Page 1
DATA SH EET
Product specification
File under Integrated Circuits, IC02
January 1988
INTEGRATED CIRCUITS
TDA5330T
VHF, UHF and Hyperband
mixer/oscillator for TV and VCR
3-band tuners
Page 2
January 1988 2
Philips Semiconductors Product specification
VHF, UHF and Hyperband mixer/oscillator for
TV and VCR 3-band tuners
TDA5330T
GENERAL DESCRIPTION
The TDA5330T is a monolithic integrated circuit that performs the band A, band B and band C mixer/oscillator functions
in TV and VCR tuners. This device gives the designer the capability to design an economical and physically small 3-band
tuner which will be capable of meeting the most stringent requirements e.g. FTZ or FCC. The tuner development time
can be drastically reduced by using this device.
Features
• Balanced mixer with a common emitter input for band A
• Amplitude-controlled oscillator for band A
• Balanced mixer with common base input for band B and C
• Balanced oscillator for band B and C
• Local oscillator buffer output for external prescaler
• SAW filter preamplifier with an output impedance of 100 Ω
• Bandgap voltage stabilizer for oscillator stability
• Electronic bandswitch
QUICK REFERENCE DATA
PACKAGE OUTLINE
28-lead mini-pack , plastic (SO20; SOT163A); SOT 163-1; 1996 November 28.
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply voltage V
19−2, 26
− 12 − V
Band A frequency range f
A
48 − 180 MHz
Band B frequency range f
B
160 − 470 MHz
Band C frequency range f
C
430 − 860 MHz
Conversion noise F 7 − 11 dB
Band A input voltage 1% cross-modulation V
24−26
− 100 − dBµV
Band B and C input power 1% cross-modulation P
I
−−21 − dBm
Band A voltage gain G
v
− 24 − dB
Band B voltage gain G
v
− 37 − dB
Band C voltage gain G
v
− 36 − dB
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January 1988 3
Philips Semiconductors Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
TDA5330T
Fig.1 Block diagram.
Page 4
January 1988 4
Philips Semiconductors Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
TDA5330T
Fig.2 Pinning diagram.
PINNING
1 A OSC band A oscillator input
2 GND ground (0 V)
3 A OSC band A oscillator output
4 B OSC band B oscillator input
5 B OSC band B oscillator output
6 B OSC band B oscillator output
7 B OSC band B oscillator input
8 C OSC band C oscillator input
9 C OSC band C oscillator output
10 C OSC band C oscillator output
11 C OSC band C oscillator input
12 BS electronic bandswitch
13 IF OUT IF amplifier output
14 IF OUT IF amplifier output
15 IF IN IF amplifier input
16 IF IN IF amplifier input
17 MIX OUT mixer output
18 MIX OUT mixer output
19 V
P
positive supply voltage
20 C IN band C input
21 C IN band C input
22 B IN band B input
23 B IN band B input
24 A IN band A input
25 A IN band A input
26 RF GND ground for RF inputs
27 LO OUT local oscillator amplifier output
28 LO OUT local oscillator amplifier output
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
THERMAL RESISTANCE
PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT
Supply voltage V
P=V19−2, 26
−0.3 14 V
Switching voltage V
12
014V
Output current of each pin to ground I
O
−−10 mA
Maximum short-circuit time (all pins) t
SC
− 10 s
Storage temperature range T
stg
−55 +150 °C
Operating ambient temperature range T
amb
−25 +80 °C
From junction to ambient in free air R
th j-a
typ. 75 K/W
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January 1988 5
Philips Semiconductors Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
TDA5330T
CHARACTERISTICS
V
P
= 12 V; T
amb
=25°C; unless otherwise specified.
