2
55
54
26
27
CAPCP
CLAMP2
SENSEIN+
SENSEOUT 53
52
28
29
FB2
FB1
EED
SENSEIN
V
51
50
30
31
EE3
V
RETRACT
EE4
V
49
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
32
FILTER
TDA5341
ROSC TP2 BRAKEDELAY VCM UVDIN1 RESETOUT ENABLE
V
DDD
V
DD3
CLOCK DATA VCM+ V
ref DPULSE V
CMIN2 V
CMIN1
MGE816
Fig.2 Pinning diagram.
Page 7
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit with speed control
FUNCTIONAL DESCRIPTION
The TDA5341 offers a sensorless three-phase motor full-wave drive function. The device also offers protected outputs capable of handling high currents and can be used with star or delta connected motors.
The TDA5341 can easily be adapted for different motors and applications.
The TDA5341 offers the following features:
Sensorless commutation by using the motor EMF
Built-in start-up circuit
Optimum commutation, independent of motor type or
motor loading
Built-in flyback diodes
Three-phase full-wave drive
High output current (1.3 A)
Low MOS R
Outputs protected by current limitation and thermal
protection of each output transistor
Low current consumption
Additional uncommitted operational amplifier
H-bridge actuator driver current controlled with an
external series sense resistor
Automatic retract procedure
Adjustable park voltage
Sleep mode
Automatic brake (after park) procedure
DSon
(1 )
TDA5341
Speed control based on FLL technique
Serial port DATAIN (24 bits)
Friction reduction prior to spin-up.
TDA5341 modes description
The TDA5341 can be used in two main modes, depending on whether they are controlled or not.
The ‘controlled modes’ (user commands) are executed by the TDA5341 without delay or priority treatment, either by software via the serial port or by hardware. BRAKE is a hardware command whereas RETRACT can be controlled in both ways. If it is preferable to control the heads parking via the serial bus, the equivalent pin can be left open-circuit.
The sleep mode is controlled by software only; it results from the combination of the spindle and actuator being disabled. The spindle is turned off by bit SPINDLE DISABLE, whereas the actuator is disabled towards bit VCM DISABLE of the serial port (see Section “Serial port”). In addition, a special spin-up mode can be activated in the event of high head stiction
The ‘uncontrolled modes’ only result from different failures caused by either a too high internal temperature or an abnormally low power voltage, which will cause the actuator to retract and, after the spindle, to brake. The output signals mainly affected by those failures are RESETOUT, MOT1, 2 and 3, VCM+ and VCM. This is summarised in Tables 1 and 2.
Table 1 Summary of controlled modes
HARDWARE/
SOFTWARE
Software spindle disable high impedance high impedance HIGH spindle off Software VCM disable not affected high impedance HIGH spindle on; VCM off Hardware brake LOW not affected HIGH spindle coils ground Software/
hardware Hardware friction reduction not affected HIGH heads in vibration
MODE MOT1, 2 AND 3
retract not affected VCM= 0.65 V;
VCM+ AND
VCM
VCM+=0V
RESETOUT EFFECT
HIGH heads parked
Page 8
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit with speed control
Table 2 Summary of uncontrolled modes
FAILURE MOT1, 2 AND 3 VCM+ AND VCM RESETOUT EFFECT
Thermal shut-down
Voltage shut-down
Controlled modes
S
PINDLE DISABLE
The spindle circuitry is switched off when bit 23 (SPINDLE DISABLE) of the serial port is pulled HIGH. In that mode, the reference band gap generator is cut off so that all internal current sources are disabled. Both the spindle and actuator outputs will be set to the high impedance state because the upper converter is also turned off.
It should be noted that the uncommitted operational amplifier is also disabled in that mode.
VCM
DISABLE
The actuator will be disabled when bit 22 (VCM DISABLE) is set to logic 1; the spindle circuitry is not affected in that mode. The retract circuitry also remains active, so that the heads can be parked although the VCM is disabled. In that mode, the current consumption can be reduced by ±4 mA.
high impedance LOW VCM= 0.65 V;
VCM+ = 0 V
high impedance LOW VCM= 0.65 V;
VCM+ = 0 V
RICTION REDUCTION
F Pulling FREDENA HIGH activates the friction reduction
mode of the TDA5341. In that mode, a clock signal fed via pin TESTIN will cause the MOT outputs to sequentially switch-on and switch-off at the same frequency and, as a result, generate an AC spindle torque high enough to overcome the head stiction.
Before start-up, the head stiction might be higher than normal due to condensation between the head(s) and the disk(s). Normal spin-up is not possible when this friction torque is higher than the start-up torque of the spindle motor. Spin-up is then only possible after friction has been reduced by breaking the head(s) free. Bringing a static friction system into mechanical resonance is an effective method to break static friction head(s) free.
The resonance frequency is:
f
res
1

×=
------ -

2π
LOW automatic park and brake
LOW automatic park and brake
C

0.5
--- -

J
TDA5341
S
LEEP MODE
The sleep mode is obtained by pulling both the SPINDLE and VCM DISABLE bits of the serial port HIGH. The power monitor circuitry only remains active in sleep mode.
