Datasheet TDA1591-V3-S3, TDA1591-V3-S1 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of March 1992
File under Integrated Circuits, IC01

1996 Sep 02

INTEGRATED CIRCUITS

TDA1591

PLL stereo decoder and noise
blanker

1996 Sep 02 2

Philips Semiconductors Product specification

PLL stereo decoder and noise blanker TDA1591

FEATURES

• Adjustment-free voltage controlled PLL oscillator for
ceramic resonator (f = 456 kHz)

• Pilot signal dependent mono/stereo switching

• Analog control of mono/stereo change over

[stereo blend, Stereo Noise Controller (SNC)]

• Adjacent channel noise suppression (114 kHz)

• Pilot canceller

• Analog control of de-emphasis; High Cut Control (HCC)

• Applicable as source selector for AM/FM/cassette

switching

• Separate interference noise detector

• Integrated input low-pass filter for delayed noise

blanking

• Noise blanking at MPX-demodulator outputs

• Internal voltage stabilization.

GENERAL DESCRIPTION

The TDA1591 is a monolithic bipolar integrated circuit
providing the stereo decoder function and noise blanking
for FM car radio applications.

The device operates in a power supply range of

7.5 to 12 V.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

P

supply voltage (pin 5) 7.5 10 12 V

I

P

supply current − 12 − mA

V

o(rms)

audio output signal (RMS value) − 900 − mV
THD total harmonic distortion − 0.1 0.3 %
S/N signal-to-noise ratio − 76 − dB

α

cs

channel separation − 40 − dB
V

trigg

interference voltage trigger level − 10 − mV

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA1591 DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1
TDA1591T SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

1996 Sep 02 3

Philips Semiconductors Product specification

PLL stereo decoder and noise blanker TDA1591

BLOCK DIAGRAM

handbook, full pagewidth

stereo

indication

SNC

HCC

V

i MPX

68 kΩ 82 kΩ

0.1 µF

68 pF

C

comp

470 kΩ

0.1

µF

10 kΩ

V

ref

= 1 to 5 V

from pin 5

27 kΩ

27 kΩ

from IF level detector

100 kΩ 100 kΩ

12 3 4567 8 9 10

111213141516

20 19 18 17

+

+

+

+

6.8 nF

6.8 nF

47 kΩ

0.22 µF

0.22 µF

V

0.22 µF

47 kΩ

47 kΩ

47 kΩ

0.22 µF

mute on

VCO off

6.5 kΩ

6.5


kΩ

PILOT

DETECTOR

SWITCH

STEREO

BLEND

4-POLE

FILTER

(80 kHz)

PILOT

CANCEL

2-POLE

FILTER

(30 kHz)

GATE

AND

HCC

PHASE

DETECTOR

LOGIC

INTERFERENCE

DETECTOR



PULSE

FORMER

VCO

VOLTAGE

STABILIZER

REFERENCE

CURRENT



NOISE

DETECTOR

470

pF

2.2

kΩ

470

pF

1.2

nF

0.1

µF

100 kΩ

CSB456F11

(Murata)

22

nF

0.22

µF

27 kΩ

V

P

= 10 V

INFI

interference signal (TDA1596, pin 3)

19 kHz

TDA1591

R1

75 kΩ

forced

mono

7.4 kΩ

7.4 kΩ

47

nF

IDENT

38 kHz

100

µF

FB-R

R2

R3

FB-L

10 Ω

(1)

MEH027

iAUX

V

oL

V

oR

V

iAUX

PILOT

12 kΩ

Fig.1 Block diagram with external components, also used as test circuit.

(1) Simulates the roll-off of the FM demodulator.

1996 Sep 02 4

Philips Semiconductors Product specification

PLL stereo decoder and noise blanker TDA1591

PINNING

SYMBOL PIN DESCRIPTION

PLL 1 phase locked loop filter
OSC 2 oscillator input/output pin for

ceramic resonator
GND 3 ground (0 V)
I

ref

4 reference current

V

P

5 supply voltage (+10 V)
INFI 6 interference signal input
PUFO 7 pulse former time constant;

VCO off

NDET 8 noise detector time constant;

mute on

FB-L 9 AF feedback input for left audio

signal

V

oL

10 AF output signal left

V

oR

11 AF output signal right

FB-R 12 AF feedback input for right audio

signal

C

DEEL

13 de-emphasis capacitor for left

channel

C

DEER

14 de-emphasis capacitor for right

channel
HCC 15 HCC input for de-emphasis control
SNC 16 stereo blend input
V

ref

17 externally applied reference

voltage of 1 to 5 V
IDENT 18 identification output (HIGH = pilot

existing; stereo)
PILOT 19 pilot detector level (forced mono

input)
V

i MPX

20 MPX input signal from IF

demodulator

Fig.2 Pin configuration.