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply voltage V
19−2, 26
10 − 13.2 V
Supply current I
19
− 42 55 mA
Switching voltage;
band A V
12
0 − 1.1 V
band B V
12
1.6 − 2.4 V
band C V
12
3.0 − 5.0 V
Switching current;
band C I
12
−−50 µA
Band A Mixer
(including IF amplifier)
measured using
circuit shown in
Fig.9
Frequency range f
A
48 − 180 MHz
Noise figure note 1;
50 MHz NF − 7.5 9 dB
180 MHz NF − 910dB
Optimum source
conductance 50 MHz G
24−26
− 0.5 − mS
180 MHz G
24−26
− 1.1 − mS
Input admittance see Fig.9
Input capacitance 50 - 180 MHz C
24−26
− 2 − pF
Input voltage 1% cross-modulation;
in channel V
24−26
97 100 − dBµV
Input voltage 10 kHz pulling;
in channel V
24−26
100 108 − dBµV
Voltage gain 20 log
(V
13−14/V24
)G
v
22.5 25.0 27.5 dB
Band A mixer
Conversion
transadmittance Sc = I
17/V24
mixer = −I18/V
24
Sc
24−17, 18
− 3.5 − mS
Mixer output
admittance pins 15 and 16 − 0.1 − mS
Mixer output
capacitance C
17−18
− 2 − pF
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January 1988 6
Philips Semiconductors Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
TDA5330T
Band A oscillator
Frequency range f
A
80 − 216 MHz
Frequency shift ∆V
P
= 10% ∆f −−200 kHz
Frequency drift ∆T = 25 °C ∆f −−400 kHz
Frequency drift 5 s to 15 min after
switching on ∆f −
−
200 kHz
Band B mixer
(including IF)
measured using circuit
shown in
Fig.9
measurements
using hybrid;
note 2
Frequency range f
B
160 − 470 MHz
Noise figure pins 22 and 23;
200 MHz NF − 810dB
470 MHz NF − 810dB
Input admittance see Fig.5
Available input power 1% cross-modulation;
in channel;
pins 22 and 23;
200 MHz P
AI
−24 −21 − dBm
470 MHz P
AI
−24 −21 − dBm
10 kHz pulling pins 22 and 23;
in channel;
470 MHz −−11 − dBm
N+5 − 1 MHz pulling note 3;
430 MHz −−11 − dBm
Voltage gain note 4;
200 MHz G
v
33 36 39 dB
470 MHz G
v
33 36 39 dB
Band B oscillator
Frequency range f
B
200 − 500 MHz
Frequency shift ∆V
P
= 10% ∆f −−400 kHz
Frequency drift ∆T=25°C ∆f −−500 kHz
Frequency drift 5 s to 15 min after
switching on ∆f −−200 kHz
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
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January 1988 7
Philips Semiconductors Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
TDA5330T
Band C mixer
(including IF)
measured
using circuit shown in
Fig.9;
measurements
using hybrid;
note 2
Frequency range f
C
430 − 860 MHz
Noise figure pins 20 and 21;
430 MHz NF − 911dB
860 MHz NF − 911dB
Input admittance see Fig.6
Available input power 1% cross-modulation
in channel;
pins 20 and 21;
430 MHz P
AI
−25 −21 − dBm
860 MHz P
AI
−25 −21 − dBm
10 kHz pulling pins 20 and 21;
in channel;
860 MHz −−20 − dBm
N+5 − 1 MHz pulling note 3;
820 MHz −42 −35 − dBm
Voltage gain note 4;
430 MHz G
v
33 36 39 dB
860 MHz G
v
33 36 39 dB
Band C oscillator
Frequency range f
C
470 − 900 MHz
Frequency shift ∆V
b
= 10% ∆f −−400 kHz
Frequency drift ∆T=25°C ∆f −−800 kHz
Frequency drift 5 s to 15 min after
switching on ∆f −−200 kHz
mod. phase
IF Amplifier
note 5; differentially
measured at 36 MHz;
see Fig.7
Input reflection
coefficient S
11
−−0,5 −2.0 − dB/deg
Reverse transmission
coefficient S
12
−−41 −7 − dB/deg
Forward transmission
coefficient S
21
− 12 160 − dB/deg
Output reflection
coefficient see Fig.8 S
22
−−910− dB/deg
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
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January 1988 8
Philips Semiconductors Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
TDA5330T
Notes
1. Measured with an input circuit for optimum noise. (see Fig.3).
2. The values have been corrected for hybrid and cable losses. The symmetrical output impedance of the circuit is
100 Ω.
3. The input level of a N+5 − 1 MHz signal (just visible).
4. The gain is defined as the transducer gain (measured in Fig.9) plus the voltage transformation ratio of L6 to L7
(6:1, 16 dB).
5. All S parameters are referred to a 50 Ω system.
6. Measured with 50 Ω output impedance on pins 26 and 27 and a RF input signal level of:
RF level = 1 V at f < 180 MHz
RF power = 0.5 dBm at 100 MHz < f < 225 MHz
RF power = −10 dBm at 225 MHz < f < 860 MHz
Table 1 Component values
Note
1. Value to be fixed.
LO output
Output voltage into
50 Ω resistor V
27−28
14 35 100 mV
Spurious signal on
LO output with
respect to LO
output signal note 6 SRF −−−10 dB
LO signal harmonics
with respect to
LO signal measured at 50 Ω SHD −−−10 dB
COMPONENT F = 50 MHz F = 180 MHz
L 13 t, ∅ 5.5 mm, wire 0.7 mm (note 1)
L2 rigid cable, 2.9 cm (note 1)
L3 rigid cable, 4 cm (note 1)
C 9.6 pF (note 1)
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Fig.3 Input circuit for optimum noise.