ETRACT
R Retract is activated by pulling either bit 21 (PARK) HIGH
or RETRACT (pin 30) LOW. WhenRETRACT is set LOW, a voltage of 0.65 V is applied to pin VCM for parking.
It should be noted that the park voltage can be made adjustable by changing one of the interconnect masks. Accordingly, some different voltages, varying from
0.2 to 1.2 V, can quickly be obtained on customer demand. This mode does not affect the control of the spindle rotation.
B
RAKE MODE
The brake mode is activated by pulling BRAKE (pin 11) LOW. When a voltage of less than 0.8 V is applied to pin BRAKE, the 3 motor outputs are short-circuited to ground, which results in a quick reduction of the speed until the motor stops completely.
Where:
C = Stiffness of the head-spring(s) in direction of disk(s) rotation, (N/m)
2
J = Inertia of the disk(s), (kg/m
).
The external clock input frequency must be:
f
clk
6

------ -

2π
C

0.5
×=
--- -

J
A burst of n × 6 clock pulse will bring the system into resonance and break the heads free (n > 2). Once the heads have been broken free, the normal spin-up procedure can be applied.
It should be noted that the clock frequency must be smaller than 40000/CAPCDM (nF).
Page 9
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit with speed control
Uncontrolled modes
P
OWER SHUT-DOWN
If the power supply decreases to less than the voltage threshold determined by the ratio between R1 and R2 connected to UVDIN2 (see Fig.8) (for more than 1 µs), the TDA5341 will issue a reset (RESETOUT goes LOW) and the following operation will start:
Firstly, the MOT outputs are switched to the high impedance state so as to get back the rectified EMF issued from the motor itself. At the same time, the voltage upper converter is cut off in order to preserve the voltage on the charge pump capacitance at CAPCP. The energy supplied in that way is then used to park the heads in a safe position
Secondly, after a certain period of time, depending on the RC constant of the device connected to BRAKEDELAY, the lower MOS drivers will be turned on in order to stop the motor completely.
TDA5341
The system will only function when the EMF voltage from the motor is present. Consequently, a start oscillator is provided that will generate commutation pulses when no zero-crossings in the motor voltage are available.
A timing function is incorporated into the device for internal timing and for timing of the reverse rotation detection.
The TDA5341 also contains a control amplifier, directly driving output amplifiers.
The TDA5341 also provides access to the user of some of its internal test modes. Firstly, a PRESET mode can be used for prepositioning the three motor output drivers into a fixed state. By pulling pin PRESET to 0.75 V above V MOT3 goes HIGH, MOT2 goes LOW and MOT1 goes to the high impedance state.
In addition, when TESTIN is pulled HIGH (provided that FREDENA is LOW), the 3 motor output drivers are switched off. It should be noted that RESETOUT goes LOW in that particular event.
DD
,
T
HERMAL SHUT-DOWN
Should the temperature of the chip exceed +140 ±10 °C, a shut-down operation will also be processed. The actions described for power shut-down will be sequenced in the same manner.
PINDLE SECTION (see Fig.1)
S Full-wave driving of a three-phase motor requires three
push-pull output stages. In each of the six possible states two outputs are active, one sourcing current and one sinking current. The third output presents a high impedance to the motor which enables measurement of the motor EMF in the corresponding motor coil by the EMF comparator at each output. The commutation logic is responsible for control of the output transistors and selection of the correct EMF comparator.
The zero-crossing in the motor EMF (detected by the comparator selected by the commutation logic) is used to calculate the correct moment for the next commutation, i.e. the change to the next output state. The delay is calculated (depending on the motor loading) by the adaptive commutation delay block.
Because of high inductive loading the output stages contain flyback diodes. The output stages are also protected by a current limiting circuit and by thermal protection of the six output transistors.
The zero-crossings can be used to provide speed information such as the tacho signal (FG).
Adjustments
The system has been designed in such a way that the tolerances of the application components are not critical. However, the approximate values of the following components must still be determined:
The start capacitor; this determines the frequency of the start oscillator
The two capacitors in the adaptive commutation delay circuit; these are important in determining the optimum moment for commutation, depending on the type and loading of the motor
The timing capacitor; this provides the system with its timing signals.
The start capacitor (CAPST)
This capacitor determines the frequency of the start oscillator. It is charged and discharged, with a current of
5.5 µA, from 0.05 to 2.2 V and back to 0.05 V. The time
taken to complete one cycle is given by: t
= (0.78 × C); where C is given in µF.
start
The start oscillator is reset by a commutation pulse and so is only active when the system is in the start-up mode. A pulse from the start oscillator will cause the outputs to change to the next state (torque in the motor). If the movement of the motor generates enough EMF the TDA5341 will run the motor.
