Datasheet TDA5333T-C5, TDA5332T-C5 Datasheet (Philips)

Page 1
DATA SH EET
Preliminary specification File under Integrated Circuits, IC02
March 1989
INTEGRATED CIRCUITS
TDA5332T
Double mixer/oscillator for TV and VCR tuners
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March 1989 2
Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR tuners
TDA5332T
GENERAL DESCRIPTION
The TDA5332T is an integrated circuit that performs the mixer/oscillator functions in TV and VCR tuners. This device gives the designer the capability to design an economical and physically small tuner which will be capable of meeting the most stringent requirements e.g. FTZ or FCC. The tuner development time can be drastically reduced by using this device.
Features
Balanced mixer with a common emitter input for band A
Amplitude-controlled oscillator for band A
Balanced mixer with common base input for band B
Balanced oscillator for band B
SAW filter preamplifier with an output impedance of 75 in application
Bandgap voltage stabilizer for oscillator stability
Electronic bandswitch
QUICK REFERENCE DATA
PACKAGE OUTLINE
20-lead mini-pack, plastic (SO20L; SOT163A); SOT163-1; 1996 November 29.
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply voltage V
P
12 V
Band A frequency range depending on application f
A
45 470 MHz
Band B frequency range depending on application f
B
160 860 MHz
Band A noise factor 50 MHz NF
A
7.5 dB
Band B noise factor 860 MHz NF
B
9 dB
Band A input voltage 1% cross-modulation V
18-20
100 dBµV
Band B input power 1% cross-modulation
note 5 P
I
−−21 dBm
Band A voltage gain G
VA
25 dB
Band B voltage gain G
VB
36 dB
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Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR tuners
TDA5332T
Fig.1 Block diagram.
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Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR tuners
TDA5332T
Fig.2 Pinning diagram.
PINNING
1 A OSC band A oscillator input 2 GND ground (0 V) 3 A OSC band A oscillator output 4 B OSC band B oscillator input 5 B OSC band B oscillator output 6 B OSC band B oscillator output 7 B OSC band B oscillator input 8 BS electronic bandswitch 9 IF OUT IF amplifier output
10 IF OUT IF amplifier output
11 IF IN IF amplifier input 12 IF IN IF amplifier input 13 MIX OUT mixer output 14 MIX OUT mixer output 15 V
P
positive supply voltage 16 B IN band B input 17 B IN band B input 18 A IN band A input 19 A IN band A input 20 RF GND ground for RF inputs
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
THERMAL RESISTANCE
HANDLING
Pins 8, 9 and 10 withstand the ESD test in accordance with MIL-STD-883C category B (2000 V).
PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT
Supply voltage V
P
0.3 14 V
Switching voltage V
8
014V
Output current of each pin to ground I
O
−−10 mA
Maximum short-circuit time (all pins) t
SC
10 s
Storage temperature range T
stg
55 + 150 °C
Operating ambient temperature range T
amb
25 + 80 °C
Junction temperature T
j
−+150 °C
From junction to ambient in free air R
th j-a
typ. 100 K/W
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Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR tuners
TDA5332T
CHARACTERISTICS
V
P
= 12 V; T
amb
=25°C; all voltages are referenced to ground (pins 2 and 20); measured in Fig.3; unless otherwise
specified.
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply voltage V
15
10 13.2 V
Supply current I
15
42 55 mA
Switching voltage;
band A V
SA
0 1.1 V
band B V
SB
3 5V
Switching current
band A I
SA
−−10 µA
band B I
SB
−−50 µA
IF Amplifier
differentially measured at 36 MHz mod. phase
Input reflection
coefficient note 4 S
11
−−0.5 2 dB/
o
Reverse transmission
coefficient S
12
−−41 7 dB/
o
Forward transmission
coefficient S
21
12 160 dB/
o
Output reflection
coefficient S
22
−−910 dB/
o
Input admittance in
application Y
I
−−1.4 mS
0.9 pF
Output admittance
in application Z
O
−−55 −Ω 230 nH
Band A mixer (including IF amplifier)
measured using circuit shown in Fig.3
Frequency range f
A
45 470 MHz
Noise factor 50 MHz NF 7.5 9 dB
225 MHz NF 911dB 300 MHz NF 10 12 dB 470 MHz NF 11 13 dB
Optimum source
conductance 50 MHz G
18-20
0.5 mS
225 MHz G
18-20
1.1 mS
300 MHz G
18-20
1.2 mS
470 MHz G
18-20
1.9 mS
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Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR tuners
TDA5332T
Input capacitance 50 470 MHz C
18-20
2.5 pF
Input voltage 1% cross-modulation;
in channel;
V
18-20
97 100 dBµV
Input voltage 10 kHz pulling;
in channel; f < 300 MHz
V
18-20
100 108 dBµV
Voltage gain 20 log
(V
9-10/V18
)G
V
22.5 25.0 27.5 dB
Band A mixer
Conversion transadmittance
mixer I
13/V18
= I14/V
18
C
t
3.5 mS
Mixer output admittance pins 13 and 14 0.1 mS Mixer output capacitance C
13-14
2 pF
Band A oscillator
Frequency range f
A
80 520 MHz
Frequency shift V
P
= 10%
note 6; f = 330 MHz f −−200 kHz
Frequency drift T=25°C
note 7; f = 330 MHz f −−400 kHz
Frequency drift 5 s to 15 min
after switching on; f −−200 kHz f = 330 MHz
Band B mixer (including IF)
measured using circuit shown in Fig.3; measurements using hybrid; note 1
Frequency range f
B
160 860 MHz
Noise factor not corrected
for image pins 16 and 17
160 MHz NF
B
911dB
860 MHz NF
B
911dB
Available input power note 5;
1% cross-modulation; in channel; pins 16 and 17;
160 MHz P
IB
25 21 dBm
860 MHz P
IB
25 21 dBm
10 kHz pulling note 5;
pins 16 and 17; in channel
860 MHz −−20 dBm
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
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Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR tuners