handbook, halfpage

TDA1591

MHA363

1
2
3
4
5
6
7
8
9

10

20
19
18
17
16
15
14
13
12
11

PLL
OSC
GND

INFI
PUFO
NDET

FB-L

V

oL

I

ref

V

P

V

i MPX

V

oR

C

DEEL

C

DEER

HCC

SNC

IDENT

PILOT

V

ref

FB-R

1996 Sep 02 5

Philips Semiconductors Product specification

PLL stereo decoder and noise blanker TDA1591

FUNCTIONAL DESCRIPTION

Adapting the MPX input to the level of the FM demodulator
output is realized by the value of input resistor R1
(see Fig.3). The total gain of the stereo decoder is
applicable by varying the feedback resistors R2 and R3
(see Figs 1 and 4).

In mute position and the VCO switched off (pin 7), the
output amplifiers can be used for cassette playback,
AM stereo purpose or other signal sources.

The Stereo Noise Controller (SNC) provides a smooth
mono to stereo take-over (see Fig.5).

For High Cut Control (HCC), the de-emphasis time
constant can be changed to higher values
(see Figs 7 and 8). This function is controlled by an analog
input signal.

The noise blanking facility is achieved by gating the stereo
decoder output signal.

The interference detector generates a gating pulse
preferable forced by the level detector voltage of the IF
part.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

Note

1. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.

SYMBOL PARAMETER MIN. MAX. UNIT

V

P

supply voltage (pin 5) 0 13.2 V

P

tot

total power dissipation 0 0.25 W

T

stg

storage temperature −55 +150 °C

T

amb

operating ambient temperature −40 +85 °C

V

es

electrostatic handling; note 1

pins 1 and 16 −400 +400 V
pin 5 −300 +300 V
all other pins −600 +600 V

1996 Sep 02 6

Philips Semiconductors Product specification

PLL stereo decoder and noise blanker TDA1591

CHARACTERISTICS

VP= 10 V; T

amb

=25°C; input signal V

i MPX(p-p)

= 1.7 V; m = 100% (∆f=±75 kHz, f

mod

= 1 kHz); de-emphasis of 50 µs

and series resistor at input R1 = 150 kΩ; measurements taken in Fig.1; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

supply voltage (pin 5) 7.5 10 12 V

I

P

supply current − 12 − mA

Stereo decoder

V

i MPX(p-p)

MPX input signal on pin 20
(peak-to-peak value)

− 1.7 − V

∆V

i MPX(p-p)

overdrive margin of MPX input signal THD = 1% 3 −−dB

V

o(rms)

AF mono output signal at pins 10 and 11
(RMS value)

without pilot − 900 − mV

∆V

o

overdrive margin of output signal THD = 1% 3 −−dB

V

10-11/Vo

difference of output voltage levels −−1dB

V

o 10,11

DC output voltage (pins 10 and 11) 3.3 3.8 4.3 V

R

o 10,11

output resistance − 130 −Ω

α

cs

channel separation pin 16 open-circuit;

see Fig.6

− 40 − dB

THD total harmonic distortion − 0.1 0.3 %
S/N signal-to-noise ratio f = 20 to 16000 Hz − 76 − dB

α

19

pilot signal suppression f = 19 kHz − 50 − dB

α

38

subcarrier suppression f = 38 kHz − 50 − dB

α

57

f = 57 kHz − 46 − dB

α

76

f = 76 kHz − 60 − dB

IM2 intermodulation for f

spur

= 1 kHz f

mod

= 10 kHz; note 1 − 60 − dB

IM3 f

mod

= 13 kHz; note 1 − 58 − dB

α

57

ARI traffic radio (ARI) f = 57 kHz; note 2 − 70 − dB

α

67

Subsidiary Communication Authorization
(SCA)

f = 67 kHz; note 3 70 −−dB

α

114

Adjacent Channel Interference (ACI) f = 114 kHz; note 4 − 80 − dB

α

190

f = 190 kHz; note 4 − 70 − dB

PSRR power supply ripple rejection f = 100 Hz;

V

ripple(rms)

= 100 mV

− 35 − dB

VCO (pin 2)

f

osc

oscillator frequency (ceramic resonator) − 456 − kHz

frequency range of free running oscillator 452 − 460 kHz
∆f/f capture and holding range − 1 − %
V

7

VCO-off voltage (pin 7) 0 − 0.6 V

1996 Sep 02 7

Philips Semiconductors Product specification

PLL stereo decoder and noise blanker TDA1591

Mono/stereo control (pins 16, 17 and 19)

V

i pilot(rms)

pilot threshold voltage for automatic switching

by pilot input voltage (RMS value)

stereo on − 24 30 mV

stereo off 820−mV
HYS hysteresis of pilot threshold voltage − 2 − dB
V

19

switching voltage for external mono control
(pin 19)