Page 10
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit with speed control
If the amount of EMF generated is insufficient, then the motor will move one step only and will oscillate in its new position. The amplitude of the oscillation must decrease sufficiently before the arrival of the next start pulse, to prevent the pulse arriving during the wrong phase of the oscillation. The oscillation of the motor is given by:
1
-- ­2
0.5
f
osc
=

×
K
------- -

Π
Where:
K
= torque constant (N.m/A)
t
I = current (A) p = number of magnetic pole-pairs J = inertia J (kg/m
Example: J = 6.34 × 10−7 kg/m2, K = 4.5 × 10−3 N.m/A, p = 6 and I = 0.48 A; thus f damping, a start frequency of 48.4 Hz can be chosen or t = 24 ms, thus C = 0.024/0.78 = 0.031 µF, (choose 33 nF).
The Adaptive Commutation Delay (CAPCDM and CAPCDS)
P
I
××
--- -
t
J
2
).
= 22.7 Hz. Without
osc
TDA5341
During the next commutation period this capacitor (CAPCDM) is discharged at twice the charging current. The charging current is 10 µA and the discharging current 20 µA; the voltage range is from 0.87 to 2.28 V. The voltage must stay within this range at the lowest commutation frequency of interest, f
10 10×
C
==
-----------------------­f1.41×
6–
7092
------------ ­f
C1
Where C is in nF. If the frequency is lower, then a constant commutation
delay after the zero-crossing is generated by the discharge from 2.28 to 0.87 V at 20 µA.
Maximum delay = (0.070 × C) ms: Where C is in nF. Example: nominal commutation frequency is 3240 Hz and
the lowest usable frequency is 1600 Hz, thus CAPCDM = 7092/1600 = 4.43 (choose 4.7 nF)
The other capacitor, CAPCDS, is used to repeat the same delay by charging and discharging with 20 µA. The same value can be chosen as for CAPCDM. Figure 3 illustrates typical voltage waveforms.
C1
:
In this circuit capacitor CAPCDM is charged during one commutation period, with an interruption of the charging current during the diode pulse.
handbook, full pagewidth
voltage on CAPCDM
voltage on CAPCDS
MGE820
Fig.3 CAPCDM and CAPCDS voltage waveforms in normal running mode.
1997 Jul 10 10
Page 11
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit with speed control
The Timing Capacitor (CAPTI)
Capacitor CAPTI is used for timing the successive steps within one commutation period; these steps include some internal delays.
The most important function is the watchdog time in which the motor EMF has to recover from a negative diode pulse back to a positive EMF voltage (or vice-versa). A watchdog timer is a guarding function that only becomes active when the expected event does not occur within a predetermined time.
The EMF usually recovers within a short time if the motor is running normally (<<ms). However, if the motor is motionless or rotating in the reverse direction, then the time can be longer (>>ms).
A watchdog time must be chosen so that it is long enough for a motor without EMF (still) and eddy currents that may stretch the voltage in a motor winding. However, it must be short enough to detect reverse rotation. If the watchdog time is made too long, then the motor may run in the wrong direction (with little torque).
TDA5341
The capacitor is charged, with a current of 60 µA, from
0.03 to 0.3 V. Above this level it is charged, with a current of 5 µA, up to 2.2 V only if the selected motor EMF remains in the wrong polarity (watchdog function). At the end, or, if the motor voltage becomes positive, the capacitor is discharged with a current of 30 µA. The watchdog time is the time taken to charge the capacitor, with a current of 5 µA, from 0.3 to 2.2 V. The value of CAPTI is given by:
t
6
C510
×
Where: C is in nF and t is in ms. Example: If, after switching off, the voltage from a motor
winding is reduced, in 3.5 ms, to within 10 mV (the offset of the EMF comparator), then the value of the required timing capacitor is given by:
C = 2.63 × 3.5 = 9.2 (choose 10 nF) Typical voltage waveforms are illustrated by Fig.4.
m
------- -
1.9
=×=
2.63t
m
handbook, full pagewidth
V
MOT1
voltage on CAPTI
MGE821
If the chosen value of CAPTI is too small, then oscillations can occur in certain positions of a blocked rotor. If the chosen value is too large, then it is possible that the motor may run in the reverse direction (synchronously with little torque).
Fig.4 Typical CAPTI and V
voltage waveforms in normal running mode.
MOT1
1997 Jul 10 11
Page 12
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit with speed control
Other design aspects
There are other design aspects concerning the application of the TDA5341 besides the commutation function. They are as follows:
Generation of the tacho signal FG
Motor control
Current limiting
Thermal protection.
FG signal
The FG signal is generated in the TDA5341 by using the zero-crossing of the motor EMF from the three motor windings and the commutation signal.
Output FG switches from HIGH-to-LOW on all zero-crossings and LOW-to-HIGH on all commutations and can source more than 40 µA and sink more than
1.6 mA. Example: A three-phase motor with 6 magnetic pole-pairs
at 1500 rpm and with a full-wave drive has a commutation frequency of 25 × 6 × 6 = 900 Hz and generates a tacho signal of 900 Hz.