TDA5332T
Notes to the characteristics
1. The values have been corrected for hybrid and cable losses. The symmetrical output impedance of the circuit is 100 .
2. The input level of a N + 5 1 MHz signal (just visible).
3. The gain is defined as the transducer gain (measured in Fig.3) plus the voltage transformation ratio of L6 to L7 (6:1, 16 dB).
4. All S parameters are referred to a 50 system.
5. The input power is defined as the power delivered by the generator on a 50 load.
6. The frequency shift is defined for a variation of power supply from; a) VP= 12 V to VP= 10.8 V b) VP= 12 V to VP= 13.2 V. In both cases the frequency shift is below the specified value.
7. The frequency drift is defined for a variation of ambient temperature from; a) T
amb
=25°C to T
amb
=0°C
b) T
amb
=25°C to T
amb
=50°C
In both cases the frequency shift is below the specified value.
N + 5 1 MHz
pulling notes 2 and 5;
820 MHz 42 35 dBm
Voltage gain note 3;
160 MHz G
VB
33 36 39 dB
860 MHz G
VB
33 36 39 dB
Band B oscillator
Frequency range f
B
200 900 MHz
Frequency shift note 6;
V
P
= 10% f −−400 kHz
Frequency drift note 7;
T=25°C ∆f −−800 kHz
Frequency drift 5 s to 15 min
after switching on f −−400 kHz
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
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Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR tuners
TDA5332T
APPLICATION INFORMATION
Fig.3 Application diagram.
Proposal of VHF/UHF tuner band A = VHF I + VHF III (45 to 300 MHz)
band B = UHF (470 to 900 MHz)
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Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR tuners
TDA5332T
Component values of the application diagram
Note
1. Coil type: TOKO 7 kN; material: 113 kN, screw core (03-0093), pot core (04-0026).
resistors R1 = 47 k R2 = 18 R3 = 1.2 k R4 = 4.7 k
R5 = 100 R6 = 22 k R7 = 1 k R8 = 2.2 k R9 = 22 k R10 = 15 k R11 = 47 k
capacitors C1 = 1 nF C2 = 1 nF C3 = 1 nF C4 = 1 nF
C5 = 1 nF C6 = 1 nF C7 = 1 nF C8 = 15 pF (N750) C9 = 15 pF (N750) C10 = 1 nF C11 = 1 nF C12 = 1 nF C13 = 0.68 pF (SMD) C14 = 1 pF (SMD) C15 = 1 pF (SMD) C16 = 0.68 pF (SMD) C17 = 100 pF (SMD) C18 = 5.6 pF (SMD) C19 = 1 pF (NPO) C20 = 1 pF (NPO) C21 = 82 pF (N750) C22 = 1 nF C23 = 1 nF C24 = 1 nF C25 = 1 nF C26 = 1 µF (40V) C27 = 1 nF Cm = 18 pF (N750)
diodes and IC D1 = BB911 D2 = BA482 D3 = BB405B IC = TDA5332T coils L1 = 2.5 t (φ3) L2 = 8.5 t (φ3) L3 = 1.5 t (φ3)
L4 = 1.5 t (φ3) L5 = 2 × 5 t (note 1) L8 = 5 µH (choke coil) transformer L6 = 12t (note 1) L7 = 2 t
wire size for L1 to L4 = 0.4 and for L5 to L7 = 0.1 mm.
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Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR tuners
TDA5332T
PACKAGE OUTLINE
UNIT
A
max.
A
1
A2A
3
b
p
cD
(1)E(1) (1)
eHELLpQ
Z
ywv θ
REFERENCES
OUTLINE VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8 0
o o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT163-1
10
20
w M
b
p
detail X
Z
e
11
1
D
y
0.25
075E04 MS-013AC
pin 1 index
0.10
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.51
0.49
0.30
0.29
0.050
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
0 5 10 mm
scale
X
θ
A
A
1
A
2
H
E
L
p
Q
E
c
L
v M
A
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
95-01-24 97-05-22
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Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR tuners
TDA5332T
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
(order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the
printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between
50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
Wave soldering
Wave soldering techniques can be used for all SO packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique
should be used.
The longitudinal axis of the package footprint must be parallel to the solder flow.
The package footprint must incorporate solder thieves at the downstream end.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
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Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR tuners
TDA5332T
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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