0 − 1V

V

ref

reference input voltage range (pin 17) 1 − 5V

V

16-17

control voltage for channel separation due to
pin 17 (V

ref

)

α

cs

= 6 dB; see Fig.5 −−85 − mV

α

cs

= 26 dB; see Fig.5 −−32 − mV

Pilot indicator logic level output (pin 18)

V

18

LOW voltage I18= −200 µA − 250 400 mV

I

18

HIGH current V18=10V −−1µA

Muting (pin 8)

MUTE

att

mute attenuation (pin 8) V8< 0.4 V − 80 − dB

V

8

>4V −−0.2 dB

V

O(offset)

DC offset voltage (pins 10 and 11)

after muting

−−±400 mV

HCC (pin 15)

CR

deem

control range of de-emphasis see Figs 7 and 8

for European standard C

deem

= 6.8 nF 50 − 150 µs

for USA standard C

deem

=10nF 75 − 225 µs

V

15-17

control voltage (pin 15 due to pin 17) in both
standards

lower value CR

deem

− 0 − mV

upper value CR

deem

−−300 − mV

Noise interference detector

V

trigg

trigger threshold (pin 6) f

int

= 120 kHz

V

8(DC)

= 7.7 V − 10 − mV

V

8(DC)

= 6.7 V − 100 − mV

∆V

8

voltage offset as a function of V

trigg

V

6 trigg

=10mV − 200 − mV

V

6 trigg

= 100 mV − 2.3 − V

t

sup

AF suppression time; pulse width − 40 −µs

I

13,14

input offset current (pins 13 and 14) during AF suppression

time

− 20 − nA

V

pulse

trigger sensitivity (pin 6) τ

pulse

=10µs − 10 − mV

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1996 Sep 02 8

Philips Semiconductors Product specification

PLL stereo decoder and noise blanker TDA1591

Notes

1. Intermodulation suppression [Beat Frequency Components (BFC)]:
;

;

measured with 91% mono signal; f

mod

= 10 kHz or 13 kHz; 9% pilot signal.

2. ARI suppression:

measured with 91% stereo signal; f

mod

= 1 kHz; 9% pilot signal; 5% ARI subcarrier

(f

s

= 57 kHz; f

mod

= 23 Hz; AM m = 0.6).

3. Subsidiary Communication Authorization (SCA):

;

measured with 81% mono signal; f

mod

= 1 kHz; 9% pilot signal; 10% SCA subcarrier (fs= 67 kHz, unmodulated).

4. Adjacent Channel Interference (ACI):

;

;

measured with 90% mono signal; f

mod

= 1 kHz; 9% pilot signal; 1% spurious signal

(f

s

= 110 kHz or 186 kHz, unmodulated).

IM2

V

o(signal)

at 1 kHz()

V

o(spurious)

at 1 kHz()

------------------------------------------------------- -

= f

s

2 10 kHz×()19 kHz–=

IM3

V

o(signal)

at 1 kHz()

V

o(spurious)

at 1 kHz()

------------------------------------------------------- -

= f

s

3 13 kHz×()38 kHz–=

α

57

ARI

V

o(signal)

at 1 kHz()

V

o(spurious)

at 1 kHz 23 Hz±()

---------------------------------------------------------------------------- -

=

α

67

V

o(signal)

at 1 kHz()

V

o(spurious)

at 9 kHz()

------------------------------------------------------- -

= f

s

238kHz×()67 kHz–=

α

114

V

o(signal)

at 1 kHz()

V

o(spurious)

at 4 kHz()

------------------------------------------------------- -

= f

s

110 kHz 3 38 kHz×()–=

α

190

V

o(signal)

at 1 kHz()

V

o(spurious)

at 4 kHz()

------------------------------------------------------- -

= f

s

186 kHz 5 38 kHz×()–=

1996 Sep 02 9

Philips Semiconductors Product specification

PLL stereo decoder and noise blanker TDA1591

Fig.3 Input signal as a function of series input resistor R1.

handbook, full pagewidth

300

R1 (kΩ)

1000

(V)

0

200

2

4

V

i MPX(p-p)

MEH029

Fig.4 Overall signal gain as a function of feedback

resistors R2 and R3 (R1 = 150 kΩ).

handbook, halfpage

G

(dB)

0204060

R2, R3 (kΩ)

0

−2

−4

−6

2

4

6

MEH030

Fig.5 Stereo blend characteristic (SNC).

handbook, halfpage

−200 −100 0
control voltage V

16−17

(mV)

50

40

30

20

10

0

α

cs

(dB)

MEH031

1996 Sep 02 10

Philips Semiconductors Product specification

PLL stereo decoder and noise blanker TDA1591

Fig.6 Channel separation as a function of audio frequency.