Motor control
TDA5341
Current limiting
Outputs MOT1 to MOT3 are protected against high currents in two ways; current limiting of the ‘lower’ output transistor and current limiting of the ‘upper’ one. This means that the current from and to the output stages is limited.
It is possible to adjust the limiting current externally by using an external resistor connected between pin ILIM and ground, the value is determined by the formula:
ILIM
10020
I
Where R = R (min.) = 19.5 k and I If R < 19.5 k, then I
protection purposes.
Thermal protection
Thermal protection of the six output transistors of the spindle section is achieved by each transistor having a thermal sensor that is active when the transistor is switched on. The transistors are switched off when the local temperature becomes too high. In that event, a RESET is automatically generated to the external world by pulling RESETOUT LOW.
×=
2.54
----------­R
ILIM
is internally limited for device
ILIM
= 1.3 A.
Figure 5 shows the spindle transconductance by giving the relative output current as a function of the voltage applied to pin CNTRL.
handbook, halfpage
(% of I
100
I
o
)
max
80
60
40
20
0
05
1234
control voltage (V)
MGE822
Fig.5 Output current control.
Reset section
This circuit provides the following:
An external signal that sends a
RESETOUT (active LOW) to the disk drive circuitry at power-up and power-down
Causes actuator to retract (PARK). The power-up reset signal (RESETOUT) applied to
external circuits as a digital output is typically 150 ms after power-up. In the same way, as soon as VDD goes below a threshold that is externally set (UVDIN2), RESETOUT goes LOW. The under voltage detection threshold is adjustable with external resistors (see Fig.8).
The reset circuitry has a minimum output pulse (100 ms) even for brief power interruptions (higher than 1 ms). The pulse duration can be adjusted with an external capacitor (UVDIN1).
1997 Jul 10 12
Page 13
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit with speed control
The power for retraction is received from the rectification of the EMF of the spindle before it is spun down. After retraction, a brake procedure is automatically settled. The time needed for retraction, prior to braking, can be precisely adjusted with the external RC device connected to pin BRAKEDELAY. The discharge of the capacitance across the resistance from VDD− 0.7 V down to 1 V will provide the desired time constant.
Actuator section
The actuator driver has a control input voltage that is proportional to the actuator current which is capable of a closed-loop band-pass frequency higher than 10 kHz.
T
RANSFER FUNCTION
handbook, full pagewidth
C
L1
TDA5341
An operational amplifier input allows passive external components for compensation and gain setting. The compensation amplifier is able to be pulled out of a saturation state within 5 µs and its output swing is VDD− 1.5 V.
An actuator current-sense amplifier is provided for use by the disc drive controller. The gain from current-sense resistor to sense the amplifier output is typically 10 (±3%) and the output voltage swing is ±1.25 V. An input common mode range insures operation through all normal coil voltage excursions. Maximum recovery time from saturation is 20 µs (typ.).
actuator
input
GAINSEL
T11R
×Z
×
f
C
L2
R
IN1
R
IN2
R
f
V
CMIN2
V
CMIN1
V
ref
SENSEOUT
PREAMP
TDA5341
FB2 FB1
OUTPUT GAIN 11
R
s
VCM
SENSE
AMP
SENSEIN
VCM+ SENSEIN+
MGE825
Fig.6 VCM section application diagram.

×=
--------------------------------------------------------------------------------------------------------------------
L

R
RfRsRfZ
IN
1
VCM
110 Rs× ZL×+×+×()×
With GAINSEL = HIGH; RIN=R
With GAINSEL = LOW;
R
=
IN
IN1
R
×
IN1RIN2
------------------------------
+
R
IN1RIN2
1997 Jul 10 13
Page 14
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit with speed control
Speed control function
Speed control is efficiently achieved by the frequency-locked loop circuitry which is enabled by bit D20 of the CONTROL register.
Its aim is to keep the tachometer signal set to a reference programmed by the user via the serial port (see Section “Serial port”).
The FLL operates as follows: When power is first applied to the circuit, the FILTER pin is
pulled HIGH so that maximum output current can be sourced for optimum torque.
FG pulses will appear rapidly so as to provide a ‘clean’ clock signal (FMOT) that will issue one pulse per mechanical revolution. This may be used for speed regulation, by re-entering the signal through the DPULSE pin. Then, after it has been synchronised to the ROSC clock, it is compared to an accurate reference derived from the ROSC clock and programmed by the user via the serial port. The resulting variation in frequency generates a speed error term that will switch a charge-pump up or down in order to charge or discharge an external RC filter (FILTER). The voltage at the FILTER pin is then used as an input to the current control amplifier that regulates the current in both upper and lower NMOS transistors.
A velocity regulation based upon (maximum) one corrective action per mechanical revolution may be considered insufficient in some applications. That is the reason why the second input of the FLL circuitry was intentionally left open-circuit and directly accessible to the external world via pin DPULSE. In that way, total freedom is given to the user to use any signal coming out of the microcontroller in order to regulate the motor velocity with a finer accuracy.
