Page 1
DATA SH EET
Product specification
File under Integrated Circuits, IC02
January 1985
INTEGRATED CIRCUITS
TDA3810
Spatial, stereo and pseudo-stereo
sound circuit
Page 2
January 1985 2
Philips Semiconductors Product specification
Spatial, stereo and pseudo-stereo
sound circuit
TDA3810
DESCRIPTION
The TDA3810 integrated circuit provides spatial, stereo and pseudo-stereo sound for radio and television equipment.
Features
• Three switched functions:
– spatial (widened stereo image)
– stereo
– pseudo-stereo (artificial stereo from a mono source)
• Offset compensated operational amplifiers to reduce switch noise
• LED driver outputs to facilitate indication of selected operating mode
• Start/stop circuit to reduce switch noise and to prevent LED-flicker
• TTL-compatible control inputs
QUICK REFERENCE DATA
PACKAGE OUTLINE
18-lead DIL; plastic (SOT102); SOT102-1; 1996 November 25.
Supply voltage (pin 18) V
P
typ. 12 V
Supply current (LEDs off) I
P
typ. 6 mA
Operating ambient temperature range T
amb
0 to +70 °C
Input signals (r.m.s. value) V
i(rms)
< 2V
Total harmonic distortion (stereo) THD typ. 0,1 %
Channel separation (stereo) α typ. 70 dB
Gain (stereo) G
v
typ. 0 dB
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January 1985 3
Philips Semiconductors Product specification
Spatial, stereo and pseudo-stereo sound
circuit
TDA3810
(1) Used in spatial mode for correction of high
frequency only (optimal performance).
Fig.1 Block diagram/test circuit showing external components; for control inputs to pins 11 and 12 see truth table.
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January 1985 4
Philips Semiconductors Product specification
Spatial, stereo and pseudo-stereo sound
circuit
TDA3810
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
THERMAL RESISTANCE
CHARACTERISTICS
V
P
= 12 V; T
amb
= 25 °C; test circuit Fig.1 stereo mode (pin 11 to ground) unless otherwise specified.
Output load:
R
6-10, 13-10
≥ 4,7 kΩ; C
6-10, 13-10
≤ 150 pF.
PSEUDO-STEREO MODE
The quality and strength of the pseudo-stereo effect is determined by external filter components.
Supply voltage (pin 18) V
P
max. 18 V
Storage temperature range T
stg
−25 to +150 °C
Operating ambient temperature range T
amb
0 to +70 °C
From crystal to ambient R
th cr-a
= 80 K/W
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Supply voltage range (pin 18) V
P
4,5 − 16,5 V
Supply current I
P
− 612mA
Reference voltage V
S
5,3 6 6,7 V
Input voltage (pin 2 or 17)
THD = 0,2% (stereo mode) V
i(rms)
−−2V
Input resistance (pin 2 or 17) R
i
50 75 − kΩ
Voltage gain V
o/Vi
G
v
− 0 − dB
Channel separation (R/L) α 60 70 − dB
Total harmonic distortion
f = 40 to 16 000 Hz; V
o(rms)
= 1 V THD − 0,1 − %
Power supply ripple rejection RR − 50 − dB
Noise output voltage
(unweighted) left and right output V
n(rms)
− 10 −µV
SPATIAL MODE
(pins 11 and 12 HIGH)
Antiphase crosstalk α−50 − %
Voltage gain G
v
1,4 2,4 3,4 dB
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January 1985 5
Philips Semiconductors Product specification
Spatial, stereo and pseudo-stereo sound
circuit
TDA3810
Truth table
LOW = 0 to 0,8 V (the less positive voltage)
HIGH = 2 V to 5,5 V (the more positive voltage)
X = don’t care
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
CONTROL INPUTS
(pins 11 and 12)
Input resistance R
i
70 120 − kΩ
Switching current −I
i
− 35 100 µA
LED DRIVERS
(pins 7 and 8)
Output current for LED −I
o
10 12 15 mA
Forward voltage V
F
−−6V
MODE
CONTROL INPUT STATE LED
SPATIAL
PIN 7
LED
PSEUDO
PIN 8
PIN 11 PIN 12
Mono pseudo-stereo HIGH LOW off on
Spatial stereo HIGH HIGH on off
Stereo LOW X off off
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January 1985 6
Philips Semiconductors Product specification
Spatial, stereo and pseudo-stereo sound
circuit
TDA3810
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
SOT102-1
93-10-14
95-01-23
UNIT
A
max.
12
b
1
(1) (1)
(1)
b
2
cD E e M
Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min.
A
max.
b
max.
w
M
E
e
1
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
3.9
3.4
0.2542.54 7.62
8.25
7.80
9.5
8.3
0.854.7 0.51 3.7
inches
0.055
0.044
0.021
0.015
0.013
0.009
1.40
1.14
0.055
0.044
0.86
0.84
0.26
0.24
0.15
0.13
0.010.10 0.30
0.32
0.31
0.37
0.33
0.0330.19 0.020 0.15
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w M
b
1
b
2
e
D
A
2
Z
18
1
10
9
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
DIP18: plastic dual in-line package; 18 leads (300 mil)
SOT102-1
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January 1985 7
Philips Semiconductors Product specification
Spatial, stereo and pseudo-stereo sound
circuit
TDA3810
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
(order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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