(1) Coupling capacitor CK at pin 20= 10 µF.
(2) Coupling capacitor CK at pin 20 = 0.1 µF.

handbook, full pagewidth

(1)

(2)

(dB)

α

cs

0

50

10

20

30

40

MEH032

10

f

oAF

(Hz)

10

2

10

3

10

4

10

5

handbook, full pagewidth

f

oAF

(Hz)

V

oAF

(dB)

(2)

(1)

−10

2

0

−6

−8

−2

−4

MEH033

10 10

2

10

3

10

4

Fig.7 HCC as a function of audio frequency (pin 7 connected to GND; without pre-emphasis).

(1) V

15-17

=0.

(2) V

15-17

= −300 mV.

1996 Sep 02 11

Philips Semiconductors Product specification

PLL stereo decoder and noise blanker TDA1591

Fig.8 HCC with f

mod

= 10 kHz.

handbook, full pagewidth

0

control voltage V

15−17

(mV)

−200−300

0

−100

−10

−2

∆V

o

(dB)

−4

−6

−8

MEH034

1996 Sep 02 12

Philips Semiconductors Product specification

PLL stereo decoder and noise blanker TDA1591

TEST INFORMATION

Fig.9 TDA1591 test board (component side).

handbook, full pagewidth

MHA364

12 kΩ

47 kΩ

47 kΩ

2.2 kΩ

47 kΩ

47 kΩ

27 kΩ

10 Ω

27 kΩ

100 kΩ

100 kΩ

470 kΩ

10 kΩ

68 kΩ

82 kΩ

27 kΩ

100 kΩ

100

µF

100

nF

100

nF

220 nF

220

nF

CSB456F11

220

nF

470pF470

pF

220

nF

22
nF

1.2 nF

220 nF

100 nF

47 nF

6.8 nF

6.8 nF

TDA1591

101.5

76.5

1

AUX IN

AF OUT

AF OUT

AUX IN

MUTE

VCO
OFF

MPX IN

Intf IN

V

ref

SNC

HCC

PIL

GND

V

P

MONO

Dimensions in mm.

1996 Sep 02 13

Philips Semiconductors Product specification

PLL stereo decoder and noise blanker TDA1591

PACKAGE OUTLINES

UNIT

A

max.

1 2

b

1

cD E e M

H

L

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT146-1

92-11-17
95-05-24

A 

min.

A 

max.

b

Z

max.

w

M

E

e

1

1.73

1.30

0.53

0.38

0.36

0.23

26.92

26.54

6.40

6.22

3.60

3.05

0.2542.54 7.62

8.25

7.80

10.0

8.3

2.04.2 0.51 3.2

0.068

0.051

0.021

0.015

0.014

0.009

1.060

1.045

0.25

0.24

0.14

0.12

0.010.10 0.30

0.32

0.31

0.39

0.33

0.0780.17 0.020 0.13

  SC603

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w M

b

1

e

D

A

2

Z

20

1

11

10

b

E

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

(1)

(1) (1)

DIP20: plastic dual in-line package; 20 leads (300 mil)

SOT146-1

1996 Sep 02 14

Philips Semiconductors Product specification

PLL stereo decoder and noise blanker TDA1591

UNIT

A

max.

A

1

A2A

3

b

p

cD

(1)E(1) (1)

eHELLpQ

Z

ywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

2.65

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

13.0

12.6

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8
0

o
o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT163-1

92-11-17
95-01-24

10

20

w M

b

p

detail X

Z

e

11

1

D

y

0.25

075E04 MS-013AC

pin 1 index

0.10

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.51

0.49

0.30

0.29

0.050

1.4

0.055

0.42

0.39

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

0 5 10 mm

scale

X

θ

A

A

1

A

2

H

E

L

p

Q

E

c

L

v M

A

(A )

3

A

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

1996 Sep 02 15

Philips Semiconductors Product specification

PLL stereo decoder and noise blanker TDA1591

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

DIP

S

OLDERING BY DIPPING OR BY WA VE

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

W

AVE SOLDERING

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1996 Sep 02 16

Philips Semiconductors Product specification

PLL stereo decoder and noise blanker TDA1591

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

1996 Sep 02 17

Philips Semiconductors Product specification

PLL stereo decoder and noise blanker TDA1591

NOTES

1996 Sep 02 18

Philips Semiconductors Product specification

PLL stereo decoder and noise blanker TDA1591

NOTES

1996 Sep 02 19

Philips Semiconductors Product specification

PLL stereo decoder and noise blanker TDA1591

NOTES

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1996 SCA51
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. [phone], Fax. [phone]

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. [phone], Fax. [phone]

Norway: Box 1, Manglerud 0612, OSLO,
Tel. [phone], Fax. [phone]

Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,

Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]
Middle East: see Italy

Printed in The Netherlands 517021/1200/02/pp20 Date of release: 1996 Sep 02 Document order number: 9397 750 00921