Moreover, a mixed regulation is also possible: firstly, the FMOT signal is fed via DPULSE into the FLL circuitry and then once data is read out off the disc, it is switched to another clock signal with a higher frequency than FMOT. Simultaneously, a new division factor is programmed via the serial port.
It should be noted that there is no need for external synchronization. However, it is recommended to change the division factor and the DPULSE clock rate during the period when FMOT is HIGH.
TDA5341
Serial port
The serial port operates as follows: When ENABLE is HIGH, the serial port is disabled, which
means the TDA5341 functions regardless of any change at pins DATA and CLOCK.
When ENABLE is set LOW some set-up time before the falling edge of CLOCK, the serial port is enabled, i. e. data is serially shifted into the 24-bit shift register on the falling edge of the CLOCK signal. The least significant bit (LSB = DATA 0) is the first in, DATA(23) the MSB is the last in.
ENABLE goes HIGH, the contents of the shift
When register are loaded into the internal fixed register (CONTROL register), it will not change until the next rising edge of ENABLE.
It should be noted that when RESET goes HIGH it will force all bits of the shift register and the control register to logic 0. However, there is no reset effect on both power-up and power-down i.e there is no correlation between RESET and RESETOUT.
CLOCK can be stopped (either in the HIGH or LOW state) once RESET or ENABLE have been asserted.
The 24-bit control register is organized as follows:
D23: SPINDLE DISABLE – When LOW, the spindle circuitry is enabled
D22: VCM DISABLE – When LOW, the actuator circuitry is enabled
D21: PARK – When HIGH, it enables the head retraction. This has
the same effect as pin RETRACT pulled LOW
D20: FLL ENABLE – When HIGH, it closes the complete speed regulation
loop
– When LOW, it will set the output of the charge pump
(FILTER) to the high impedance state
D19 and D18 – The combination of these bits fixes the division factor
to apply on the FG signal with respect to the number of poles.
1997 Jul 10 14
Page 15
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit with speed control
Table 3 Division factor
D19 D18 POLE PAIRS
004 016 108 1112
D17 to D0 These bits program the division factor to apply to the
ROSC signal so as to generate a reference that will precisely control the spindle rotation;
– The division factor can range from 8 (DIV = 1) to
– The relationship between this division factor, ROSC
18
8 × [2
1] = 2097144 (DIV = 3FFFF)
and the motor frequency is as follows: DIVISION FACTOR = 7.5 × ROSC/MOTOR speed
where the MOTOR speed is given in rpm and ROSC in Hz.
TDA5341
Example: for a motor speed of 3600 rpm and a reference oscillation ROSC of 16 MHz, the division factor that has to be programmed via the bus, will be:
×
3600
6–
16 10
DIV 7.5
× 33333==
------------------------
The resulting error will be less than 0.04 rpm.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER MIN. MAX. UNIT
V
DD
V
i
V
60,8,21
V
45,37,53
V
1,2,18,19
T
stg
T
amb
P
tot
positive supply voltage 5.5 V input voltage (all pins) 0.3 VDD+ 0.3 V output voltage pins MOT1, MOT2 and MOT3 0.25 +5.5 V output voltage pins VCM, VCM+ and SENSEOUT 0.7 VDD+ 0.7 V input voltage pins CAPST, CAPTI, CAPCDM and CAPCDS 2.5 V IC storage temperature 55 +150 °C operating ambient temperature 0 +70 °C total power dissipation see Fig.7
HANDLING
Every pin withstands the ESD test in accordance with MIL-STD-883C. Method 3015 (HBM 1900 , 100 pF) 3 pulses positive and 3 pulses negative on each pin with reference to ground. Class 1 : 0 to 1999 V.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER VALUE UNIT
R
th j-a
thermal resistance from junction to ambient in free air 54 K/W
1997 Jul 10 15
Page 16
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit with speed control
3
P
tot
(W)
2
1
0
0 50 150
(2)
(1)
SAFE
OPERATING
AREA
(1) T (2) T
j(max) j(max)
handbook, halfpage
= 130 °C. = 150 °C.
100
T
amb
TDA5341
MGE823
(°C)
Fig.7 Power derating curve.
CHARACTERISTICS (SPINDLE FUNCTION)
V
DD
= 5 V; V
DD1
and V
DD2>VDD
is not allowed; T
=25°C; unless otherwise specified.