Page 9
January 1988 9
Philips Semiconductors Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
TDA5330T
Table 2 Electrical parameters of the circuit (for appropriate impedance and selectivity)
Note
1. Value to be fixed.
PARAMETER F = 50 MHz F = 180 MHz UNIT
Insertion loss 0.3 (note 1) dB
Bandwidth 8 (note 1) MHz
Image suppression 15 (note 1) dB
Output impedance (source for IC) 2 (note 1) kΩ
Fig.4 S11 of the band A mixer input (40 to 220 MHz).
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January 1988 10
Philips Semiconductors Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
TDA5330T
Fig.5 S11 of the band B mixer input (150 to 500 MHz).
Fig.6 S11 of the band C mixer input (450 to 900 MHz).
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January 1988 11
Philips Semiconductors Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
TDA5330T
Fig.7 S11 of the LO output (50 to 900 MHz).
Fig.8 S11, S12 and S22 of the IF amplifier (30 to 60 MHz).
Page 12
January 1988 12
Philips Semiconductors Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
TDA5330T
Fig.9 Test circuit diagram.
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January 1988 13
Philips Semiconductors Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
TDA5330T
Component values of the test circuit
Note
1. Coil type: TOKO 7 kN; material: 113 kN, screw core (03-0093), pot core (04-0026).
resistors
R1 = 47 kΩ R2 = 18 Ω R3 = 22 kΩ R4 = 22 kΩ
R5 = 22 Ω (SMD) R6 = 22 kΩ R7 = 1 kΩ R8 = 2.2 kΩ
R9 = 22 kΩ R10 = 15 kΩ R11 = 22 kΩ
capacitors
C1 = 1 nF C2 = 1 nF C3 = 1 nF C4 = 1 nF
C5 = 1 nF C6 = 1 nF C7 = 1 nF C8 = 1 nF
C9 = 1 nF C10 = 1 nF C11 = 1 nF C12 = 15 pF (N750)
C13 = 15 pF (N750) C14 = 1 nF C15 = 1 nF C16 = 1 nF
C17 = 0.68 pF (SMD) C18 = 1 pF (SMD) C19 = 100 pF (SMD) C20 = 5.6 pF (SMD)
C21 = 1 pF C22 = 0.68 pF (SMD) C23 = 150 pF (N750) C24 = 1.8 pF (N750)
C25 = 3.3 pF (SMD) C26 = 3.3 pF (SMD) C27 = 1.8 pF (SMD) C28 = 1 nF
C29 = 1 pF (NPO) C30 = 1 pF (NPO) C31 = 82 pF (N750) C32 = 1 nF
C33 = 1 µF (40 V) Cm = 18 pF (N750)
diodes and IC
D1 = BB911 D2 = BB909B D3 = BB405B
IC = TDA5330T
coils
L1 = 6.5 t (φ3) L2 = 1.5 t (φ3) L3 = 1.5 t (φ3) L4 = 1.5 t (φ3)
L5 = 2 × 6 t (note 1) L6 = 12 t (note 1) L7 = 2 t (mounted on L6) L8 = 5 µH (choke coil)
wire size for L1 to L4 = 0.4 and for L5 to L7 = 0.1 mm.
Page 14
January 1988 14
Philips Semiconductors Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
TDA5330T
PACKAGE OUTLINE
UNIT
A
max.
A
1
A2A
3
b
p
cD
(1)E(1) (1)
eHELLpQ
Z
ywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT163-1
10
20
w M
b
p
detail X
Z
e
11
1
D
y
0.25
075E04 MS-013AC
pin 1 index
0.10
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.51
0.49
0.30
0.29
0.050
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
0 5 10 mm
scale
X
θ
A
A
1
A
2
H
E
L
p
Q
E
c
L
v M
A
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
95-01-24
97-05-22
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January 1988 15
Philips Semiconductors Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
TDA5330T
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
(order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO packages.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the
printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between
50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
Wave soldering
Wave soldering techniques can be used for all SO packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique
should be used.
• The longitudinal axis of the package footprint must be parallel to the solder flow.
• The package footprint must incorporate solder thieves at the downstream end.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less
than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a
dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
Page 16
January 1988 16
Philips Semiconductors Product specification
VHF, UHF and Hyperband mixer/oscillator
for TV and VCR 3-band tuners
TDA5330T
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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