amb
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
V V
DD DD1
general supply voltage 4.5 5.0 5.25 V supply voltage 1 for the spindle
4.5 5.0 5.25 V
motor drivers
V
DD2
supply voltage 2 for the spindle
4.5 5.0 5.25 V
motor drivers
V
DD3
supply voltage for the actuator
4.5 5.0 5.25 V
driver
I
DD
I
q(sm)
general supply current 11 15 mA quiescent current in sleep mode 1.4 2 mA
Thermal protection
T
SD
local temperature at temperature
130 140 150 °C
sensor causing shut-down
T reduction in temperature before
after shut-down T
30 −°C
SD
switch-on
V
so
test pin switch-off voltage 2.5 −−V
1997 Jul 10 16
Page 17
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit
TDA5341
with speed control
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
MOT0
V
i
I
bias
V
CSW
V
CWS
MOT1, MOT2 and MOT3; pins 60, 8 and 21
V
DO
t
r
t
f
Output current limiting circuit; V
I
ILIM
V
ILIM
I
ILIM(CR)
input voltage level 0.3 VDD− 1.7 V input bias current 1 0 µA comparator switching voltage level note 1 ±6.8 ±9.2 ±11.6 mV variation in comparator switching
3.4 +3.4 mV
voltage levels within one IC
drop-out voltage Io= 250 mA −−0.34 V
I
= 250 mA;
o
T
=70°C
amb
output rise time from 0.2 to 0.8V output fall time from 0.8 to 0.2V
= 5 V; pin 23
ILIM
limiting current (estimation) R input voltage I limiting current control range
(estimation)
=20k 1.15 1.25 1.35 A
ILIM
= 100 µA 2.43 2.51 2.60 V
ILIM
I
=
o
---------------­10000
I
ILIM
−−0.39 V
10 25 35 µs
DD
10 25 35 µs
DD
0.01 1.3 A
Output current control circuit; pin 24
V
CNTRL
C
CPC
input voltage level 0 V control loop stability capacitor 100 nF
CAPCPC; pin 22
I
o(sink)
I
o(source)
output sink current 30 40 50 µA output source current 5.5 3.5 1.5 µA
CAPCP; pin 27
C
extCP
external output capacitor for the charge pump
I
o(sink)
V
CP
output sink current VDD=0V;
charge pump voltage 9.0 9.9 10.8 V
CAPST; pin 1
I
o(sink)
I
o(source)
V
SW(L)
V
SW(M)
V
SW(H)
output sink current 4.5 6.0 7.5 µA output source current 7.0 5.5 4.0 µA lower switching level 0.20 V middle switching level 0.30 V upper switching level 2.20 V
DD
V
note 2 22 −−nF
1 2.5 µA
V
= 1.2 V
clamp
1997 Jul 10 17
Page 18
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit
TDA5341
with speed control
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
CAPTI; pin 2
I
o(sink)
I
oH(source)
I
oL(source)
V
SW(L)
V
SW(M)
V
SW(H)
CAPCDM; pin 18
I
o(sink)
I
o(source)
I
sink/Isource
V
IL
V
IH
CAPCDS; pin 19
I
o(sink)
I
o(source)
I
sink/Isource
V
IL
V
IH
FG; pin 10
V
OL
I
OL
I
OH
R
F
δ duty factor 50 %
output sink current 25 35 45 µA HIGH level output source current 85 70 55 µA LOW level lower source current 7.5 5.0 2.5 µA lower switching level 30 mV middle switching level 0.3 V upper switching level 2.2 V
output sink current 13 20 27 µA output source current 13.5 10 6.5 µA ratio of sink-to-source current 2.2 2.0 1.8 LOW level input voltage 0.82 0.87 0.92 V HIGH level input voltage 2.20 2.28 2.37 V
output sink current 13 20 27 µA output source current 27 20 13 µA ratio of sink-to-source current 1.1 1.0 0.9 µA LOW level input voltage 0.82 0.87 0.92 V HIGH level input voltage 2.20 2.28 2.37 V
LOW level output voltage Io=0µA −−0.5 V LOW level output current VOL= 1 V 3.3 5.3 mA HIGH level output current VOH= 4.5 V −−83 40 mA ratio of FG frequency and
1
commutation frequency
BRAKE; pin 11
I
NM
V
NM
V
BM
I
BM
normal mode current VNM= 2.8 V 40 27 −µA normal mode voltage 2.65 V brake mode voltage −−2.35 V brake mode current 40 24 −µA
Upper converter; pins 61 and 62
C
XA
C
YA
external pump capacitor pin 61 10 nF external pump capacitor pin 62 10 nF
Notes
1. Switching levels with respect to MOT1, MOT2 and MOT3.
2. CAPCP value is dependant of the powerless park and brake operations.
1997 Jul 10 18
DD
V
Page 19
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit
TDA5341
with speed control
CHARACTERISTICS (RESET FUNCTION)
V
= 5 V; V
DD
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
UVDIN1; pin 44
I
UVDIN1
V
UVDIN1
UVDIN2; pin 54
V
UVDIN2
I
UVDIN2
RESETOUT; pin 43
V
PTH
t
dPU
t
dPD
t
PDW
t
W(min)
R
pu
V
OL
and V
DD1
DD2>VDD
load capacitance current to
is not allowed; T
=25°C; unless otherwise specified.
amb
2.3 1.7 1.3 µA
control the reset pulse width input voltage threshold to
2.4 2.55 2.75 V
activate the reset output
comparator voltage for
see Fig.8 1.280 1.315 1.340 V power-up and power-down detection
input current V
= 1.6 V 0.5 +0.5 µA
UVDIN2
power threshold voltage see Fig.9 4.25 V power-up reset delay C = 0.1 µF;
100 150 200 ms
see Fig.9 power-down reset delay see Fig.9 −−4µs power-down reset pulse width see Fig.9 1.0 4 µs minimum output pulse width C = 0.1 µF 100 −−ms pull-up resistance 6 10 14 k LOW level output voltage IOL= 8.5 mA −−0.5 V
under-voltage threshold 1.32
handbook, halfpage
R2 R1+()
×=
----------------------------­R1
V
DD
UVDIN2
Fig.8 Reset mode threshold.
1997 Jul 10 19
R1R2
MGE818
Page 20
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit with speed control
handbook, full pagewidth
V
DD
t
< 1.2 µs
PDW
RESETOUT
t
dPU
t
dPD
t
PDW
> 4 µs
t
W(min)
TDA5341
V
DD
V
PTH
t
d
V
OH
V
OL
MGE819
Fig.9 Reset mode timing.
CHARACTERISTICS (VCM FUNCTION)
V
DD
= 5 V; V
DD1
and V
DD2>VDD
is not allowed; T
=25°C; unless otherwise specified.
amb
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
SENSEIN and SENSEIN+; pins 51 and 52
V
CS
I
iSENSE
common input sense voltage 0 V
DD
input sense current 250 +250 µA
SENSEOUT; pin 53
V
SENSE
I
oSENSE
G
SENSE
f
co
V
o(os)
t
RSA
V
; pin 36
ref
V
ref
I
ref
differential output voltage V output sense current 250 +250 µA sense amplifier gain 9.9 10.2 10.5 cross-over frequency 40 MHz output offset voltage I recovery time from saturation 20 −µs
reference input voltage 1.9 2.6 V reference input current 5 +5 µA
= 1.9 to 2.6 V 0.5 V
ref
SENSEIN
=0 −66 +66 mV
±1.25 4.0 V
ref
V
1997 Jul 10 20
Page 21
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit
TDA5341
with speed control
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VCM+ and VCM; pins 37 and 45
V
CMdo
I
oLIM
G
v
V
oPARK
VCMIN1 and VCMIN2
V
i
I
ibias
I
i(os)
GAINSEL; pin 15
V
IH
V
IL
I
IH
I
IL
R
SW
drop-out voltage Io= 400 mA 0.8 1.0 V output current limiting 0.7 1.15 1.5 A power amplifier voltage gain 9 12 output park voltage RL=40Ω; note 1 0.75 V
input voltage level 1.9 2.6 V input bias current −−0.25 µA input offset current 25 nA
HIGH level input voltage 2 −− V LOW level input voltage −−0.8 V HIGH level input current 10 +10 µA LOW level input current 20 +10 µA switch resistance GAINSEL = LOW −−40
GAINSEL = HIGH 10 −− M
FB1 and FB2; pins 28 and 29
V V
i(os)
FB
input offset voltage 5 +5 mV feed-back differential output
voltage
f
co
I
oFB
t
RSB
R
SW
cross-over frequency 10 MHz feed-back output current 250 +250 µA recovery time from saturation 5 −µs switch resistance GAINSEL = LOW −−40
RETRACT; pin 30
V
IH
V
IL
I
IH
I
IL
HIGH level input voltage 2 −− V LOW level input voltage −−0.8 V HIGH level input current 10 +10 µA LOW level input current 20 +10 µA
BRAKEDELAY; pin 46
V
BM
V
NM
brake mode threshold voltage 0.75 1.0 V normal mode voltage VDD− 0.85 −− V
VDD= 5.25 V ±0.4 −±V
0.45 V
DD
GAINSEL = HIGH 10 −− M
1997 Jul 10 21
Page 22
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit
TDA5341
with speed control
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Uncommitted operational amplifier; pins 4 to 6
V
i(os)
I
i(bias)
I
i(os)
V
CM
G
OL
f
co
V
OL
V
OH
Note
1. This is the PARK default value. Other values can be obtained with a metal mask change.
CHARACTERISTICS (SPEED CONTROL FUNCTION)
= 5 V; V
V
DD
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
input offset voltage 3.5 +3.5 mV input bias current 250 +250 nA input offset current 25 nA common mode voltage 1.7 2.6 V open loop gain 68 dB cross-over frequency 10 MHz LOW level output voltage IOL= 250 µA −−0.7 V HIGH level output voltage IOH= 250 µA 4.3 −− V
DD1
and V
DD2>VDD
is not allowed; T
=25°C; unless otherwise specified.
amb
FILTER; pin 32
I
o(sink)
I
o(source)
I
sink/Isource
I
charge pump leakage current 5 +5 nA
LO
DATA, RESET and
V
IL
V
IH
I
i
output sink current 80 100 120 µA output source current 110 90 70 µA ratio of sink-to-source current 0.9 1.1 1.2
ENABLE; pins 38, 57 and 42
LOW level input voltage −−0.8 V HIGH level input voltage 2.4 −− V input current 0 −µA
CLOCK; pin 39
V
IL
V
IH
f
clk
LOW level input voltage −−0.8 V HIGH level input voltage 2.4 −− V clock frequency −−18 MHz
ROSC; pin 48
V
IL
V
IH
f
refOSC
LOW level input voltage −−0.8 V HIGH level input voltage 2.4 −− V reference oscillator frequency 1 20 MHz
DPULSE; pin 35
V
IL
V
IH
f
DPULSE
LOW level input voltage −−0.8 V HIGH level input voltage 2.4 −− V data pulse frequency −−10 MHz
1997 Jul 10 22
Page 23
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit
TDA5341
with speed control
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
FMOT; pin 58
V
OL
δ duty factor 50 % Timing; see Fig.10 t
su1
t
su2
t
h
handbook, full pagewidth
LOW level output voltage IOL= 500 µA −−0.1 V
ENABLE set-up time 8 −− ns DATA set-up time 6 −− ns DATA hold time 10 −− ns
CLOCK
t
su1
ENABLE
DATA
SHIFTED DATA
t
su2
t
h
MGE824
Fig.10 Timing diagram.
1997 Jul 10 23
Page 24
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit with speed control
APPLICATION INFORMATION
V
DD2
V
V
EE1
+5 V
DD3
V
DD
TDA5341
V
EE2VEE3
V
handbook, full pagewidth
C2 C1
to micro-
controller
R1
CNTRL FILTER
FREDENA
CLOCK
DATA
ENABLE
RESET
ROSC
TESTIN
RESETOUT
BRAKE
FG
FMOT
DPULSE
CAPCP CAPXA CAPXB CAPYA CAPYB
CAPCDM
CAPCDS
CAPTI
CAPST
V
DD1
24 32
9 39 38 42 57 48 12 43 11 10 58 35
27 61 59 62 63 18 19 2 1
50 14 55 31 49 17 36
V
EED
DDD
V
EE4
CLAMP1 CLAMP2
2634116406425
V
V
EE
ref
MOT1
60
MOT2
8
MOT3
21
MOT0
7
ILIM
23
CAPCPC
22
UVDIN1
44
UVDIN2
54
RETRACT
30
GAINSEL
15
VCM
45
VCM+
37
SENSEIN
51
SENSEIN+
52
SENSEOUT
53
V
CMIN1
33
FB1
28
V
CMIN2
34
FB2
29
BRAKEDELAY
46
C
C
R
L1
L2
TDA5341
SPINDLE MOTOR
+5 V
R
s
f
R
R
MGE826
IN1
IN2
input
Fig.11 Application diagram of the TDA5341 in a hard disk drive.
1997 Jul 10 24
Page 25
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit with speed control
PACKAGE OUTLINE
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
c
y
X
A
48 33
49
Z
32
E
TDA5341
SOT314-2
e
w M
b
p
e
pin 1 index
1.45
1.35
b
0.25
17
16
Z
w M
p
D
H
D
0.27
0.18
0.17
0.12
D
(1)
(1) (1)(1)
D
10.1
10.1
9.9
9.9
v M
B
v M
B
0 2.5 5 mm
scale
eH
H
D
12.15
0.5
11.85
64
1
DIMENSIONS (mm are the original dimensions)
mm
A
A1A2A3bpcE
max.
0.20
1.60
0.05
UNIT
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
E
A
12.15
11.85
Q
H
E
E
A
2
A
A
1
detail X
LLpQZywv θ
0.69
0.75
0.45
0.59
0.12 0.11.0 0.2
L
Z
L
D
1.45
1.05
(A )
3
θ
p
E
1.45
1.05
o
7
o
0
OUTLINE VERSION
SOT314-2
IEC JEDEC EIAJ
REFERENCES
1997 Jul 10 25
EUROPEAN
PROJECTION
ISSUE DATE
94-01-07 95-12-19
Page 26
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit with speed control
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
Reflow soldering
Reflow soldering techniques are suitable for all LQFP packages.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
Wave soldering
Wave soldering is not recommended for LQFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices.
(order code 9398 652 90011).
TDA5341
If wave soldering cannot be avoided, the following conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering technique should be used.
The footprint must be at an angle of 45° to the board
direction and must incorporate solder thieves downstream and at the side corners.
Even with these conditions, do not consider wave soldering LQFP packages LQFP48 (SOT313-2), LQFP64 (SOT314-2) or LQFP80 (SOT315-1).
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
1997 Jul 10 26
Page 27
Philips Semiconductors Product specification
Brushless DC motor and VCM drive circuit
TDA5341
with speed control
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1997 Jul 10 27
Page 28
Philips Semiconductors – a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,
Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381
China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 São Paulo, SÃO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849
Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381
Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1997 SCA55 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
Printed in The Netherlands 297027/1200/01/pp28 Date of release: 1997Jul 10 Document order number: 9397 750 02621
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